MX29LV320TTI-70R - Macronix International Co., Ltd.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

32M-BIT [4M x 8 / 2M x 16] SINGLE VOLTAGE

3V ONLY FLASH MEMORY

FEATURES

GENERAL FEA TURES

• 4,194,304 x 8 / 2,097,152 x 16 switchable

• Sector Structure

- 8K-Byte x 8 and 64K-Byte x 63

• Extra 64K-Byte sector for security

- Features factory locked and identifiable, and cus-

tomer lockable

• Twenty-Four Sector Groups

- Provides sector group protect function to prevent pro-

gram or erase operation in the protected sector group

- Provides chip unprotect function to allow code chang-

ing

- Provides temporary sector group unprotect function

for code changing in previously protected sector groups

• Single Power Supply Operation

- 2.7 to 3.6 volt for read, erase, and program opera-

tions

• Latch-up protected to 250mA from -1V to Vcc + 1V

• Low Vcc write inhibit is equal to or less than 1.4V

• Compatible with JEDEC standard

- Pinout and software compatible to single power sup-

ply Flash

PERFORMANCE

• High Performance

- F ast access time: 70/90/120ns

- F ast program time: 7us/word, 210s/chip (typical)

- F ast erase time: 1.6s/sector, 112s/chip (typical)

• Low Power Consumption

- Low active read current: 10mA (typical) at 5MHz

- Low standby current: 200nA (typical)

• Minimum 100,000 erase/program cycle

• 10-year data retention

SOFTW ARE FEA TURES

• Erase Suspend/ Erase Resume

- Suspends sector erase operation to read data from

or program data to another sector which is not being

erased

• Status Reply

- Data polling & Toggle bits provide detection of pro-

gram and erase operation completion

• Support Common Flash Interface (CFI)

HARDWARE FEATURES

• Ready/Busy (RY/BY) Output

- Provides a hardware method of detecting program

and erase operation completion

• Hardware Reset (RESET) Input

- Provides a hardware method to reset the internal state

machine to read mode

• WP/ACC input pin

- Provides accelerated program capability

PACKAGE

• 48-Pin TSOP

• 48-Ball CSP

GENERAL DESCRIPTION

The MX29LV320T/B is a 32-mega bit Flash memory or-

ganized as 4M bytes of 8 bits and 2M words of 16 bits.

MXIC's Flash memories offer the most cost-effective and

reliable read/write non-volatile random access memory .

The MX29LV320T/B is packaged in 48-pin TSOP and

48-ball CSP. It is designed to be reprogrammed and

erased in system or in standard EPROM programmers.

The standard MX29LV320T/B offers access time as fast

as 70ns, allowing operation of high-speed microproces-

sors without wait states. To eliminate bus contention,

the MX29LV320T/B has separate chip enable (CE) and

output enable (OE) controls.

MXIC's Flash memories augment EPROM functionality

with in-circuit electrical erasure and programming. The

MX29LV320T/B uses a command register to manage

this functionality.

MXIC Flash technology reliably stores memory

contents even after 100,000 erase and program

cycles. The MXIC cell is designed to optimize the

erase and program mechanisms. In addition, the

combination of advanced tunnel oxide processing

and low internal electric fields for erase and

programming operations produces reliable cycling.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

AUTOMA TIC PROGRAMMING

The MX29LV320T/B is byte/word programmable using

the Automatic Programming algorithm. The Automatic

Programming algorithm makes the external system do

not need to have time out sequence nor to verify the

data programmed. The typical chip programming time at

room temperature of the MX29LV320T/B is less than 36

seconds.

AUTOMA TIC PROGRAMMING ALGORITHM

MXIC's Automatic Programming algorithm require the user

to only write program set-up commands (including 2 un-

lock write cycle and A0H) and a program command (pro-

gram data and address). The device automatically times

the programming pulse width, provides the program veri-

fication, and counts the number of sequences. A status

bit similar to DATA polling and a status bit toggling be-

tween consecutive read cycles, provide feedback to the

user as to the status of the programming operation.

A UTOMA TIC CHIP ERASE

The entire chip is bulk erased using 50 ms erase pulses

according to MXIC's Automatic Chip Erase algorithm.

Typical erasure at room temperature is accomplished in

less than 50 seconds. The Automatic Erase algor ithm

automatically programs the entire array prior to electri-

cal erase. The timing and verification of electrical erase

are controlled internally within the device.

AUTOMA TIC SECTOR ERASE

The MX29LV320T/B is sector(s) erasable using

MXIC's Auto Sector Erase algorithm. Sector erase

modes allow sectors of the array to be erased in one

erase cycle. The Automatic Sector Erase algorithm

automatically programs the specified sector(s) prior to

electrical erase. The timing and verification of

electrical erase are controlled internally within the

device.

AUTOMA TIC ERASE ALGORITHM

MXIC's Automatic Erase algorithm requires the user to

write commands to the command register using stand-

ard microprocessor write timings. The device will auto-

matically pre-program and verify the entire array. Then

the device automatically times the erase pulse width,

provides the erase verification, and counts the number

of sequences. A status bit toggling between consecu-

tive read cycles provides feedback to the user as to the

status of the programming operation.

machine which controls the erase and programming cir-

cuitry. During write cycles, the command register inter-

nally latches address and data needed for the program-

ming and erase operations. During a system write cycle,

addresses are latched on the falling edge, and data are

latched on the rising edge of WE .

MXIC's Flash technology combines years of EPROM

experience to produce the highest levels of quality , relia-

bility, and cost eff ectiv eness. The MX29LV320T/B elec-

trically erases all bits simultaneously using Fowler-Nord-

heim tunneling. The bytes/words are programmed by

using the EPROM programming mechanism of hot elec-

tron injection.

During a program cycle, the state-machine will control

the program sequences and command register will not

respond to any command set. During a Sector Erase

cycle, the command register will only respond to Erase

Suspend command. After Erase Suspend is completed,

the device stays in read mode. After the state machine

has completed its task, it will allow the command regis-

ter to respond to its full command set.

The MX29LV320T/B uses a 2.7V to 3.6V VCC

supply to perform the High Reliability Erase and

auto Program/Erase algorithms.

The highest degree of latch-up protection is

achieved with MXIC's proprietary non-epi process.

Latch-up protection is proved for stresses up to 100

milliamperes on address and data pin from -1V to

VCC + 1V.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

PIN CONFIGURATION

48 TSOP

SYMBOL PIN NAME

A0~A20 Address Input

Q0~Q14 15 Data Inputs/Outputs

Q15/A-1 Q15(Data Input/Output, word mode)

A-1(LSB Address Input, byte mode)

CE Chip Enable Input

WE Write Enable Input

OE Output Enable Input

BYTE Word/Byte Selection Input

RESET Hardware Reset Pin, Active Low

R Y/BY Read/Busy Output

VCC 3.0 volt-only single power supply

WP/ACC Hardware Write Protect/Acceleration

GND Device Ground

N C Pin Not Connected Internally

PIN DESCRIPTION LOGIC SYMBOL

48-Ball CSP 8mm x 9mm (Ball Pitch = 0.8 mm), Top Vie w , Balls Facing Do wn

A BCDEFGH

6 A13 A12 A14 A15 A16 BYTE Q15/A-1 GND

5 A9 A8 A10 A11 Q7 Q14 Q13 Q6

4 WE RESET N C A19 Q5 Q12 Vcc Q4

3 RY/BY WP/ACC A18 A20 Q2 Q10 Q11 Q3

2 A7 A17 A6 A5 Q0 Q8 Q9 Q1

1A3A4 A2A1A0CEOEGND

A15

A14

A13

A12

A11

A10

A19

A20

RESET

WP/ACC

RY/BY

A18

A17

A16

BYTE

GND

Q15/A-1

Q14

Q13

Q12

VCC

Q11

Q10

GND

MX29LV320T/B

16 or 8

Q0-Q15

(A-1)

RY/BY

A0-A20

WP/ACC

RESET

BYTE

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

BLOCK DIAGRAM

CONTROL

INPUT

LOGIC

PROGRAM/ERASE

HIGH V OLTAGE

WRITE

STATE

MACHINE

(WSM)

STATE

MX29LV320T/B

FLASH

ARRAY

X-DECODER

ADDRESS

LATCH

AND

BUFFER Y-PASS GATE

Y-DECODER

ARRAY

SOURCE

HV COMMAND

DATA

DECODER

COMMAND

DATA LATCH

I/O BUFFER

PGM

DATA

PROGRAM

DATA LATCH

SENSE

AMPLIFIER

Q0-Q15/A-1

A0-A20

RESET

BYTE

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Sector Sector Sector Address Sector Size (x8) (x16)

Group A20-A12 (Kbytes/Kwords) Address Range Address Range

1 SA0 000000xxx 64/32 000000h-00FFFFh 000000h-07FFFh

1 SA1 000001xxx 64/32 010000h-01FFFFh 008000h-0FFFFh

1 SA2 000010xxx 64/32 020000h-02FFFFh 010000h-17FFFh

1 SA3 000011xxx 64/32 030000h-03FFFFh 018000h-01FFFFh

2 SA4 000100xxx 64/32 040000h-04FFFFh 020000h-027FFFh

2 SA5 000101xxx 64/32 050000h-05FFFFh 028000h-02FFFFh

2 SA6 000110xxx 64/32 060000h-06FFFFh 030000h-037FFFh

2 SA7 000111xxx 64/32 070000h-07FFFFh 038000h-03FFFFh

3 SA8 001000xxx 64/32 080000h-08FFFFh 040000h-047FFFh

3 SA9 001001xxx 64/32 090000h-09FFFFh 048000h-04FFFFh

3 SA10 001010xxx 64/32 0A0000h-0AFFFFh 050000h-057FFFh

3 SA11 001011xxx 64/32 0B0000h-0BFFFFh 058000h-05FFFFh

4 SA12 001100xxx 64/32 0C0000h-0CFFFFh 060000h-067FFFh

4 SA13 001101xxx 64/32 0D0000h-0DFFFFh 068000h-06FFFFh

4 SA14 001110xxx 64/32 0E0000h-0EFFFFh 070000h-077FFFh

4 SA15 001111xxx 64/32 0F0000h-0FFFFFh 078000h-07FFFFh

5 SA16 010000xxx 64/32 100000h-10FFFFh 080000h-087FFFh

5 SA17 010001xxx 64/32 110000h-11FFFFh 088000h-08FFFFh

5 SA18 010010xxx 64/32 120000h-12FFFFh 090000h-097FFFh

5 SA19 010011xxx 64/32 130000h-13FFFFh 098000h-09FFFFh

6 SA20 010100xxx 64/32 140000h-14FFFFh 0A0000h-0A7FFFh

6 SA21 010101xxx 64/32 150000h-15FFFFh 0A8000h-0AFFFFh

6 SA22 010110xxx 64/32 160000h-16FFFFh 0B0000h-0B7FFFh

6 SA23 010111xxx 64/32 170000h-17FFFFh 0B8000h-0BFFFFh

7 SA24 011000xxx 64/32 180000h-18FFFFh 0C0000h-0C7FFFh

7 SA25 011001xxx 64/32 190000h-19FFFFh 0C8000h-0CFFFFh

7 SA26 011010xxx 64/32 1A0000h-1AFFFFh 0D0000h-0D7FFFh

7 SA27 011011xxx 64/32 1B0000h-1BFFFFh 0D8000h-0DFFFFh

8 SA28 011100xxx 64/32 1C0000h-1CFFFFh 0E0000h-0E7FFFh

8 SA29 011101xxx 64/32 1D0000h-1DFFFFh 0E8000h-0EFFFFh

8 SA30 011110xxx 64/32 1E0000h-1EFFFFh 0F0000h-0F7FFFh

8 SA31 011111xxx 64/32 1F0000h-1FFFFFh 0F8000h-0FFFFFh

9 SA32 100000xxx 64/32 200000h-20FFFFh 100000h-107FFFh

9 SA33 100001xxx 64/32 210000h-21FFFFh 108000h-10FFFFh

9 SA34 100010xxx 64/32 220000h-22FFFFh 110000h-117FFFh

9 SA35 100011xxx 64/32 230000h-23FFFFh 118000h-11FFFFh

10 SA36 100100xxx 64/32 240000h-24FFFFh 120000h-127FFFh

10 SA37 100101xxx 64/32 250000h-25FFFFh 128000h-12FFFFh

10 SA38 100110xxx 64/32 260000h-26FFFFh 130000h-137FFFh

10 SA39 100111xxx 64/32 270000h-27FFFFh 138000h-13FFFFh

Table 1.a: MX29LV320T SECTOR GROUP ARCHITECTURE

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Sector Sector Sector Address Sector Size (x8) (x16)

