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April 1st, 2010
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REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 1 of 11
M62216FP/GP
Low Voltage Operation STEP-UP DC/DC Converter REJ03D0845-0201
Rev.2.01
Nov 14, 2007
Description
The M62216FP is designed as low voltage operation STEP-UP DC/DC converter.
This IC can operate very low input voltage (over 0.9 V) and low power dissipation. (circuit current is less than 850 µA)
So, this IC suitable for power supply of portable system that using low voltage battery. (DRY battery, rechargeable
battery)
Features
• Pre-drive type PWM output (Pre-drive only)
• Low voltage operation……… .. VIN = 0.9 V min.
• Low current dissipation……… IB = 850 µA t yp .
• Pre-drive output current can be adjusted
• Built-in ON/OFF Function….... IB (OFF) = 35 µA typ.
• Appli cation for STE P-DOWN Conve rter can be used
Application
DC/DC Converter for portable sets of battery used
Block Diagram
PWM Comp
DRIVE1
DRIVE2
PWM
Start
Start OSC
Amp
OSC
V
REF
Iconst
BIAS
ON/OFF
7
8
1
2
3
IN FB GND
4
65
+
−
++
−
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 2 of 11
Pin Arrangement
Outline: PRSP0008DA-A (8P2S-A) [FP]
8P2X-A [GP]
(Top view)
8
5
6
7
1
4
3
2
BIAS
FB
IN
ON/OF
F
DRIVE2
GND
PWM
DRIVE1
M62216FP/GP
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 3 of 11
Absolute Maximum Ratings
(Ta = 25°C, unless otherwise noted)
Item Symbol Ratings Units Conditions
Input voltage VIN 15.5 V
Bias terminal supply voltage VBlAS 15.5 V
Drive1 terminal supply voltage VDRIVE1 15.5 V
Drive2 terminal supply voltage VDRIVE2 15.5 V
Drive1 terminal input current IDRIVE1 100 mA
Drive2 terminal Input current IDRIVE2 10 mA
Power dissipation Pd 440 (FP) 250 (GP) mW Ta = 25°C
Operating temperature Topr −20 to +85 °C
Storage temperature Tstg −40 to +150 °C
Electrical Characteristics
(Ta = 25°C, VIN = 1.7 V, VOUT = VBIAS = 3.0 V, unless otherwise noted)
Limits
Block
Item
Symbol Min Typ Max
Units
Test Condition
Input voltage range VIN 0.9 15 V
BIAS voltage setting range*1 V
BlAS 1.7 15 V
BIAS current IB 850 1200 µA
All device
BIAS current at off mode IB (OFF) 35 47 µA
Reference voltage VREF 1.20 1.26 1.32 V Use internal amp as
Buffer-amp
Voltage
reference BIAS voltage regulation of VREF ∆VREF 10 30 mV VBIAS = 1.7 to 15 V
Input current IIN 20 nA IN = 1 V/IM
Open loop voltage gain AV 70 dB fIN = 100 Hz, null amp
operation
FB terminal sink current IFB+ 260 800 µA IN = 1.4 V, FB = 1.25 V/IM
Error
Amp.
FB terminal source current IFB− 30 45 60 µA IN = 1.1 V, FB = 1.25 V/IM
Oscillation frequency fOSC 95 125 155 kHz PWM terminal monitored Osc. Maximum on duty DUTYmax 82 87 92 % PWM terminal monitored,
IN = 1.1 V
Saturation voltage between PWM
Term. and DRIVE1 Term. Vsat1 0.25 0.5 V
Saturation voltage between PWM
Term. and DRIVE2 Term. Vsat2 1.0 1.2 V
IDRIVE1 = 50 mA,
IDRIVE2 = 5 mA
Leak current of DRIVE1 terminal IL1 −1 1 µA IN = 1.4 V
Leak current of DRIVE2 terminal IL2 −1 1 µA IN = 1.4 V
Output
Output low voltage of PWM
terminal VPWM (L) 0.03 0.3 V IPWM = 1 mA
Input current of ON/OFF terminal
at on status ION 2 3 µA ON/OFF
Threshold voltage of ON/OFF
terminal VTH (ON) 0.65 0.75 V
Note: 1. Setting range of BlAS voltage as same as setting range of output voltage.
