2SJ479(L), 2SJ479(S)
Silicon P Channel DV–L MOS FET
High Speed Power Switching
ADE-208-541 (Z)
1st. Edition
Sep. 1997
Features
Low on-resistance
RDS(on) = 25 mtyp.
4V gate drive devices.
High speed switching
Outline
1. Gate
2. Drain
3. Source
4. Drain
123
4
123
4
LDPAK
G
D
S
2SJ479(L), 2SJ479(S)
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage VDSS –30 V
Gate to source voltage VGSS ±20 V
Drain current ID–30 A
Drain peak current ID(pulse)Note1 –120 A
Body to drain diode reverse drain current IDR –30 A
Channel dissipation Pch Note2 50 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
2SJ479(L), 2SJ479(S)
3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
voltage V(BR)DSS –30 V ID = –10mA, VGS = 0
Gate to source breakdown
voltage V(BR)GSS ±20 V IG = ±100µA, VDS = 0
Zero gate voltege drain
current IDSS –10 µAV
DS = –30 V, VGS = 0
Gate to source leak current IGSS ±10 µAV
GS = ±16V, VDS = 0
Gate to source cutoff voltage VGS(off) –1.0 –2.0 V ID = –1mA, VDS = –10V
Static drain to source on state RDS(on) 2535mI
D
= –15A, VGS = –10V Note3
resistance RDS(on) 4060mI
D
= –15A, VGS = –4V Note3
Forward transfer admittance |yfs| 1220—S I
D
= –15A, VDS = –10V Note3
Input capacitance Ciss 1700 pF VDS = –10V
Output capacitance Coss 950 pF VGS = 0
Reverse transfer capacitance Crss 260 pF f = 1MHz
Turn-on delay time td(on) 20 ns VGS = –10V, ID = –15A
Rise time tr 290 ns RL = 0.67
Turn-off delay time td(off) 170 ns
Fall time tf 130 ns
Body to drain diode forward
voltage VDF –1.1 V IF = –30A, VGS = 0
Body to drain diode reverse
recovery time trr 70 ns IF = –30A, VGS = 0
diF/ dt = 50A/µs
Note: 3. Pulse test
See characteristic curves of 2SJ471
2SJ479(L), 2SJ479(S)
4
Main Characteristics
100
75
50
25
050 100 150 200
–500
–200
–100
–20
–50
–10
–2
–5
–1
–0.5
–0.1 –0.3 –1 –3 –10 –30 –100
1 ms
Ta = 25 °C
100 µs
PW = 10 ms (1shot)
DC Operation (Tc = 25°C)
10 µs
Channel Dissipation Pch (W)
Case Temperature Tc (°C)
Power vs. Temperature Derating
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Maximun Safe Operation Area
Operation in
this area is
limited by R DS(on)
3
1
0.3
0.1
0.03
0.01
10 µ100 µ1 m 10 m 100 m 1 10
DM
P
PW
T
D = PW
T
ch – c(t) = s (t) • ch – c
ch – c = 2.5 °C/W, Tc = 25 °C
θ γ θ
θ
Tc = 25°C
D = 1
0.5
0.2
0.1
0.05
0.02
0.01
1shot pulse
Pulse Width PW (S)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermao Impedance s (t)
γ
2SJ479(L), 2SJ479(S)
5
Vin Monitor
D.U.T.
Vin
10 V
RL
V
= –10 V
DD
tr
td(on)
Vin
90% 90%
10%
10%
Vout
td(off)
Vout
Monitor
50
90%
10%
tf
Switching Timen Test Circuit Waveform
2SJ479(L), 2SJ479(S)
6
Package Dimensions
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
LDPAK (L)
1.4 g
10.2 ± 0.3
0.86
0.76 ± 0.1
2.54 ± 0.5
2.54 ± 0.5
+ 0.2
– 0.1
1.2 ± 0.2
4.44 ± 0.2
1.3 ± 0.15
2.59 ± 0.2
0.4 ± 0.1
11.0 ± 0.5
8.6 ± 0.3
10.0
11.3 ± 0.5
+ 0.3
– 0.5
(1.4)
1.27 ± 0.2
As of January, 2001
Unit: mm
2SJ479(L), 2SJ479(S)
7
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
LDPAK (S)-(1)
1.3 g
10.2 ± 0.3
1.27 ± 0.2
(1.5)
(1.4)
8.6 ± 0.3
10.0 + 0.3
– 0.5
4.44 ± 0.21.3 ± 0.15
0.1 + 0.2
– 0.1
0.4 ± 0.1
0.86 + 0.2
– 0.1
2.54 ± 0.5
2.54 ± 0.5
1.2 ± 0.2
3.0+ 0.3
– 0.5
(1.5)
7.8
6.6
2.2
1.7
7.8
7.0
As of January, 2001
Unit: mm
2SJ479(L), 2SJ479(S)
8
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
LDPAK (S)-(2)
1.35 g
10.2 ± 0.3
1.27 ± 0.2
(1.5)
(1.4)
8.6 ± 0.3
10.0 + 0.3
– 0.5
4.44 ± 0.21.3 ± 0.2
0.1 + 0.2
– 0.1
0.4 ± 0.1
0.86 + 0.2
– 0.1
2.54 ± 0.5
2.54 ± 0.5
1.2 ± 0.2
5.0+ 0.3
– 0.5
(1.5)
7.8
6.6
2.2
1.7
7.8
7.0
As of January, 2001
Unit: mm
2SJ479(L), 2SJ479(S)
9
Cautions
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