TelegesisTM TG-PM-0511-ETRX358x-LRS r7 ETRX358x-LRS and ETRX358xHR-LRS Product Manual m en de d fo r N ew D ETRX358x-LRS ZIGBEE (R) MODULES es ig n TelegesisTM is a trademark of Silicon Laboratories Inc. N ot R ec om PRODUCT MANUAL (c)2016 Silicon Labs ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS Table of Contents 1 INTRODUCTION ................................................................................................................. 5 Hardware Description ....................................................................................................... 5 PRODUCT APPROVALS ................................................................................................... 7 FCC Approvals ................................................................................................................. 7 FCC Labelling Requirements ........................................................................................... 8 IC (Industry Canada) Approvals ....................................................................................... 8 IC Labelling Requirements ............................................................................................... 9 European Certification .................................................................................................... 10 Declarations of Conformity ............................................................................................. 10 IEEE 802.15.4 ................................................................................................................ 10 The ZigBee Protocol ...................................................................................................... 11 D 2.1 2.1.1 2.2 2.2.1 2.3 2.4 2.5 2.6 N ew 2 es ig n 1.1 3 MODULE PINOUT ............................................................................................................ 12 4 HARDWARE DESCRIPTION ............................................................................................ 14 5.1 5.2 5.3 6 6.1 6.2 fo r 5 Hardware Interface......................................................................................................... 14 FIRMWARE DESCRIPTION ............................................................................................. 15 Token Settings ............................................................................................................... 16 Custom Firmware ........................................................................................................... 16 Boost Mode vs. Normal Mode ........................................................................................ 16 m en de d 4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................... 17 Environmental Characteristics ........................................................................................ 17 Recommended Operating Conditions............................................................................. 17 DC ELECTRICAL CHARACTERISTICS ........................................................................... 18 8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 20 9 A/D CONVERTER CHARACTERISTICS .......................................................................... 21 10 AC ELECTRICAL CHARACTERISTICS ........................................................................... 21 PHYSICAL DIMENSIONS................................................................................................. 26 ot R 11 TX Power Characteristics ............................................................................................... 23 Power Settings for Regulatory Compliance .................................................................... 24 Temperature behaviour .................................................................................................. 25 ec 10.1 10.2 10.3 om 7 RECOMMENDED REFLOW PROFILE ............................................................................. 27 13 PRODUCT LABEL DRAWING ......................................................................................... 28 N 12 14 14.1 14.2 RECOMMENDED FOOTPRINT ........................................................................................ 29 Recommended Placement ............................................................................................. 31 Example carrier board .................................................................................................... 33 15 RELIABILITY TESTS ........................................................................................................ 34 16 APPLICATION NOTES ..................................................................................................... 34 (c)2016 Silicon Labs -2- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 17 17.1 17.2 17.3 17.4 Safety Precautions ......................................................................................................... 34 Design Engineering Notes.............................................................................................. 34 Storage Conditions......................................................................................................... 35 PACKAGING .................................................................................................................... 36 Embossed Tape ............................................................................................................. 