5-V Low Drop Fixed Voltage Regulator
TLE 4275
Data Sheet 1 Rev. 1.7, 2007-02-19
d
Type Package
TLE 4275 PG-TO220-5-11 (RoHS compliant)
TLE 4275 D PG-TO252-5-11 (RoHS compliant)
TLE 4275 G PG-TO263-5-1 (RoHS compliant)
TLE 4275 S PG-TO220-5-12 (RoHS compliant)
P-TO220-5-11
PG-TO220-5-11
P-TO252-5-11
PG-TO252-11
P-TO263-5-1
PG-TO263-5-1
P
-TO220-5-12
PG-TO220-5-12
Features
Output voltage 5 V ± 2%
Very low current consumption
Power-on and undervoltage reset
Reset low down to VQ = 1 V
Very low-drop voltage
Short-circuit-proof
Reverse polarity proof
Suitable for use in automotive electronics
ESD protection > 4 kV
Green Product (RoHS compliant) version of TLE 4275
AEC qualified
Functional Description
The TLE 4275 is a monolithic integrated low-drop
voltage regulator in a 5-pin TO-package. An input
voltage up to 45 V is regulated to VQ,nom = 5.0 V. The IC
is able to drive loads up to 450 mA and is short-circuit
proof. At overtemperature the TLE 4275 is turned off by
the incorporated temperature protection. A reset signal
is generated for an output voltage VQ,rt of typ. 4.65 V.
The delay time can be programmed by the external
delay capacitor.
Data Sheet 2 Rev. 1.7, 2007-02-19
TLE 4275
Dimensioning Information on External Components
The input capacitor CI is necessary for compensation of line influences. Using a resistor
of approx. 1 in series with CI, the oscillating of input inductivity and input capacitance
can be damped. The output capacitor CQ is necessary for the stability of the regulation
circuit. Stability is guaranteed at values CQ 22 µF and an ESR of 5 within the
operating temperature range.
Circuit Description
The control amplifier compares a reference voltage to a voltage that is proportional to the
output voltage and drives the base of the series transistor via a buffer. Saturation control
as a function of the load current prevents any oversaturation of the power element. The
IC also incorporates a number of internal circuits for protection against:
Overload
Overtemperature
Reverse polarity
TLE 4275
Data Sheet 3 Rev. 1.7, 2007-02-19
Figure 1 Pin Configuration (top view)
Table 1 Pin Definitions and Functions
Pin No. Symbol Function
1IInput; block to ground directly at the IC by a ceramic capacitor.
2ROReset Output; open collector output
3GNDGround; Pin 3 internally connected to heatsink
4DReset Delay; connect capacitor to GND for setting delay time
5QOutput; block to ground with a 22 µF capacitor,
ESR < 5 at 10 kHz.
AEP02580
15
ROΙDQ
GND
AEP02756
GNDΙRO Q
D
GND
RO
Ι
IEP02528
DQ
PG-TO252-5-11
PG-TO263-5-1
PG-TO220-5-11
IEP02527
ΙRO
GNDDQ
PG-TO220-5-12
Data Sheet 4 Rev. 1.7, 2007-02-19
TLE 4275
Figure 2 Block Diagram
AEB02425
Buffer
Reference
Bandgap
Protection
Circuit
Control and
Saturation
Temperature
Sensor
Reset
Generator
I
Q
D
RO
1 5
2
4
3
TLE 4275
Data Sheet 5 Rev. 1.7, 2007-02-19
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
Table 2 Absolute Maximum Ratings
Parameter Symbol Limit Values Unit Test Condition
Min. Max.
Input
Voltage VI-42 45 V
Current II Internally limited
Output
Voltage VQ-1.0 16 V
Current IQ Internally limited
Reset Output
Voltage VRO -0.3 25 V
Current IRO – 5 5 mA
Reset Delay
Voltage VD-0.3 7 V
Current ID-2 2 mA
Temperature
Junction temperature Tj-40 150 °C–
Storage temperature Tstg -50 150 °C–
Table 3 Operating Range
Parameter Symbol Limit Values Unit Remarks
Min. Max.
Input voltage VI5.5 42 V
Junction temperature Tj-40 150 °C–
Thermal Resistance
Junction case Rthjc –4K/W
Junction ambient Rthj-a –53K/WTO263
1)
1) Worst case, regarding peak temperature; zero airflow; mounted on a PCB FR4, 80 × 80 × 1.5 mm3, heat sink
area 300 mm2
Junction ambient Rthj-a –78K/WTO252
1)
Junction ambient Rthj-a –65K/WTO220
Data Sheet 6 Rev. 1.7, 2007-02-19
TLE 4275
Table 4 Characteristics
VI = 13.5 V; -40 °C < Tj < 150 °C (unless otherwise specified)
Parameter Symbol Limit Values Unit Measuring
Condition
Min. Typ. Max.