Group A20-A12 (Kbytes/Kwords) Address Range Address Range

11 SA40 101000xxx 64/32 280000h-28FFFFh 140000h-147FFFh

11 SA41 101001xxx 64/32 290000h-29FFFFh 148000h-14FFFFh

11 SA42 101010xxx 64/32 2A0000h-2AFFFFh 150000h-157FFFh

11 SA43 101011xxx 64/32 2B0000h-2BFFFFh 158000h-15FFFFh

12 SA44 101100xxx 64/32 2C0000h-2CFFFFh 160000h-147FFFh

12 SA45 101101xxx 64/32 2D0000h-2DFFFFh 168000h-14FFFFh

12 SA46 101110xxx 64/32 2E0000h-2EFFFFh 170000h-177FFFh

12 SA47 101111xxx 64/32 2F0000h-2FFFFFh 178000h-17FFFFh

13 SA48 110000xxx 64/32 300000h-30FFFFh 180000h-187FFFh

13 SA49 110001xxx 64/32 310000h-31FFFFh 188000h-18FFFFh

13 SA50 110010xxx 64/32 320000h-32FFFFh 190000h-197FFFh

13 SA51 110011xxx 64/32 330000h-33FFFFh 198000h-19FFFFh

14 SA52 110100xxx 64/32 340000h-34FFFFh 1A0000h-1A7FFFh

14 SA53 110101xxx 64/32 350000h-35FFFFh 1A8000h-1AFFFFh

14 SA54 110110xxx 64/32 360000h-36FFFFh 1B0000h-1B7FFFh

14 SA55 110111xxx 64/32 370000h-37FFFFh 1B8000h-1BFFFFh

15 SA56 111000xxx 64/32 380000h-38FFFFh 1C0000h-1C7FFFh

15 SA57 111001xxx 64/32 390000h-39FFFFh 1C8000h-1CFFFFh

15 SA58 111010xxx 64/32 3A0000h-3AFFFFh 1D0000h-1D7FFFh

15 SA59 111011xxx 64/32 3B0000h-3BFFFFh 1D8000h-1DFFFFh

16 SA60 111100xxx 64/32 3C0000h-3CFFFFh 1E0000h-1E7FFFh

16 SA61 111101xxx 64/32 3D0000h-3DFFFFh 1E8000h-1EFFFFh

16 SA62 111110xxx 64/32 3E0000h-3EFFFFh 1F0000h-1F7FFFh

17 SA63 111111000 8/4 3F0000h-3F1FFFh 1F8000h-1F8FFFh

18 SA64 111111001 8/4 3F2000h-3F3FFFh 1F9000h-1F9FFFh

19 SA65 111111010 8/4 3F4000h-3F5FFFh 1FA000h-1FAFFFh

20 SA66 111111011 8/4 3F6000h-3F7FFFh 1FB000h-1FBFFFh

21 SA67 111111100 8/4 3F8000h-3F9FFFh 1FC000h-1FCFFFh

22 SA68 111111101 8/4 3FA000h-3FBFFFh 1FD000h-1FDFFFh

23 SA69 111111110 8/4 3FC000h-3FDFFFh 1FE000h-1FEFFFh

24 SA70 111111111 8/4 3FE000h-3FFFFFh 1FF000h-1FFFFFh

Top Boot Security Sector Addresses

Sector Address Sector Size (x8) (x16)

A20~A12 (Kbytes/Kwords) Address Range Address Range

111111xxx 64/32 3F0000h-3FFFFFh 1F8000h-1FFFFFh

Note:The address range is A20:A-1 in byte mode (BYTE=VIL) or A20:A0 in word mode (BYTE=VIH)

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Sector Sector Sector Address Sector Size (x8) (x16)

Group A20-A12 (Kbytes/Kwords) Address Range Address Range

1 SA0 000000000 8/4 000000h-001FFFh 000000h-000FFFh

2 SA1 000000001 8/4 002000h-003FFFh 001000h-001FFFh

3 SA2 000000010 8/4 004000h-005FFFh 002000h-002FFFh

4 SA3 000000011 8/4 006000h-007FFFh 003000h-003FFFh

5 SA4 000000100 8/4 008000h-009FFFh 004000h-004FFFh

6 SA5 000000101 8/4 00A000h-00BFFFh 005000h-005FFFh

7 SA6 000000110 8/4 00C000h-00DFFFh 006000h-006FFFh

8 SA7 000000111 8/4 00E000h-00FFFFh 007000h-007FFFh

9 SA8 000001xxx 64/32 010000h-01FFFFh 008000h-00FFFFh

9 SA9 000010xxx 64/32 020000h-02FFFFh 010000h-017FFFh

9 SA10 000011xxx 64/32 030000h-03FFFFh 018000h-01FFFFh

10 SA11 000100xxx 64/32 040000h-04FFFFh 020000h-027FFFh

10 SA12 000101xxx 64/32 050000h-05FFFFh 028000h-02FFFFh

10 SA13 000110xxx 64/32 060000h-06FFFFh 030000h-037FFFh

10 SA14 000111xxx 64/32 070000h-07FFFFh 038000h-03FFFFh

11 SA15 001000xxx 64/32 080000h-08FFFFh 040000h-047FFFh

11 SA16 001001xxx 64/32 090000h-09FFFFh 048000h-04FFFFh

11 SA17 001010xxx 64/32 0A0000h-0AFFFFh 050000h-057FFFh

11 SA18 001011xxx 64/32 0B0000h-0BFFFFh 058000h-05FFFFh

12 SA19 001100xxx 64/32 0C0000h-0CFFFFh 060000h-067FFFh

12 SA20 001101xxx 64/32 0D0000h-0DFFFFh 068000h-06FFFFh

12 SA21 001110xxx 64/32 0E0000h-0EFFFFh 070000h-077FFFh

12 SA22 001111xxx 64/32 0F0000h-0FFFFFh 078000h-07FFFFh

13 SA23 010000xxx 64/32 100000h-10FFFFh 080000h-087FFFh

13 SA24 010001xxx 64/32 110000h-11FFFFh 088000h-08FFFFh

13 SA25 010010xxx 64/32 120000h-12FFFFh 090000h-097FFFh

13 SA26 010011xxx 64/32 130000h-13FFFFh 098000h-09FFFFh

14 SA27 010100xxx 64/32 140000h-14FFFFh 0A0000h-0A7FFFh

14 SA28 010101xxx 64/32 150000h-15FFFFh 0A8000h-0AFFFFh

14 SA29 010110xxx 64/32 160000h-16FFFFh 0B0000h-0B7FFFh

14 SA30 010111xxx 64/32 170000h-17FFFFh 0B8000h-0BFFFFh

15 SA31 011000xxx 64/32 180000h-18FFFFh 0C0000h-0C7FFFh

15 SA32 011001xxx 64/32 190000h-19FFFFh 0C8000h-0CFFFFh

15 SA33 011010xxx 64/32 1A0000h-1AFFFFh 0D0000h-0D7FFFh

15 SA34 011011xxx 64/32 1B0000h-1BFFFFh 0D8000h-0DFFFFh

16 SA35 011100xxx 64/32 1C0000h-1CFFFFh 0E0000h-0E7FFFh

16 SA36 011101xxx 64/32 1D0000h-1DFFFFh 0E8000h-0EFFFFh

16 SA37 011110xxx 64/32 1E0000h-1EFFFFh 0F0000h-0F7FFFh

16 SA38 011111xxx 64/32 1F0000h-1FFFFFh 0F8000h-0FFFFFh

Table 1.b: MX29LV320B SECTOR GROUP ARCHITECTURE

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Sector Sector Sector Address Sector Size (x8) (x16)

Group A20-A12 (Kbytes/Kwords) Address Range Address Range

17 SA39 100000xxx 64/32 200000h-20FFFFh 100000h-107FFFh

17 SA40 100001xxx 64/32 210000h-21FFFFh 108000h-10FFFFh

17 SA41 100010xxx 64/32 220000h-22FFFFh 110000h-117FFFh

17 SA42 100011xxx 64/32 230000h-23FFFFh 118000h-11FFFFh

18 SA43 100100xxx 64/32 240000h-24FFFFh 120000h-127FFFh

18 SA44 100101xxx 64/32 250000h-25FFFFh 128000h-12FFFFh

18 SA45 100110xxx 64/32 260000h-26FFFFh 130000h-137FFFh

18 SA46 100111xxx 64/32 270000h-27FFFFh 138000h-13FFFFh

19 SA47 101000xxx 64/32 280000h-28FFFFh 140000h-147FFFh

19 SA48 101001xxx 64/32 290000h-29FFFFh 148000h-14FFFFh

19 SA49 101010xxx 64/32 2A0000h-2AFFFFh 150000h-157FFFh

19 SA50 101011xxx 64/32 2B0000h-2BFFFFh 158000h-15FFFFh

20 SA51 101100xxx 64/32 2C0000h-2CFFFFh 160000h-167FFFh

20 SA52 101101xxx 64/32 2D0000h-2DFFFFh 168000h-16FFFFh

20 SA53 101110xxx 64/32 2E0000h-2EFFFFh 170000h-177FFFh

20 SA54 101111xxx 64/32 2F0000h-2FFFFFh 178000h-17FFFFh

21 SA55 110000xxx 64/32 300000h-30FFFFh 180000h-187FFFh

21 SA56 110001xxx 64/32 310000h-31FFFFh 188000h-18FFFFh

21 SA57 110010xxx 64/32 320000h-32FFFFh 190000h-197FFFh

21 SA58 110011xxx 64/32 330000h-33FFFFh 198000h-19FFFFh

22 SA59 110100xxx 64/32 340000h-34FFFFh 1A0000h-1A7FFFh

22 SA60 110101xxx 64/32 350000h-35FFFFh 1A8000h-1AFFFFh

22 SA61 110110xxx 64/32 360000h-36FFFFh 1B0000h-1B7FFFh

22 SA62 110111xxx 64/32 370000h-37FFFFh 1B8000h-1BFFFFh

23 SA63 111000xxx 64/32 380000h-38FFFFh 1C0000h-1C7FFFh

23 SA64 111001xxx 64/32 390000h-39FFFFh 1C8000h-1CFFFFh

23 SA65 111010xxx 64/32 3A0000h-3AFFFFh 1D0000h-1D7FFFh

23 SA66 111011xxx 64/32 3B0000h-3BFFFFh 1D8000h-1DFFFFh

24 SA67 111100xxx 64/32 3C0000h-3CFFFFh 1E0000h-1E7FFFh

24 SA68 111101xxx 64/32 3D0000h-3DFFFFh 1E8000h-1EFFFFh

24 SA69 111110xxx 64/32 3E0000h-3EFFFFh 1F0000h-1F7FFFh

24 SA70 111111xxx 64/32 3F0000h-3FFFFFh 1F8000h-1FFFFFh

Bottom Boot Security Sector Addresses

Sector Address Sector Size (x8) (x16)

A20~A12 (Kbytes/Kwords) Address Range Address Range

111111xxx 64/32 000000h-00FFFFh 00000h-07FFFh

Note:The address range is A20:A-1 in byte mode (BYTE=VIL) or A20:A0 in word mode (BYTE=VIH)

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Operation CE OE WE RESET WP/ACC Addresses Q0~Q7 Q 8 ~ Q15

(Note 2) Byte=VIH Byte=VIL

Read L L H H L/H AIN DOUT DOUT Q8-A14

=High-Z

Write (Note 1) L H L H Note 3 AIN DIN DIN Q15=A-1

Accelerate L H L H VHH AIN DIN DIN

Program

Standby VCC ±X X VCC ±H X High-Z High-Z High-Z

0.3V 0.3V

Output Disable L H H H L/H X High-Z High-Z High-Z

Reset X X X L L/H X High-Z High-Z High-Z

Sector Group L H L VID L/H Sector Addresses, DIN, DOUT XX

Protect (Note 2) A6=L, A1=H, A0=L

Chip Unprotect L H L VID Note 3 Sector Addresses, DIN, DOUT XX

(Note 2) A6=H, A1=H, A0=L

Temporary Sector X X X VID Note 3 AIN DIN DIN High-Z

Group Unprotect

Legend:

L=Logic LO W=VIL, H=Logic High=VIH, VID=12.0±0.5V , VHH=11.5-12.5V, X=Don't Care, AIN=Address IN, DIN=Data IN,

DOUT=Data OUT

Notes:

1. When the WP/ACC pin is at VHH, the device enters the accelerated program mode. See "Accelerated Program

Operations" for more information.

