Ver. 201207
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
＊1
Typ.
Rated Current (A)
＊2
Max. Typ.
CIG22H1R0MNE 1008/2520 1.0 ±20 % 0.080±25 % 3.3 1.5 2.0
CIG22H1R2MNE 1008/2520 1.2 ±20 % 0.094±20 % 2.8 1.5 1.9
CIG22H1R5MNE 1008/2520 1.5 ±20 % 0.104±20 % 2.4 1.5 1.6
CIG22H2R2MNE 1008/2520 2.2 ±20 % 0.116±20 % 1.8 1.2 1.6
CIG22H3R3MNE 1008/2520 3.3 ±20 % 0.133±20 % 1.0 1.0 1.5
CIG22H4R7MNE 1008/2520 4.7 ±20 % 0.233±20 % 0.95 0.8 1.0
※Rated Current (A)
＊1
:DC current value when Inductance dropsto 30% of nominal Inductance value (ONLY REFERENCE)
※Rated Current (A)
＊2
:DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
22 2.5±0.2 2.0±0.2 1.1±0.1 0.55±0.25
DESCRIPTION
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG22H Series (2520/ EIA 1008)
High Current Type
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201207
CI G 22 H 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (H:High Current Type)
(5) Inductance (1R0:1.0uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 2,500
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
