APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
1
7 pin DDPAK
PACKAGE STYLE CC
7 pin TO220 7 pin TO220
Staggered Leads PACKAGE STYLE CD
PACKAGE STYLE CX
TYPICAL APPLICATION
Ref: APPLICATION NOTES 8, 20, 26
FEATURES
• LOW COST
• WIDE BANDWIDTH - 1.1 Mhz
• HIGH OUTPUT CURRENT - 2.5A (Combined)
• WIDE COMMON MODE RANGE Includes negative supply
• WIDE SUPPLY VOLTAGE RANGE Single supply: 5V to 40V
Split supplies: ± 2.5V to ± 20V
• LOW QUIESCIENT CURRENT
• VERY LOW DISTORTION
APPLICATIONS
• HALF AND FULL BRIDGE MOTOR DRIVERS
• AUDIO POWER AMPLIFIER
• IDEAL FOR SINGLE SUPPLY SYSTEMS
5V Peripherals, 12V Automotive, 28V Avionic
PACKAGING OPTIONS
• 7 TO-220 Plastic Package (PA75CD)
• 7 TO-220 with Staggered Lead Form (PA75CX)
• 7 DDPAK Surface Mount Package (PA75CC)
DESCRIPTION
The amplifier design consists of dual power op amp on a single
monolithic die. Side B of the dual monolithic is configured as a
unity gain buffer to increase the current capability of the master
side A. The use of two PA75 amplifiers provides a cost-effective
solution to applications where multiple amplifiers are required or
a bridge configuration is needed. Very low harmonic distortion
of .02% THD and low IQ makes the PA75 a good solution for
power audio applications.
The PA75 is available in three standard package designs. The
surface mount version of the PA75, the PA75CC, is an industry
standard non-hermetic plastic 7-pin DDPAK. The through hole
version of the PA75, the PA75CD and PA75CX, are industry
standard non-hermetic plastic 7-pin TO-220 packages. The
PA75CX is staggered lead formed and offers standard 100
mil spacing. This allows for easier PC board layout. (Please
refer to the CX lead form package drawing for dimension of
the PA75CX).
The monolithic amplifier is directly attached to the metal tabs
of the PA75CC, PA75CD, and PA75CX. The metal tabs of the
packages are directly tied to -Vs.
EQUIVALENT SCHEMATIC ONE CHANNEL
Combining the power op amp (master channel A) and the
unity gain buffer (slave channel B) in a parallel connection
yields a single 2.5A amplifier. RI and RF can set up channel A
for the required gain for the overall circuit. Small values of RS
(sense resistors) are used on the outputs to improve current
sharing characteristics. The master amplifier can be configured
in inverting or non-inverting gain configurations.
EXTERNAL
CONNECTIONS
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
2
PARAMETER TEST CONDITIONS 2 MIN TYP MAX UNITS
INPUT
OFFSET VOLTAGE, initial 1 15 mV
OFFSET VOLTAGE, vs. temperature Full temperature range 20 µV/°C
BIAS CURRENT, initial 100 500 nA
COMMON MODE RANGE Full temperature range –VS +VS–1.3 V
COMMON MODE REJECTION, DC Full temperature range 60 90 dB
POWER SUPPLY REJECTION Full temperature range 60 90 dB
CHANNEL SEPARATION IOUT = 500mA, ƒ = 1kHz 50 68 dB
INPUT NOISE VOLTAGE RS = 100Ω, ƒ = 1 to 100kHz 22 nV/√Hz
GAIN
OPEN LOOP GAIN Full temperature range 89 100 dB
GAIN BANDWIDTH PRODUCT AV = 40dB 0.9 1.4 MHz
PHASE MARGIN Full temperature range, RL = 2KΩ, CL = 100pF 65 °
POWER BANDWIDTH VO(P-P) = 28V 13.6 kHz
OUTPUT
CURRENT, peak 1.5 A
SLEW RATE 1 1.4 V/µs
VOLTAGE SWING Full Temperature Range, IO = 100mA |VS| - 1.1 |VS| - .8 V
VOLTAGE SWING Full Temperature Range, IO = 1A |VS| - 1.8 |VS| - 1.4 V
HARMONIC DISTORTION AV = 1, R2 = 50Ω, VO = .5VRMS, ƒ = 1kHz .02 %
POWER SUPPLY
VOLTAGE, VSS3 5 30 40 V
CURRENT, quiescent, total 8 10 mA
THERMAL
RESISTANCE,DC junction to case (single) 5.84 6.42 °C/W
RESISTANCE,AC junction to case (single) 4.38 4.81 °C/W
RESISTANCE,DC junction to case (both) 3.97 4.36 °C/W
RESISTANCE,AC junction to case (both) 2.98 3.27 °C/W
RESISTANCE,junction to air (CD,CX) 60 °C/W
RESISTANCE,junction to air (CC)4 27 °C/W
TEMPERATURE RANGE,case Meets full range specifications –25 85 °C
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PA75