2.The sector group protect and chip unprotect functions may also be implemented via programming equipment. See

the "Sector Group Protection and Chip Unprotection" section.

3.If WP/ACC=VIL, the tw o outermost boot sectors remain protected. If WP/ACC=VIH, the two outermost boot sector

protection depends on whether they were last protected or unprotected using the method described in "Sector/

Sector Block Protection and Unprotection". If WP/A CC=V HH, all sectors will be unprotected.

4.DIN or Dout as required by command sequence, data polling, or sector protection algorithm.

5.Address are A20:A0 in word mode (BYTE=VIH), A20:A-1 in byte mode (BYTE=VIL).

Table 2. BUS OPERATION--1

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

A20 A11 A9 A8 A6 A5

Operation CE OE W E t o t o t o to A1 A0 Q0-Q7 Q8-Q15

A12 A10 A7 A2

Read Silicon ID L L H X X VID X L X L L C2H X

Manufacturer Code

Read Silicon ID L L H X X VID X L X L H A7H 22h(word)

MX29LV320T X (byte)

Read Silicon ID L L H X X VID X L X L H A8H 22h(word)

MX29LV320B X (byte)

Sector Group Protect L VID LSAXV

ID XLXXX X X

Chip Unprotect L VID LXXV

ID XHXXX X X

Sector Protect L L H SA X VID X L X H L 01h(1), X

Verification or 00h

Security Sector L L H X X VID X L X H H 99h(2), X

Indicater or 19h

Bit (Q7)

BUS OPERATION--2

Notes:

1.Code=00h means unprotected, or code=01h protected.

2.Code=99 means factory locked, or code=19h not facory locked.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

REQUIREMENTS FOR READING ARRAY

DATA

To read array data from the outputs, the system must

drive the CE and OE pins to VIL. CE is the power control

and selects the device. OE is the output control and gates

arra y data to the output pins. WE should remain at VIH.

The internal state machine is set for reading array data

upon device power-up, or after a hardware reset. This

ensures that no spurious alteration of the memory content

occurs during the power transition. No command is

necessary in this mode to obtain array data. Standard

microprocessor read cycles that assert valid address on

the device address inputs produce valid data on the device

data outputs. The device remains enabled for read access

until the command register contents are altered.

WRITE COMMANDS/COMMAND SEQUENCES

To program data to the device or erase sectors of memory

, the system must drive WE and CE to VIL, and OE to

VIH.

An erase operation can erase one sector, multiple sectors

, or the entire device. T able 1 indicates the address space

that each sector occupies. A "sector address" consists

of the address bits required to uniquely select a sector .

Writing specific address and data commands or

sequences into the command register initiates device

operations . Table 3 defines the valid register command

sequences. Writing incorrect address and data values or

writing them in the improper sequence resets the device

to reading array data. Section has details on erasing a

sector or the entire chip, or suspending/resuming the erase

operation.

After the system writes the Automatic Select command

sequence, the device enters the Automatic Select mode.

The system can then read Automatic Select codes from

the internal register (which is separate from the memory

array) on Q7-Q0. Standard read cycle timings apply in

this mode. Refer to the Automatic Select Mode and

Automatic Select Command Sequence section for more

information.

ICC2 in the DC Characteristics table represents the active

current specification for the write mode. The "AC

Characteristics" section contains timing specification

table and timing diagrams for write operations.

ACCELERATED PROGRAM OPERATION

The device offers accelerated program operations through

the WP/ACC function. If the system asserts VHH on ACC

pin, the device will provide the fast programming time to

user. This function is primar ily intended to allow faster

manufacturing throughput during production. Removing

VHH from the WP/ACC pin returns the device to normal

operation. Note that the WP/A CC pin must not be at VHH

for operations other than accelerated programming, or

device damage may result.

STANDBY MODE

MX29LV320T/B can be set into Standby mode with two

different approaches. One is using both CE and RESET

pins and the other one is using RESET pin only.

When using both pins of CE and RESET, a CMOS

Standby mode is achiev ed with both pins held at Vcc ±

0.3V. Under this condition, the current consumed is less

than 0.2uA (typ.). If both of the CE and RESET are held

at VIH, but not within the range of VCC ± 0.3V, the device

will still be in the standby mode, but the standby current

will be larger. During Auto Algorithm operation, Vcc ac-

tive current (ICC2) is required even CE = "H" until the

operation is completed. The device can be read with stan-

dard access time (tCE) from either of these standby

modes.

When using only RESET, a CMOS standby mode is

achieved with RESET input held at Vss ± 0.3V, Under

this condition the current is consumed less than 1uA

(typ.). Once the RESET pin is taken high,the device is

back to active without recovery delay.

In the standby mode the outputs are in the high imped-

ance state, independent of the OE input.

MX29LV320T/B is capable to provide the Automatic

Standby Mode to restrain power consumption during read-

out of data. This mode can be used effectively with an

application requested low power consumption such as

handy terminals.

To active this mode, MX29L V320T/B automatically switch

themselves to low power mode when MX29LV320T/B

addresses remain stable during access time of

tA CC+30ns . It is not necessary to control CE, WE, and

OE on the mode. Under the mode, the current consumed

is typically 0.2uA (CMOS level).

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MX29LV320T/B

OUTPUT DISABLE

With the OE input at a logic high level (VIH), output from

the devices are disabled. This will cause the output pins

to be in a high impedance state.

RESET OPERATION

The RESET pin provides a hardware method of resetting

the device to reading array data. When the RESET pin is

driven low for at least a period of tRP, the device

immediately terminates any operation in progress,

tristates all output pins, and ignores all read/write

commands for the duration of the RESET pulse. The

device also resets the internal state machine to reading

array data. The operation that was interrupted should be

reinitiated once the device is ready to accept another

command sequence, to ensure data integrity

Current is reduced for the duration of the RESET pulse.

When RESET is held at VSS±0.3V, the device draws

CMOS standby current (ICC4). If RESET is held at VIL

but not within VSS±0.3V, the standby current will be

greater.

The RESET pin ma y be tied to system reset circuitry. A

system reset would that also reset the Flash memory,

enabling the system to read the boot-up firm-ware from

the Flash memory .

If RESET is asserted during a program or erase

operation, the RY/BY pin remains a "0" (busy) until the

internal reset operation is complete, which requires a time

of tREADY (during Embedded Algorithms). The system

can thus monitor R Y/BY to determine whether the reset

operation is complete. If RESET is asserted when a

program or erase operation is not ex ecuting (R Y/BY pin

is "1"), the reset operation is completed within a time of

tREAD Y (not during Embedded Algorithms). The system

can read data tRH after the RESET pin returns to VIH.

Refer to the AC Characteristics tables for RESET

parameters and to Figure 14 for the timing diagram.

SECTOR GROUP PROTECT OPERATION

The MX29LV320T/B features hardware sector group pro-

tection. This feature will disable both program and erase

operations for these sector group protected. To activate

this mode, the programming equipment must force V ID

on address pin A9 and control pin OE, (suggest VID =

12V) A6 = VIL and CE = VIL.(see Table 2) Programming

of the protection circuitry begins on the falling edge of

the WE pulse and is terminated on the rising edge. Please

refer to sector group protect algorithm and waveform.

MX29LV320T/B also provides another method which re-

quires VID on the RESET only . This method can be imple-

mented either in-system or via programming equipment.

This method uses standard microprocessor bus cycle

timing.

To verify programming of the protection circuitry , the pro-

gramming equipment must f orce VID on address pin A9 (

with CE and OE at VIL and WE at VIH). When A1=1, it

will produce a logical "1" code at device output Q0 for a

protected sector . Otherwise the device will produce 00H

for the unprotected sector . In this mode, the addresses,

except for A1, are don't care. Address locations with

A1= VIL are reserved to read manufacturer and de vice

codes.(Read Silicon ID)

It is also possible to determine if the group is protected

in the system by writing a Read Silicon ID command.

Performing a read operation with A1=VIH, it will produce

a logical "1" at Q0 for the protected sector.

CHIP UNPROTECT OPERATION

The MX29LV320T/B also features the chip unprotect

mode, so that all sectors are unprotected after chip

unprotect is completed to incorporate any changes in

the code. It is recommended to protect all sectors before

activating chip unprotect mode.

To activate this mode, the programming equipment must

force VID on control pin OE and address pin A9. The CE

pins must be set at VIL. Pins A6 must be set to VIH.(see

Table 2) Refer to chip unprotect algorithm and wave-

form for the chip unprotect algorithm. The unprotection

mechanism begins on the f alling edge of the WE pulse

and is terminated on the rising edge.

MX29LV320T/B also provides another method which re-

quires VID on the RESET only . This method can be imple-

mented either in-system or via programming equipment.

This method uses standard microprocessor bus cycle

timing.

It is also possible to determine if the chip is unprotected

in the system by writing the Read Silicon ID command.

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MX29LV320T/B

P erforming a read operation with A1=VIH, it will produce

00H at data outputs(Q0-Q7) for an unprotected sector. It

is noted that all sectors are unprotected after the chip

unprotect algorithm is completed.

TEMPORARY SECTOR GROUP UNPROTECT

OPERATION

This feature allows temporary unprotection of previously

protected sector to change data in-system. The Tempo-

rary Sector Unprotect mode is activated by setting the

RESET pin to VID(11.5V-12.5V). During this mode, for-

merly protected sectors can be programmed or erased

as un-protected sector. Once V ID is remo ve from the

RESET pin, all the previously protected sectors are pro-

tected again.

WRITE PROTECT (WP)

The write protect function provides a hardware method

to protect boot sectors without using VID.

If the system asser ts VIL on the WP/ACC pin, the de-

vice disables program and erase functions in the two

"outermost" 8 Kbyte boot sectors independently of

whether those sectors were protected or unprotected

using the method described in Sector/Sector Group Pro-

tection and Chip Unprotection". The two outermost 8

Kbyte boot sectors are the two sectors containing the

lowest addresses in a bottom-boot-configured device, or

the two sectors containing the highest addresses in a

top-boot-configured device.

If the system asser ts VIH on the WP/ACC pin, the de-

vice re verts to whether the two outermost 8K Byte boot

sectors were last set to be protected or unprotected. That

is, sector protection or unprotection for these two sec-

tors depends on whether they were last protected or un-

protected using the method described in "Sector/Sector

Group Protection and Chip Unprotection".

Note that the WP/ACC pin must not be left floating or

unconnected; inconsistent behavior of the device may

result.

AUTOMATIC SELECT OPERATION

Flash memories are intended for use in applications where

the local CPU alters memory contents. As such, manu-

facturer and device codes must be accessible while the

device resides in the target system. PROM program-

mers typically access signature codes by raising A9 to

a high voltage . Howe ver , multiplexing high v oltage onto

address lines is not generally desired system design prac-

tice.

MX29LV320T/B provides hardware method to access the

Automatic Select operation. This method requires VID on

A9 pin, VIL on CE, OE, A6, and A1 pins. When applying

VIL on A0 pin, the device will output MXIC's manufac-

ture code of C2H. When applying VIH on A0 pin, the de-

vice will output MX29LV320T/B device code of 22A7h

and 22A8h.

