BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
µµ
µ
PC2710TB
5 V, SUPER MINIMOLD SILICON MMIC
MEDIUM OUTPUT POWER AMPLIFIER
Document No. P13443EJ3V0DS00 (3rd edition)
Date Published January 2001 N CP(K)
DATA SHEET
DESCRIPTION
The
µ
PC2710TB is a silicon monolithic integrated circuit designed as PA driver for 900 MHz band cellular
telephone tuners. This IC is packaged in super minimold package which is smaller than conventional minimold.
This IC is manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
Supply voltage : VCC = 4.5 to 5.5 V
Circuit current : ICC = 22 mA TYP. @VCC = 5.0 V
Power gain : GP = 33 dB TYP. @ f = 500 MHz
Medium output power : PO(sat) = +13.5 dBm TYP. @ f = 500 MHz
Upper limit operating frequency : fu = 1.0 GHz TYP. @ 3 dB bandwidth
Port impedance : input/output 50
High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATION
PA driver for 900 MHz band cellular telephone
ORDERING INFORMATION
Part Number Package Marking Supplying Form
µ
PC2710TB-E3 6-pin super mini mold C1F Embossed tape 8 mm wide.
1, 2, 3 pins face the perforation side of the tape.
Qty 3 kpcs/reel.
Remark To order evaluation samples, please contact your nearby sales office.
(Part number for sample order:
µ
PC2710TB-A)
Caution Electro-static sensitive devices
The mark shows major revised points
DISCONTINUED
Data Sheet P13443EJ3V0DS
2
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PC2710TB
PIN CONNECTIONS
Pin No. Pin Name
1 INPUT
2GND
3GND
4OUTPUT
5GND
3
2
1
4
C1F
(Top View)
5
6
4
5
6
3
(Bottom View)
2
1
6V
CC
PRODUCT LINE-UP (TA = +25°
°°
°C, VCC = Vout = 5.0 V, ZS = ZL = 50
)
Part No. fu
(GHz) PO(sat)
(dBm) GP
(dB) NF
(dB) ICC
(mA) Package Marking
µ
PC2708T 6-pin minimold
µ
PC2708TB 2.9 +10.0 15 6.5 26 6-pin super minimol d C1D
µ
PC2709T 6-pin minimold
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PC2709TB 2.3 +11.5 23 5.0 25 6-pin super minimol d C1E
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PC2710T 6-pin minimold
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PC2710TB 1.0 +13.5 33 3.5 22 6-pin super minimol d C1F
µ
PC2776T 6-pin minimold
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PC2776TB 2.7 +8.5 23 6.0 25 6-pin super minimol d C2L
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Notice The package size distinguishes between minimold and super minimold.
DISCONTINUED
Data Sheet P13443EJ3V0DS 3
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PC2710TB
SYSTEM APPLICATION EXAMPLE
EXAMPLE OF 900 MHz BAND DIGITAL CELLULER TELEPHONE
DEMOD.
PLL
I
I
Q
Q
PLL
PA
TX
PC2710TB
Driver 0°
90°
SW
RX
µ
φ
DISCONTINUED
Data Sheet P13443EJ3V0DS
4
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PC2710TB
PIN EXPLANATION
Pin
No. Pin Name Applied
Voltage
(V)
Pin
Voltage
(V)Note Funct i on and A ppl i cations Internal E qui valent Circ ui t
1 INPUT 0.90 Signal input pin. A internal
matchi ng circuit , configured
with resi stors, enabl es 50
connect i on over a wide band.
A multi-feedback circuit i s
designed to cancel the
deviati ons of hFE and
resistance.
This pin must be coupled to
signal s ource with c apacitor
for DC cut.
2
3
5
GND 0 Ground pin. This pin shoul d
be connect ed t o system
ground with mini m um
inductance. Ground pattern on
the board should be f ormed
as wide as possible.
All the ground pi ns must be
connect ed together with wi de
ground pattern to decrease
impedance difference.
4 OUTPUT Voltage as
same as
VCC
through
external
inductor
Signal output pin. The
inductor m ust be attached
between VCC and output pi ns
to supply current t o t he
internal output transistors.
