© Semiconductor Components Industries, LLC, 2012
February, 2012 Rev. 10
1Publication Order Number:
MMQA/D
MMQA, SZMMQA Quad
Common Anode Series
SC-74 Quad Monolithic
Common Anode
Transient Voltage Suppressors for ESD
Protection
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment, and other applications. Its quad junction common
anode design protects four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
Features
SC74 Package Allows Four Separate Unidirectional Configurations
Peak Power Min. 24 W @ 1.0 ms (Unidirectional),
per Figure 5 Waveform
Peak Power Min. 150 W @ 20 ms (Unidirectional),
per Figure 6 Waveform
Maximum Clamping Voltage @ Peak Pulse Current
Low Leakage < 2.0 mA
ESD Rating of Class 3B (exceeding 16 kV) per the Human Body
Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
PbFree Packages are Available*
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
1
2
3
6
5
4
MARKING DIAGRAM
PIN ASSIGNMENT
SC74
CASE 318F
STYLE 1
xxxMG
G
http://onsemi.com
xxx = Specific Device Code
M = Date Cade
G=PbFree Package
(Note: Microdot may be in either location)
SC74 QUAD TRANSIENT
VOLTAGE SUPPRESSOR
24 WATTS PEAK POWER
5.6 33 VOLTS
DEVICE MARKING & ORDERING
INFORMATION
See specific marking and ordering information in the device
marking and ordering information table on page 6 of this data
sheet.
MMQA, SZMMQA Quad Common Anode Series
http://onsemi.com
2
THERMAL CHARACTERISTICS (TA = 25°C Unless Otherwise Noted)
Characteristic Symbol Value Unit
Peak Power Dissipation @ 1.0 ms (Note 1)
@ TA 25°C
Ppk 24
W
Peak Power Dissipation @ 20 ms (Note 2)
@ TA 25°C
Ppk 150
W
Total Power Dissipation on FR-5 Board (Note 3)
@ TA = 25°C
PD225
1.8
MW
mW/°C
Thermal Resistance from JunctiontoAmbient RqJA 556 °C/W
Total Power Dissipation on Alumina Substrate (Note 4)
@ TA = 25°C
Derate above 25°C
PD300
2.4
MW
mW/°C
Thermal Resistance from JunctiontoAmbient RqJA 417 °C/W
Junction and Storage Temperature Range TJ, Tstg 55 to +150 °C
Lead Solder Temperature Maximum (10 Second Duration) TL260 °C
1. Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 4.
2. Non-repetitive current pulse per Figure 6 and derate above TA = 25°C per Figure 4.
3. FR-5 = 1.0 x 0.75 x 0.62 in.
4. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless Otherwise Noted)
UNIDIRECTIONAL
(Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA)
Device
(Note 8)
Breakdown Voltage
Max
Reverse
Leakage
Current
Max Zener
Impedance
(Note 7)
Max
Reverse
Surge
Current
Max
Reverse
Voltage @
IRSM
(Note 6)
(Clamping
Voltage)
Maximum
Temperature
Coefficient
of VZ
Capacitance
@ 0 Volt
Bias, 1 MHz
VZT
(Note 5)
(V) @ IZT IRVR(pF)
Min Nom Max (mA) (nA) (V)
ZZT @ IZT
(W) (mA)
IRSM
(A)
VRSM
(V) (mV/°C) Min Max
MMQA5V6T 5.32 5.6 5.88 1.0 2000 3.0 400 3.0 8.0 1.26
MMQA6V2T 5.89 6.2 6.51 1.0 700 4.0 300 2.66 9.0 10.6
MMQA6V8T 6.46 6.8 7.14 1.0 500 4.3 300 2.45 9.8 10.9 100 250
MMQA12VT 11.4 12 12.6 1.0 75 9.1 80 1.39 17.3 14
MMQA13VT 12.4 13 13.7 1.0 75 9.8 80 1.29 18.6 15
MMQA15VT 14.3 15 15.8 1.0 75 11 80 1.1 21.7 16
MMQA18VT 17.1 18 18.9 1.0 75 14 80 0.923 26 19
MMQA20VT 19 20 21 1.0 75 15 80 0.84 28.6 20.1
MMQA21VT 20 21 22.1 1.0 75 16 80 0.792 30.3 21
MMQA22VT 20.9 22 23.1 1.0 75 17 80 0.758 31.7 22
MMQA24VT 22.8 24 25.2 1.0 75 18 100 0.694 34.6 25
MMQA27VT 25.7 27 28.4 1.0 75 21 125 0.615 39 28
MMQA33VT 31.4 33 34.7 1.0 75 25 200 0.504 48.6 37
5. VZ measured at pulse test current IT at an ambient temperature of 25°C.
6. Surge current waveform per Figure 5 and derate per Figure 4.
7. ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC),
with AC frequency = 1 kHz.