VERIFY SECTOR GROUP PROTECT STATUS

OPERATION

MX29LV320T/B provides hardware method for sector

group protect status v erify. This method requires VID on

A9 pin, VIH on WE and A1 pins, VIL on CE, OE, A6, and

A0 pins, and sector address on A12 to A20 pins. When

the identified sector is protected, the device will output

01H. When the identified sector is not protect, the de vice

will output 00H.

SECURITY SECTOR FLASH MEMORY REGION

The Security Sector (Security Sector) feature provides a

Flash memory region that enables permanent part iden-

tification through an Electronic Serial Number (ESN). The

Security Sector is 64 Kbytes (32 Kwords) in length, and

uses a Security Sector Indicator Bit (Q7) to indicate

whether or not the Security Sector is locked when shipped

from the factory. This bit is per-manently set at the fac-

tory and cannot be changed, which prevents cloning of a

factory locked part. This ensures the security of the ESN

once the product is shipped to the field.

MXIC offers the device with the Security Sector either

f actory loc ked or customer lockab le. The factory-lock ed

version is always protected when shipped from the fac-

tory, and has the Security on Silicon Sector (Security

Sector) Indicator Bit permanently set to a "1". The cus-

tomer-lockable version is shipped with the unprotected,

allowing customers to utilize the that sector in any man-

ner they choose. The customer-lockable v ersion has the

Security on Silicon Sector (Security Sector) Indicator Bit

permanently set to a "0". Thus, the Security Sector Indi-

cator Bit prevents customer-lockable devices from be-

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

ing used to replace devices that are factory locked.

The system accesses the Security Sector through a

command sequence (see "Enter Security Sector/Exit

Security Sector Command Sequence"). After the sys-

tem has written the Enter Security Sector command se-

quence, it may read the Security Sector by using the ad-

dresses normally occupied by the boot sectors. This

mode of operation continues until the system issues the

Exit Security Sector command sequence, or until power

is removed from the device. On power-up, or following a

hardware reset, the device reverts to sending commands

to the boot sectors.

Factory Locked: Security Sector Programmed

and Protected at the Factory

In a factory locked device, the Security Sector is pro-

tected when the de vice is shipped from the f actory. The

Security Sector cannot be modified in any wa y. The de-

vice is available preprogrammed with one of the follow-

ing:

A random, secure ESN only.

Customer code through the Express Flash service.

Both a random, secure ESN and customer code through

the Express Flash service.

In devices that have an ESN, a Bottom Boot device will

have the 16-byte (8-word) ESN in the lowest address-

able memory area starting at 00000h and ending at

0000Fh (00007h). In the Top Boot device the starting

address of the ESN will be at the bottom of the lowest 8

Kbyte (4 Kword) boot sector starting at 3F0000h

(1F8000h) and ending at 3F000Fh (1F8007h).

Customer Lockable: Security Sector NOT Pro-

grammed or Protected at the Factory

If the security feature is not required, the Security Sec-

tor can be treated as an additional Flash memory space,

expanding the size of the available Flash array by 64

Kbytes (32 Kwords). The Secur ity Sector can be read,

progr ammed, and erased as often as required. The Se-

curity Sector area can be protected using one of the

following procedures:

Write the three-cycle Enter Security Region command

sequence, and then follow the in-system sector group

protect algorithm as shown in Figure 17, except that

RESET may be at either VIH or VID. This allows in-sys-

tem protection of the without raising any device pin to a

high voltage. Note that this method is only applicable to

the Security Sector .

Write the three-cycle Enter Security Region command

sequence, and then use the alternate method of sector

protection described in the "Sector/Sector Block Protec-

tion and Unprotection section.

Once the Security Sector is locked and verified, the sys-

tem must write the Exit Security Sector Region com-

mand sequence to return to reading and writing the re-

mainder of the arra y.

The Security Sector protection must be used with cau-

tion since, once protected, there is no procedure avail-

able for unprotecting the Security Sector area and none

of the bits in the Security Sector memory space can be

modified in any w ay.

DATA PROTECTION

The MX29LV320T/B is designed to offer protection

against accidental erasure or programming caused by

spurious system level signals that may exist during power

transition. During power up the device automatically re-

sets the state machine in the Read mode. In addition,

with its control register architecture, alteration of the

memory contents only occurs after successful comple-

tion of specific command sequences. The device also

incorporates several features to prevent inadvertent write

cycles resulting from VCC power-up and power-down tran-

sition or system noise.

LOW VCC WRITE INHIBIT

When VCC is less than VLKO the device does not ac-

cept any write cycles. This protects data during VCC

pow er-up and pow er-down. The command register and

all internal program/erase circuits are disabled, and the

de vice resets. Subsequent writes are ignored until VCC

is greater than VLKO. The system must provide the proper

signals to the control pins to prevent unintentional write

when VCC is greater than VLKO.

WRITE PULSE "GLITCH" PROTECTION

Noise pulses of less than 5ns (typical) on OE, CE or WE

will not initiate a write cycle.

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MX29LV320T/B

LOGICAL INHIBIT

Writing is inhibited by holding any one of OE = VIL, CE =

VIH or WE = VIH. To initiate a write cycle CE and WE

must be a logical zero while OE is a logical one.

POWER-UP SEQUENCE

The MX29LV320T/B powers up in the Read only mode.

In addition, the memory contents may only be altered

after successful completion of the predefined command

sequences.

POWER-UP WRITE INHIBIT

If WE=CE=VIL and OE=VIH during power up , the device

does not accept commands on the rising edge of WE.

The internal state machine is automatically reset to the

read mode on power-up.

POWER SUPPLY DECOUPLING

In order to reduce power switching effect, each device

should have a 0.1uF ceramic capacitor connected be-

tween its VCC and GND .

SOFTWARE COMMAND DEFINITIONS

Device operations are selected by writing specific ad-

dress and data sequences into the command register.

Writing incorrect address and data values or writing them

in the improper sequence will reset the device to the

read mode. Table 3 defines the v alid register command

sequences. Note that the Erase Suspend (B0H) and

Erase Resume (30H) commands are valid only while the

Sector Erase operation is in progress. Either of the two

reset command sequences will reset the device (when

applicable).

All addresses are latched on the falling edge of WE or

CE, whichever happens later . All data are latched on ris-

ing edge of WE or CE, whiche ver happens first.

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MX29LV320T/B

First Bus Second Bus Third Bus Fourth Bus Fifth Bus Sixth Bus

Command Bus Cycle Cycle Cycle Cycle Cycle Cycle

Cycles Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data

Read(Note 5) 1 RA RD

Reset(Note 4) 1 XXX F0

Automatic Select(Note 5)

Manufacturer ID Word 4 555 AA 2AA 55 555 90 X00 C2H

Byte 4 AAA AA 555 55 AAA 90 X00 C2H

Device ID Word 4 555 AA 2AA 55 555 90 X01 ID

Byte 4 AAA AA 555 55 AAA 90 X02

Security Sector Factory Word 4 555 AA 2AA 55 555 90 X03 99/19

Protect Verify (Note 6) Byte 4 AAA AA 555 55 AAA 90 X06

Sector Protect Verify Word 4 555 AA 2AA 55 555 90 (SA)X02 00/01

(Note 7) Byte 4 AAA AA 555 55 AAA 90 (SA)X04

Enter Security Sector Word 3 555 AA 2 AA 55 5 5 5 88

Region Byte 3 AAA AA 555 55 AAA 88

Exit Security Sector Word 4 5 55 AA 2A A 55 5 55 9 0 XXX 00

Byte 4 AAA AA 555 55 AAA 90 XXX 00

Program Word 4 555 AA 2AA 55 555 A0 PA PD

Byte 4 AAA AA 555 55 AAA A0 PA PD

Chip Erase Word 6 555 AA 2AA 55 555 80 555 AA 2AA 55 555 10

Byte 6 AAA AA 555 55 AAA 80 AAA AA 555 55 AAA 10

Sector Erase Word 6 5 55 AA 2AA 5 5 5 55 8 0 5 55 AA 2AA 55 SA 30

Byte 6 AAA AA 555 55 AAA 80 AAA AA 555 55 SA 30

CFI Query (Note 8) Word 1 55 98

Byte 1 AA 98

Erase Suspend(Note 9) 1 SA B0

Erase Resume(Note 10) 1 SA 30

TABLE 3. MX29LV320T/B COMMAND DEFINITIONS

Legend:

X=Don't care

RA=Address of the memory location to be read.

RD=Data read from location RA during read operation.

PA=Address of the memor y location to be programmed.

Addresses are latched on the falling edge of the WE or CE

pulse.

PD=Data to be programmed at location PA. Data is latched

on the rising edge of WE or CE pulse.

SA=Address of the sector to be erased or verified. Address

bits A20-A12 uniquely select any sector.

ID=22A7h(Top), 22A8h(Bottom)

Notes:

1. See Table 1 for descriptions of bus operations.

2. All values are in hexadecimal.

3. Except when reading array or Automatic Select data, all bus cycles are write operation.

4. The Reset command is required to return to the read mode when the device is in the Automatic Select mode or if Q5 goes

high.

5. The fourth cycle of the Automatic Select command sequence is a read cycle.

6. The data is 99h for factory locked and 19h for not factory locked.

7. The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block. In the third cycle of the

command sequence, address bit A20=0 to ver ify sectors 0~31, A20=1 to verify sectors 32~70 for Top Boot device.

8. Command is valid when device is ready to read array data or when device is in Automatic Select mode.

9. The system may read and program functions in non-erasing sectors, or enter the Automatic Select mode, when in the erase

Suspend mode. The Erase Suspend command is valid only during a sector erase operation.

10.The Erase Resume command is valid only during the Erase Suspend mode.

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MX29LV320T/B

READING ARRAY DATA

The device is automatically set to reading array data

after device power-up. No commands are required to

retrieve data. The device is also ready to read array data

after completing an Automatic Program or Automatic

Erase algorithm.

After the device accepts an Erase Suspend command,

the device enters the Erase Suspend mode. The sys-

tem can read array data using the standard read tim-

ings, except that if it reads at an address within erase-

suspended sectors, the device outputs status data. After

completing a programming operation in the Erase

Suspend mode, the system may once again read array

data with the same exception. See Erase Suspend/Erase

Resume Commands” for more information on this mode.

The system must issue the reset command to re-en-

able the device for reading array data if Q5 goes high

during an active program or erase operation, or while in

the Automatic Select mode. See the "Reset Command"

section, next.

RESET COMMAND

Writing the reset command to the device resets the

device to reading array data. Address bits are don't care

for this command.

The reset command may be written between the se-

quence cycles in an erase command sequence before

erasing begins. This resets the device to reading array

data. Once erasure begins, however, the device ignores

reset commands until the operation is complete.

The reset command may be written between the se-

quence cycles in a program command sequence before

programming begins. This resets the device to reading

array data (also applies to programming in Erase Suspend

mode). Once programming begins, however, the device

ignores reset commands until the operation is complete.

The reset command may be written between the se-

quence cycles in an Automatic Select command

sequence. Once in the Automatic Select mode, the reset

command must be written to return to reading array data

(also applies to Automatic Select during Erase Suspend).

If Q5 goes high during a program or erase operation,

writing the reset command returns the device to read-ing

array data (also applies during Erase Suspend).

AUTOMATIC SELECT COMMAND SEQUENCE

The Automatic Select command sequence allows the

host system to access the manufacturer and device

codes, and determine whether or not a sector is pro-

tected. Table 2 sho ws the address and data requirements.

This method is an alternative to that shown in Table 3,

which is intended for EPROM programmers and requires

VID on address bit A9.

The Automatic Select command sequence is initiated

by writ-ing two unlock cycles, followed by the Automatic

Select command. The device then enters the Automatic

Select mode, and the system may read at any address

any number of times, without initiating another command

sequence. A read cycle at address XX00h retrieves the

manufacturer code. A read cycle at address XX01h in

word mode (or xx02h in byte mode) returns the device

code. A read cycle containing a sector address (SA) and

the address 02h on A7-A0 in word mode (or the address

04h on A6-A-1 in byte mode) returns 01h if that sector is

protected, or 00h if it is unprotected. Refer to Table 1 for

valid sector addresses.