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 4 of 11
Application Circuit
(1) Standard ap plication circuit
V
IN
V
OUT
GND
BIAS
DRIVE2
DRIVE1
PWM
FBIN
ON/OFF
R
D1
R
D2
DiL
Co
R1
R2
56 4
3
2
1
8
7
Tr
C
IN
++
V
IN
: 0.9~14 V
V
OUT
: 1.7~15 V
(V
OUT
> V
IN
)
(2) Application circuit 1 (VIN ≥ 1.7 V)
V
IN
V
OUT
GND
BIAS
DRIVE2
DRIVE1
PWM
FBIN
ON/OFF
R
D1
R
D2
DiL
Co
R1
R2
56 4
3
2
1
8
7
Tr
C
IN
++
V
IN
: 1.7~14 V
V
OUT
: 2.5~15 V
(V
OUT
> V
IN
)
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 5 of 11
(3) Application circuit 2 (VOUT > 15 V)
VIN VOUT
GND
BIAS
DRIVE2
DRIVE1
PWM
FBIN
ON/OFF
RD1
RD2
DiL
Co
R1
R2
56 4
3
2
1
8
7
Tr
CIN
VIN : 1.7~15 V
VOUT : 15 V~
(VOUT > VIN)
+
+
(4) Application circuit for STEP-DOWN circuit
V
IN
V
OUT
GND
BIAS
DRIVE2
DRIVE1
PWM
FBIN
ON/OFF
R
D1
R
D2
LTr
Co
R1
R2
56 4
3
2
1
8
7
C
IN
Di
V
IN
: 2.0~15 V
V
OUT
: 1.7~14 V
(V
OUT
< V
IN
)
+
+
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 6 of 11
Typical Characteristics
Power Dissipation Pd (mW)
Ambient Temperature Ta (°C)
Thermal Derating
(Absolute Maximum Rating)
BIAS Voltage V
BIAS
(V)
BIAS Current I
B
(mA)
BIAS Current vs. BIAS Voltage
(Ta = 25°C)
Ambient Temperature Ta (°C)
BIAS Current I
B
(mA)
BIAS Current vs.
Ambient Temperature
BIAS Voltage V
BIAS
(V)
OFF State BIAS Current
I
B (OFF)
(µA)
OFF State BIAS Current vs.
BIAS Voltage (ON/OFF = GND)
600
500
0
200
100
400
300
0507525 100 125 150
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0246810121416
1.6
0.4
0.6
0.8
1.0
1.2
1.4
−40 −20 0 20 40 60 80 100
80
0
20
40
60
024 68 1610 12 14
Input Frequency fin (kHz)
Open Loop Gain A
V
(dB)
Open Loop Gain vs. Input Frequency
(Vin = 0.1 Vrms, Null Amp, Ta = 25°C)
FB Sink Current I
FB+
(mA)
FB Voltage V
FB
(V)
FB Voltage vs. FB Sink Current
(V
BIAS
= 3.0 V, IN = 1.4 V)
100
20
40
60
80
0.01 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
1.25
1.00
0.75
0.50
0.25
0
FP
GP
VBIAS = 1.7 V
VBIAS = 3.0 V
VBIAS = 15 V
Ta = −20
°
C
Ta = +25
°
C
Ta = +85
°
C
Ta = −20
°
C
Ta = +25
°
C
Ta = +85
°
C
VBIAS = 1.7 V
VBIAS = 3.0 V
VBIAS = 15 V
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 7 of 11
FB Source Current IFB− (µA)
FB Voltage VFB (V)
FB Source Current vs. FB Voltage
(VBIAS = 3.0 V, IN = 1.1 V)
BIAS Voltage VBIAS (V)
Oscillating Frequency fOSC (kHz)
Oscillating Frequency vs.
BIAS Voltage
(PWM Terminal Monitored, Ta = 25°C)
Ambient Temperature Ta (°C)
Oscillating Frequency fOSC (kHz)
Oscillating Frequency vs.
Ambient Temperature
(PWM Terminal Monitored, IN = 1.1 V)
BIAS Voltage VBIAS (V)
Max ON Duty DUTYmax (%)
Max ON Duty vs. BIAS Voltage
(PWM Terminal Monitored, IN = 1.1 V, Ta = 25°C)
60
50
0
20
10
40
30
0 1.0 1.50.5 2.0 2.5 3.0
160
140
120
100
80
0246810121416
160
80
100
120
140
−40 −20 0 20 40 60 80 100
100
75
80
85
90
95
024 68 1610 12 14
Ambient Temperature Ta (°C)
Max ON Duty DUTYmax (%)
Max ON Duty vs. Ambient Temperature
(PWM Terminal Monitored, IN = 1.1 V)
Input Current of DRIVE1 Terminal
IDRIVE1 (mA)
Saturation Voltage Between
PWM-DRIVE1 Terminal Vsat1 (V)
Saturation Voltage Between PWM-DRIVE1
Terminal vs. Input Current of DRIVE1 Terminal
(IDRIVE2 = 5 mA, IN = 1.1 V, Ta = 25°C)
100
75
80
85
90
95
−40 −20 0 20 40 60 80 100 010203040506070
1.0
0.8
0.6
0.4
0.2
0
V
BIAS
= 1.7 V
V
BIAS
= 3.0 V
V
BIAS
= 15 V
V
BIAS
= 1.7 V
V
BIAS
= 3.0 V
V
BIAS
= 15 V
V
BIAS
= 1.7 V
V
BIAS
= 3.0 V
V
BIAS
= 9.0 V
V
BIAS
= 15 V
Ta = −20
°
C
Ta = +25
°
C
Ta = +85
°
C
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 8 of 11
Saturation Voltage Between
PWM-DRIVE1 Terminal Vsat1 (V)
Input Current of DRIVE1 Terminal
IDRIVE1 (mA)
Saturation Voltage Between PWM-DRIVE1
Terminal vs. Input Current of DRIVE1 Terminal
(VBIAS = 3.0 V, IN = 1.1 V, Ta = 25
°C
)
Input Current of DRIVE2 Terminal
IDRIVE2 (mA)
Saturation Voltage Between
PWM-DRIVE2 Terminal Vsat2 (V)
Saturation Voltage Between PWM-DRIVE2
Terminal vs. Input Current of DRIVE2 Terminal
(IN = 1.1 V, Ta = 25°C)
PWM Sink Current (mA)
PWM Output Low Voltage
VPWM (L) (V)
PWM Output Low Voltage
vs. PWM Sink Current
(VBIAS = 3.0 V, IN = 1.4 V)
Ambient Temperature Ta (°C)
Input ON Current (µA)
Input ON Current vs.
