TECHNICAL NOTE 3-terminal Regulator LDO Regulator series Standard Variable Output LDO Regulator BA00DD0W and BA00CC0W Series General Description The BA00DD0/CC0 series are low-saturation regulators available for outputs up to 2A/1A. The output voltage can be arbitrarily configured using the external resistance. These series of LDO regulators are offered in a broad packaging lineup. This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading. Features 1) Maximum output current : 2A (BA00DD0 series), 1A(BA00CC0 series) 2) 1% high-precision output voltage (BA00DD0) 3) Low saturation with PNP output 4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits 5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading 6) Built-in over- voltage protection circuit that prevents the destruction of the IC due to power supply surges 7) TO220CP and HRP5 packaging(BA00DD0), and TO220FP/CP and TO252 packaging(BA00CC0) Applications Usable in DSP power supplies for DVDs and CDs, FPDs, televisions, personal computers or any other consumer device Line up 1A BA00CC0 Series Part Number BA00CC0WT BA00CC0WT-V5 BA00CC0CP-V5 Package TO220FP-5 TO220FP-5(V5) TO220CP-V5 BA00CC0WFP TO252-5 2A BA00DD0 Series Part Number BA00DD0CP-V5 BA00DD0WHFP Package TO220CP-V5 HRP-5 2007.Oct. ABSOLUTE MAXIMUM RATINGS(Ta=25) Parameter Symbol Input Power Supply Voltage1 Vcc Pd Limits -0.3 ~ +35 2300(HRP5) 1300(TO252-5) mW Topr Tstg Tjmax VCTL Vcc peak 2000(TO220FP/CP) -40 ~ +125 -55 ~ +150 +150 -0.3 ~ +Vcc +50 V V 2 Power Dissipation Operating Temperature Range Ambient Storage Temperature Junction Temperature Output Control Terminal Voltage Voltage Applied to the Tip 3 Unit V 1 2 Must not exceed Pd HRP5 : In cases in which Ta25 when a 70mmx70mmx1.6mm glass epoxy board is used, the power is reduced by 18.4 mW/. TO252-5 : In cases in which Ta25 when a 70mmx70mmx1.6mm glass epoxy board is used, the power is reduced by 10.4 mW/. TO252FP-5 : No heat sink. When Ta25, the power is reduced by 16 mW/. 3 Applied voltage : 200msec or less (tr1msec) tr1msec 50V 35V MAX200msec (Voltage Supply more than 35V) 0V Recommended Operating Range (Ta=25) Parameter Symbol Input Power BA00CC0 Vcc Supply Voltage BA00DD0 BA00CC0 Output Current Io BA00DD0 Output Control Terminal Voltage VCTL Min. 4.0 3.0 Max. 25.0 25.0 1 2 Unit 0 Vcc V V A Electrical Characteristics(ABRIDGED) BA00CC0 Series (unless specified otherwise, Ta=25, Vcc=10V, VCTL=5V, Io=500mA, R1=2.2K, R2=6.8K) Parameter Symbol Min. Typ. Max. C-terminal Voltage Vc 1.200 1.225 1.250 V Io=50mA Circuit Current at the Time of Shutdown Isd 0 10 A VCTL=0V Vd 0.3 0.5 V Io 1.0 A Input Stability Reg.I 20 100 mV Load Stability Reg.L 50 150 mV Output Voltage Temperature Coefficient TCVO 0.02 %/ Minimum I/O Voltage Difference Output Current Capacity Unit Conditions Vcc= 0.95xVo Vcc= 6V25 V Io=5mA1A Io=5mA ,Tj=0~125 Design guarantee(100% shipping inspection not performed) BA00DD0 Series (unless specified otherwise, Ta=25, Vcc=8V, VCTL=3V, Io=500mA, R1=15K, R2=44K) Parameter Symbol Min. Typ. Max. Unit Conditions C-terminal Voltage VADJ 1.257 1.270 1.283 V Circuit Current at the Time of Shutdown Isd 0 10 A Vd 0.45 0.7 V Io 2.0 A Reg.I 15 35 mV Vcc= 5.7V 25 V, Io=200mA Reg.L 50 100 mV Io=0mA2A TCVO 0.02 %/ Minimum I/O Voltage Difference Output Current Capacity Input Stability Load Stability