The system must write the reset command to exit the

Automatic Select mode and return to reading array data.

ENTER SECURITY SECT OR & EXIT SECURITY

SECTOR COMMAND SEQUENCE

The Security Sector provides a secured area which con-

tains a random, sixteen-byte electronic serial

number.(ESN)

The system can access the Security Sector area by is-

suing the three-cycle "Enter Security Sector command

sequence. The device continues to access the security

section area until the system issues the four-cycle Exit

Security Sector command sequence. The Exit Security

Sector command sequence returns the device to normal

operation.

BYTE/WORD PROGRAM COMMAND SEQUENCE

The device programs one byte/word of data for each

progr am operation. The command sequence requires f our

bus cycles, and is initiated by writing two unlock write

cycles, followed by the program set-up command. The

program address and data are written next, which in turn

initiate the Embedded Program algor ithm. The system is

not required to provide further controls or timings. The

device automatically generates the program pulses and

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MX29LV320T/B

verifies the programmed cell margin. Table 3 shows the

address and data requirements for the byte/word program

command sequence.

When the Embedded Program algorithm is complete, the

device then returns to reading array data and addresses

are no longer latched. The system can determine the

status of the program operation by using Q7, Q6, or RY/

BY. See "Write Operation Status" for inf ormation on these

status bits.

Any commands written to the device during the Em-

bedded Program Algorithm are ignored. Note that a

hardware reset immediately terminates the programming

operation. The Byte/Word Program command sequence

should be reinitiated once the device has reset to reading

array data, to ensure data integrity.

Programming is allowed in any sequence and across

sector boundaries. A bit cannot be programmed from a

"0" back to a "1". Attempting to do so may cause the

device to set Q5 to "1" ,” or cause the Data Polling

algorithm to indicate the operation was successful.

Pins A0 A1 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Code (Hex)

Manufacture code VIL VIL 1 1 0 0 0 0 1 0 C2H

Device code for MX29LV320T VIH VIL 1 0 1 0 0 1 1 1 22A7H

Device code for MX29LV320B VIH VIL 1 0 1 0 1 0 0 0 22A8H

TABLE 4. SILICON ID CODE

AUTOMA TIC CHIP/SECTOR ERASE COMMAND

The device does not require the system to preprogram

prior to erase. The Automatic Erase algorithm automati-

cally preprograms and verifies the entire memory for an

all zero data pattern prior to electrical erase. The system

is not required to provide any controls or timings during

these operations. Table 3 shows the address and data

requirements for the chip erase command sequence.

Any commands written to the chip during the Automatic

Erase algorithm are ignored. Note that a hard-ware reset

during the chip erase operation immediately terminates

the operation. The Chip Erase command sequence should

However, a succeeding read will show that the data is

still "0". Only erase operations can convert a "0" to a

"1".

SETUP AUTOMATIC CHIP/SECTOR ERASE

Chip erase is a six-bus cycle operation. There are two

"unlock" write cycles. These are follow ed b y writing the

"set-up" command 80H. Two more "unlock" write cycles

are then followed by the chip erase command 10H, or

the sector erase command 30H.

The MX29LV320T/B contains a Silicon-ID-Read opera-

tion to supplement traditional PROM programming meth-

odology. The operation is initiated by writing the read

silicon ID command sequence into the command regis-

ter. Following the command write, a read cycle with

A1=VIL,A0=VIL retrieves the manufacturer code of C2H.

A read cycle with A1=VIL, A0=VIH returns the device

code of A7H/A8H f or MX29LV320T/B.

be reinitiated once the device has returned to reading

arra y data, to ensure data integrity.

The system can determine the status of the erase op-

eration b y using Q7, Q6, Q2, or RY/BY. See "Write Op-

eration Status" for information on these status bits. When

the Automatic Erase algorithm is complete, the device

returns to reading array data and addresses are no longer

latched.

Figure 5 illustrates the algorithm for the erase opera-

tion.See the Erase/Program Operations tables in "AC

Characteristics" for parameters, and to Figure 4 for tim-

ing diagrams.

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MX29LV320T/B

SECTOR ERASE COMMANDS

The device does not require the system to entirely

pre-program prior to executing the Automatic Set-up

Sector Erase command and Automatic Sector Erase

command. Upon executing the Automatic Sector

Erase command, the device will automatically

program and verify the sector(s) memory for an all-

zero data pattern. The system is not required to

provide any control or timing during these operations.

When the sector(s) is automatically verified to

contain an all-zero pattern, a self-timed sector erase

and verify begin. The erase and verify operations are

complete when the data on Q7 is "1" and the data on

Q6 stops toggling for two consecutive read cycles, at

which time the device returns to the Read mode. The

system is not required to provide any control or timing

during these operations.

When using the Automatic Sector Erase algorithm,

note that the erase automatically terminates when

adequate erase margin has been achieved for the

memory array (no erase verification command is

required). Sector erase is a six-bus cycle operation.

There are two "unlock" write cycles. These are

followed by writing the set-up command 80H. Two

more "unlock" write cycles are then followed by the

sector erase command 30H. The sector address is

latched on the falling edge of WE or CE, whichever

happens later , while the command(data) is latched on

the rising edge of WE or CE, whichever happens first.

Sector addresses selected are loaded into internal

whichever happens later. Each successive sector

load cycle started by the falling edge of WE or CE,

whichever happens later must begin within 50us from

the rising edge of the preceding WE or CE, whichever

happens first. Otherwise, the loading period ends and

internal auto sector erase cycle starts. (Monitor Q3 to

determine if the sector erase timer window is still

open, see section Q3, Sector Erase Timer.) Any

command other than Sector Erase(30H) or Erase

Suspend(B0H) during the time-out period resets the

device to read mode.

ERASE SUSPEND

This command only has meaning while the state ma-

chine is executing Automatic Sector Erase operation,

and therefore will only be responded during Automatic

Sector Erase operation. When the Erase Suspend com-

mand is issued during the sector erase operation, the

device requires a maximum 20us to suspend the sector

erase operation. However, When the Erase Suspend com-

mand is written during the sector erase time-out, the

device immediately terminates the time-out period and

suspends the erase operation. After this command has

been executed, the command register will initiate erase

suspend mode. The state machine will retur n to read

mode automatically after suspend is ready. At this time,

state machine only allows the command register to re-

spond to the Erase Resume, program data to, or read

data from any sector not selected f or er asure. The sys-

tem can use Q7, or Q6 and Q2 together , to determine if

a sector is actively erasing or is erase-suspended.

The system can determine the status of the program

operation using the Q7 or Q6 status bits, just as in the

standard program operation. After an erase-suspend pro-

gram operation is complete, the system can once again

read array data within non-suspended blocks.

ERASE RESUME

This command will cause the command register to clear

the suspend state and return back to Sector Erase mode

but only if an Erase Suspend command was previously

issued. Erase Resume will not have any effect in all

other conditions. Another Erase Suspend command can

be written after the chip has resumed erasing.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Table 5. Write Operation Status

Notes:

1. P erforming successive read operations from the erase-suspended sector will cause Q2 to toggle.

2. P erf orming successiv e read operations from any address will cause Q6 to toggle.

3. Reading the byte/word address being programmed while in the erase-suspend program mode will indicate logic "1"

at the Q2 bit.

How ev er, successive reads from the erase-suspended sector will cause Q2 to toggle .

WRITE OPERATION STATUS

The device provides several bits to determine the sta-

tus of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/BY.

Table 5 and the following subsections describe the func-

tions of these bits. Q7, RY/BY, and Q6 each offer a

method for determining whether a program or erase op-

eration is complete or in progress . These three bits are

discussed first.

Status Q7 Q6 Q5 Q3 Q2 RY/BY

Note1 Note2

Byte/Word Program in Auto Program Algorithm Q7 Toggle 0 N/A No 0

Toggle

Auto Erase Algorithm 0 Toggle 0 1 Toggle 0

Erase Suspend Read 1 No 0 N/A Toggle 1

(Erase Suspended Sector) Toggle

In Progress Erase Suspended Mode Erase Suspend Read Data Data Data Data Data 1

(Non-Erase Suspended Sector)

Erase Suspend Program Q7 Toggle 0 N/A N/A 0

Byte/Word Program in Auto Program Algorithm Q7 Toggle 1 N/A No 0

Toggle

Exceeded

Time Limits Auto Erase Algorithm 0 Toggle 1 1 Toggle 0

Erase Suspend Program Q7 Toggle 1 N/A N/A 0

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Q7: Data Polling

The Data Polling bit, Q7, indicates to the host system

whether an Automatic Algorithm is in progress or com-

pleted, or whether the device is in Erase Suspend. Data

P olling is valid after the rising edge of the final WE pulse

in the program or erase command sequence.

During the Automatic Program algorithm, the device out-

puts on Q7 the complement of the datum programmed

to Q7. This Q7 status also applies to progr amming dur-

ing Erase Suspend. When the Automatic Program algo-

rithm is complete, the device outputs the datum pro-

gr ammed to Q7. The system must provide the program

address to read valid status information on Q7. If a pro-

gr am address f alls within a protected sector, Data Poll-

ing on Q7 is active for approximately 1 us, then the de-

vice returns to reading array data.

During the Automatic Erase algorithm, Data Polling pro-

duces a "0" on Q7. When the Automatic Erase algorithm

is complete, or if the device enters the Erase Suspend

mode, Data P olling produces a "1" on Q7. This is analo-

gous to the complement/true datum out-put described

for the Automatic Program algorithm: the erase function

changes all the bits in a sector to "1" prior to this, the

device outputs the "complement,” or "0".” The system

must provide an address within any of the sectors se-

lected for erasure to read valid status information on Q7.

After an erase command sequence is written, if all sec-

tors selected f or er asing are protected, Data Polling on

Q7 is active for approximately 100 us, then the device

returns to reading array data. If not all selected sectors

are protected, the Automatic Erase algorithm erases the

unprotected sectors, and ignores the selected sectors

that are protected.

When the system detects Q7 has changed from the

complement to true data, it can read valid data at Q7-Q0

on the following read cycles. This is because Q7 may

change asynchronously with Q0-Q6 while Output Enable

(OE) is asserted low.

Q6:Toggle BIT I

Toggle Bit I on Q6 indicates whether an Automatic Pro-

gram or Erase algorithm is in progress or complete, or

whether the device has entered the Erase Suspend mode.

Toggle Bit I may be read at any address, and is valid

after the rising edge of the final WE or CE, whichever

happens first pulse in the command sequence (prior to

the program or erase operation), and during the sector

time-out.

During an Automatic Program or Erase algorithm opera-

tion, successive read cycles to any address cause Q6

to toggle. The system may use either OE or CE to con-

trol the read cycles. When the operation is complete, Q6

stops toggling.

After an erase command sequence is written, if all sec-

tors selected for erasing are protected, Q6 toggles for

100us and returns to reading array data. If not all se-

lected sectors are protected, the Automatic Erase algo-

rithm erases the unprotected sectors, and ignores the

selected sectors that are protected.

The system can use Q6 and Q2 together to determine

whether a sector is actively erasing or is erase suspended.

When the device is actively erasing (that is, the Auto-

matic Erase algorithm is in progress), Q6 toggling. When

the device enters the Erase Suspend mode, Q6 stops

toggling. Howe ver , the system m ust also use Q2 to de-

termine which sectors are erasing or erase-suspended.

Alternatively, the system can use Q7.

If a program address falls within a protected sector, Q6

toggles for approximately 2us after the program com-

mand sequence is written, then returns to reading array

data.

Q6 also toggles during the erase-suspend-program mode,

and stops toggling once the Automatic Program algo-

rithm is complete.

Table 5 shows the outputs for Toggle Bit I on Q6.

Q2:Toggle Bit II

The "Toggle Bit II" on Q2, when used with Q6, indicates

whether a par ticular sector is actively erasing (that is,

the Automatic Erase algorithm is in process), or whether

that sector is erase-suspended. Toggle Bit II is valid

after the rising edge of the final WE or CE, whichever

happens first pulse in the command sequence.