Ambient Temperature
0.5
0
0.2
0.1
0.4
0.3
0406020 80 100 120
0.6
0
0.1
0.2
0.3
0.4
0.5
024 681012
4.0
0
1.0
2.0
3.0
−40 −20 0 20 40 60 80 100
Ambient Temperature Ta (°C)
Threshold Voltage of ON/OFF
Terminal VTH (ON) (V)
Threshold Voltage of ON/OFF Terminal
vs. Ambient Temperature (VBIAS = 3.0 V)
Input Voltage VIN (V)
Max Load Current for START-UP
IOmax (mA)
Max Load Current for START-UP(*1)
vs. Input Voltage
(Standard Application Circuit, VO = 3.0 V, Ta = 25°C)
1.0
0
0.2
0.4
0.6
0.8
−40 −20 0 20 40 60 80 100 0.8 1.0 1.2 1.4 1.6
200
150
175
100
125
75
25
50
0
1.7
0.7
1.1
0.9
1.5
1.3
0462 8 10 12
Ta = −20
°
C
Ta = +25
°
C
Ta = +85
°
C
Tr: 2SC3052-F, L: 68 µH,
R
D1
: 680 Ω, R
D2
: 1.6 kΩ
Tr: 2SC3439-H, L: 22 µH,
R
D1
: 1.3 kΩ, R
D2
: 3.3 kΩ
V
BIAS
= V
ON
=
1.7 V
V
BIAS
= V
ON
=
3.0 V
V
BIAS
= V
ON
=
15 V
V
BIAS
= 1.7 V, I
DRIVE1
= 20 mA
V
BIAS
= 3.0 V, I
DRIVE1
= 50 mA
V
BIAS
= 15 V, I
DRIVE1
= 40 mA
I
DRIVE2
= 2 mA
I
DRIVE2
= 5 mA
I
DRIVE2
= 10 mA
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 9 of 11
Efficiency (%)
Load Current IO (mA)
Efficiency vs. Load Current
(Standard Application circuit:
VIN = 1.5 V, VO = 3.0 V, Ta = 25°C)
Input Voltage VIN (V)
Max Load Current for START-UP
IOSTmax (mA)
Max Load Current for START-UP (*2)
vs. Input Voltage
(Application circuit1: VO = 5.0 V, Ta = 25°C)
Load Current IO (mA)
Efficiency (%)
Efficiency vs. Load Current
(Application circuit1:
VIN = 3.0 V, VO = 5.0 V, Ta = 25°C)
100
80
0
20
60
40
1 10 100 1000
200
150
100
75
0
1.5 2.0 2.5 3.0 3.5 4.0
175
125
50
25
100
80
0
20
60
40
1 10 100 1000
Tr: 2SC3052-F, L: 150 µH,
R
D1
: 750 Ω, R
D2
: 3.6 kΩ
Tr: 2SC3439-H, L: 22 µH,
R
D1
: 1.3 kΩ, R
D2
: 6.8 kΩ
Tr: 2SC3052-F
Tr: 2SC3439-H
Tr: 2SC3052-F
Tr: 2SC3439-H
note: 1, 2. These characteristics show the maximum output load current when start-up.
Therefore, output voltage can grown-up to setting voltage less than a curve in the graph when
using these exter na l components va lue.
