LD 271
LD 271 H
LD 271 L
LD 271 LH
IR-Lumineszenzdiode
Infrared Emitter
Lead (Pb) Free Product - RoHS Compliant
2007-04-04 1
Wesentliche Merkmale
GaAs-LED in 5mm radial-Gehäuse
Typische Peakwellenlänge 950nm
Hohe Zuverlässigkeit
Mit verschiedenen Beinchenlängen lieferbar
Variante mit “stand-off” lieferbar
TTW Löten geeignet
Anwendungen
IR-Fernsteuerung von Fernseh- und
Rundfunkgeräten, Videorecordern,
Lichtdimmern
Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
Sensorik
Diskrete Lichtschranken
Typ
Type Bestellnummer
Ordering Code Strahlstärkegruppierung 1) (IF = 100mA, tp = 20 ms)
Radiant intensity grouping 1)
Ie (mW/sr)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr
measured at a solid angle of Ω = 0.01 sr
LD 271 Q62703Q0148 15 (>10)
LD 271 L Q62703Q0833
LD 271 H Q62703Q0256 >16
LD 271 LH Q62703Q0838
Features
GaAs-LED in 5mm radial package (T 1 3/4)
Typical peak wavelength 950nm
High reliability
Available with two different lead lengths
Version with stand-off available
Suitable for TTW soldering
Applications
IR remote control of hi-fi and TV-sets, video
tape recorders, dimmers
Remote control for steady and varying intensity
Sensor technol ogy
Discrete interrupters
2007-04-04 2
LD 271, LD 271 H, LD 271 L, LD 271 LH
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg – 40 + 100 °C
Sperrspannung
Reverse voltage VR5 V
Durchlaßstrom
Forward current IF130 mA
Stoßstrom, tp = 10 μs, D = 0
Surge current IFSM 3.5 A
Verlustleistung
Power dissipation Ptot 220 mW
Wärmewiderstand
Thermal resistance RthJA 330 K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA, tp = 20 ms
λpeak 950 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
Δλ 55 nm
Abstrahlwinkel
Half angle ϕ ± 25 Grad
deg.
Aktive Chipfläche
Active chip area A0.25 mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area L × B
L × W0.5 × 0.5 mm²
Abstand Chipoberfläche bis Linsenscheitel
Distance chip front to lens top H4.0 4.6 mm
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ie from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf1μs
LD 271, LD 271 H, LD 271 L, LD 271 LH
2007-04-04 3
Kapazität, VR = 0 V, f = 1 MHz
Capacitance Co40 pF
Durchlaßspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
VF
VF
1.30 ( 1.5)
1.90 ( 2.5)
V
V
Sperrstrom, VR = 5 V
Reverse current IR0.01 ( 1) μA
Gesamtstrahlungsfluß
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe18 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe,
IF = 100 mA
TCI– 0.55 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA TCV– 1.5 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA TCλ0.3 nm/K
Gruppierung der Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel Ω = 0.01 sr
Grouping of Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
LD 271
LD 271 L LD 271 H
LD 271 LH
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 μs
Ie
Ie typ.
15 (> 10)
120
> 16
mW/sr
mW/sr
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
LD 271, LD 271 H, LD 271 L, LD 271 LH
2007-04-04 4
Relative Spectral emission
Irel = f (λ)
Forward Current
IF = f (VF), single pulse, tp = 20 μs
Radiation Characteristics Irel = f (ϕ)
OHRD1938
λ
rel
Ι
0880 920 960 1000
nm
1060
20
40
60
80
%
100
V
OHR01041
F
F
Ι
1
1
10
0
10
-1
10
10
-2
A
1.5 2 2.5 3 3.5 4 V 4.5
max.
typ.
OHR01879
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiant Intensity
Single pulse, tp = 20 μs
Permissible Pulse Handling
Capability IF = f (τ), TC = 25 °C,
duty cycle D = parameter
Ιe
Ιe 100 mA = f (IF)
Ι
OHR01038
F
-1
10
10 0
1
10
2
10
10 -2 -1
10 0
10 A 10 1
Ι
e
Ι
e(100 mA)
t
OHR00257
P
10
-5
s
T
t
p
D=t
p
T
Ι
F
10
4
Ι
F
DC
0.5
0.2
0.1
0.005
0.01
0.02
0.05
mA
10
3
10
2-4
10
-3
10
-2
10
-1
10
0
10
2
10
=D
5
5
Max. Permissible Forward Current
IF = f (TA)
T
OHO00364
A
0
F
Ι
0 20 40 60 80 100C
mA
20
40
60
80
100
120
140
160
200
LD 271, LD 271 H, LD 271 L, LD 271 LH
2007-04-04 5
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Gehäusef arbe: grau
Brechungsindex Verguss: 1.53
Package Colour: grey
Refractive index resin: 1.53
4.8 (0.189)
4.2 (0.165)
11.6 (0.457)
11.2 (0.441)
25.2 (0.992)
24.2 (0.953)
1.3 (0.051)
1.0 (0.039)
Cathode
Chip position
GEXY6239
1.0 (0.039)
0.7 (0.028)
spacing
2.54 (0.100)
1.2 (0.047)
1.8 (0.071)
0.4 (0.016)
0.6 (0.024) Area not flat
8.2 (0.323)
9.0 (0.354)
7.8 (0.307)
7.5 (0.295)
ø5.1 (0.201)
ø4.8 (0.189)
5.5 (0.217)
5.9 (0.232)
0.4 (0.016)
0.6 (0.024)
LD 271 / LD 271 H
7.8 (0.307)
7.5 (0.295)
9.0 (0.354)
8.2 (0.323)
29 (1.142)
27 (1.063)
1.8 (0.071)
1.2 (0.047)
4.8 (0.189)
4.2 (0.165)
ø5.1 (0.201)
ø4.8 (0.189)
0.8 (0.031)
0.4 (0.016)
0.6 (0.024)
0.4 (0.016)
2.54 (0.100)
spacing
5.9 (0.232)
5.5 (0.217)
0.6 (0.024)
0.4 (0.016)
Area not flat
Chip position
Cathode
GEOY6645
LD 271 L / LD 271 LH
2007-04-04 6
LD 271, LD 271 H, LD 271 L, LD 271 LH
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Empfohlenes Lötpaddesign Wellenlöten (TTW)
Recommended Solder Pad TTW Soldering
Maße in mm (inch) / Dimensions in mm (inch).
OHLY0598
0
050 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
4 (0.157)
OHLPY985
4.8 (0.189)
LD 271, LD 271 H, LD 271 L, LD 271 LH
2007-04-04 7
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics. All typical data
and graphs are bas ing on sample base, but do n't represent th e production range. If re quired, e.g. because of tech nical
improvements, the typ. data will be chan ged without any further notice.
Terms of delivery and rights to change design re serve d. Due to tec hnical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
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By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-supp ort devices or systems 2 with the express written approval of OSRAM OS.
1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected
to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.
2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the us er may be endangered.