TECHNICAL NOTE
3-terminal Regulator ＆ LDO Regulator series
Standard Variable
Output LDO Regulator
BA00DD0W and BA00CC0W Series
●General Description
The BA00DD0/CC0 series are low-saturation regulators available for outputs up to 2A/1A. The output voltage can be
arbitrarily configured using the e xternal resistance. These series of LDO regulators are offered in a broad packaging lineup.
This IC has a built-in over-current protec tion circuit that prevents the destruction of the IC due to output short circuits and a
thermal shutdown circuit that protects the IC from thermal damage due to overloading.
●Features
1) Maximum output current : 2A (BA00DD0 series), 1A(BA00CC0 series)
2) ±1% high-precision output voltage (BA00DD0)
3) Low saturation with PNP output
4) Built-in over-current protection circu it that prevents the destruction of the IC due to output short circuits
5) Built-in thermal shutdown circuit for protecting the IC from thermal dam age due to overloading
6) Built-in over- voltage protection circuit that prevents the destruction of the IC due to power supply surges
7) TO220CP and HRP5 packaging(BA00DD0), and TO220FP/CP and TO252 packaging(BA00CC0)
●Applications
Usable in DSP power supplies for DVDs and CDs, FPDs, televisions, personal computers or any ot her consumer device
●Line up
1A BA00CC0 Series
2A BA00DD0 Series
2007.Oct.
Part Number Package
BA00CC0WT TO220FP-5
BA00CC0WT-V5 TO220FP-5(V5)
BA00CC0CP-V5 TO220CP-V5
BA00CC0WFP TO252-5
Part Number Package
BA00DD0CP-V5 TO220CP-V5
BA00DD0WHFP HRP-5
2/8
●ABSOLUTE MAXIMUM RATINGS(Ta=25℃)
Parameter Symbol Limits Unit
Input Power Supply Voltage＊1 Vcc -0.3 ~ +35 V
2300(HRP5)
1300(TO252-5)
Power Dissipation ＊2 Pd
2000(TO220FP/CP) mW
Operating Temperature Range Topr -40 ~ +125 ℃
Ambient Storage Temperature Tstg -55 ~ +150 ℃
Junction Temperature Tjmax +150 ℃
Output Control Terminal Voltage VCTL -0.3 ~ +Vcc V
Voltage Applied to the Tip ＊3 Vcc peak +50 V
＊ 1 Must not exceed Pd
＊ 2 HRP5 : In cases in which Ta≥25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 18.4 mW/℃.
TO252-5 : In cases in which Ta≥25℃ when a 70mm×70mm×1.6mm glass epoxy board is used, the power is reduced by 10.4 mW/℃.
TO252FP-5 : No heat sink. When Ta≥25℃, the power is reduced by 16 mW/℃.
＊3 Applied voltage : 200msec or less (tr≥1msec)
● Recommended Operating Range (Ta= 25 ℃)
Parameter Symbol Min. Max. Unit
BA00CC0□□ 4.0 25.0 Input Power
Supply Voltage BA00DD0□□ Vcc 3.0 25.0 V
BA00CC0□□ － 1
Output Current BA00DD0□□ Io － 2 A
Output Control Terminal Voltage VCTL 0 Vcc V
● Electrical Characteristics(ABRIDGED)
BA00CC0□□ Series (unless specified otherwise, Ta=25℃, Vcc=10V, VCTL=5V, Io=500mA, R1=2.2KΩ, R2=6.8KΩ)
Parameter Symbol Min. Typ. Max. Unit Conditions
C-terminal Voltage Vc 1.200 1.225 1.250 V Io=50mA
Circuit Current at the Time of Shutdown Isd － 0 10 μA VCTL=0V
Minimum I/O Voltage Difference ΔVd － 0.3 0.5 V Vcc= 0.95×Vo
Output Current Capacity Io 1.0 － － A
Input Stability Reg.I － 20 100 mV Vcc= 6V→25 V
Load Stabilit y Reg.L － 50 150 mV Io=5mA→1A
Output Voltage Temperature Coefficient＊ TCVO － ±0.02 － %/℃ Io=5mA ,Tj=0~125℃