(2SC3052-F: hFE = 250 to 500, 2SC3439-H: hFE = 600 to 1200)
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 10 of 11
Equation for Constants Calculation
Constants
Constants
Standard Application Circuit Application Circuit 1
STEP-DOWN Circuit
Application Circuit 2
Note:
V
F
: Forward voltage of external diode.
V
CE (sat)
: Saturation voltage of external transistor.
V
BE
: Voltage between Base - Emitter of external transistor.
h
FE
: h
FE
of external transistor at saturating.
A1: Ratio of current into DRIVE1 terminal.
(A1 = 0.8~0.9)
A2: Ratio of current into DRIVE2 terminal.
(A2 = 1 − A1)
A3: Ratio of current into DRIVE2 terminal.
(A3 = 0.1~0.2)
• Set R2 to several kΩ ~ several 10ths kΩ.
• Set current into DRIVE2 terminal more than 100 µA.
(Ipk / h
FE
) × A2 ≥ 100 µA, (Ipk / h
FE
) × A3 ≥ 100 µA
• Set ∆I
O
to 1/5 ~ 1/3 of maximum load current
• The maximum rating of current of external parts (transistor,
diode and inductor) are 1.5 to 2 times of Ipk.
T
ON
+ T
OFF
T
OFF (MIN)
T
ON
+ T
OFF
T
ON
T
OFF
1 +
T
ON
+ T
OFF
T
ON
T
OFF
1 +
T
ON
+ T
OFF
T
ON
T
OFF
1 +
T
ON
+ T
OFF
T
ON
T
OFF
1 +
T
ON (MAX)
lpk
L
(MIN)
R1
R
D1
(V
IN
− V
CE (sat)
)
2
× T
ON (MAX)
2
× f
OSC
2 × V
O
× (l
O
+ l
B
)
(V
IN
− V
CE (sat)
− V
O
)
× T
ON (MAX)
∆l
O
(V
IN
− V
CE (sat)
)
2
× T
ON (MAX)
2
× f
OSC
2 × V
O
× l
O
(V
IN
− V
CE (sat)
)
2
× T
ON (MAX)
2
× f
OSC
2 × V
O
× l
O
V
O
+ V
F
− V
IN
V
IN
− V
CE (sat)
V
O
+ V
F
− V
IN
V
IN
− V
CE (sat)
V
O
+ V
F
− V
IN
V
IN
− V
CE (sat)
V
O
+ V
F
V
IN
− V
CE (sat)
− V
O
T
ON
T
OFF
1
f
OSC
1
f
OSC
1
f
OSC
1
f
OSC
− T
OFF (MIN)
1
f
OSC
− T
OFF (MIN)
1
f
OSC
− T
OFF (MIN)
1
f
OSC
− T
OFF (MIN)
1
f
OSC
R
D2
T
ON
+ T
OFF
T
OFF (MIN)
T
ON (MAX)
lpk
L
(MIN)
R1
R
D1
T
ON
T
OFF
R
D2
V
O
− (V
BE
+ V
sat1
)
(lpk/h
FE
) × A1
V
O
− V
BE
− V
sat1
lpk/h
FE
V
O
− (V
BE
+ V
sat2
)
(lpk/h
FE
) × A2
V
O
− (V
BE
+ V
sat2
)
(lpk/h
FE
) × A2
V
IN
− V
sat2
(lpk/h
FE
) × A3
V
O
− (V
BE
+ V
sat1
)
(lpk/h
FE
) × A1
V
IN
− (V
BE
+ V
sat1
)
(lpk/h
FE
) × A1
V
IN
− (V
BE
+ V
sat2
)
(lpk/h
FE
) × A2
2 × l
O
T
ON
T
OFF
1 +× (l
O
+ l
B
)2 ×
− 1 × R2
V
O
V
REF
− 1 × R2
V
O
V
REF
− 1 × R2
V
O
V
REF
− 1 × R2
V
O
V
REF
T
ON
T
OFF
1 +× l
O
2 ×T
ON
T
OFF
1 +× l
O
2 ×
M62216FP/GP
REJ03D0845-0201 Rev.2.01 Nov 14, 2007
Page 11 of 11
Package Dimensions
2.
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
NOTE)
DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
b
p
A
1
H
E
y0.1
e1.27
c
0° 10°
L0.2 0.4 0.6
0.05
A1.9
5.9 6.2 6.5
A
2
1.5
E4.2 4.4 4.6
D4.8 5.0 5.2
Reference
Symbol
Dimension in Millimeters
Min Nom Max
0.35 0.4 0.5
0.13 0.15 0.2
P-SOP8-4.4x5-1.27 0.07g
MASS[Typ.]
8P2S-APRSP0008DA-A
RENESAS CodeJEITA Package Code Previous Code
1.12 1.42
Detail F
L
A
1
A
2
F
*1
*2
*3
85
41 Index mark
y
b
p
e
A
c
E
H
E
D
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications
or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.
Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.0