Q2 toggles when the system reads at addresses within

those sectors that have been selected for erasure. (The

system may use either OE or CE to control the read

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

cycles.) But Q2 cannot distinguish whether the sector

is actively erasing or is erase-suspended. Q6, by com-

parison, indicates whether the device is actively eras-

ing, or is in Erase Suspend, but cannot distinguish which

sectors are selected f or erasure . Thus, both status bits

are required for sectors and mode information. Refer to

Table 5 to compare outputs for Q2 and Q6.

Reading Toggle Bits Q6/ Q2

Whenever the system initially begins reading toggle bit

status, it must read Q7-Q0 at least twice in a row to

determine whether a toggle bit is toggling. Typically, the

system would note and store the value of the toggle bit

after the first read. After the second read, the system

would compare the new value of the toggle bit with the

first. If the toggle bit is not toggling, the device has

completed the program or erase operation. The system

can read array data on Q7-Q0 on the following read cycle.

However, if after the initial two read cycles, the system

determines that the toggle bit is still toggling, the sys-

tem also should note whether the value of Q5 is high

(see the section on Q5). If it is, the system should then

determine again whether the toggle bit is toggling, since

the toggle bit may have stopped toggling just as Q5 went

high. If the toggle bit is no longer toggling, the device

has successfully completed the program or erase opera-

tion. If it is still toggling, the device did not complete the

operation successfully, and the system must write the

reset command to return to reading array data.

The remaining scenario is that system initially determines

that the toggle bit is toggling and Q5 has not gone high.

The system may continue to monitor the toggle bit and

Q5 through successive read cycles, determining the sta-

tus as described in the previous paragraph. Alternatively ,

it may choose to perform other system tasks. In this

case, the system must start at the beginning of the al-

gorithm when it returns to determine the status of the

operation.

Q5:Program/Erase Timing

Q5 will indicate if the program or erase time has exceeded

the specified limits(internal pulse count). Under these

conditions Q5 will produce a "1". This time-out condition

indicates that the program or erase cycle was not suc-

cessfully completed. Data Polling and Toggle Bit are the

only operating functions of the device under this condi-

tion.

If this time-out condition occurs during sector erase op-

eration, it specifies that a particular sector is bad and it

may not be reused. However , other sectors are still func-

tional and may be used for the program or erase opera-

tion. The device must be reset to use other sectors.

Write the Reset command sequence to the device, and

then execute program or erase command sequence. This

allows the system to continue to use the other active

sectors in the device.

If this time-out condition occurs during the chip erase

operation, it specifies that the entire chip is bad or com-

bination of sectors are bad.

If this time-out condition occurs during the byte/word pro-

gramming operation, it specifies that the entire sector

containing that byte/word is bad and this sector maynot

be reused, (other sectors are still functional and can be

reused).

The time-out condition may also appear if a user tries to

program a non blank location without erasing. In this

case the device locks out and never completes the Au-

tomatic Algorithm operation. Hence, the system never

reads a valid data on Q7 bit and Q6 never stops toggling.

Once the Device has exceeded timing limits, the Q5 bit

will indicate a "1". Please note that this is not a device

failure condition since the device was incorrectly used.

The Q5 failure condition may appear if the system tries

to program a "1" to a location that is previously pro-

grammed to "0". Only an erase operation can change a

"0" back to a "1".” Under this condition, the device halts

the operation, and when the operation has exceeded the

timing limits, Q5 produces a "1".

Q3:Sector Erase Timer

After the completion of the initial sector erase command

sequence, the sector erase time-out will begin. Q3 will

remain low until the time-out is complete. Data Polling

and Toggle Bit are valid after the initial sector erase com-

mand sequence.

If Data P olling or the Toggle Bit indicates the device has

been written with a valid erase command, Q3 may be

used to determine if the sector erase timer window is

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

still open. If Q3 is high ("1") the internally controlled

erase cycle has begun; attempts to write subsequent

commands to the device will be ignored until the erase

operation is completed as indicated by Data Polling or

Toggle Bit. If Q3 is low ("0"), the de vice will accept addi-

tional sector erase commands. To insure the command

has been accepted, the system software should check

the status of Q3 prior to and following each subsequent

sector erase command. If Q3 were high on the second

status check, the command may not have been accepted.

If the time between additional erase commands from the

system can be less than 50us, the system need not to

monitor Q3.

RY/BY:READY/BUSY OUTPUT

The RY/BY is a dedicated, open-drain output pin that

indicates whether an Embedded Algorithm is in progress

or complete. The RY/BY status is valid after the rising

edge of the final WE pulse in the command sequence.

Since RY/BY is an open-drain output, several R Y/BY pins

can be tied together in parallel with a pull-up resistor to

VCC .

If the output is low (Busy), the device is actively erasing

or programming. (This includes programming in the Erase

Suspend mode.) If the output is high (Ready), the device

is ready to read array data (includ-ing during the Erase

Suspend mode), or is in the standby mode.

QUERY COMMAND AND COMMON FLASH

INTERFACE (CFI) MODE

MX29LV320T/B is capable of operating in the CFI mode.

This mode all the host system to determine the manu-

facturer of the device such as operating parameters and

configuration. Two commands are required in CFI mode.

Query command of CFI mode is placed first, then the

Reset command exits CFI mode. These are described in

Table 3.

The single cycle Query command is valid only when the

device is in the Read mode, including Erase Suspend,

Standby mode , and Automatic Select mode; howev er, it

is ignored otherwise.

The Reset command exits from the CFI mode to the

Read mode, or Erase Suspend mode, or Automatic Se-

lect mode. The command is valid only when the device

is in the CFI mode.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Table 6-1. CFI mode: Identification Data Values

(All values in these tables are in hexadecimal)

Description Address (h) Address (h) Data (h)

(Word Mode) (Byte Mode)

Query-unique ASCII string "QRY" 1 0 20 0051

11 22 0052

12 24 0059

Primary vendor command set and control interface ID code 1 3 2 6 0002

14 28 0000

Address for primary algorithm extended query table 15 2A 0040

16 2C 0000

Alternate vendor command set and control interface ID code (none) 1 7 2E 0000

18 30 0000

Address for secondary algorithm extended query table (none) 1 9 32 0000

1A 34 0000

Table 6-2. CFI Mode: System Interface Data Values

Description Address (h) Address (h) Data (h)

(Word Mode) (Byte Mode)

VCC supply, minimum (2.7V) 1B 3 6 0027

VCC supply, maximum (3.6V) 1 C 3 8 0036

VPP supply, minimum (none) 1 D 3A 0000

VPP supply, maximum (none) 1E 3C 0000

Typical timeout for single word/byte write (2N us) 1F 3E 0004

Typical timeout for maximum size buffer write (2N us) (not supported) 20 4 0 0000

Typical timeout for individual sector erase (2N ms) 2 1 4 2 000A

Typical timeout for full chip erase (2N ms) 2 2 44 0000

Maximum timeout for single word/byte write times (2N X Typ) 23 46 0005

Maximum timeout for maximum size buffer write times (2N X Typ) 24 48 0000

Maximum timeout for individual sector erase times (2N X Typ) 25 4 A 0004

Maximum timeout for full chip erase times (not supported) 2 6 4C 0000

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Table 6-3. CFI Mode: Device Geometry Data Values

Description Address (h) Address (h) Data (h)

(Word Mode) (Byte Mode)

Device size (2N bytes) 2 7 4E 0016

Flash device interface code (02=asynchronous x8/x16) 2 8 5 0 0002

29 52 0000

Maximum number of bytes in multi-byte write (not supported) 2A 5 4 0000

2B 56 0000

Number of erase sector regions 2 C 58 0002

Erase Sector Region 1 Information 2 D 5A 0007

[2E,2D] = # of same-size sectors in region 1-1 2E 5C 0000

[30, 2F] = sector size in multiples of 256-bytes 2F 5E 0020

30 60 0000

Erase Sector Region 2 Information 3 1 6 2 003E

32 64 0000

33 66 0000

34 68 0001

Erase Sector Region 3 Information 3 5 6A 0000

36 6C 0000

37 6E 0000

38 70 0000

Erase Sector Region 4 Information 3 9 7 2 0000

3A 74 0000

3B 76 0000

3C 78 0000

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Table 6-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values

Description Address (h) Address (h) Data (h)

(Word Mode) (Byte Mode)

Query-unique ASCII string "PRI" 4 0 8 0 0050

41 82 0052

42 84 0049

Major version number, ASCII 4 3 8 6 0031

Minor version number, ASCII 4 4 8 8 0031

Address sensitive unlock (0=required, 1= not required) 4 5 8A 0000

Erase suspend (2= to read and write) 4 6 8 C 0002

Sector protect (N= # of sectors/group) 4 7 8 E 0004

Temporary sector unprotect (1=supported) 48 90 0001

Sector protect/Chip unprotect scheme 49 92 0004

Simultaneous R/W operation (0=not supported) 4A 94 0000

Burst mode type (0=not supported) 4B 9 6 0000

Page mode type (0=not supported) 4 C 98 0000

ACC (Acceleration) Supply Minimum 4D 9A 00B5

(0=not supported, D7-D4:Volt, D3-D0:100mV

ACC (Acceleration) Supply Maximum 4E 9 C 00C5

(0=not supported, D7-D4:Volt, D3-D0:100mV

Top/Bottom Boot Sector Flag 4 F 9E 000X

02h=Bottom Boot Device, 03h=Top Boot Device

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

ABSOLUTE MAXIMUM RATINGS

Storage T emperature

Plastic Packages . . . . . . . . . . . . . ..... -65oC to +150oC

Ambient T emperature

with Power Applied. . . . . . . . . . . . . .... -65oC to +125oC

V oltage with Respect to Ground

VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V

A9, OE, and

RESET (Note 2) . . . . . . . . . . . ....-0.5 V to +12.5 V

All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V

Output Short Circuit Current (Note 3) . . . . . . 200 mA

Notes:

1. Minimum DC v oltage on input or I/O pins is -0.5 V.

During voltage transitions, input or I/O pins may over-

shoot VSS to -2.0 V for periods of up to 20ns. Maxi-

mum DC voltage on input or I/O pins is VCC +0.5 V.

During voltage transitions, input or I/O pins may over-

shoot to VCC +2.0 V f or periods up to 20 ns.

2. Minimum DC input voltage on pins A9, OE, and

RESET is -0.5 V. During v oltage tr ansitions, A9, OE,

and RESET ma y overshoot VSS to -2.0 V f or periods

of up to 20 ns. Maximum DC input voltage on pin A9

is +12.5 V which ma y ov ershoot to 14.0 V f or periods

up to 20 ns.

3. No more than one output may be shorted to ground at

a time. Duration of the short circuit should not be

greater than one second.

Stresses above those listed under "Absolute Maximum

Ratings" may cause permanent damage to the device.

This is a stress rating only; functional operation of the

device at these or any other conditions above those in-

dicated in the operational sections of this data sheet is

not implied. Exposure of the device to absolute maxi-

mum rating conditions for extended periods may affect

device reliability.