＊Design guarantee(100% shipping inspection not performed)
BA00DD0□□ Series (unless specified otherwise, Ta=25℃, Vcc=8V, VCTL=3V, Io=500mA, R1=15KΩ, R2=44KΩ)
Parameter Symbol Min. Typ. Max. Unit Conditions
C-terminal Voltage VADJ 1.257 1.270 1.283 V Io=100mA
Circuit Current at the Time of Shutdown Isd － 0 10 μA VCTL=0V
Minimum I/O Voltage Difference ΔVd － 0.45 0.7 V Vcc= 0.95×Vo, Io=2A
Output Current Capacity Io 2.0 － － A
Input Stability Reg.I － 15 35 mV
Vcc= 5.7V →25 V,
Io=200mA
Load Stabilit y Reg.L － 50 100 mV Io=0mA→2A
Output Voltage Temperature Coefficient＊ TCVO － ±0.02 － %/℃ Io=5mA ,Tj=0~125℃
＊Design guarantee(100% shipping inspection not performed)
MAX200msec
(Voltage Supply more than 35V)
50V
35V
0V
tr≧1msec
3/8
●Reference Data
BA00CC0□□(3.3V preset voltage)
(Unless specified otherwise, Vcc=10V, VOUT=3.3V preset, VCTL=3V, Io=0mA, R1=2.2KΩ, and R2=6.8KΩ)
Fig.10 CTL Voltage vs. Output Voltage Fig.11 Overvoltage Operating Fig.12 Thermal Shutdown
Circuit Characteristics
Characteristics(Io=200mA)
Fig.6 Ripple Rejection Chara c teristics
（Io=100mA）
1000k
2.0
2.5
3.0
3.5
4.0
4.5
-40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE:Ta[℃]
OUTPUT VOLTAGE:VOUT[V
]
0
1
2
3
4
5
6
7
8
0 2 4 6 8 1012141618202224
CO NT ROL V OLTA GE: VCTL[V ]
OUTPUT VOLTAGE:VOUT[V
]
0
1
1
2
2
3
3
4
4
0 5 10 15 20 25 30 35 40
SUPPLY VOLTAGE:Vcc[V]
OUTPUT VOLTAGE:VOUT[V
]
0
1
1
2
2
3
3
4
4
130 140 150 160 170 180 190
AMBIENT TEMPERATURE:Ta[℃]
OUTPUT VOLTAGE:VOUT[V
]
0
50
100
150
200
0 100 200 300 400 500 600 700 800 900 1000
O UT PUT CURRENT: Io[ mA ]
CIRCUIT CURRENT:Icc[mA]
0
100
200
300
400
500
600
700
800
900
1000
0 2 4 6 8 101214161820
CONTROL VOLTAGE:VCTL[V]
CONTROL CURRENT:ICTL[µA]
Fig.7 Output Voltage Fig.8 Circuit Current by load Level Fig.9 CTL Voltage vs. CTL Current
Temperature Characteristics (I
OUT=0mA→1A)
Fig.3 Input Stability Fig.1 Circuit current Fig.2 Input Stability （Io=500mA）
0.0
0.5
1.0
1.5
2.0
2.5
3.0
02468101214161820
SUPPLY VOLTAGE:VCC[V]
CIRCUIT CURRENT:ICC[mA]
0.0
1.0
2.0
3.0
4.0
0 2 4 6 8 10 12 14 16 18 20
SUPPLY VOLTAGE:VCC[V]
OUTPUT VOLTAGE:VOUT[V
]
0.0
1.0
2.0
3.0
4.0
0 2 4 6 8 10 12 14 16 18 20
SUPPLY VOLTAGE:VCC[V]
OUTPUT VOLTAGE:VOUT[V
]
Fig.5 Input/Output Voltage Difference
0
100
200
300
400
500
600
0 100 200 300 400 500 600 700 800 900 1000
O UTPUT CURRENT :I o[ mA ]
DROPOUT VOLTAGE:
ΔVd[V]
0
10
20
30
40
50
60
70
80
10 1000 100000
FREQUENCY:f[Hz]
RIPPLE REJECTION:R.R[dB
]
Fig.4 Load Stability Io-ΔVd Characteristics（Vcc=2.95V）
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 200 400 600 800 1000 1200 1400 1600 1800 2000
OUTPUT CURRENT:Io[mA]
OUTPUT VOLTAGE:VOUT[V
]
100k 10k 1k 100
[mV]
4/8
●Reference Data
BA00DD0□□(5.0V preset voltage)
(Unless specified otherwise, Vcc=8V, VOUT=5V preset, VCTL=3V, Io=0mA, R1=15KΩ, and R2=44KΩ)
Circuit Characteristics
4.8
4.9
5.0
5.1
5.2
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE:Ta[℃]
OUTPUT VOLTAGE:VOUT[V
]
0
1
2
3
4
5
6
7
8
0 2 4 6 8 1012141618202224
CO NT ROL V OLTA GE: VCTL[V ]
OUTPUT VOLTAGE:VOUT[V
]
0
1
1
2
2
3
3
4
4
0 5 10 15 20 25 30 35 40