Output Voltage Temperature Coefficient Design guarantee(100% shipping inspection not performed) 2/8 Io=100mA VCTL=0V Vcc= 0.95xVo, Io=2A Io=5mA ,Tj=0~125 Reference Data BA00CC0(3.3V preset voltage) (Unless specified otherwise, Vcc=10V, VOUT=3.3V preset, VCTL=3V, Io=0mA, R1=2.2K, and R2=6.8K) OUTPUT VOLTAGE:VOUT[V] CIRCUIT CURRENT:ICC[mA] 2.5 2.0 1.5 1.0 4.0 OUTPUT VOLTAGE:VOUT[V] 4.0 3.0 3.0 2.0 1.0 3.0 2.0 1.0 0.5 0.0 0.0 0 2 4 6 8 10 12 14 16 18 0.0 20 0 2 4 SUPPLY VOLTAGE:VCC[V] 8 10 12 14 16 18 20 0 2 4 SUPPLY VOLTAGE:VCC[V] Fig.1 Circuit current Fig.2 Input Stability 2.0 1.5 1.0 10 12 14 16 18 20 70 RIPPLE REJECTION:R.R[dB] 2.5 8 Fig.3 Input Stability Io=500mA 80 500 [mV] DROPOUT VOLTAGE:Vd[V] 3.0 6 SUPPLY VOLTAGE:VCC[V] 600 3.5 OUTPUT VOLTAGE:VOUT[V] 6 400 300 200 60 50 40 30 20 100 0.5 10 0 0.0 0 0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 100 10 100 200 300 400 500 600 700 800 900 1000 1k 1000 Fig.5 Input/Output Voltage Difference Io-Vd CharacteristicsVcc=2.95V 4.5 100k 100000 1000k FREQUENCY:f[Hz] OUTPUT CURRENT:Io[mA] OUTPUT CURRENT:Io[mA] Fig.4 Load Stability 10k 200 Fig.6 Ripple Rejection Characteristics Io=100mA 1000 3.5 3.0 2.5 CONTROL CURRENT:ICTL[A] CIRCUIT CURRENT:Icc[mA] OUTPUT VOLTAGE:VOUT[V] 900 4.0 150 100 50 800 700 600 500 400 300 200 100 0 2.0 -40 -20 0 20 40 60 80 100 120 0 0 AMBIENT TEMPERATURE:Ta[] Fig.8 Circuit Current by load Level (IOUT=0mA1A) 4 4 5 4 3 2 1 OUTPUT VOLTAGE:VOUT[V] 7 OUTPUT VOLTAGE:VOUT[V] 4 6 3 3 2 2 1 1 0 6 8 10 12 14 16 18 20 22 24 CONTROL VOLTAGE:VCTL[V] Fig.10 CTL Voltage vs. Output Voltage 8 10 12 14 16 18 20 3 3 2 2 1 1 0 4 6 Fig.9 CTL Voltage vs. CTL Current 4 2 4 CONTROL VOLTAGE:VCTL[V] 8 0 2 OUTPUT CURRENT:Io[mA] Fig.7 Output Voltage Temperature Characteristics OUTPUT VOLTAGE:VOUT[V] 0 100 200 300 400 500 600 700 800 900 1000 0 0 5 10 15 20 25 30 SUPPLY VOLTAGE:Vcc[V] Fig.11 Overvoltage Operating Characteristics(Io=200mA) 3/8 35 40 130 140 150 160 170 180 AMBIENT TEMPERATURE:Ta[] Fig.12 Thermal Shutdown Circuit Characteristics 190 Reference Data BA00DD0(5.0V preset voltage) (Unless specified otherwise, Vcc=8V, VOUT=5V preset, VCTL=3V, Io=0mA, R1=15K, and R2=44K) 5.5 OUTPUT VOLTAGE:VOUT[V] CIRCUIT CURRENT:ICC[mA] 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 8 8 7 7 OUTPUT VOLTAGE:VOUT[V] 6.0 6 5 4 3 2 6 5 4 3 2 1.0 1 0.5 0.0 1 0 0 2 4 6 8 10 12 14 16 18 20 22 24 0 0 2 4 6 8 10 12 14 16 18 20 SUPPLY VOLTAGE:VCC[V] SUPPLY VOLTAGE:VCC[V] Fig.13 Circuit Current Fig.14 Input Stability 8 22 24 0 5 5 4 4 3 3 2 600 500 400 300 200 2 100 14 16 18 20 22 24 50 45 40 35 30 25 20 15 5 1 0 1.0 2.0 3.0 4.0 0 0 4.8 0.5 1.0 1.5 OUT PUT CURRENT:IOUT [A] OUT PUT CURRENT:IOUT [A] Fig.16 Load Stability CONTROL CURRENT:ICTL[A] CIRCUIT CURRENT:[mA] 5.1 5.0 4.9 140 120 100 80 60 40 4.8 60 80 500 400 300 200 0 0 40 600 100 20 20 1000k 700 160 0 100k 100000 800 180 -20 10k FREQUENCY:f[Hz] 200 -40 1k 1000 100 10 2.0 Fig.17 Input/Output Voltage Difference Fig.18 Ripple Rejection Characteristics Iout=100mA Iout-Vd CharacteristicsVcc=4.75V 5.2 OUTPUT VOLTAGE:VOUT[V] 12 10 1 0.5 100 1.0 1.5 2.0 0 2 4 6 Fig.19 Output Voltage Temperature Characteristics Fig.20 Circuit Current by load Level (IOUT=0mA2A) 7 47 6 5 4 3 2 1 10 12 14 16 18 20 22 24 Fig.21 CTL Voltage vs. CTL Current 8 OUTPUT VOLTAGE:VOUT[V] 48 OUTPUT VOLTAGE:VOUT[V] 8 8 CONTROL VOLTAGE:VCTL[V] OUTPUT CURRENT:IOUT[A] AMBIENT TEMPERATURE:Ta[] OUTPUT VOLTAGE:VOUT[V] 10 55 RIPPLE REJECTION:R.R[dB] DROPOUT VOLTAGE:VDRP[V] [V] OUTPUT VOLTAGE:VOUT[V] 6 8 60 700 6 6 Fig.15 Input Stability Io=2A 800 7 4 SUPPLY VOLTAGE:VCC[V] 8 7 2 36 35 24 23 12 6 4 2 1 0 0 2 4 6 8 10 12 14 16 18 20 22 24 CONTROL VOLTAGE:VCTL[V] Fig.22 CTL Voltage vs. Output Voltage 1 0 0 0 5 10 15 20 25 30 35 SUPPLY VOLTAGE:Vcc[V] Fig.23 Overvoltage Operating Characteristics(Io=200mA) 4/8 40 130 140 150 160 170 180 AMBIENT TEMPERATURE:Ta[] Fig.24 Thermal Shutdown Circuit Characteristics 190 Block Diagrams [BA00CC0WFP] [BA00DD0WHFP] [BA00CC0WT] [BA00DD0WT] N.C.(TO252-5) GND(HRP5) 3 Vref Vref Driver VOUT Vcc 2 Driver VOUT Vcc 4 4 2 + 0.33F + 0.33F 22F OVP OCP TSD 1 Fin GND CTL 22F OVP C(ADJ) 5 R1 TOP VIEW TOP VIEW Symbol 1 5 R2 Fig.26 TOP VIEW Function PINNo. Symbol Function Output voltage ON/OFF control 1 CTL Output voltage ON/OFF control 2 VCC Power supply voltage input 2 VCC Power supply voltage input 3 N.C./GND Unconnected terminal/GND* 3 GND GND 4 OUT Voltage output 4 OUT Voltage output 5 C Output voltage regulation terminal 5 ADJ Output voltage regulation terminal FIN GND GND 1 2 3 4 5 1 2 3 4 5 TO252-5 CTL C(ADJ) GND R2 R1 PINNo. 3 CTL Fig.25 FIN OCP TSD 1 HRP5 1 2 3 45 1 2 3 45 TO220FP-5 TO220FP-5(V5) *TO252-5 is N.C., and HRP5 is GND 12 3 4 5 TO220CP-V5 Input / Output Equivalent Circuit Diagrams < BA00CC0WT/BA00CC0WFP > Vcc 25k CTL C 10 k 25k VOUT 5.5 k Fig.27 < BA00DD0WT/BA00DD0WFP > Vcc Vcc Vcc 10k 39k 2k VOUT CTL ADJ 31k 500 Fig.28 Output Voltage Configuration Method Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.29. Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistors with large values are used. The use of resistors with R1=2K to 15 K is recommended. VOUT Vo = Vc (VADJ) x BACC0 BADD0 1 R2 R1 R2 Vc VADJ Vc : 1.225 (Typ.) VADJ : 1.270 (Typ.) CADJ R1 Fig.29 5/8 Thermal Design HRP-5 9 8 7.3W 7 6 5.5W 5 4 3 2 1 2 TO252-5 2.0 When using a maximum heat sick : j-c=6.25(/W) When using an IC alone : j-c=62.5(/W) 20 Power Dissipation:Pd(W) Power Dissipation:Pd(W) To225FP-5 25 Board size : 70x70x1.6 3 board contains a thermal Board front copper foil area : 10.5x10.5 2 2-layer board (back surface copper foil area :15x15 2) 2-layer board (back surface copper foil area :70x70 2) 4-layer board (back surface copper foil area :70x70 2) 15 10 5 2.3W Mounted on a Rohm standard board Board size : 70x70x1.6 Copper foil area :7x7 TO252-5ja=96.2(/W) 1.6 120.0 Power Dissipation:Pd(W) 10 1.30 1.2 0.8 0.4 22.0 1 0 0 0 25 50 75 100 Ambient temperature:Ta( 125 150 0.0 0 25 50 75 100 Ambient temperature:Ta( 125 150 0 25 50 75 100 Ambient temperature:Ta( 125 Fig.30 Fig.31 Fig.32 When using at temperatures over Ta=25, please refer to the heat reducing characteristics shown in Fig.30 through 32. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature TjMAX. Fig.31 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a normal temperature (25), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures less than the acceptable loss Pd. The calculation method for power consumption Pc(W) is as follows : Pc = (Vcc-Vo)xIoVccxIcca Acceptable loss PdPc VccInput voltage VoOutput voltage IoLoad current IccaCircuit current Solving this for load current IO in order to operate within the acceptable loss, Io Pd - VccxIcca VccVo Please refer to Figs.8 and 20 for Icca. It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design. Calculation Example Example 1) When Ta=85, Vcc=8.3V, Vo=3.3V, BA33DD0WT 1.048.3xIcca Io 5 Io200mA (Icca : 2mA) With the IC alone : ja=62.5/W -16mW/ 25=2000mW 85=1040mW Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is : Pc=Vccx(IccaIshort) Ishort : Short circuit current Terminal Vicinity Settings and Cautions Vcc Terminal Please attach a capacitor (greater than 0.33F) between the Vcc and GND. The capacitance values differ depending on the application, so please chose a capacitor with sufficient margin and verify the operation on an actual board. CTL Terminal The CTL terminal is turned ON at 2.0V and higher and OFF at 0.8V and lower within the operating power supply voltage range. The power supply and the CTL terminal may be started up and shut down in any order without problems. Vo Terminal Please attach an anti-oscillation capacitor between VOUT and GND. The capacitance of the capacitor may significantly change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable operating region while referring to the ESR characteristics reference data shown in Figs.33 through 35. In cases where there are sudden load fluctuations, the a large capacitor is recommended. Below figure , it is ESR-to-Io stability Area characteristics ,measured by 22-ceramic-capacitor and resistor connected in series. This characteristics is not equal value perfectly to 22-aluminum electrolytic capacitor in order to measurement method. 6/8 150 Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can vary with the board's wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the final status of these items for actual use. Keep capacitor capacitance within a range of 22F1000F. It is also recommended that a 0.33F bypass capacitor be connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input voltage or the load, please check the operation in real application to determine proper capacitance. 100 IC 22F C(ADJ) EFFECTIVE SERIES RESISTANCE:ESR [] OUT Fig.33:Output equivalent circuit Unstable operating region 10 Stable operating region 1 Unstable operating region 0.1 0 1000 200 600 800 400 OUTPUT CURRENTlo(mA) EFFECTIVE SERIES RESISTANCE:ESR [] Unstable operating region 100 10 Stable operating region 1 Unstable operating region 0.1 1 10 OUTPUT Fig.34:Io vs. ESR characteristics (BACC0,22F) 100 CURRENTlo(mA) 1000 Fig.35: Io vs. ESR characteristics (BADD0,22F) Other 1) Protection Circuits Overcurrent Protection Circuit A built-in overcurrent protection circuit corresponding to the current capacity prevents the destruction of the IC when there are load shorts. This protection circuit is a "7"-shaped current control circuit that is designed such that the current is restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents, it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the overcurrent protection circuit has negative current capacity characteristics with regard to temperature (Refer to Figs.4 and 16). Thermal Shutdown Circuit (Thermal Protection) This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As shown above, this must be used within the range of acceptable loss, but if the acceptable loss happens to be continuously exceeded, the chip temperature Tj increases, causing the temperature protection circuit to operate. When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12 and 24 for the temperatures at which the temperature protection circuit operates). There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to avoid leaving the IC in the overloaded state. Reverse Current In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.36). 