OPERATING RATINGS

Commercial (C) Devices

Ambient Temperature (TA ) . . . . . . . . . . . . 0 °C to +70°C

Industrial (I) Devices

Ambient Temperature (TA ) . . . . . . . . . . - 4 0 °C to +85 °C

VCC Supply Voltages

VCC for regulated voltage range . . . . . +3.0 V to 3.6 V

VCC for full voltage range. . . . . . . . . . . +2.7 V to 3.6 V

Operating ranges define those limits between which the

functionality of the device is guaranteed.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Parameter Description Test Conditions Min T yp Max Unit

ILI Input Load Current (Note 1) VIN = VSS to VCC, ±1.0 uA

VCC = VCC max

ILIT A9 Input Load Current VCC = VCC max ; A9=12.5V 35 uA

ILO Output Leakage Current VOUT = VSS to VCC , ±1.0 uA

VCC = VCC max

ICC1 VCC Active Read Current CE= VIL, OE = VIH 5 MHz 1 0 1 6 mA

(Notes 2, 3) 1 MHz 2 4 mA

ICC2 VCC Active W rite Current CE= VIL , OE = VIH, 15 30 mA

(Notes 2, 4, 6) WE=VIL

ICC3 VCC Standby Current (Note 2) CE, RESET, 0.2 1 5 uA

WP/A CC = VCC±0.3 V

ICC4 VCC Reset Current (Note 2) RESET = VSS ± 0.3 V, 0.2 15 uA

WP/ACC= VCC ± 0.3 V

ICC5 Automatic Sleep Mode VIH = VCC ± 0.3 V; 0.2 1 5 uA

(Notes 2,5) VIL = VSS ± 0.3 V,

WP/A CC = VCC ± 0.3 V

IACC WP/ACC Accelerated Program CE=VIL,OE=VIH WP/ACC pin 5 1 0 mA

Current, W ord or Byte VCC pin 1 5 30 mA

VIL Input Low V oltage -0.5 0.8 V

VIH Input High V oltage 0.7xVcc Vcc+0.3 V

V HH Voltage for WP/A CC Sector VCC = 3.0 V ± 10% 11.5 12.5 V

Protect/Unprotect and Program

Acceleration

VID Voltage f or Automatic Select and VCC = 3.0 V ± 10% 11.5 12.5 V

Temporary Sector Unprotect

VO L Output Lo w Voltage IOL = 4.0mA, VCC = VCC min 0.45 V

VO H1 Output High V oltage IOH =-2.0mA,VCC = VCC min 0.85 Vcc V

V O H2 IOH =-100uA,VCC = VCC min Vcc-0.4 V

VLKO Low VCC Lock-Out Voltage 1.4 2.1 V

(Note 6)

Notes:

1. On the WP/ACC pin only, the maximum input load current when WP/A CC = VIL is ± 5.0uA / VIH is ± 3.0uA.

2. Maximum ICC specifications are tested with VCC = VCC max.

3. The ICC current listed is typically is less than 2 mA/MHz, with OE at VIH. Typical specifications are for VCC = 3.0

4. ICC active while Embedded Erase or Embedded Program is in progress.

5. Automatic sleep mode enables the low power mode when addresses remain stable for tA CC + 30 ns. T ypical sleep

mode current is 200 nA.

6. Not 100% tested.

DC CHARACTERISTICS TA=-40°°

°°

°C to 85°°

°°

°C, VCC=2.7V~3.6V (VCC=3.0~3.6V for MX29LV320T/B-

70R/90R)

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

SWITCHING TEST CIRCUITS TEST SPECIFICA TIONS

Test Condition 70 70R 90 90R 120Unit

Output Load 1 TTL gate

Output Load Capacitance,CL 3 0 30 100 pF

(including jig capacitance)

Input Rise and F all Times 5 ns

Input Pulse Levels 0.0-3.0 V

Input timing measurement 1.5 V

reference levels

Output timing measurement 1.5 V

reference levels

WAVEFROM INPUTS OUTPUTS

Steady

Changing from H to L

Changing from L to H

Don't Care, Any Change P ermitted Changing, State Unknown

Does Not Apply Center Line is High Impedance State(High Z)

KEY TO SWITCHING WAVEFORMS

1.5V 1.5V

Measurement Level

3.0V

0.0V OUTPUT

INPUT

SWITCHING TEST WAVEFORMS

DEVICE UNDER

TEST

DIODES=IN3064

OR EQUIVALENT

CL 6.2K ohm

1.6K ohm +3.3V

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Symbol DESCRIPTION CONDITION 70 90 1 2 0 Unit

tACC Address to output delay CE=VIL MAX 70 9 0 12 0 ns

OE=VIL

tCE Chip enable to output delay OE=VIL MAX 70 9 0 1 20 ns

tOE Output enable to output delay MAX 40 4 0 5 0 ns

tDF OE High to output float(Note1) MAX 30 3 0 3 0 ns

tO H Output hold time of from the rising edge of MI N 0 0 0 ns

Address, CE, or OE, whichever happens first

t R C Read cycle time (Note 1) MI N 70 90 1 2 0 ns

t W C Write cycle time (Note 1) MI N 70 90 1 2 0 ns

tCWC Command write cycle time(Note 1) MIN 70 9 0 1 20 ns

tAS Address setup time MI N 0 0 0 ns

tAH Address hold time MIN 45 4 5 5 0 ns

tDS Data setup time MI N 45 4 5 5 0 ns

tDH Data hold time MIN 0 0 0 ns

tVCS Vcc setup time(Note 1) MI N 50 5 0 5 0 ns

tCS Chip enable setup time MIN 0 0 0 ns

tCH Chip enable hold time MIN 0 0 0 ns

tOES Output enable setup time (Note 1) MIN 0 0 0 ns

tOEH Output enable hold time (Note 1) Read MIN 0 0 0 ns

Toggle & MIN 10 10 10 ns

Data Polling

tWES WE setup time MI N 0 0 0 ns

tWEH WE hold time MI N 0 0 0 n s

tCEP CE pulse width MIN 45 4 5 5 0 ns

tCEPH CE pulse width high MIN 30 3 0 3 0 ns

tWP WE pulse width MIN 45 4 5 5 0 ns

tWPH WE pulse width high MI N 30 3 0 3 0 ns

tBUSY Program/Erase v alid to R Y/BY dela y MAX 90 9 0 9 0 ns

tGHWL Read recovery time before write MIN 0 0 0 ns

tGHEL Read recovery time before write MIN 0 0 0 ns

tWHWH1 Programming operation BYTE TYP 9 9 9 us

WORD TYP 11 11 11 us

Accelerated programming operation word or TYP 7 7 7 us

byte

tWHWH2 Sector erase operation TYP 0.9 0.9 0.9 sec

tBAL Sector address hold time MAX 5 0 5 0 5 0 us

Note: 1.Not 100% T ested

2.tr = tf = 5ns

AC CHARACTERISTICS TA=-40°°

°°

°C to 85°°

°°

°C, VCC=2.7V~3.6V (VCC=3.0~3.6V for MX29LV320T/B-

70R/90R)

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 1. COMMAND WRITE OPERATION

Addresses

DIN

tDS

tAH

Data

tDH

tCS tCH

tCWC

tWPH

tWP

tOES

tAS

VCC

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

ADD V alid

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

READ/RESET OPERATION

Fig 2. READ TIMING WAVEFORMS

Addresses

tACC

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

VOH

VOL

HIGH Z HIGH Z

D ATA V alid

tOE

tOEH tDF

tCE

tRC

Outputs

tOH

ADD V alid

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 3. RESET TIMING WAVEFORM

AC CHARACTERISTICS

Parameter Description Test Setup All Speed Options Unit

tREAD Y1 RESET PIN Low (During Automatic Algorithms) MAX 2 0 us

to Read or Write (See Note)

tREAD Y2 RESET PIN Low (NOT During Automatic MAX 500 ns

Algorithms) to Read or Write (See Note)

tRP1 RESET Pulse Width (During Automatic Algorithms) MIN 1 0 us

tRP2 RESET Pulse Width (NOT During Automatic Algorithms) MIN 5 00 ns

tRH RESET High Time Before Read(See Note) MIN 7 0 ns

tRB1 RY/BY Recove ry Time(to CE, OE go low) MI N 0 ns

tRB2 RY/BY Recovery Time(to WE go lo w) MIN 5 0 ns

Note:Not 100% tested

tRH

tRB1

tRB2

tReady1

tRP2

tRP1

tReady2

RY/BY

CE, OE

RESET

Reset Timing NOT during Automatic Algorithms

Reset Timing during Automatic Algorithms

RY/BY

CE, OE

RESET

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

ERASE/PROGRAM OPERATION

Fig 4. AUTOMATIC CHIP ERASE TIMING WAVEFORM

tWC

Address

55h

2AAh SA

10h

Progress Complete

VA VA

NOTES:

SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").

tAS

tAH

555h for chip erase

tGHWL

tCH

tWP

tDS tDH

tWHWH2

Read Status Data Erase Command Sequence(last two cycle)

tBUSY tRB

tCS tWPH

tVCS

Data

RY/BY

VCC

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 5. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART

START

Write Data AAH Address 555H

Write Data 55H Address 2AAH

Write Data AAH Address 555H

Write Data 80H Address 555H

YES

Write Data 10H Address 555H

Write Data 55H Address 2AAH

DATA = FFh ?

YES

Auto Erase Completed

Data Poll

from system

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 6. AUTOMATIC SECTOR ERASE TIMING WAVEFORM

tWC

Address

55h

2AAh Sector

Address 1

Sector

Address 0

30h

Progress Complete

VA VA

30h

NOTES:

SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status").

Sector

Address n

tAS

tAH

tBAL

tGHWL

tCH

tWP

tDS tDH

tWHWH2

Read Status Data Erase Command Sequence(last two cycle)

tBUSY tRB

tCS tWPH

tVCS

Data

RY/BY

VCC

30h

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 7. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART

START

Write Data AAH Address 555H

Write Data 55H Address 2AAH

Write Data AAH Address 555H

Write Data 80H Address 555H

Write Data 30H Sector Address

Write Data 55H Address 2AAH

Auto Sector Erase Completed

Data Poll from System

YES

Data=FFh?

Last Sector

to Erase ?

YES

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 8. ERASE SUSPEND/RESUME FLOWCHART

START

Write Data B0H

Toggle Bit checking Q6

not toggled

ERASE SUSPEND

YES

Write Data 30H

Continue Erase

Reading or

Programming End

Read Array or

Program

Another

Erase Suspend ? NO

YES

ERASE RESUME

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 9. AUTOMATIC PROGRAM TIMING WAVEFORMS

Fig 10. Accelerated Program Timing Diagram

tWC

Address

A0h

555h PA

PD Status DOUT

PA PA

NOTES:

1.PA=Program Address, PD=Program Data, DOUT is the true data the program address

tAS

tAH

tGHWL

tCH

tWP

tDS tDH

tWHWH1

Read Status Data (last two cycle)Program Command Sequence(last two cycle)

tBUSY tRB

tCS tWPH

tVCS

Data

RY/BY

VCC

WP/ACC

tVHH

VHH (11.5V ~ 12.5V)

VIL or VIH VIL or VIH

tVHH

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 11. CE CONTROLLED WRITE TIMING WAVEFORM

tWC

tWH

tGHEL

tWHWH1 or 2

tCP

Address

Data Q7

Data Polling

DOUT

RESET

RY/BY

NOTES:

1. PA=Program Address, PD=Program Data, DOUT=Data Out, Q7=complement of data written to device.

2. Figure indicates the last two bus cycles of the command sequence.

tAH

tAS

PA for program

SA for sector erase

555 for chip erase

tRH

tDH

tDS

tWS

A0 for program

55 for erase

tCPH

tBUSY

PD for program

30 for sector erase

10 for chip erase

555 for program

2AA for erase

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 12. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART

START

Write Data AAH Address 555H

Write Data 55H Address 2AAH

Write Program Data/Address

Write Data A0H Address 555H

YES

Verify Data OK ?

YES

Auto Program Completed

Data Poll

from system

Increment

Address

Last Address ?

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

SECTOR GROUP PROTECT/CHIP UNPROTECT

Fig 13. Sector Group Protect/Chip Unprotect Waveform (RESET Control)

Sector Group Protect:150us

Chip Unprotect:15ms

1us

VID

VIH

Data

SA, A6

A1, A0

Valid* Valid*

Status

Valid*

Sector Group Protect or Chip Unprotect

40h60h60h

Verify

RESET

Note: * for sector group protect A6=0, A1=1, A0=0 ; for chip unprotect A6=1, A1=1, A0=0

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 14. SECTOR GROUP PROTECT TIMING WAVEFORM (A9, OE Control)

Notes: tVLHT (V oltage transition time)=4us min.

tWPP1 (Write pulse width for sector group protect)=100ns min.

tOESP (OE setup time to WE active)=4us min.

tOE

Data

12V

tOESP

tWPP 1

tVLHT

Verify

01H F0H

A20-A12 Sector Address

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 15. SECTOR GROUP PROTECTION ALGORITHM (A9, OE Control)

START

Set Up Sector Addr

PLSCNT=1

Sector Group Protection

Complete

Data=01H?