SUPPLY VOLTAGE:Vcc[V]
OUTPUT VOLTAGE:VOUT[V
]
0
2
4
6
8
130 140 150 160 170 180 190
AMBIENT TEMPERATURE:Ta[℃]
OUTPUT VOLTAGE:VOUT[V
]
0
20
40
60
80
100
120
140
160
180
200
O UT PUT CURRENT:I OUT[ A]
CIRCUIT CURRENT:[mA]
0
100
200
300
400
500
600
700
800
0 2 4 6 8 1012141618202224
CO NT ROL V OLTAG E: VCTL[V]
CONTROL CURRENT:ICTL[µA]
Fig.19 Output Voltage Fig.20 Circuit Current by load Level Fig.21 CTL Voltage vs. CTL Current
Temperature Characteristics (I
OUT=0mA→2A)
Fig.15 Input Stability Fig.13 Circuit Current Fig.14 Input Stability （Io=2A）
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
024681012141618202224
SUPPLY VOLTAGE:VCC[V]
CIRCUIT CURRENT:ICC[mA]
0
1
2
3
4
5
6
7
8
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE:VCC[V]
OUTPUT VOLTAGE:VOUT[V
]
0
1
2
3
4
5
6
7
8
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE:VCC[V]
OUTPUT VOLTAGE:VOUT[V
]
0
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
OUTPUT CURRE NT: I OUT[ A]
OUTPUT VOLTAGE:VOUT[V]
Fig.17 Input/Output Voltage Difference
0
100
200
300
400
500
600
700
800
OUTPUT CURRE NT: I OUT[ A]
DROPOUT VOLTAGE:VDRP[V]
0
5
10
15
20
25
30
35
40
45
50
55
60
10 1000 100000
FREQUENCY:f[Hz]
RIPPLE REJECTION:R.R[dB
]
Fig.16 Load Stability Fig.18 Ripple Rejection C haracteristics
（Iout=100mA）
Iout-ΔVd Characteristics（Vcc=4.75V）
1000k
100k
10k
1k
100
0.5 1.0 1.5 2.0
1.0 2.0 3.0 4.0 4.8
0.5 1.0 1.5 2.0
1
8
2
3
4
5
6
7
Fig.22 CTL Voltage vs. Output Voltage Fig.23 Overvoltage Operating Fig.24 Thermal Shutdown
Characteristics(Io=200mA)
[ｍV]
5/8
●Block Diagrams
[BA00CC0WFP]
[BA00DD0WHFP]
TOP VIEW
TO252-5 HRP5
PINNo. Symbol Function
1 CTL Output voltage ON/OFF control
2 VCC Power supply voltage input
3 N.C./GND Unconnected terminal/GND*
4 OUT Voltage output
5 C Output voltage regulation terminal
FIN GND GND
[BA00CC0WT]
[BA00DD0WT]
TO220FP-5 TO220FP-5(V5)
PINNo. Symbol Function
1 CTL Output voltage ON/OFF control
2 VCC Power supply voltage input
3 GND GND
4 OUT Voltage output
5 ADJ Output voltage regulation terminal
●Input / Output Equivalent Circuit Diagrams
< BA00CC0WT/BA00CC0WFP >
< BA00DD0WT/BA00DD0WFP >
●Output Voltage Configuration Method
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.29.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistors with large
values are used. The use of resistors with R1=2KΩ to 15 KΩ is recommended.
Vo = Vc (V
ADJ) × 1 ＋
BA□□CC0□□ Vc : 1.225 (Typ.)
BA□□DD0□□
VADJ : 1.270 (Typ.)
R2
R1
0.33
μ
F
22μF
VOUT
C
(
ADJ
)
+
GND
V
cc
CTL
R1 R2
Driver
TSD OCP
Vref
N.C.(TO252-5)
GND(HRP5)
Fin
1 5
2 4
OVP
3
1 2 3 4 5
1 2 3 4 5
*TO252-5 is N.C., and HRP5 is GND
1 2 3 4 5 1 2 3 4 5
TOP VIEW TOP VIEW
0.33
μ
F
22μF
VOUT
C
(
ADJ
)
+
GND
V
cc
CTL
R1 R2
Driver
TSD OCP
Vref
3
1 5
2 4
OVP
CTL
25kΩ
25kΩ
VOUT
10 kΩ C
5.5 kΩ
Vcc
Vcc
500Ω
10kΩ
ADJ
Vcc
CTL 39kΩ 2kΩ
Vcc
Fig.27
Fig.28
Fig.25 Fig.26
VOUT
C
（
ADJ
）
R1
R2
Vc
（VADJ）
Fig.29
VOUT
31kΩ
1 2 3 4 5
TO220CP-V5
6/8
●Thermal Design
HRP-5 To225FP-5 TO252-5
Fig.30 Fig.31 Fig.32
When using at temperatures over Ta=25℃, please refer to the heat reducing charact eristics shown in Fig.30 through 32.