8. Include SZ-prefix devices where applicable.
MMQA, SZMMQA Quad Common Anode Series
http://onsemi.com
3
TYPICAL CHARACTERISTICS
300
VZ, NOMINAL ZENER VOLTAGE (V)
C, CAPACITANCE (pF)
250
200
150
100
50
0
5.6 6.8 12 20 27
BIASED AT 0 V
BIASED AT 1 V
BIASED AT 50%
OF VZ NOM
Figure 1. Typical Capacitance
5.6 6.8 20 27
10,000
1,000
100
10
0
Figure 2. Typical Leakage Current
IR, LEAKAGE (nA)
VZ, NOMINAL ZENER VOLTAGE (V)
33 33
+150°C
+25°C
-40°C
Figure 3. Steady State Power Derating Curve Figure 4. Pulse Derating Curve
0 25 50 75 100 125 150 175
300
250
200
150
100
50
0
PD, POWER DISSIPATION (mW)
TA, AMBIENT TEMPERATURE (°C)
FR‐5 BOARD
ALUMINA SUBSTRATE
100
90
80
70
60
50
40
30
20
10
00 25 50 75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ TA= 25 C
°
MMQA, SZMMQA Quad Common Anode Series
http://onsemi.com
4
TYPICAL CHARACTERISTICS
Figure 5. 10 × 1000 ms Pulse Waveform
VALUE (%)
100
50
001234
t, TIME (ms)
tr
tP
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO 50%
OF IRSM.
tr 10 ms
HALF VALUE— IRSM
2
PEAK VALUE—IRSM
Figure 6. 8 × 20 ms Pulse Waveform
100
90
80
70
60
50
40
30
20
10
0020406080
t, TIME (ms)
% OF PEAK PULSE CURRENT
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE IRSM @ 8 ms
HALF VALUE IRSM/2 @ 20 ms
Figure 7. Maximum NonRepetitive Surge
Power, Ppk versus PW
Figure 8. Typical Maximum NonRepetitive
Surge Power, Ppk versus VZ
Ppk PEAK SURGE POWER (W)
0.1 1.0 10 100 1000
1.0
10
100
Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk).
PW, PULSE WIDTH (ms)
UNIDIRECTIONAL
RECTANGULAR
WAVEFORM, TA = 25°C
200
180
160
140
120
100
80
60
40
20
05.6 6.8 12 20 33
NOMINAL VZ
P
27
, PEAK SURGE POWER (W)
PK
8 × 20 WAVEFORM AS PER FIGURE
NO TAG
10 × 100 WAVEFORM AS PER FIGURE
NO TAG
MMQA, SZMMQA Quad Common Anode Series
http://onsemi.com
5
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SC-74
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. A simplified example of
MMQA/SZMMQA Series Device applications is illustrated
below.
KEYBOARD
TERMINAL
PRINTER
ETC.
FUNCTIONAL
DECODER
I/O
A
MMQA/SZMMQA SERIES DEVICE
GND
B
C
D
Figure 9. Computer Interface Protection
I/O
RAM ROM
CLOCK
CPU
CONTROL BUS
ADDRESS BUS
DATA BUS
GND
VGG
VDD
MMQA/SZMMQA
SERIES DEVICE Figure 10. Microprocessor Protection
MMQA, SZMMQA Quad Common Anode Series
http://onsemi.com
6
DEVICE MARKING AND ORDERING INFORMATION
Device* Device Marking Package Shipping
MMQA5V6T1 5A6 SC74 3,000/Tape & Reel
MMQA6V2T1 6A2 SC74 3,000/Tape & Reel
MMQA6V2T3 6A2 SC74 10,000/Tape & Reel
MMQA6V8T1 6A8 SC74 3,000/Tape & Reel
MMQA12VT1 12A SC74 3,000/Tape & Reel
MMQA13VT1 13A SC74 3,000/Tape & Reel
MMQA15VT1 15A SC74 3,000/Tape & Reel
MMQA18VT1 18A SC74 3,000/Tape & Reel
MMQA20VT1 20A SC74 3,000/Tape & Reel
MMQA20VT3 20A SC74 10,000/Tape & Reel
MMQA21VT1 21A SC74 3,000/Tape & Reel
MMQA22VT1 22A SC74 3,000/Tape & Reel
MMQA24VT1 24A SC74 3,000/Tape & Reel
MMQA27VT1 27A SC74 3,000/Tape & Reel
MMQA27VT3 27A SC74 10,000/Tape & Reel
MMQA33VT1 33A SC74 3,000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
*Include SZ-prefix devices where applicable.
Mechanical Characteristics:
CASE: Voidfree, Transfermolded, Thermosetting Plastic Case.
FINISH: Corrosion resistant finish, easily solderable.
Package designed for optimal automated board assembly.
Small package size for high density applications.
Available in 8 mm Tape and Reel.
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel.
MMQA, SZMMQA Quad Common Anode Series
http://onsemi.com
7
PACKAGE DIMENSIONS
SC74
CASE 318F05
ISSUE M
23
456
D
1
e
b
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F01, 02, 03, 04 OBSOLETE. NEW STANDARD
318F05.
C
L
0.7
0.028
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.95
0.037
ǒmm
inchesǓ
SCALE 10:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 1.00 1.10 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.25 0.37 0.50 0.010
c0.10 0.18 0.26 0.004
D2.90 3.00 3.10 0.114
E1.30 1.50 1.70 0.051
e0.85 0.95 1.05 0.034
0.20 0.40 0.60 0.008
0.039 0.043
0.002 0.004
0.015 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
NOM MAX
2.50 2.75 3.00 0.099 0.108 0.118
HE
L
0°10°0°10°
q
q
STYLE 1:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
MMQA/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative