OKI Semiconductor PEDL70215-01
Issue Date: Jul. 30, 2003
MK70215 Preliminary
Bluetooth Module
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GENERAL DESCRIPTION
The MK70215 is Bluetooth module operates in the 2.4 GHz ISM band. Embedded baseband /RF
transceiver LSI and protocol stacks up to Serial Port Profile(SPP) provide users with Bluetooth Class2
stable wireless connectivity and high performance. Equipped with UART/PCM interface, it is suitable
for both data/voice application purposes. This surface-mount type module can be mounted to users'
boards easily by soldering. The development TAT for Bluetooth-enabled end products can be shortened
very effectively by utilizing MK70215.
FEATURES
- Conforms to the Bluetooth Specification Version 1.1
- Optimized design where RF/BB LSI chips and authorized OKI software are used
- SPP full module includes Bluetooth baseband IC & RF transceiver IC, EEPROM and XTAL
- RF output power: Class 2
- Interfaces provided
UART interface (Supports HCI and SPP commands /up to 921.6 kbps)
PCM interface* (selectable between PCM Linear/A-law/µ-law)
* The PCM I/F is only valid in the HCI mode.
BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry.
The information contained herein can change without notice owing to the product being under development.
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OKI Semiconductor MK70215
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BLOCK DIAGRAM
ARM7TDMI
PCM
I/F
UART
I/F
BaseBand
Core
ROM
RAM
BPF
EEPROM
RF_ANT
GND
VDD
nReset
nDetach
PCM_IN
PCM_OUT
PCM_SYNC
PCM_CLK
UART_TD
UART_RD
UART_RTS
UART_CTS
GPIO
I/F
CIO6
CIO5
CIO4
CIO3
T/R
SW
CIO2
Osc
13MHz Osc
32.768kHz
Baseband-LSI
RF-LSI
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OKI Semiconductor MK70215
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ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Condition Rating Unit
Power supply voltage VDD Ta = 25°C –0.3 to 4.5 V
Input voltage VIN Ta = 25°C –0.3 to 4.5 V
Input RF power Ta = 25°C 20 dBm
Storage temperature Tstg–40 to +85 °C
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OKI Semiconductor MK70215
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RECOMMENDED OPERATING CONDITI ON S
Parameter Symbol Condition Min. Typ. Max. Unit
Power supply voltage VDD3.0 3.3 3.6 V
“H” level input voltage Vih2.2 VDD V
“L” level input voltage Vil 0 — 0.8 V
Operating temperature TOP-30 25 75 °C
ELECTRICAL CHARACTERISTICS
Following values are valid for VDD = 3.3 V ±0.3 V, Ta = -30 to 75°C.
Values of the RF characteristics are defined at the RF_ANT pin for the module.
General Specifications
Items Specification Note
Conformance Specifications Bluetooth Specification
Version 1.1
Power Class Class 2
Frequency range 2,402 to 2,480 MHz
Number of channels 79ch
Channel separation 1 MHz
Modulation method GFSK
RF input-output impedance Nominal 50 2,402 to 2,480 MHz
Symbol Rate 1 Mbps
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OKI Semiconductor MK70215
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DC Characteristics
Output voltage (Applies to digital pins )
Parameter Symbol Min. Typ. Max. Unit
“H” level output voltage Voh 2.4 — V
“L” level output voltage Vol0.4 V
Power consumption
Mode Symbol Typ. Max. Unit
During operation IDDO 80 mA
During stand-by IDDS 200 µA
RF Transmission Characteristics
Parameter Min. Max. Unit Remarks
Output power –4 +4 dBm
ICFT –50 +50 kHz
Frequency drift
DH1
DH3, DH5
–25
–40
+25
+40
kHz
kHz
Frequency Max drift rate 20 kHz/50
µs
Frequency deviation
f1avg: payload = 11110000
f2max: payload = 1010…
f2avg/f1avg
140
115
80
175
kHz
kHz
%
20 dB band width 1 MHz
In-band spurious emission
Freq. offset = ±2 MHz
Freq. offset ±3 MHz
–20
–40
dBm
dBm
Measured by peak detection
–36
–30
–47
–47
dBm
dBm
dBm
dBm
When operating
Out-of-band spurious emission
30 MHz f < 1GHz
1 GHz f 12.75 GHz
1.8 GHz f 1.9 GHz
5.15 GHz f 5.30 GHz
30 MHz f < 1GHz
1 GHz f 12.75 GHz
1.8 GHz f 1.9 GHz
5.15 GHz f 5.30 GHz
–57
–47
–47
–47
dBm
dBm
dBm
dBm
When in standby
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RF Reception Characteristics
Parameter Min. Typ. Max. Unit Remarks
Sensitivity*1 — –77 –72 dBm
C/I characteristics
Co-channel
Adjacent channel C/I = 1 MHz
Adjacent channel C/I = 2 MHz
Adjacent channel C/I 3 MHz
Image frequency
Image frequency ±1 MHz
12
14
4
–30
–40
–9
–20
dB
dB
dB
dB
dB
dB
Specification at ordinary temperature
(Bluetooth Ver.1.1 Test Specification)
Out-of-band blocking
30 MHz f < 2,000 MHz
2,000 MHz f 2,399 MHz
2,498 MHz f < 3,000 MHz
3,000 MHz f 12.75 GHz
–10
–27
–27
–10
dBm
dBm
dBm
dBm
Specification at ordinary temperature
Intermodulation characteristic –25 dB Specification at ordinary temperature
Maximum input level 0.1 %
Specification at ordinary temperature, at
–20 dBm input
Limit of collateral radio waves
30 MHz f < 1 GHz
1 GHz f 12.75 GHz
–57
–47
dBm
dBm
Spurious emission during inquiry scan
operation
*1 The receiver sensitivity is measured at BER 0.1% by Dirty transmitter Signal (According to Bluetooth Ver.1.1
Test Specification )
Others Characteristics
Conducted Emission and Radiation Emission level : Satisfied with FCC, TELEC, ETSI specification.
MECHANICAL CHARACTERISTICS
Marking Specifications
Company name : OKI (Refer to Module Outline)
Model name:MK70215 (Refer to Module Outline)
Lot. No:XXXXXXX\ (Refer to Module Outline)
1 pin mark (Refer to Module Outline)
Weight Specifications
Model Name Weight
MK70215 1.5 g (Max.)
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OKI Semiconductor MK70215
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CONNECTOR PIN DE SCRIPTIONS
TERMINAL NAME I/O TYPE
MK70215
INSIDE
PULL
UP/DOWN
FUNCTION
RF_ANT (*1) I/O Z0=50
UART_TD O UART Data Output
UART_RD I Schmitt UART Data Input
UART_RTS O UART Ready to Send
UART_CTS I UART Clear to Send
PCM_IN (*2) I Pull up Synchronous 8kss-1 Data Input
PCM_OUT O Synchronous 8kss-1 Data Output
PCM_SYNC (*3) I/O Pull down Synchronous Data Strobe
PCM_CLK (*3) I/O Pull down Synchronous Data Clock
nRESET(*4) I Pull up Active low reset (L:Reset)
nDetach I
Pull up Active low sleep signal (L:Sleep)
CIO2 I
Pull up
CIO3 O
— —
CIO4 O
— —
CIO5 I
Pull up
CIO6 I
Pull up
Vdd (*5) – — Power Supply Voltage
GND – —
AGND – —
*1 Terminated to a 50 load or connected to ANT.
*2 The PCM_IN pins are pulled-up internally.
*3 The PCM_CLK, and PCM_SYNC pins are pulled-down internally.
*4 Setting the reset signal input pin RESET to a “L” level can reset the LSI. The reset state of the LSI is held for a
duration of 10 msec even after the reset signal is switched to a “H” level.
*5 Mount an approximately 10µF tantalum or electrolytic capacitor to the power supply input pin.
The capacitor should be mounted as close to the power supply pin of the module as possible.
* The PCM I/F is only valid in the HCI mode.
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OKI Semiconductor MK70215
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INTERFACE SPECIFICATIONS
UART Interface
Various settings can be made for the UART interface by using the Vendor specific command (refer to the
ML70512 Software Manual).