T he IC characteristics are closely related to the temperatur e at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature TjMAX.
Fig.31 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptabl e loss range that can be used with the IC alone. Even when the ambient temper ature Ta is a
normal temperature (25℃), the chip (junction) temperat ure Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follo ws :
Pc = (Vcc-Vo)×Io＋Vcc×Icca
Acceptable loss Pd≦Pc
Solving this for load current IO in order to operate within the acceptable loss,
Io≦
（Please refer to Figs.8 and 20 for Icca.）
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal
design.
Calculation Example
Example 1) When Ta=85℃, Vcc=8.3V, Vo=3.3V, BA33DD0WT
Io≦ With the IC alone : θja=62.5℃/W → -16mW/℃
Io≦200mA (Icca : 2mA) 25℃=2000mW → 85℃=1040mW
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Icca＋Ishort)
Ishort : Short circuit current
●Terminal Vicinity Settings and Cautions
・Vcc Terminal
Please attach a capacitor (greater than 0.33μF) between the Vcc and GND.
The capacitance values differ depending on the appl ication, so please c hose a capacitor with sufficient margin and verif y
the operation on an actual bo ard.
・CTL Terminal
The CTL terminal is turned ON at 2.0V and higher a nd OFF at 0.8V and l ower within the operating po wer supply voltage
range.
The power supply and the CTL terminal may be started up and shut down in any order without problems.
●Vo Terminal
Please attach an anti-oscillation capacitor between VOUT and GND. The capacitance of the capacitor may significantly
change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or
aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low
temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable
operating region while referring to the ESR characteristics reference data shown in Figs.33 through 35. In cases where there
are sudden load fluctuations, the a large capacitor is recommended.
Below figure , it is ESR-to-Io stability Area characteristics ,measur ed b y 22 μＦ-ceramic-c apacitor and resistor conn ecte d in
series.
This characteristics is not equal value perfectly to 22μＦ-aluminum electrolytic capacitor in order to measurement
method.
Pd – Vcc×Icca
Vcc－Vo
1.04－8.3×Icca
5
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7㎜
TO252-5θja=96.2(℃/W)
Vcc：
Vo：
Io：
Icca：
Input voltage
Output voltage
Load current
Circuit current
0.0
0.4
0.8
1.2
1.6
2.0
0 25 50 75 100 125 150
Ambie n t te mpe ratu re :Ta(℃）
Power Dissipation:Pd(W
)
0
1
2
3
4
5
6
7
8
9
10
0 25 50 75 100 125 150
Ambient temperature:Ta(℃）
Power Dissipation:Pd(W
)
0
5
10
15
20
25
0 25 50 75 100 125 150
Ambient temperature:Ta(℃）
Power Dissipation:Pd(W
)
③7.3W
②5.5W
①2.3W
（1）20.0
（2）2.0
1.30
Board size : 70×70×1.6 ㎜3 （board contai ns a therma l ）
Board front copper foil area : 10.5×10.5 ㎜2
①2-layer board (back surface copper foil area :15×15 ㎜2)
②2-layer board (back surface copper foil area :70×70 ㎜2)
③4-layer board (back surface copper foil area :70×70 ㎜2)
（1） When using a maximum heat sick : θj-c=6.25(℃/W)
（2） When using an IC alone : θj-c=62.5(℃/W)
7/8
Note, however, that the stable range sug gested in the figure depends on the IC an d the resistance load involved, and can
vary with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the final
status of these items for actual use.
Keep capacitor capacitance within a range of 22μF～1000μF. It is also recommended that a 0.33μF bypass capacitor be
connected as close to the input pin-GND as location possible. Ho wever, in situations such as rapid fluctuation of the input
voltage or the load, please check the operation in real application to determine proper capacitance.
Fig.33:Output equivalent circuit Fig.34:Io vs. ESR characteristics Fig.35: Io vs. ESR characteristics
(BA□□CC0,22μF) (BA□□DD0,22μF)
●Other
1) Protection Circuits
Overcurrent Protection Circuit
A built-in overcurrent protection circuit corresponding to the current capacity prevents the destruction of the IC when there
are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is restricted
and does not latch even when a large current momentarily flows through the system with a high-capacitance capacitor.