2) This IC is bipolar IC that has a P-board (substrate) and P+ isolation layer between each devise, as shown in Fig.37. A P-N junction is formed between this P-layer and the N-layer of each device, and the P-N junction operates as a parasitic diode when the electric potential relationship is GND> Terminal A, GND> Terminal B, while it operates as a parasitic transistor when the electric potential relationship is Terminal B GND> Terminal A. Parasitic devices are intrinsic to the IC. The operation of parasitic devices induces mutual interference between circuits, causing malfunctions and eventually the destruction of the IC itself. It is necessary to be careful not to use the IC in ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND (P-board) to the input terminal. Transistor (NPN) B (Pin B) O E Reverse current CTL Resistor (Pin A) (Pin B) B P+ P N P+ N P+ P N GND P Parasitic element GND Parasitic element or transistor Parasitic element or transistor N N P C E N N GND Fig. 36:Bypass diode GND P+ OUT Vcc GND (Pin A) Parasitic element GND Fig. 37: Example of the basic structure of a bipolar IC 7/8 Part Number Selection B A 0 0 ROHM model name Output voltage C C 0 H F P W Current capacity Shutdown switch CC0 : 1A W : With switch DD0 : 1A None : Without switch Package T : TO220-3,5 F P : TO252-3,5 HFP : HRP5 CP: TO220CP TO220FP-5 Package specification TR : Embossed taping(HRP5) E2 : Embossed taping(TO252-5, TO220CP) None : Tube container V5 :Foaming(V5 only) Unit:mm Unit:mm Unit:mm Unit:mm E 2 TO220FP-5 (V5) HRP5 TO252-5 Unit:mm TO2220CP-V5 Package SpecificationTO220FP-5 Package Form Package Quantity Package Orientation Package SpecificationTO220FP-5V5 Container tube Package 500pcs Package Quantity Form Container tube 500pcs The product orientation in each container The product orientation in each container Package Orientation tube is constant. tube is constant. *Please make orders in multiples of the package quantity. *Please make orders in multiples of the package quantity. Tape and Reel informationHRP5 <Tape and Reel information > TO252-3,5 Tape Embossed taping Tape Embossed taping Quantity 2000pcs Quantity 2000pcs Direction of feed E2 Direction of feed When the reek is held with the left hand and the tape is drawn out with the right hand, the No.1 pin of the product faces the lower left direction. Reel No.1 pin Direction of feed TR When the reek is held with the left hand and the tape is drawn out with the right hand, the No.1 pin of the product faces the upper right direction. Reel *Please make orders in multiples of the package quantity. No.1 pin *Please make orders in multiples of the package quantity. 8/8 Direction of feed Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com Copyright (c) 2007 ROHM CO.,LTD. THE AMERICAS / EUPOPE / ASIA / JAPAN Contact us : webmaster@ rohm.co. jp 21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121 FAX : +81-75-315-0172 Appendix1-Rev2.0