Output
Output voltage VQ4.9 5.0 5.1 V 5 mA < IQ < 400 mA
6 V < VI < 28 V
Output voltage VQ4.9 5.0 5.1 V 5 mA < IQ < 200 mA
6 V < VI < 40 V
Output current
limitation1)
IQ450 700 mA
Current consumption;
Iq = II - IQ
Iq 150 200 µAIQ = 1 mA;
Tj = 25 °C
Current consumption;
Iq = II - IQ
Iq 150 220 µAIQ = 1 mA;
Tj 85 °C
Current consumption;
Iq = II - IQ
Iq–510mAIQ = 250 mA
Current consumption;
Iq = II - IQ
Iq–1222mAIQ = 400 mA
Drop voltage1) Vdr 250 500 mV IQ = 300 mA;
Vdr = VI - VQ
Load regulation VQ–1530mVIQ = 5 mA to 400 mA
Line regulation VQ-15 5 15 mV Vl = 8 V to 32 V
IQ = 5 mA
Power supply ripple
rejection
PSRR –60dBfr = 100 Hz;
Vr = 0.5 Vpp
Temperature output
voltage drift
dVQ/dT–0.5mV/K
TLE 4275
Data Sheet 7 Rev. 1.7, 2007-02-19
Reset Timing D and Output RO
Reset switching
threshold
VQ,rt 4.5 4.65 4.8 V
Reset output low voltage VROL –0.20.4V Rext 5 k;
VQ > 1 V
Reset output leakage
current
IROH –010µAVROH = 5 V
Reset charging current ID,c 3.0 5.5 9.0 µAVD = 1 V
Upper timing threshold VDU 1.5 1.8 2.2 V
Lower timing threshold VDRL 0.2 0.4 0.7 V
Reset delay time trd 10 16 22 ms CD = 47 nF
Reset reaction time trr –0.52µsCD = 47 nF
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
Table 4 Characteristics (cont’d)
VI = 13.5 V; -40 °C < Tj < 150 °C (unless otherwise specified)
Parameter Symbol Limit Values Unit Measuring
Condition
Min. Typ. Max.
Data Sheet 8 Rev. 1.7, 2007-02-19
TLE 4275
Figure 3 Test Circuit
Figure 4 Reset Timing
AES02472
D
V
I
D
C
47 nF
GND
RO
5 k
V
Q
V
RO
D
V
D, d
I
100 nF
I
C
2
1000 µF
C
I
1
Q
22 µF
C
Q
R
ext
1
4
5
2
3
I
I I
Q
RO
I
GND
I
D, c
I
I
AED03010
Thermal
trd
Power-on-Reset Voltage Dip Secondary Overload
at OutputSpike
VΙ
D,c
Ι
=
Vd
dt
VQ
Q, rt
V
trr
<
rr
t
at Input Undervoltage
Shutdown
CD
t
VRO
D
V
t
t
t
VDU
VDRL
Data Sheet 9 Rev. 1.7, 2007-02-19
TLE 4275
Output Voltage VQ versus
Temperature Tj
Output Voltage VQ versus
Temperature Tj
Output Current IQ versus Temperature
Tj
Output Voltage VQ versus
Input Voltage VI
AED03029
-40 04080120 ˚C 16
0
4.6
j
T
Q
V
V
I
= 13.5 V
4.7
4.8
4.9
5.0
5.1
V
5.2
AED03029
-40 04080120 C 16
0
2.9
j
T
Q
V
V
I
= 13.5 V
3.0
3.1
3.2
3.3
3.4
V
3.5
AED03034
-40 04080120 ˚C 16
0
0
j
T
200
400
600
800
1000
mA
1200
Q
I
R
6
4
2
04
02
8
12
10
Q
VV
10
V
68
VΙ
AED01929
= 25
L
Data Sheet 10 Rev. 1.7, 2007-02-19
TLE 4275
Output Current IQ versus
Input Voltage VI
Current Consumption Iq
versus Output Current IQ
Current Consumption Iq
versus Output Current IQ
Drop Voltage Vdr versus
Output Current IQ
AED03030
0 10 20 30 40 V5
0
0
0.4
0.8
1.2
A
1.0
0.6
0.2
I
V
I
Q
= 125 ˚C
T
j
25 ˚C
00
AED03084
Ι
q
1
2
mA
3
= 13.5 V
mA
Ι
V
20 40 60 80 120
Q
Ι
00
AED03085
Ι
qmA
= 13.5 V
mA
Ι
V
100 200 300 400 600
Q
Ι
10
20
30
40
50
60
70
80
AED03031
0
0
Q
I
100
200
300
400
500
600
700
800
mV
V
dr
j
T
= 125 ˚C
25 ˚C
200 400 600 100
mA
Data Sheet 11 Rev. 1.7, 2007-02-19
TLE 4275
Charge Current ID,c
versus Temperature Tj
Delay Switching Threshold VDU, VDRL
versus Temperature Tj
AED03086
-40
0
I
V
= 13.5 V
1
2
3
4
5
6
7
8
µA