The default values are as follows:
Baud rate: 115.2 kbps
Parity: Non-parity
Data length: 8 bits
Stop bit: 1 bit
Flow control: off
PCM Interface
Application format
PCM linear (8, 16 bits/sample, 64 kHz sampling frequency)/A-law/µ-law
Bluetooth format
CVSD/A-law/µ-law
PCMCLK (64kH
z
or 128kHz)
PCMOUT
PCMSYNC
LSB MSB DA TA DAT A DATA LSB DATA
125 µs (8 kHz)
MSB
8 bits or 16 bits
Data is output at the timing of CLK rise.
PCM Output Timing
PCMCLK (64kHz
or 128kHz)
PCMIN
PCMSYNC
LSB MSB DATA DAT A DA TA LSB DAT A
125 µs (8 kHz)
MSB
8 bits or 16 bits
Data is captured at the timing of CLK fall.
PCM Input Timing
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OKI Semiconductor MK70215
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PCM Timing Specifications
Parameter Symbol Condition Min. Typ. Max. Unit
PCMIN setup time to PCMCLK (input) fall tPC0 500 - -
PCMIN hold time to PCMCLK (input) fall tPC1 500 - -
PCMOUT setup time to PCMCLK (input) rise tPC2 500 - -
PCMOUT hold time to PCMCLK (input) rise tPC3 500 - -
PCMSYNC (input) setup time to PCMCLK (input) rise tPC4 500 - -
PCMSYNC (input) hold time to PCMCLK (input) rise tPC5 500 - -
PCMIN setup time to PCMCLK (output) fall tPC7 500 - -
PCMIN hold time to PCMCLK (output) fall tPC8 500 - -
PCMOUT setup time to PCMCLK (output) rise tPC9 500 - -
PCMOUT hold time to PCMCLK (output) rise tPC10 500 - -
Delay time from PCMCLK (output) rise to PCMSYNC (output) tPC13
CL = 50 pF
- - 500
ns
PCMCLK (input)
PCMIN
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PCMOUT
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tPC2 t
PC3 tPC2 t
PC3
tPC0 t
PC1
PCMSYNC (input )
PCMSYNC (output)
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tPC4 t
PC5 tPC4 t
PC5
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tPC6
PCMCLK (output)
PCMIN
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PCMOUT
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tPC9 t
PC10 tPC9 t
PC10
tPC7 t
PC8
PCMSYNC (input )
PCMSYNC (output)
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tPC11 t
PC12 tPC11 t
PC12
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tPC13
PCM Timing
PEDL70215-01
OKI Semiconductor MK70215
10/14
MOUNTING MODULE
Recommended Module Fixing Method
This module corresponds to Reflow-soldering.
This module corresponds to Pb-free
Recommended Reflow Conditions
Recommended PCB Pattern
The accuracy of each size is ±0.05mm.
PEDL70215-01
OKI Semiconductor MK70215
11/14
Notes on Mounting the Module
1. The shielding case is connected to GND in the module. For mounting the module, when pattern wiring that
touches the shielding case is carried out on the product board, do not cause a short-circuit between the shielding
case and the pattern. For example, apply resist on the entire surface that touches the shielding case.
2. The effects of noise on a product board depend on the connection of GND/NC to the fixation pads. Select the
connection with better electrical characteristics in the module mounted state.
CAUTIONS IN USE
This module consists of precision electronic components. Therefore, note the following when handling the
module:
1. In a case of decomposition or recomposition of this module, the operations in these specifications are not
assured.
2. This module is not waterproof or drip-proof. Do not use the module in wet locations.
3. Do not use this module under high temperature or high humidity conditions, in direct sunlight, or in dusty
places.
PEDL70215-01
OKI Semiconductor MK70215
12/14
MODULE OUTLINE
Outline of MK70215
MK70215
OKI
Lot. No,
2.2±0.1mm
1.7mm
φ 0.8±0.05m m×20 pls
0.2±0.08mm
16.0.127mm
16.0.1mm 17.0.127mm
17.0.127mm
PEDL70215-01
OKI Semiconductor MK70215
13/14
REVISION HISTORY
Page
Document
No. Date Previous
Edition
Current
Edition
Description
PEDL70215-01 July 30,2003 Preliminary edition 1
PEDL70215-01
OKI Semiconductor MK70215
14/14
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2. The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3. When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6. The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any
system or application where the failure of such system or application may result in the loss or damage of
property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7. Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2003 Oki Electric Industry Co., Ltd.