Feb. 2009
3
MITSUBISHI IGBT MODULES
CM150RL-24NF
HIGH POWER SWITCHING USE
IC = 15mA, VCE = 10V
Tj = 25°C
Tj = 125°C
VCE = 10V
VGE = 0V
VCE = VCES, VGE = 0V
±VGE = VGES, VCE = 0V
IC = 150A, VGE = 15V
VCC = 600V, IC = 150A, VGE = 15V
VCC = 600V, IC = 150A
VGE = ±15V
RG = 2.1Ω, Inductive load
IE = 150A
IE = 150A, VGE = 0V
IGBT part (1/6 module)*1
FWDi part (1/6 module)*1
Case to heat sink, Thermal compound Applied (1/6 module)
*2
1
0.5
3.0
—
23
2
0.45
—
130
70
400
350
150
—
3.8
0.14
0.23
—
31
mA
µA
nF
nF
nF
nC
ns
ns
ns
ns
µC
V
K/W
K/W
K/W
Ω
—
—
2.1
2.4
—
—
—
675
—
—
—
—
—
5.8
—
—
—
0.051
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2.1
7V
V
68
ns
Collector cutoff current
Gate leakage current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Contact thermal resistance
External gate resistance
Gate-emitter threshold voltage
Collector-emitter saturation voltage
Thermal resistance
ICES
IGES
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (
Note 1
)
Qrr (
Note 1
)
VEC(
Note 1
)
Rth(j-c)Q
Rth(j-c)R
Rth(c-f)
RG
Symbol Parameter
VGE(th)
VCE(sat)
Unit
Typ.
Limits
Min. Max.
Test conditions
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
INVERTER PART
IC = 7.5mA, VCE = 10V
Tj = 25°C
Tj = 125°C
VCE = 10V
VGE = 0V
VCE = VCES, VGE = 0V
±VGE = VGES, VCE = 0V
IC = 75A, VGE = 15V
VCC = 600V, IC = 75A, VGE = 15V
IF = 75A
IGBT part*1
Clamp diode part*1
1
0.5
3.0
—
11.5
1.0
0.23
—
3.8
0.24
0.36
42
mA
µA
nF
nF
nF
nC
V
K/W
K/W
Ω
—
—
2.1
2.4
—
—
—
338
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4.2
7V
V
68
Collector cutoff current
Gate leakage current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Forward voltage drop
Thermal resistance
External gate resistance
Gate-emitter threshold voltage
Collector-emitter saturation voltage
ICES
IGES
Cies
Coes
Cres
QG
VFM
Rth(j-c)Q
Rth(j-c)R
RG
Symbol Parameter
VGE(th)
VCE(sat)
*1 : Case temperature (Tc) measured point is just under the chips.
If you use this value, Rth(f-a) should be measured just under the chips.
*2 : Typical value is measured by using thermally conductive grease of
λ
= 0.9[W/(m • K)].
Note 1. IE, VEC, trr & Qrr represent characteristics of the anti-parallel, emitter-collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Unit
Typ.
Limits
Min. Max.
Test conditions
BRAKE PART