GE
Data Sheet
September 25, 2015 ©2015 General Electric Company. All rights reserved.
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
Features
Compliant to RoHS EU Directive 2011/65/EU (-Z
versions)
Compliant to RoHS EU Directive 2011/65/EU under
exemption 7b (Lead solder exemption). Exemption 7b
will expire after June 1, 2016 at which time this product
will no longer be RoHS compliant (non-Z versions)
Delivers up to 3A output current
High efficiency – 94% at 3.3V full load (VIN = 5.0V)
Small size and low profile:
20.3 mm x 11.4 mm x 7.27 mm
(0.80 in x 0.45 in x 0.286 in)
Low output ripple and noise
High Reliability:
Calculated MTBF = 11.9M hours at 25oC Full-load
Constant switching frequency (300 kHz)
Output voltage programmable from 0.75 Vdc to
3.63Vdc via external resistor
Line Regulation: 0.4% (typical)
Load Regulation: 0.4% (typical)
Temperature Regulation: 0.4 % (typical)
Remote On/Off
Output overcurrent protection (non-latching)
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-03
Certified, and VDE‡ 0805:2001-12 (EN60950-1) Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Description
Austin MiniLynx
TM SMT (surface mount technology) power modules are non-isolated dc-dc converters that can deliver up to
3A of output current with full load
efficiency of 94.0% at 3.3V output. These modules provide a precisely regulated output
voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (V
IN = 2.4 –
5.5Vdc). Their open
-frame construction and small footprint enable designers to develop cost- and space-efficient solutions.
*
UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All VIN -0.3 5.8 Vdc
Continuous
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage VO,set ≤ VIN – 0.5V VIN 2.4 5.5 Vdc
Maximum Input Current All IIN,max 3.0 Adc
(VIN= VIN, min to VIN, max, IO=IO, max VO,set = 3.3Vdc)
Input No Load Current VO,set = 0.75Vdc IIN,No load 10 mA
(VIN = 5.0Vdc, IO = 0, module enabled) VO,set = 3.3Vdc IIN,No load 17 mA
Input Stand-by Current All IIN,stand-by 0.6 mA
(VIN = 5.0Vdc, module disabled)
Inrush Transient All I2t 0.04 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All 35 mAp-p
Input Ripple Rejection (120Hz) All 30 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a
complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety
and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A
(see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input
current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point All VO, set -2.0 VO, set +2.0 % VO, set
(VIN=IN, min, IO=IO, max, TA=25°C)
Output Voltage All VO, set -3% +3% % VO, set
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Adjustment Range All VO 0.7525 3.63 Vdc
Selected by an external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max) All 0.4 % VO, set
Load (IO=IO, min to IO, max) All 0.4 % VO, set
Temperature (Tref=TA, min to TA, max) All 0.4 % VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max
Cout = 1μF ceramic//10μFtantalum capacitors)
RMS (5Hz to 20MHz bandwidth) All 10 15 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 25 50 mVpk-pk
External Capacitance
ESR ≥ 1 mΩ All CO, max 1000 μF
ESR ≥ 10 mΩ All CO, max 5000 μF
Output Current All Io 0 3 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 220 % Io
(VO= 90% of VO, set)
Output Short-Circuit Current All IO, s/c 2 Adc
(VO≤250mV) ( Hiccup Mode )
Efficiency
V
O,set
=
0 75Vdc
η 81.5 %
VIN= VIN, nom, TA=25°C VO, set = 1.2Vdc η 87.0 %
IO=IO, max , VO= VO,set VO,set = 1.5Vdc η 89.0 %
VO,set = 1.8Vdc η 90.0 %
VO,set = 2.5Vdc η 93.0 %
VO,set = 3.3Vdc η 94.0 %
Switching Frequency All fsw 300 kHz
Dynamic Load Response
(dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) All Vpk 250 mV
Load Change from Io= 50% to 100% of Io,max; 1μF
ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation)
All ts 50 µs
(dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) All Vpk 250 mV
Load Change from Io= 100% to 50%of Io,max: 1μF
ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation)
All ts 50 µs
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
4
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Dynamic Load Response
(dIo/dt=2.5A/µs; V VIN = VIN, nom; TA=25°C) All Vpk 60 mV
Load Change from Io= 50% to 100% of Io,max;
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
All ts 100 µs
(dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) All Vpk 60 mV
Load Change from Io= 100% to 50%of Io,max:
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
All ts 100 µs
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (IO=IO, max, TA=25°C) 11,965,153 Hours
Weight 2.8 (0.1) g (oz.)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
On/Off Signal interface
Device code with Suffix “4” – Positive logic
(On/Off is open collector/drain logic input;
Signal referenced to GND - See feature description section)
Input High Voltage (Module ON) All VIH ― ― VIN, max V
Input High Current All IIH ― ― 10 μA
Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V
Input Low Current All IIL ― 0.2 1 mA
Device Code with no suffix – Negative Logic
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Input High Voltage (Module OFF) All VIH 1.5 ― VIN,max Vdc
Input High Current All IIH 0.2 1 mA
Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc
Input low Current All IIL ― 10 μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN = VIN, nom, TA = 25 oC, )
Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (delay from
instant at which V
IN
=V
IN, min
until Vo=10% of Vo,set)
All
Tdelay
―
3.9
―
msec
Case 2: Input power is applied for at least one second
and then the On/Off input is set to logic Low (delay from
instant at which Von/Off=0.3V until Vo=10% of Vo, set)
All
Tdelay
―
3.9
―
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
―
4.2
8.5
msec
Output voltage overshoot – Startup ―
1
% VO, set
IO= IO, max; VIN = 3.0 to 5.5Vdc, TA = 25 oC
Remote Sense Range ― ― 0.5
Overtemperature Protection
All Tref 140 °C
(See Thermal Consideration section)
Input Undervoltage Lockout
Turn-on Threshold All 2.2 V
Turn-off Threshold All 2.0 V
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
6
Characteristic Curves
The following figures provide typical characteristics for the Austin MiniLynxTM SMT modules at 25ºC.
EFFICIENCY, η (%)
70
73
76
79
82
85
88
91
94
0 0.6 1.2 1.8 2.4 3
V
IN
= 5.0V
V
IN
= 3.3V
V
IN
= 2.5V
EFFICIENCY, η (%)
73
76
79
82
85
88
91
94
97
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 3.3V
VIN = 2.5V
OUTPUT CURRENT, I
O
(A)
OUTPUT CURRENT, I
O
(A)
Figure 1. Converter Efficiency versus Output Current (Vout =
0.75Vdc).
Figure 4. Converter Efficiency versus Output Current (Vout =
1.8Vdc).
EFFICIENCY, η (%)
70
73
76
79
82
85
88
91
94
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 3.3V
VIN = 2.5V
EFFICIENCY, η (%)
OUTPUT CURRENT, I
O
(A)
OUTPUT CURRENT, I
O
(A)
Figure 2. Converter Efficiency versus Output Current (Vout =
1.2Vdc).
Figure 5. Converter Efficiency versus Output Current (Vout =
2.5Vdc).
EFFICIENCY, η (%)
72
75
78
81
84
87
90
93
96
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 3.3V
VIN = 2.5V
EFFICIENCY, η (%)
OUTPUT CURRENT, I
O
(A)
OUTPUT CURRENT, I
O
(A)
Figure 3. Converter Efficiency versus Output Current
(Vout =
1.5Vdc).
Figure 6. Converter Efficiency versus Output Current (Vout =
3.3Vdc).
74
77
80
83
86
89
92
95
98
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 4.0V
VIN = 3.3V
75
78
81
84
87
90
93
96
99
0 0.6 1.2 1.8 2.4 3
VIN = 5.5V
VIN = 5.0V
VIN = 4.0V
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reser
ved. Page
7
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MiniLynxTM SMT modules at 25ºC.
INPUT CURRENT, IIN (A)
0
0.5
1
1.5
2
2.5
3
3.5
012 3 4 5
Io=1.5A
Io=0A
Io=3A
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
INPUT VOLTAGE, VIN (V)
TIME, t (20 µs/div)
Figure 7. Input voltage vs. Input Current
(Vout =2.5Vdc).
Figure 10. Transient Response to Dynamic Load Change
from 50% to 100% of full load (Vo = 3.3Vdc).
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
TIME, t (1µs/div)
TIME, t (20 µs/div)
Figure 8. Typical Output Ripple and Noise
(VIN = 5.0V dc, Vo = 0.75Vdc, Io=3A).
Figure 11. Transient Response to Dynamic Load Change
from 100% to 50% of full load (Vo = 3.3 Vdc).
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (20mV/div)
TIME, t (1µs/div)
TIME, t (100µs/div)
Figure 9. Typical Output Ripple and Noise
(VIN = 5.0V dc, Vo = 3.3Vdc, Io=3A).
Figure 12. Transient Response to Dynamic Load Change
from 50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150
μF Polymer Capacitors).
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
8
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MiniLynxTM SMT modules at 25ºC.