04080
120 160˚C
I
T
j
= 1 V
D
V
D, c
I
D, c
0
-40
AED03083
VDU V
= 13.5 V
˚C
Ι
V
j
T
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
04080 120 160
VDU
VDRL
VDRL
Data Sheet 12 Rev. 1.7, 2007-02-19
TLE 4275
Package Outlines
Figure 5 PG-TO220-5-11 (Plastic Transistor Single Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
GPT09064
A
A0.25 M
Typical
9.8±0.15
2.8
1)
15.65
±0.3
13.4
0...0.15
1.7 0.8±0.1
±0.11.27 4.4
9.25
±0.2
0.05
1)
All metal surfaces tin plated, except area of cut.
C
±0.2
17
±0.3
8.51)
10±0.2
3.7-0.15
C
2.4 0.5±0.1
±0.3
8.6
10.2
±0.3
±0.43.9
±0.48.4
3.7
±0.3
Y
ou can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
TLE 4275
Data Sheet 13 Rev. 1.7, 2007-02-19
Figure 6 PG-TO252-5-11 (Plastic Transistor Single Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
1
) Includes mold flashes on each side.
4.56 0.25
M
A
6.5
5.7 MAX.
±0.1
per side
0.15 MAX.
-0.2
6.22
±0.5
9.98
(4.24) 1
A
1.14
5 x 0.6
±0.15
0.8
±0.1
+0.15
-0.05
0.1
B
-0.04
+0.08
0...0.15
0.51 MIN.
0.5
B
2.3
-0.10
0.5
+0.05
-0.04
+0.08
(5)
-0.01
0.9
+0.20
B
1)
All metal surfaces tin plated, except area of cut.
GPT09527
Y
ou can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Data Sheet 14 Rev. 1.7, 2007-02-19
TLE 4275
Figure 7 PG-TO263-5-1 (Plastic Transistor Single Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
BA0.25
M
±0.2
GPT0911
3
10
8.5
1)
(15)
±0.2
9.25 ±0.3
1
0...0.15
5 x 0.8
±0.1
±0.1
1.27
4.4
B
0.5
±0.1
±0.3
2.7
4.7±0.5
2.4
1.7
0...0.3 A
1)
7.55
4 x
All metal surfaces tin plated, except area of cut.
Metal surface min. X = 7.25, Y = 6.9
Typical
1)
0.1 B
0.1
0.05
8˚ MAX.
GPT09113
Y
ou can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
TLE 4275
Data Sheet 15 Rev. 1.7, 2007-02-19
Figure 8 PG-TO220-5-12 (Plastic Transistor Single Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products
and to be compliant with government regulations the device is available as a green
product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable
for Pb-free soldering according to IPC/JEDEC J-STD-020).
GPT09065
A
BA0.25 M
Typical
9.8±0.15
2.8
1)
15.65±0.3
13.4
0...0.15
1.7 0.8±0.1
±0.11.27 4.4
B
9.25±0.2
0.05
1) All metal surfaces tin plated, except area of cut.
C
±0.2
17±0.3
8.51)
10±0.2
3.7-0.15
C
2.4 0.5±0.1
13±0.5
±0.511
6x
Y
ou can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Data Sheet 16 Rev. 1.7, 2007-02-19
TLE 4275
TLE 4275
Revision History: 2007-02-19 Rev. 1.7
Previous Version: 1.6
Page Subjects (major changes since last revision)
general Removed all information related to the TLE4275v33 Product Proposal.
(See separate datasheet for the TLE4275v33)
general Updated Infineon logo
#1 Added “AEC” and “Green” logo
#1 Added “Green Product” and “AEC qualified” to the feature list
#1 Updated Package Names to “PG-xxx”
general Removed leadframe variant “P-TO-252-1”
#12 to #15 Added “Green Product” remark
#17 Disclaimer Update
Edition 2007-02-19
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
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