IR-Lumineszenzdiode Infrared Emitter Lead (Pb) Free Product - RoHS Compliant LD 271 LD 271 H LD 271 L LD 271 LH Wesentliche Merkmale Features * * * * * * * * * * * * GaAs-LED in 5mm radial-Gehause Typische Peakwellenlange 950nm Hohe Zuverlassigkeit Mit verschiedenen Beinchenlangen lieferbar Variante mit "stand-off" lieferbar TTW Loten geeignet GaAs-LED in 5mm radial package (T 1 3/4) Typical peak wavelength 950nm High reliability Available with two different lead lengths Version with stand-off available Suitable for TTW soldering Anwendungen Applications * IR-Fernsteuerung von Fernseh- und Rundfunkgeraten, Videorecordern, Lichtdimmern * Geratefernsteuerungen fur Gleich- und Wechsellichtbetrieb * Sensorik * Diskrete Lichtschranken * IR remote control of hi-fi and TV-sets, video tape recorders, dimmers * Remote control for steady and varying intensity * Sensor technology * Discrete interrupters Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung 1) (IF = 100mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) LD 271 Q62703Q0148 15 (>10) LD 271 L Q62703Q0833 LD 271 H Q62703Q0256 LD 271 LH Q62703Q0838 >16 1) gemessen bei einem Raumwinkel = 0.01 sr measured at a solid angle of = 0.01 sr 2007-04-04 1 LD 271, LD 271 H, LD 271 L, LD 271 LH Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlastrom Forward current IF 130 mA Stostrom, tp = 10 s, D = 0 Surge current IFSM 3.5 A Verlustleistung Power dissipation Ptot 220 mW Warmewiderstand Thermal resistance RthJA 330 K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 55 nm Abstrahlwinkel Half angle 25 Grad deg. Aktive Chipflache Active chip area A 0.25 mm2 Abmessungen der aktiven Chipflache Dimensions of the active chip area LxB LxW 0.5 x 0.5 mm Abstand Chipoberflache bis Linsenscheitel Distance chip front to lens top H 4.0 ... 4.6 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr , tf 1 s Kennwerte (TA = 25 C) Characteristics 2007-04-04 2 LD 271, LD 271 H, LD 271 L, LD 271 LH Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Kapazitat, VR = 0 V, f = 1 MHz Capacitance Co 40 pF VF VF 1.30 ( 1.5) 1.90 ( 2.5) V V Sperrstrom, VR = 5 V Reverse current IR 0.01 ( 1) A Gesamtstrahlungsflu Total radiant flux IF = 100 mA, tp = 20 ms e 18 mW Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA TCI - 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 1.5 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC 0.3 nm/K Durchlaspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Gruppierung der Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2007-04-04 Symbol Symbol Ie Ie typ. 3 Wert Value LD 271 LD 271 L LD 271 H LD 271 LH 15 (> 10) 120 > 16 Einheit Unit mW/sr mW/sr LD 271, LD 271 H, LD 271 L, LD 271 LH e Radiant Intensity 100 mA = f (IF) e Relative Spectral emission Irel = f () Single pulse, tp = 20 s OHRD1938 100 e OHO00364 200 F mA e (100 mA) % rel OHR01038 10 2 Max. Permissible Forward Current IF = f (TA) 160 80 140 10 1 120 60 100 80 40 10 0 60 20 40 20 0 880 920 960 1000 nm 10 -1 10 -2 1060 Forward Current IF = f (VF), single pulse, tp = 20 s F F 10 0 A F 10 1 OHR00257 10 4 mA tp D= 5 typ. 10 0 Permissible Pulse Handling Capability IF = f (), TC = 25 C, duty cycle D = parameter OHR01041 10 1 A 10 -1 tp T max. 0.1 10 -1 5 -2 2 T D= 0.005 0.01 0.02 0.05 10 3 F 0.2 0.5 DC 10 1 1.5 2 2.5 3 3.5 10 4 V 4.5 VF 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 2 s tP Radiation Characteristics Irel = f () 40 30 20 10 0 OHR01879 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 2007-04-04 0.8 0.6 0.4 0 20 40 60 80 4 100 120 0 0 20 40 60 80 C 100 TA LD 271, LD 271 H, LD 271 L, LD 271 LH Mazeichnung Package Outlines 9.0 (0.354) 8.2 (0.323) 7.5 (0.295) 1.8 (0.071) 0.7 (0.028) o5.1 (0.201) Area not flat 1.3 (0.051) 1.0 (0.039) 1.0 (0.039) 2.54 (0.100) spacing 0.6 (0.024) 0.4 (0.016) 7.8 (0.307) Cathode 1.2 (0.047) 25.2 (0.992) 24.2 (0.953) 4.8 (0.189) 0.6 (0.024) 4.2 (0.165) 11.6 (0.457) 11.2 (0.441) 0.4 (0.016) Chip position LD 271 L / LD 271 LH GEXY6239 Cathode 29 (1.142) 27 (1.063) o4.8 (0.189) o5.1 (0.201) 0.6 (0.024) 0.4 (0.016) 1.2 (0.047) spacing 2.54 (0.100) 9.0 (0.354) 8.2 (0.323) 7.8 (0.307) 7.5 (0.295) 0.4 (0.016) 0.8 (0.031) 1.8 (0.071) Area not flat 4.8 (0.189) 4.2 (0.165) Chip position Mae in mm (inch) / Dimensions in mm (inch). Gehausefarbe: grau Brechungsindex Verguss: 1.53 Package Colour: grey Refractive index resin: 1.53 2007-04-04 5.9 (0.232) 5.5 (0.217) o4.8 (0.189) LD 271 / LD 271 H 5 5.9 (0.232) 5.5 (0.217) 0.6 (0.024) 0.4 (0.016) GEOY6645 LD 271, LD 271 H, LD 271 L, LD 271 LH Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 t Wellenloten (TTW) TTW Soldering 4.8 (0.189) Empfohlenes Lotpaddesign Recommended Solder Pad 4 (0.157) OHLPY985 Mae in mm (inch) / Dimensions in mm (inch). 2007-04-04 6 s 250 LD 271, LD 271 H, LD 271 L, LD 271 LH Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. All typical data and graphs are basing on sample base, but don't represent the production range. If required, e.g. because of technical improvements, the typ. data will be changed without any further notice. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-04-04 7