OUTPUT CURRENT, OUTPUTVOLTAGE
IO (A) (2A/div) VO (V) (20mV/div)
INPUT VOLTAG OUTPUT VOLTAGE VIN
(V) (2V/div) VO (V) (1V/div)
TIME, t (100µs/div)
TIME, t (2ms/div)
Figure 13. Transient Response to Dynamic Load Change
from 100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150 μF
Polymer Capacitors).
Figure 16. Typical Start-Up with application of Vin
(VIN = 5.0Vdc, Vo = 3.3Vdc, Io = 3A).
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off(V) (2V/div) VO (V) (1V/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off(V) (2V/div) VO (V) (0.5V/div)
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 14. Typical Start-Up Using Remote On/Off
(VIN = 5.0Vdc, Vo = 3.3Vdc, Io = 3A).
Figure 17 Typical Start-Up Using Remote On/Off with
Prebias (VIN = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias
=1.0Vdc).
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off(V) (2V/div) VO (V) (1V/div)
OUTPUT CURRENT,
IO (A) (5A/div)
TIME, t (2ms/div)
TIME, t (10ms/div)
F
igure 15. Typical Start-Up Using Remote On/Off with Low-
ESR external capacitors (7x150uF Polymer)
(VIN = 5.0Vdc, Vo = 3.3Vdc, Io = 3A, Co = 1050
µ
F).
Figure 18. Output short circuit Current
(VIN = 5.0Vdc, Vo = 0.75Vdc).
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reser
ved. Page
9
Characteristic Curves (continued)
The following figures provide thermal derating curves for the Austin MiniLynxTM SMT modules.
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
AMBIENT TEMPERATURE, T
A
OC
AMBIENT TEMPERATURE, T
A
OC
Figure 19. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 5.0, Vo=3.3Vdc).
Figure 22. Derating Output Current versus Local
Ambient Temperature and Airflow (VIN = 3.3dc, Vo=2.5
Vdc).
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
AMBIENT TEMPERATURE, T
A
OC
Figure 20. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 5.0Vdc, Vo=1.8 Vdc).
Figure 23. Derating Output Current versus Local
Ambient Temperature and Airflow (VIN = 3.3dc, Vo=1.2
Vdc).
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
AMBIENT TEMPERATURE, TA OC
Figure 21. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 5.0Vdc, Vo=0.75 Vdc).
Figure 24. Derating Output Current versus Local
Ambient Temperature and Airflow (VIN = 3.3dc, Vo=0.75
Vdc).
Test Configurations
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
10
TO OSCILLOSCOPE
CURRENT PROBE
L
TEST
1μH
BATTERY
C
S
1000μF
Electrolytic
E.S.R.<0.1Ω
@ 20°C 100kHz
2x100μF
Tantalum
V
IN
(+)
COM
NOTE: Measure input ref l ect ed ripple current with a sim ulated
source inductance (LTEST) of 1μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
C
IN
Figure 25. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurem ents to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
COM
1uF
.
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
Figure 26. Output Ripple and Noise Test Setup.
V
O
COM
V
IN
(+)
COM
R
LOAD
R
contact
R
distribution
R
contact
R
distribution
R
contact
R
contact
R
distribution
R
distribution
V
IN
V
O
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvi n c onnect i ons are requ ired at th e m odu l e t ermi n als
to avoi d m eas urem en t er r ors due to s oc k et c ont act
resistance.
Figure 27. Output Voltage and Efficiency Test Setup.
η
=
V
O
.
I
O
V
IN
.
I
IN
x
100
%
Efficiency
Design Considerations
Input Filtering
The Austin MiniLynxTM SMT module should be connected to a
low-impedance source. A highly inductive source can affect
the stability of the module. An input capacitance must be
placed directly adjacent to the input pin of the module, to
minimize input ripple voltage and ensure module stability.
To minimize input voltage ripple, low-ESR polymer and
ceramic capacitors are recommended at the input of the
module. Figure 28 shows the input ripple voltage (mVp-p)
for various outputs with 1x22µF (TDK: C3225X5R0J226V)
ceramic capacitor at the input of the module. Figure 29
shows the input ripple with 1x47µF (TDK: C3225X5R0J476M)
ceramic capacitor at full load.
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
140
160
0 0.5 1 1.5 2 2.5 3 3.5
3.3Vin
5Vin
Output Voltage (Vdc)
Figure 28. Input ripple voltage for various outputs with
1x22 µF ceramic capacitor at the input (full-load).
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
140
160
0 0.5 1 1.5 2 2.5 3 3.5
3.3Vin
5Vin
Output Voltage (Vdc)
Figure 29. Input ripple voltage for various outputs with
1x47 µF ceramic capacitor at the input (full load).