6V
CC 4.5 to 5.5 Power supply pin, whic h
biases the internal input
transistor.
This pin s houl d be externally
equipped with by pass
capacitor to minim i ze its
impedance.
6
4
1
23 5
Note Pin voltage is measured at VCC = 5.0 V
DISCONTINUED
Data Sheet P13443EJ3V0DS 5
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PC2710TB
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Conditions Ratings Unit
Supply V ol tage VCC TA = +25°C, pin 4 and pin 6 5.8 V
Total Circ ui t Current ICC TA = +25°C60mA
Power Dissipation PDMounted on doubl e-sided copper cl ad
50 × 50 × 1.6 mm epoxy glass PWB
TA = +85°C
270 mW
Operating Ambi ent Temperature TA40 to +85 °C
Storage Temperat ure Tstg 55 to +150 °C
Input Power Pin TA = +25°C +10 dBm
RECOMMENDED OPERATING RANGE
Parameter Symbol MIN. TYP. MAX. Unit Remark
Supply V ol tage VCC 4.5 5.0 5.5 V The same vol tage should be
applied to pin 4 and pi n 6.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = +25°
°°
°C, VCC = Vout = 5.0 V, ZS = ZL = 50
)
Parameter Symbol Test Condit i ons MIN. TYP. MAX. Unit
Circuit Current ICC No signal 16 22 29 mA
Power Gain GPf = 500 MHz 30 33 36.5 dB
Saturated Output Power PO(sat) f = 500 MHz, Pin = 8 dB m +11.0 +13.5 dBm
Noise Figure NF f = 500 M Hz 3.5 5.0 dB
Upper Limit Operating
Frequency fu3 dB down below f l at gain at f = 0. 1 GHz 0.7 1. 0 GHz
Isolat i on ISL f = 500 MHz 34 39 dB
Input Return Loss RLin f = 500 MHz 3 6 dB
Output Return Loss RLout f = 500 M Hz 9 12 dB
Gain Flatness GPf = 0.1 to 0. 6 GHz ±0.8 dB
DISCONTINUED
Data Sheet P13443EJ3V0DS
6
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PC2710TB
TEST CIRCUIT
V
CC
1 000 pF
1 000 pF 1 000 pF
C
1
C
2
L
4
6
1
2, 3, 5
50 50 OUTIN
C
3
COMPONENTS OF TEST CIRCUIT
FOR MEASURING ELECTRICAL
CHARACTERISTICS EXAMPLE OF ACTURAL APPLICATION COMPONENTS
Type Value Type Value Operating Frequency
C1, C2Bias Tee 1 000 pF C1 to C3Chip Capacitor 1 000 pF 100 MHz or higher
C3Capacitor 1 000 pF 300 nH 10 MHz or higher
L Bias Tee 1 000 nH 100 nH 100 MHz or hi gher
L Chip Inductor
10 nH 1.0 GHz or higher
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for
the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2 πRfc).
DISCONTINUED
Data Sheet P13443EJ3V0DS 7
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PC2710TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C1F
321
456
Top View
Mounting Direction
Notes
1.
2.
3.
4.
30 × 30 × 0.4 mm double sided copper clad polyimide board.
Back side: GND pattern
Solder plated on pattern
: Through holes
IN OUT
CVCC
AMP-2
CC
L
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF
6-PIN SUPER MINIMOLD SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P13252E).
