TLP2405 Photocouplers GaAAs Infrared LED & Photo IC TLP2405 1. Applications * High-Speed Digital Interfacing for Instrumentation and Control Devices * Communications Equipment * Intelligent Power Module Signal Isolation 2. General The Toshiba TLP2405 consists of a GaAAs light-emitting diode coupled with a high-gain, high-speed photo detector. It is housed in the 8-pin SO8 package. The detector has a totem-pole output stage with current sourcing and sinking capabilities. The TLP2405 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 15 kV/s. The TLP2405 a logic buffer output. An inverter output version, the TLP2408, is also available. 3. Features (1) Buffer logic type (totem pole output) (2) Package: SO8 (3) Supply voltage: 4.5 to 20 V (4) Threshold input voltage, low to high: IFLH = 1.6 mA (max) (5) Propagation delay time: tpHL/tpLH = 250 ns (max) (6) Common-mode transient immunity: 15 kV/s (min) (7) Operating temperature: -40 to 100 (8) Isolation voltage: 3750 Vrms (min) (9) Safety standard UL-approved: UL1577 File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349 Note: VDE-approved: Option (V4) EN60747-5-2 (Note) When an EN60747-5-2 approved type is needed, please designate the Option (V4) (V4). 4. Packaging and Pin Configuration 1: NC 2: Anode 3: Cathode 4: NC 5: GND 6: NC 7: VO (output) 8: VCC SO8 1 2010-08-12 Rev.1.0 TLP2405 5. Internal Circuit (Note) Fig. 5.1 Internal Circuit Note: A 0.1-F bypass capacitor must be connected between pin 8 and pin 5. 6. Principle of Operation 6.1. Truth Table Input LED Output H ON H L OFF L 6.2. Mechanical Parameters Characteristics Min Unit Creepage distances 4.0 mm Clearance 4.0 Internal isolation thickness 2 2010-08-12 Rev.1.0 TLP2405 7. Absolute Maximum Ratings (Note) Unless otherwise specified, Ta = 25 Characteristics LED Symbol Note Rating Unit Forward current (Ta 85) IF 25 mA Forward current derating (Ta 85) IF/ -0.67 mA/ VR 5 V Reverse voltage Power dissipation PD 40 mW (Ta 85) PD/ -1.0 mW/ Detector Output current (Ta 25) IO 25/-15 mA Output current (Ta = 100) IO 5/-5 Output voltage VO -0.5 to 20 Supply voltage VCC -0.5 to 20 Topr -40 to 100 Tstg -55 to 125 Power dissipation derating Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage (10 s) Tsol AC, 1 min, R.H. 60% BVS V 260 (Note 1) 3750 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit Input on-state current IF(ON) 2 10 mA Input off-state voltage VF(OFF) 0 0.8 V 4.5 20 -40 100 Supply voltage VCC Operating temperature Topr (Note 1) Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. Note: A ceramic capacitor (0.1 F) should be connected between pin 8 and pin 5 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: Denotes the operating range, not the recommended operating condition. 3 2010-08-12 Rev.1.0 TLP2405 9. Electrical Characteristics (Note) Unless otherwise specified, Ta = -40 to 100, VCC = 4.5 to 20 V Characteristics Symbol Note Test Circuit Test Condition Min Typ. Max Unit 1.40 1.57 1.80 V -1.8 mV/ VF IF = 10 mA, Ta = 25 VF/Ta IF = 10 mA Input reverse current IR VR = 5 V, Ta = 25 10 A Input capacitance CT V = 0 V, f = 1 MHz 60 pF Low-level output voltage VOL Fig. 12.1.1 IO = 3.5 mA, VF = 0.8 V 0.2 0.6 V High-level output voltage VOH Fig. 12.1.2 VCC = 4.5 V, IO = -2.6 mA, IF = 5 mA 2.7 3.5 VCC = 20 V, IO = -2.6 mA, IF = 5 mA 17.4 19 Input forward voltage Input temperature coefficient of forward voltage Low-level supply current High-level supply current (Note 2) ICCL ICCH Fig. 12.1.3 VCC = 5.5 V, VF = 0 V 3.0 VCC = 20 V, VF = 0 V 3.0 Fig. 12.1.4 VCC = 5.5 V, IF = 5 mA 3.0 VCC = 20 V, IF = 5 mA 3.0 80 Low-level short-circuit output current IOSL (Note 1) Fig. 12.1.5 VCC = VO = 5.5 V, VF = 0 V 15 VCC = VO = 20 V, VF = 0 V 20 