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
11
Design Considerations (continued)
Output Filtering
The Austin MiniLynxTM SMT module is designed for low
output ripple voltage and will meet the maximum output
ripple specification with 1 µF ceramic and 10 µF tantalum
capacitors at the output of the module. However, additional
output filtering may be required by the system designer for
a number of reasons. First, there may be a need to further
reduce the output ripple and noise of the module. Second,
the dynamic response characteristics may need to be
customized to a particular load step change.
To reduce the output ripple and improve the dynamic
response to a step load change, additional capacitance at
the output can be used. Low ESR polymer and ceramic
capacitors are recommended to improve the dynamic
response of the module. For stable operation of the module,
limit the capacitance to less than the maximum output
capacitance as specified in the electrical specification table.
Safety Considerations
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards, i.e.,
UL 60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-
12 (EN60950-1) Licensed.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the input
must meet SELV requirements. The power module has
extra-low voltage (ELV) outputs when all inputs are ELV.
The input to these units is to be provided with a fast-acting
fuse with a maximum rating of 6A in the positive input lead.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
12
Feature Description
Remote On/Off
The Austin MiniLynxTM SMT power modules feature an
On/Off pin for remote On/Off operation. Two On/Off logic
options are available in the Austin MiniLynxTM series
modules. Positive Logic On/Off signal, device code suffix “4”,
turns the module ON during a logic High on the On/Off pin
and turns the module OFF during a logic Low. Negative
logic On/Off signal, no device code suffix, turns the module
OFF during logic High on the On/Off pin and turns the
module ON during logic Low.
For positive logic modules, the circuit configuration for using
the On/Off pin is shown in Figure 30. The On/Off pin is an
open collector/drain logic input signal (Von/Off) that is
referenced to ground. During a logic-high (On/Off pin is
pulled high internal to the module) when the transistor Q1 is
in the Off state, the power module is ON. Maximum
allowable leakage current of the transistor when Von/off =
VIN,max is 10µA. Applying a logic-low when the transistor Q1
is turned-On, the power module is OFF. During this state
VOn/Off must be less than 0.3V. When not using positive
logic On/off pin, leave the pin unconnected or tie to VIN.
Q1
R2
R1 Q2
R3
R4
Q3 CSS
GND
VIN+
ON/OFF
PW M Enable
+
_
ON/OFF
V
I
ON/OFF
MODULE
Figure 30. Circuit configuration for using positive logic
On/OFF.
For negative logic On/Off devices, the circuit configuration is
shown is Figure 31. The On/Off pin is pulled high with an
external pull-up resistor (typical Rpull-up = 5k, +/- 5%). When
transistor Q1 is in the Off state, logic High is applied to the
On/Off pin and the power module is Off. The minimum
On/off voltage for logic High on the On/Off pin is 1.5Vdc. To
turn the module ON, logic Low is applied to the On/Off pin by
turning ON Q1. When not using the negative logic On/Off,
leave the pin unconnected or tie to GND.
Q1
R1
R2
Q2 CSS
GND
PW M Enable
ON/OFF
VIN+
ON/OFF
_
+
V
I
MODULE
pull-up
R
ON/OFF
Figure 31. Circuit configuration for using negative logic
On/OFF.
Overcurrent Protection
To provide protection in a fault (output overload) condition,
the unit is equipped with internal current-limiting circuitry
and can endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back
into its specified range. The typical average output current
during hiccup is 2A.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
module operation is disabled. The module will begin to
operate at an input voltage above the undervoltage lockout
turn-on threshold.
Overtemperature Protection
To provide over temperature protection in a fault
condition, the unit relies upon the thermal protection
feature of the controller IC. The unit will shutdown if the
thermal reference point Tref, exceeds 140oC (typical), but
the thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating. The
module will automatically restart after it cools down.
Output Voltage Programming
The output voltage of the Austin MiniLynxTM SMT can be
programmed to any voltage from 0.75 Vdc to 3.63 Vdc by
connecting a single resistor (shown as Rtrim in Figure 32)
between the TRIM and GND pins of the module. Without an
external resistor between TRIM pin and the ground, the
output voltage of the module is 0.7525 Vdc. To calculate the
value of the resistor Rtrim for a particular output voltage Vo,
use the following equation:
Ω
−
−
=5110
7525.0
21070
Vo
Rtrim
Feature Descriptions (continued)
Output Voltage Programming (continued)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
13
For example, to program the output voltage of the Austin
MiniLynxTM module to 1.8 Vdc, Rtrim is calculated is follows:
−
−
=5110
7525
.0
8.