COMPONENT LIST
Value
C 1 000 pF
L 300 nH
DISCONTINUED
Data Sheet P13443EJ3V0DS
8
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PC2710TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°
°°
°C)
40
30
20
10
0123456
Circuit Current ICC (mA)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
Supply Voltage VCC (V)
35
25
15
5
No signal 40
30
20
10
0
060 +20 +100
Circuit Current ICC (mA)
CIRCUIT CURRENT vs. OPERATING
AMBIENT TEMPERATURE
Operating Ambient Temperature TA (°C)
35
25
15
5
40 20 +40 +60 +80
No signal
VCC = 5.0 V
NOISE FIGURE, POWER GAIN vs. FREQUENCY
35
0.3 1.0 2.0
Power Gain GP (dB)
Frequency f (GHz)
25
0.1
4
4.5
3.5
Noise Figure NF (dB)
30
3
NF
VCC = 4.5 V VCC = 5.0 V
VCC = 5.0 V
GP
VCC = 5.5 V
VCC = 4.5 V
VCC = 5.5 V
35
0.3 1.0 2.0
Power Gain GP (dB)
Frequency f (GHz)
25
0.1
30
TA = +85°C
TA = +25°C
VCC = 5.0 V
POWER GAIN vs. FREQUENCY
TA = 40°C
0
20
30
40
0.1 0.3 1.0
Isolation ISL (dB)
Frequency f (GHz)
50
10
ISOLATION vs. FREQUENCY
2.0
VCC = 5.0 V
INPUT RETURN LOSS, OUTPUT
RETURN LOSS vs. FREQUENCY
10
20
1.0
0.3 2.0
Input Return Loss RLin (dB)
Output Return Loss RLout (dB)
Frequency f (GHz)
50
0.1
30
40
VCC = 5.0 V
0
RLin RLout
DISCONTINUED
Data Sheet P13443EJ3V0DS 9
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PC2710TB
OUTPUT POWER vs. INPUT POWER
+20
+15
+5
0
40 0+10
Output Power P
out
(dBm)
Input Power P
in
(dBm)
10
15 10 5
+10
5
15 202530 +5
V
CC
= 4.5 V
V
CC
= 5.5 V
V
CC
= 5.0 V
f = 0.5 GHz
35
OUTPUT POWER vs. INPUT POWER
+20
+15
+5
0
40 0 +10
Output Power P
out
(dBm)
Input Power P
in
(dBm)
10
15 10 5
+10
5
15 202535 +5
V
CC
= 5.0 V
f = 0.5 GHz
T
A
= 40°C
T
A
= +25°C
T
A
= +85°C
30
OUTPUT POWER vs. INPUT POWER
+20
+15
+5
0
0+10
Output Power P
out
(dBm)
Input Power P
in
(dBm)
10
15 10 5
+10
5
15 202530 +5
f = 1.0 GHz
V
CC
= 4.5 V
V
CC
= 5.5 V
V
CC
= 5.0 V
40 35
OUTPUT POWER vs. INPUT POWER
+20
+15
+5
0
+10
Output Power P
out
(dBm)
Input Power P
in
(dBm)
10
+10
5
15 +50
f = 1.0 GHz
V
CC
= 5.0 V
15 10 52025303540
f = 0.5 GHz
SATURATED OUTPUT POWER vs.
FREQUENCY
+20
+14
+8
0.5 1.0 2.0
Saturated Output Power P
O (sat)
(dBm)
Frequency f (GHz)
+60.1
+18
+16
+12
+10
0.2
P
in
= 8 dBm
V
CC
= 5.0 V
V
CC
= 4.5 V
V
CC
= 5.5 V
60
50
40
30
10 +10
3rd Order Intermodulation Distortion IM
3
(dBc)
Output Power of Each Tone P
O (each)
(dBm)
20
0
10
3RD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
+88+6+4+2642
f
1
= 0.500 GHz
f
2
= 0.502 GHz
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
DISCONTINUED
Data Sheet P13443EJ3V0DS
10
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PC2710TB
S-PARAMETERS (T A = +25°
°°
°C, VCC = Vout = 5.0 V)
S11-FREQUENCY
2.0 GHz
3.0 GHz 0.1 GHz
1.0 GHz
S22- FREQUENCY
0.1 GHz
2.0 GHz
3.0 GHz
1.0 GHz
DISCONTINUED
Data Sheet P13443EJ3V0DS 11
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PC2710TB
TYPICAL S-PARAMETER VALUES (TA = +25°
°°
°C)
VCC = Vout = 5.0 V, ICC = 22 mA
FREQUENCY S11 S21 S12 S22 K
MHz MAG. ANG. MAG. ANG. MAG. ANG. MAG. ANG.
