1S1885A(Q) - TOSHIBA - Product.Network

1S1885A,1S1887A,1S1888A

2011-01-05

TOSHIBA Rectifiers Silicon Diffused Type

1S1885A,1S1887A,1S1888A

General Purpose Rectifier Applications

• Average Forward Current: IF (AV) = 1.2 A (Ta = 60°C)

• Repetitive Peak Reverse Voltage: VRRM = 100 V, 400 V, 600 V

• Peak One Cycle Surge Forward Current (non repetitive)

: IFSM = 100 A (50 Hz)

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

1S1885A 100

1S1887A 400

Repetitive peak

reverse voltage

1S1888A

VRRM

600

Average forward current (Ta = 60°C) IF (AV) 1.2 A

100 (50 Hz)

Peak one cycle surge forward current

(non repetitive) IFSM

110 (60 Hz)

Junction temperature Tj −40 to 150 °C

Storage temperature range Tstg −40 to 150 °C

Note: Using continuously under heavy loads (e.g. the application of high

temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the

reliability significantly even if the operating conditions (i.e.

operating temperature/current/voltage, etc.) are within the

absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report

and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Peak forward voltage VFM I

FM = 5 A ⎯ ⎯ 1.0 V

Repetitive peak reverse current IRRM V

RRM = Rated ⎯ ⎯ 10 μA

Thermal resistance

(junction to ambient) Rth (j-a) DC ⎯ ⎯ 100 °C /W

Marking

Abbreviation Code Part No.

85A 1S1885A

87A 1S1887A

88A 1S1888A

Unit: mm

JEDEC DO-15

JEITA SC-39

TOSHIBA 3-3B1A

Weight: 0.42 g (typ.)

Lot No.

line indicates

lead (Pb)-free package or

lead (Pb)-free finish.

88A

Part No. (or abbreviation code)

1S1885A,1S1887A,1S1888A

2011-01-05

Handling Precaution

The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be

exceeded during operation, even for an instant. The following are the general derating methods that we recommend

when you design a circuit with a device.

VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the

absolute maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for

an AC circuit. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into

account designing a device at low temperature.

IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating

of IF(AV). Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation,

set the margin by using an allowable Tamax-IF(AV) curve.

This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180.

Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.

We recommend that a device be used at a Tj of below 120°C under the worst load and heat radiation conditions.

Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When

using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.

Organic silicon is used as encapsulation material for this product, which is resin seal product. Therefore, it is

difficult to seal siloxane coming from silicone completely in this product. When using this product, please consider

above.

Please refer to the Rectifiers databook for further information.

1S1885A,1S1887A,1S1888A

2011-01-05

Surge forward current IFSM (A)

Instantaneous forward voltage vF (V)

iF – vF

Instantaneous forward current iF (A)

Average forward current IF (AV) (A)

Ta m ax – I F (AV)

Maximum allowable ambient temperature

Ta m a x ( °C )

Time t (s)

rth (j-a) – t

Transient thermal impedance

rth (j-a) (°C /W)

Number of cycles

Surge forward current (non-repetitive)

0.3

0.4

2.8

0.5

0.8 1.2 1.6 2.0 2.4

Tj = 25°C

150

Tj = 25°C

120

100

3 5 10 30 50 100

50 Hz

200

Lead length 10mm

Solder land size

5 mm × 5 mm

160

120

0.2 0.4 0.6 0.8 1.0 1.2

Resistive or inductive

load

Capacitive

load

Copper plate

Substrate

thickness

1.6 mm

0.1

0.001

5000

0.01 0.1 1 10 100 1000

1000

100

1S1885A,1S1887A,1S1888A

2011-01-05

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR

APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

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