90 High-level short-circuit output current IOSH (Note 1) Fig. 12.1.6 VCC = 5.5 V, IF = 5 mA, VO = GND -5 -15 VCC = 20 V, IF = 5 mA, VO = GND -10 -20 mA Threshold input current, low to high IFLH IO = -2.6 mA, VO > 2.4 V 0.4 1.6 Threshold input voltage, high to low VFHL IO = 3.5 mA, VO < 0.6 V 0.8 V Input current hysteresis IHYS VCC = 5 V 0.05 mA Min Typ. Max Unit 1.0 pF 1x1012 1014 Vrms Note: All typical values are at Ta = 25. Note 1: Duration of output short circuit time should not exceed 10 ms. Note 2: VOH = VCC - VO (V) 10. Isolation Characteristics Unless otherwise specified, Ta = 25 Characteristics Symbol Capacitance (input to output) CS Isolation resistance RS Isolation voltage BVS Note Test Conditions (Note 1) VS = 0 V, f = 1 MHz VS = 500 V, R.H. 60% 3750 AC, 1 s in oil 10000 DC, 1 min in oil 10000 AC, 1 min VDC Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 4 2010-08-12 Rev.1.0 TLP2405 11. Switching Characteristics (Note) Unless otherwise specified, Ta = -40 to 100, VCC = 4.5 to 20 V Characteristics Symbol Propagation delay time to logic high output tpLH Propagation delay time to logic low output tpHL Pulse width distortion Note Test Circuit Fig. 12.1.7, Fig. 12.1.8 |tpLH - tpHL| Test Condition Min Typ. Max Unit IF = 0 3 mA 30 90 250 ns IF = 3 0 mA 30 120 250 220 Rise time tr IF = 0 3 mA, VCC = 5 V 30 75 Fall time tf IF = 3 0 mA, VCC = 5 V 30 75 VCM = 1000 Vp-p, IF = 5 mA, VCC = 20 V, Ta = 25 -15 VCM = 1000 Vp-p, IF = 0 mA, VCC = 20 V, Ta = 25 15 Common-mode transient immunity at output high CMH Common-mode transient immunity at output low CML Note: Fig. 12.1.9 kV/s All typical values are at Ta = 25. 5 2010-08-12 Rev.1.0 TLP2405 12. Test Circuits and Characteristics Curves 12.1. Test Circuits Fig. 12.1.1 VOL Test Circuit Fig. 12.1.2 VOH Test Circuit Fig. 12.1.3 ICCL Test Circuit Fig. 12.1.4 ICCH Test Circuit Fig. 12.1.5 IOSL Test Circuit Fig. 12.1.6 IOSH Test Circuit 6 2010-08-12 Rev.1.0 TLP2405 Fig. 12.1.7 Switching Time Test Circuit Fig. 12.1.8 Switching Time Test Circuit Fig. 12.1.9 Common-Mode Transient Immunity Test Circuit 7 2010-08-12 Rev.1.0 TLP2405 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow (See Fig. 13.1.1 and 13.1.2) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 13.1.1 An example of a temperature profile when Sn-Pb eutectic solder is used * Fig. 13.1.2 An example of a temperature profile when lead(Pb)-free solder is used When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 8 2010-08-12 Rev.1.0 TLP2405 14. Land pattern dimensions for reference only Fig. 14.1 Land pattern dimensions for reference only 15. Marking Fig. 15.1 Marking 9 2010-08-12 Rev.1.0 TLP2405 16. EN60747-5-2 Option (V4) Specification * Part number: TLP2405(F) (Note) * The following part naming conventions are used for the devices that have been qualified according to option (V4) of EN60747. Example: TLP2405(V4-TPL,F) V4: EN60747 option TPL: tape and reel type F:[[G]]/RoHS COMPATIBLE (Note 1) Note: Use TOSHIBA standard type number for safety standard application. e.g., TLP2405(V4-TPL,F) TLP2405 Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. Fig. 16.1 EN60747 Insulation Characteristics 10 2010-08-12 Rev.1.0 TLP2405 Fig. 16.2 Insulation Related Specification (Note) Note: Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centres of 3.5mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 16.3 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747. 11 2010-08-12 Rev.1.0 TLP2405 Fig. 16.4 Test Results 12 2010-08-12 Rev.1.0 TLP2405 Package Dimensions Unit: mm Weight: 0.11 g (typ.) Package Name(s) TOSHIBA: 11-5K1S Nickname: SO8 13 2010-08-12 Rev.1.0 TLP2405 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 14 2010-08-12 Rev.1.0