100.0000 0.306 2.5 43.072 8.4 0.012 15.2 0.156 2.7 1.08
200.0000 0.324 5.2 43.517 17.1 0.010 10.7 0.164 2.1 1.17
300.0000 0.356 5.3 44.432 26.5 0.010 20.2 0.185 0.3 1.10
400.0000 0.400 2.5 45.513 36.9 0.012 26.9 0.225 5.5 0.92
500.0000 0.439 3.3 45.679 48.1 0.012 27.0 0.255 15.4 0.85
600.0000 0.469 10.2 45.670 59.7 0.013 31.3 0.283 27.6 0.77
700.0000 0.481 17.9 44.793 71.8 0.014 34.9 0.301 40.2 0.74
800.0000 0.488 26.7 43.016 84.3 0.014 27.9 0.312 54.9 0.74
900.0000 0.479 34.5 40.519 96.0 0.013 26.6 0.316 67.7 0.78
1000.0000 0.465 41.2 37.946 107.3 0.016 30.8 0.311 79.5 0.79
1100.0000 0.448 49.3 35.122 117.9 0.016 26.6 0.307 92.2 0.85
1200.0000 0.417 54.9 32.108 128.0 0.015 39.5 0.282 104.6 0.99
1300.0000 0.387 61.2 29.221 137.0 0.015 39.7 0.270 115.5 1.12
1400.0000 0.350 65.2 26.656 145.8 0.015 50.2 0.248 127.0 1.27
1500.0000 0.316 70.8 23.895 153.9 0.013 50.8 0.236 136.2 1.56
1600.0000 0.292 74.0 21.576 161.6 0.016 56.6 0.215 145.3 1.49
1700.0000 0.256 76.9 19.567 168.1 0.015 69.0 0.200 155.2 1.71
1800.0000 0.245 80.5 17.743 174.4 0.018 61.7 0.196 162.5 1.59
1900.0000 0.215 82.9 16.040 179.6 0.017 70.0 0.180 173.4 1.88
2000.0000 0.201 85.6 14.717 173.5 0.021 71.2 0.175 178.1 1.71
2100.0000 0.177 84.4 13.475 168.8 0.020 83.0 0.166 172.0 1.94
2200.0000 0.161 88.8 12.327 163.1 0.021 76.7 0.171 167.7 1.99
2300.0000 0.145 88.7 11.154 158.7 0.022 87.9 0.159 159.1 2.08
2400.0000 0.124 90.3 10.262 154.4 0.023 81.4 0.164 154.0 2.15
2500.0000 0.113 89.8 9.490 150.4 0.025 91.9 0.158 147.0 2.19
2600.0000 0.107 91.9 8.793 146.4 0.028 88.7 0.166 141.8 2.06
2700.0000 0.091 92.2 8.149 142.4 0.030 93.4 0.175 135.7 2.13
2800.0000 0.081 94.9 7.652 138.9 0.031 92.1 0.183 131.6 2.13
2900.0000 0.067 97.4 7.134 135.1 0.031 93.0 0.191 123.4 2.26
3000.0000 0.055 103.8 6.726 131.5 0.039 88.3 0.200 118.9 1.97
3100.0000 0.039 95.6 6.295 128.4 0.039 89.6 0.203 111.5 2.08
DISCONTINUED
Data Sheet P13443EJ3V0DS
12
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PC2710TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
0.9±0.1
0.7
0 to 0.1
0.15
+0.1
–0.05
2.0±0.2
1.3
0.650.65
0.2
+0.1
–0.05
2.1±0.1
1.25±0.1
0.1 MIN.
DISCONTINUED
Data Sheet P13443EJ3V0DS 13
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PC2710TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input pin and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
Soldering Method Soldering Condit i ons Recommended Condition Sym bol
Infrared Refl ow Pack age peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure li mit: NoneNote
IR35-00-3
VPS Pack age peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure li mit: NoneNote
VP15-00-3
Wave Solderi ng Soldering bath temperat ure: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure li mit: NoneNote
WS60-00-1
Partial Heating Pin tem perat ure: 300°C or below
Time: 3 s econds or less (per side of device)
Expos ure l i m i t: NoneNote
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
DISCONTINUED
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