1
21070
Rtrim
Ω= kRtrim 004.15
V
O
(+)
TRIM
GND
R
trim
LOAD
V
IN
(+)
ON/OFF
Figure 32. Circuit configuration to program output
voltage using an external resistor.
Table 1 provides Rtrim values required for some common
output voltages.
Table 1
V
O, set
(V)
Rtrim (KΩ)
0.7525
Open
1.2
41.973
1.5
23.077
1.8
15.004
2.5
6.947
3.3
3.160
Using 1% tolerance trim resistor, set point tolerance of
±2% is achieved as specified in the electrical
specification. The POL Programming Tool, available at
www.gecriticalpower.com under the Design Tools section,
helps determine the required external trim resistor
needed for a specific output voltage.
Voltage Margining
Output voltage margining can be implemented in the Austin
MiniLynxTM modules by connecting a resistor, Rmargin-up, from
the Trim pin to the ground pin for margining-up the output
voltage and by connecting a resistor, Rmargin-down, from the
Trim pin to the Output pin for margining-down. Figure 33
shows the circuit configuration for output voltage
margining. The POL Programming Tool, available at
www.gecriticalpower.com under the Design Tools section,
also calculates the values of Rmargin-up and Rmargin-down for a
specific output voltage and % margin. Please consult your
local GE technical representative for additional details.
Vo
Austin Lynx or
Lynx II Series
GND
Trim
Q1
Rtrim
Rmargin-up
Q2
Rmargin-down
Figure 33. Circuit Configuration for margining Output
voltage.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
14
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should always be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel. The test set-up is shown in Figure
35. Note that the airflow is parallel to the long axis of the
module as shown in figure 34. The derating data applies to
airflow in either direction of the module’s long axis.
Figure 34. Tref Temperature measurement
location.
The thermal reference point, Tref used in the specifications is
shown in Figure 34. For reliable operation this temperature
should not exceed 115oC.
The output power of the module should not exceed the
rated power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.
Figure 35. Thermal Test Set-up.
Air
flow
x
Power Module
Wind Tunnel
PWBs
5.97_
(0.235)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
15
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Co-planarity (max): 0.102 [0.004]
BOTTOM VIEW SIDE VIEW
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
16
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
PIN
FUNCTION
1
On/Off
2
V
IN
3
GND
4
Trim
5
V
OUT
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
17
Packaging Details
The Austin MiniLynxTM SMT version is supplied in tape & reel as standard. Modules are shipped in quantities of 400 modules per
reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions
Outside diameter: 330.2 mm (13.00)
Inside diameter: 177.8 mm (7.00”)
Tape Width: 44.0 mm (1.73”)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
18
Surface Mount Information
Pick and Place
The Austin MiniLynxTM SMT modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
placing. The label meets all the requirements for surface
mount processing, as well as safety standards and is able to
withstand maximum reflow temperature. The label also
carries product information such as product code, serial
number and location of manufacture.
Figure 36. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and pick & placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
3mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MiniLynxTM SMT power modules are lead free
modules and can be soldered either in a lead-free solder
process or a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must
be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
The Austin MiniLynxTM SMT power modules are lead free
modules and can be soldered either in a lead-free solder
process or a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must
be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.
REFLOW TEMP (°C)
REFLOW TIME (S)
Figure 37. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX TEMP SOLDER (°C)
Figure 38. Time Limit Curve Above 205oC Reflow for Tin
Lead (Sn/Pb) process.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
September 25, 2015
©2015 General Electric Company. All rights reserved.
Page
19
Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MiniLynx SMT modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules and
can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 39.
MSL Rating
The Austin MiniLynxTM SMT modules have a MSL rating of
2a.
Storage and Handling
The Austin MiniLynxTM modules have a MSL rating of 1. The
recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to Board Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Ref low Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 39. Recommended linear reflow profile using
Sn/Ag/Cu solder.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s)
or information.
September 25, 2015 ©2015 General Electric Company. All International rights reserved. Version 1.15
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 2. Device Codes
Device Code Input
Voltage Range
Output
Voltage
Output
Current
Efficiency
3.3V@ 3A
On/Off
Logic
Connector
Type Comcodes
AXH003A0X-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 3 A 94.0 % Negative SMT 108991196
AXH003A0X-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 3 A 94.0 % Negative SMT CC109101301
AXH003A0X4-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 3 A 94.0 % Positive SMT 108991205
AXH003A0X4-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 3 A 94.0 % Positive SMT 109100014
-Z refers to RoHS-compliant codes