However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents, it is not
suitable for continuous operation or transient use. Please be aware when creating thermal designs that the overcurrent
protection circuit has negative current capacity characteristics with regard to temperature (Refer to Figs.4 and 16).
Thermal Shutdown Circuit (Thermal Protection)
This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As shown
above, this must be used within the range of acceptable loss, but if the acceptable loss happens to be continuously
exceeded, the chip temperature Tj increases, causing the temperature protection circuit to operate.
When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation
immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12
and 24 for the temperatures at which the temperature protection circuit oper ates).
There are cases in which the IC is destroyed due to thermal runa way when it is left in the overloaded state. Be sure to avoid
leaving the IC in the overloaded state.
Reverse Current
In order to prevent the destruction of the IC when a reverse current flows through the IC, it is reco mmended that a diode be
placed bet ween the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.36).
2) This IC is bipolar IC that has a P-board (substrate) and P+ isolation layer
between each devise, as shown in Fig.37. A P-N junction is formed between
this P-layer and the N-layer of each device, and the P-N junction operates
as a parasitic diode when the electric potential relationship is GND>
Terminal A, GND> Terminal B, while it operates as a parasitic transistor
when the electric potential relationship is Terminal B GND> Terminal A.
Parasitic devices are intrinsic to the IC. The operation of parasitic devices
induces mutual interference between circuits, causing malfunctions and
eventually the destructio n of the IC itself. It is necessar y to be careful not to
use the IC in ways that would cause parasitic elements to operate. For
example, applying a voltage that is lower than the GND (P-board) to the
input terminal.
Fig. 37: Example of the basic structure of a bipolar IC
22μF
OUT
IC
C(ADJ)
200 400 800 1000
0.1
1
10
Stab le oper a tin g reg io n
100
0 600
Unstable operating region
Unstable operating region
1
0.1
1
10
100
10 100 1000
OUTPUT CURRENT：lo(mA) OUTPUT CURRENT：lo(mA)
Unstable operating region
Unstable operating region
Stab le oper a tin g reg io n
EFFECTIVE SERIES RESISTANCE:ESR [Ω]
EFFECTIVE SERIES RESISTANCE:ESR [Ω]
GND
N P
N
P+ P+
Parasitic element
or transistor
(Pin B) BE
Transistor
(
NPN
)
N
P
N
GND
O (Pin A)
GND
N
P+
Resistor
Parasitic element
P
NPP+
N
(Pin A)
Parasitic element
or transistor
(Pin B)
G
ND
C
B E
Parasitic element
G
ND
Fig. 36:Bypass diode
OUT
Vcc
CTL GND
Reverse current
8/8
●Part Number Selection
*Please make orders in multiples of the package quantity. *Please make orders in multiples of the package quantity.
*Please make orders in multiples of the package quantity. *Please make orders in multiples of the package quantity.
Package Form Container tube
Package Quantity 500pcs
Package Orientation The product orientation in each container
tube is constant.
Package Form Container tube
Package Quantity 500pcs
Package Orientation The product orientation in each container
tube is constant.
ROHM
model name Output
voltage
Current capacity
CC0 : 1A
DD0 : 1A
Shutdown switch
W : With switch
None : Without
switch
T :
F P :
HFP :
CP:
B 0 0 C C W
H
0
A
P E 2
F
Package specification
TR : Embossed taping(HRP5)
E2 : Embossed taping(TO252-5,
TO220CP)
None : Tube container
V5 :Foaming(V5 only)
Package
TO220-3,5
TO252-3,5
HRP5
TO220CP
（Unit:mm）
HRP5
Unit:mm
Unit:mm
TO220FP-5
(
V5
)
Unit:mm
TO220FP-5 TO252-5
＜Package Specification＞TO220FP-5 ＜Package Specification＞TO220FP-5（V5）
<Tape and Reel information > TO252-3,5
Embossed taping
E2
（When the reek is held with the left hand and the tape is drawn out with the
right hand, the No.1 pin of the product faces the lower left direction.）
Tape
Quantity
Direction
of feed
2000
p
cs
No.1 pin Reel Direction of feed
＜Tape and Reel information＞HRP5
Tape
Quantity
Direction
of feed
Embossed taping
2000
p
cs
TR
（When the reek is held with the left hand and the tape is drawn out with the
right hand, the No.1 pin of the product faces the upper right direction.）
No.1 pin
Reel Direction of feed
TO2220CP-V5
Unit:mm
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
Appendix1-Rev2.0
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The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan TEL : +81-75-311-2121
FAX : +81-75-315-0172
Appendix