Yes

OE=VID, A9=VID, CE=VIL

A6=VIL

Activate WE Pulse

Time Out 150us

Set WE=VIH, CE=OE=VIL

A9 should remain VID

Read from Sector

Addr=SA, A1=1, A6=0, A0=0

Protect Another

Sector?

Remove VID from A9

Write Reset Command

Device Failed

PLSCNT=32?

Yes

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 16. CHIP UNPROTECT TIMING WAVEFORM (A9, OE Control)

tOE

Data

12V

tOESP

tWPP 2

tVLHT

Verify

00H

F0H

Notes: tVLHT (V oltage transition time)=4us min.

tWPP2 (Write pulse width for chip unprotect)=100ns min.

tOESP (OE setup time to WE active)=4us min.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 17. CHIP UNPROTECT FLOWCHART(A9, OE Control)

START

Protect All Sectors

PLSCNT=1

Chip Unprotect

Complete

Data=00H?

Yes

Set OE=A9=VID

CE=VIL, A6=1

Activate WE Pulse

Time Out 15ms

Set OE=CE=VIL

A9=VID, A1=1, A6=A0=0

Set Up First Sector Addr

All sectors have

been verified?

Remove VID from A9

Write Reset Command

Device Failed

PLSCNT=1000?

Increment

PLSCNT

Read Data from Device

Yes

Increment

Sector Addr

* It is recommended before unprotect whole chip, all sectors should be protected in advance.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 18. IN-SYSTEM SECTOR GROUP PROTECT/CHIP UNPROTECT ALGORITHMS WITH RESET=VID

START

PLSCNT=1

RESET=VID

Wait 1us

Set up sector address

Sector Protect:

Write 60h to sector

address with

A6=0, A1=1, A0=0

Wait 150us

Verify Sector Protect:

Write 40h to sector

address with

A6=0, A1=1, A0=0

Read from

sector address

with

A6=0, A1=1, A0=0

Reset

PLSCNT=1

Remove VID from RESET

Write reset command

Sector Protect

Algorithm

Chip Unprotect

Algorithm

Sector Protect complete Remove VID from RESET

Write reset command

Chip Unprotect complete

Device failed

Temporary Sector

Unprotect Mode

Increment PLSCNT

First Write

Cycle=60h?

Set up first sector address

Protect all sectors:

The indicated portion of

the sector protect algorithm

must be performed

for all unprotected sectors

prior to issuing the first

sector unprotect address

Chip Unprotect:

Write 60h to sector

address with

A6=1, A1=1, A0=0

Wait 15 ms

Verify Sector Unprotect:

Write 40h to sector

address with

A6=1, A1=1, A0=0

Read from

sector address

with

A6=1, A1=1, A0=0

Data=01h?

PLSCNT=25?

Device failed

START

PLSCNT=1

RESET=VID

Wait 1us

First Write

Cycle=60h?

All sectors

protected?

Data=00h?

PLSCNT=1000?

Last sector

verified?

Yes

YesYes

Yes

Protect another

sector?

Reset

PLSCNT=1

Temporary Sector

Unprotect Mode

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 19. TEMPORARY SECTOR GROUP UNPROTECT WAVEFORMS

RESET

RY/BY

tVIDR

12V

0 or 3V VIL or VIH

tRSP

tVIDR

Program or Erase Command Sequence

Table 7. TEMPORARY SECTOR GROUP UNPROTECT

Parameter Std. Description Test Setup All Speed Options Unit

tVIDR VID Rise and F all Time (See Note) Mi n 50 0 ns

tRSP RESET Setup Time for Temporary Sector Unprotect Min 4 us

Note:

Not 100% tested

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 20. TEMPORARY SECTOR GROUP UNPROTECT FLOWCHART

Start

RESET = VID (Note 1)

Perform Erase or Program Operation

RESET = VIH

Temporary Sector Unprotect Completed(Note 2)

Operation Completed

2. All previously protected sectors are protected again.

Note : 1. All protected sectors are temporary unprotected. VID=11.5V~12.5V.

(if WP/ACC=VIL, outermost boot sectors will remain protected)

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 21. SILICON ID READ TIMING WAVEFORM

tACC

tCE

tACC

tOE

tOH tOH

tDF

DATA OUT

C2H A7H (TOP boot)

A8H (Bottom boot)

VID

VIH

VIL

ADD

DATA OUT

DATA

Q0-Q7

VCC 3V

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

VIH

VIL

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

WRITE OPERATION STATUS

Fig 22. DATA POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)

NOTES:

VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle.

tDF

tCE

tCH

tOE

tOEH

tACC

tRC

tOH

Address

Q0-Q6

RY/BY

tBUSY

Status Data Status Data

Status Data Complement True Valid Data

VAVA

High Z

Valid DataTrue

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 23. Data Polling Algorithm

START

Read Q7~Q0

Add. = VA (1)

Yes

Q7 = Data ?

Q5 = 1 ?

Read Q7~Q0

Add. = VA

PASS

FAIL

(2)

Notes:

1. V A=valid address for programming or erasure.

2. Q7 should be rechecked even Q5="1"because Q7 may change simultaneously with Q5.

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 24. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)

NOTES:

VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle, and

array data read cycle.

tDF

tCE

tCH

tOE

tOEH

tACC

tRC

tOH

Address

Q6/Q2

RY/BY

tBUSY

Valid Status

(first read)

Valid Status

(second read) (stops toggling)

Valid Data

VA VA

Valid Data

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

START

Read Q7~Q0

YES

Toggle Bit Q6

=Toggle?

Q5=1?

YES

(Note 1)

Read Q7~Q0 Twice (Note 1,2)

Toggle Bit Q6=

Toggle?

Program/Erase Operation Not

Complete, Write Reset Command

YES

Program/Erase Operation Complete

Fig 25. Toggle Bit Algorithm

Note:

1.Read toggle bit twice to determine whether or not it is toggling.

2.Recheck toggle bit because it may stop toggling as Q5 changes to "1".

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

Fig 26. Q6 versus Q2

NOTES:

The system can use OE or CE to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended

Enter Embedded

Erasing Erase

Suspend Enter Erase

Suspend Program

Erase

Suspend

Program

Erase Suspend

Read

Erase Suspend

Read Erase

Erase

Resume

Erase

Complete

Erase

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

MIN. MAX.

Input Voltage with respect to GND on all pins except I/O pins -1.0V 12.5V

Input Voltage with respect to GND on all I/O pins -1.0V Vcc + 1.0V

VCC Current -100mA +100mA

Includes all pins except Vcc. Test conditions: Vcc = 3.0V, one pin at a time.

LIMITS

PARAMETER MIN. TYP.(2) MAX. UNITS

Sector Erase Time 0. 9 1 5 sec

Chip Erase Time 3 5 5 0 sec

Byte Programming Time 9 300 us

Chip Programming Time Byte Mode 3 6 1 08 sec

Word Mode 24 72 sec

Erase/Program Cycles 100,000 Cycles

Accelerated Byte/Word Program Time 7 210 us

Word Program Time 1 1 36 0 us

LATCH-UP CHARACTERISTICS

ERASE AND PROGRAMMING PERFORMANCE(1)

Note: 1.Not 100% Tested, Excludes external system le v el o ver head.

2.Typical values measured at 25°C,3.3V.

Parameter Symbol Parameter Description Test Set TYP MAX UNIT

CIN Input Capacitance VIN=0 6 7.5 pF

COUT Output Capacitance VOUT=0 8.5 12 pF

CIN2 Control Pin Capacitance VIN=0 7.5 9 pF

TSOP PIN CAPACITANCE

Notes:

1. Sampled, not 100% tested.

2. Test conditions T A=25°C, f=1.0MHz

Parameter Test Conditions Min Unit

Minimum Pattern Data Retention Time 150°C 10 Years

125°C 20 Years

DATA RETENTION

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

ORDERING INFORMATION

PLASTIC PACKAGE

PART NO. ACCESS TIME Ball Pitch/ PACKAGE Remark

(ns) Ball Size

MX29LV320TTC-70 70 - 48 Pin TSOP

MX29LV320BTC-70 70 - 48 Pin TSOP

MX29LV320TTI-70 70 - 48 Pin TSOP

MX29LV320TTI-70R 7 0 - 48 Pin TSOP

MX29LV320BTI-70 70 - 48 Pin TSOP

MX29LV320BTI-70R 70 - 48 Pin TSOP

MX29LV320TTC-90 90 - 48 Pin TSOP

MX29LV320BTC-90 90 - 48 Pin TSOP

MX29LV320TTI-90 90 - 48 Pin TSOP

MX29LV320TTI-90R 9 0 - 48 Pin TSOP

MX29LV320BTI-90 90 - 48 Pin TSOP

MX29LV320BTI-90R 90 - 48 Pin TSOP

MX29LV320TTI-12 1 20 - 48 Pin TSOP

MX29LV320BTI-12 12 0 - 48 Pin TSOP

MX29LV320TXBC-70 70 0.8mm/0.3mm 48-Ball CSP

MX29LV320BXBC-70 70 0.8mm/0.3mm 48-Ball CSP

MX29LV320TXEC-70 70 0.8mm/0.4mm 48-Ball CSP

MX29LV320BXEC-70 70 0.8mm/0.4mm 48-Ball CSP

MX29LV320TXBI-70R 70 0.8mm/0.3mm 48-Ball CSP

MX29LV320BXBI-70R 70 0.8mm/0.3mm 48-Ball CSP

MX29LV320TXEI-70R 70 0.8mm/0.4mm 48-Ball CSP

MX29LV320BXEI-70R 70 0.8mm/0.4mm 48-Ball CSP

MX29LV320TXBC-90 90 0.8mm/0.3mm 48-Ball CSP

MX29LV320BXBC-90 90 0.8mm/0.3mm 48-Ball CSP

MX29LV320TXEC-90 90 0.8mm/0.4mm 48-Ball CSP

MX29LV320BXEC-90 90 0.8mm/0.4mm 48-Ball CSP

MX29LV320TXBI-90R 90 0.8mm/0.3mm 48-Ball CSP

MX29LV320BXBI-90R 90 0.8mm/0.3mm 48-Ball CSP

MX29LV320TXEI-90R 90 0.8mm/0.4mm 48-Ball CSP

MX29LV320BXEI-90R 90 0.8mm/0.4mm 48-Ball CSP

MX29LV320TXEC-70G 70 0.8mm/0.4mm 48-Ball CSP PB free

MX29LV320TXEC-90G 90 0.8mm/0.4mm 48-Ball CSP PB free

MX29LV320BXEC-70G 70 0.8mm/0.4mm 48-Ball CSP PB free

MX29LV320BXEC-90G 90 0.8mm/0.4mm 48-Ball CSP PB free

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

PACKAGE INFORMATION

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

P/N:PM0742 REV. 1.1, FEB. 10, 2003

MX29LV320T/B

REVISION HISTORY

Revision No. Description Page Date

1. 0 1. To removed "Advanced Information" P1 NOV/21/2002

2. To modify Package Information P57~59

3. To modify sector erasy timing wavefrom and added tBAL P30,36

timing in the AC Characteristics table

1.1 1. To modify the chip erase time from typ. 112sec to P2,56 FEB/10/2003

typ. 35sec/max.50sec

2. To modify the sector erase time from typ. 1.6sec to typ. 0.9sec P30,56

MX29LV320T/B

MACRONIX INTERNATIONAL CO., LTD.

HEADQUARTERS:

TEL:+886-3-578-6688

FAX:+886-3-563-2888

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TEL:+32-2-456-8020

FAX:+32-2-456-8021

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TEL:+81-44-246-9100

FAX:+81-44-246-9105

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TEL:+65-348-8385

FAX:+65-348-8096

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TEL:+886-2-2509-3300

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TEL:+1-408-453-8088

FAX:+1-408-453-8488

CHICAGO OFFICE:

TEL:+1-847-963-1900

FAX:+1-847-963-1909

http : //www.macronix.com

MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.