SPECIFICATIONS
SUPPLY VOLTAGE, total 5V to 40V
OUTPUT CURRENT SOA
POWER DISSIPATION, internal, (per amplifier) 19.5W
POWER DISSIPATION, internal (both amplifiers) 28.6W
INPUT VOLTAGE, differential ±VS
INPUT VOLTAGE, common mode +VS, -VS–0.5V
JUNCTION TEMPERATURE, max1 150°C
TEMPERATURE, pin solder—10 sec max 220°C
TEMPERATURE RANGE, storage –55°C to 150°C
OPERATING TEMPERATURE RANGE, case –40°C to 125°C
NOTES: 1. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation to
achieve high MTTF.
2. Unless otherwise noted, the following conditions apply: ±VS = ±15V, TC = 25°C.
3. +VS and –VS denote the positive and negative supply rail respectively. VSS denotes the total rail-to-rail supply voltage.
4. Heat tab attached to 3/32" FR-4 board with 2oz. copper. Topside copper area (heat tab directly attached) = 1000 sq. mm, back-
side copper area = 2500 sq. mm, board area = 2500 sq. mm.
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
3
TYPICAL PERFORMANCE
GRAPHS PA75
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
4
OPERATING
CONSIDERATIONS
PA75
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
PA75U REV B OCTOBER 2004 © 2004 Apex Microtechnology Corp.
GENERAL
Please read Application Note 1 “General Operating Consider-
ations” which covers stability, supplies, heatsinking, mounting,
SOA interpretation, and specification interpretation. Visit www.
apexmicrotech.com for design tools that help automate tasks
such as calculations for stability, internal power dissipation,
heatsink selection; Apex’s complete Application Notes library;
Technical Seminar Workbook; and Evaluation Kits.
STABILITY CONSIDERATIONS
All monolithic power op amps use output stage topologies
that present special stability problems. This is primarily due to
non-complementary (both devices are NPN) output stages with
a mismatch in gain and phase response for different polarities
of output current. It is difficult for the op amp manufacturer to
optimize compensation for all operating conditions.
SAFE OPERATING AREA (SOA)
The SOA curves combine the effect of all limits for this power
op amp. For a given application, the direction and magnitude
of the output current should be calculated or measured and
checked against the SOA curves. This is simple for resistive
loads but more complex for reactive and EMF generating
loads.
THERMAL CONSIDERATIONS
The PA75CD and CX have a large exposed copper heat
tab to which the monolithic is directly attached. The PA75CD
and CX may require a thermal washer, which is electrically
insulating since the tab is directly tied to -VS. This can result
in a thermal impedance RCS of up to 1˚C/W or greater.
The PA75CC has a large exposed integrated copper heatslug
to which the monolithic is directly attached. The solder connec-
tion of the heatslug to a minimum of 1 square inch foil area of
the printed circuit board will result in thermal performance of
25°C/W junction to air rating of the PA75CC. Solder connec-
tion to an area of 1 to 2 square inches of foil is required for
minimal power applications
Where the PA75CC is used in higher power applications,
it is necessary to use surface mount techniques of heatsink-
ing. Surface mount techniques include the use of a surface
mount fan in combination with a surface mount heatsink on
the backside of the FR4/ PC board with through hole thermal
vias. Other highly thermal conductive substrate board materials
are available for maximum heat sinking.
MOUNTING PRECAUTIONS
1. Always use a heat sink. Even unloaded the PA75 can dis-
sipate up to .4 watts.
2. Avoid bending the leads. Such action can lead to internal
damage.
3. Always fasten the tab of the CD and CX package to the heat
sink before the leads are soldered to fixed terminals.
4. Strain relief must be provided if there is any probability of
axial stress to the leads.