36 Component Orientation .................................................................................................. 37 Reel Dimensions ............................................................................................................ 37 Packaging ...................................................................................................................... 38 es ig n 16.1 16.2 16.3 ORDERING INFORMATION ............................................................................................. 39 19 ROHS DECLARATION ..................................................................................................... 40 20 DATA SHEET STATUS .................................................................................................... 40 21 LIFE SUPPORT POLICY .................................................................................................. 40 22 RELATED DOCUMENTS ................................................................................................. 40 N ot R ec om m en de d fo r N ew D 18 (c)2016 Silicon Labs -3- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS The Telegesis ETRX358x-LRS and ETRX358xHR-LRS modules are low power 2.4GHz ZigBee modules with an added frontend module (SiGe SE2432L) containing both PA and LNA for highest possible link budget. es ig n Based on the latest Ember EM358x family of single chip ZigBee solutions the new long range modules are footprint compatible with the entire Telegesis ETRX3 family, thus representing a drop-in replacement for all applications where a high link budget is required. D For custom application development the ETRX358x series integrates with ease into Ember's InSight development environment. Module Features * * * * * * * * * ZigBee Smart Energy applications Wireless Alarms and Security Home/Building Automation Wireless Sensor Networks M2M Industrial Controls Lighting and ventilation control Remote monitoring Environmental monitoring and control fo r * * * * * * * * Development Kit * * Enhancement kit available to upgrade existing Telegesis and Ember development kits to be used with the new ETRX358x family Custom software development available upon request. ot R ec * * Suggested Applications m en de d * * Small form factor, SMT module 25mm x 19mm Same footprint and pin-out as ETRX357-LRS Side Castellations for easy soldering and inspection Two antenna options: Integrated chip antenna or U.FL coaxial connector Based on 32-bit ARM(R) Cortex-M3 Industry standard JTAG Programming and real time network level debugging via the Ember Debug Port Up to 512kB of flash and 64kbytes of RAM Lowest Deep Sleep Current of sub 1A with retained RAM and GPIO and multiple sleep modes Ultra Wide supply voltage range (2.1 to 3.6V) Optional 32.768kHz watch crystal can be added externally Can act as an End Device, Router or Coordinator 22 general-purpose I/O lines including analogue inputs Firmware upgrades via serial port or over the air (password protected) Hardware supported encryption (AES-128) CE and FCC and IC compliance, IC and FCC modular approval Operating temperature range: -40C to +85C Standard version without LNA and PA available in the same form factor om * * * * N ew Image not shown actual size; enlarged to show detail. Radio Features N * Based on the Silicon Labs EM358x family of single chip ZigBee(R) SoCs * 2.4GHz ISM Band * 250kbit/s over the air data rate - NB: actual usable data throughput with ZigBee is about 20kbps * 15 channels (IEEE802.15.4 Channel 11 to 25) * SiGe SE2432L integrated PA and LNA * +20dBm output power (adjustable down to -41dBm) * High sensitivity of -106dBm typ. @ 1% packet error rate * RX Current: 33mA, TX Current: approx 140mA at 20dBm (c)2016 Silicon Labs -4- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 1 Introduction es ig n This document describes the Telegesis ETRX358x-LRS and ETRX358xHR-LRS ZigBee long range modules which have been designed to be easily integrated into another device and to provide a fast, simple and low cost wireless mesh networking interface. The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform consisting of the single chip family of EM358x SoCs combined with the ZigBee PRO compliant EmberZNet meshing stack. D The ETRX358x-LRS and ETRX358xHR-LRS modules represent an ideal platform for custom firmware development in conjunction with the Silicon Labs ZigBee development kits. 1.1 N ew No RF experience or expertise is required to add this powerful wireless networking capability to your products. The ETRX358x-LRS and ETRX358xHR-LRS offer fast integration opportunities and the shortest possible time to market for your product. Hardware Description m en de d fo r The main building blocks of the ETRX358x-LRS and ETRX358xHR-LRS are the single chip EM358x SoC from Silicon Labs, a SiGe SE2432L frontend module combining a Power Amplifier with a Low Noise Amplifier, a 24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The modules are available with on-board antenna or alternatively a U.FL connector for attaching external antennae. Modules with the U.FL connector are identified by the "HR" suffix. The integrated antenna is an Antenova Rufa, and details of the radiation pattern and further data are available from the Antenova website [5]. Chip EM3581 EM3581 EM3582 EM3582 EM3585 EM3585 EM3586 EM3586 EM3587 EM3587 EM3588 EM3588 ot R ec om Module ETRX3581-LRS 1 ETRX3581HR-LRS 1 ETRX3582-LRS 1 ETRX3582HR-LRS 1 ETRX3585-LRS 1 ETRX3585HR-LRS 1 ETRX3586-LRS 1 ETRX3586HR-LRS 1 ETRX3587-LRS ETRX3587HR-LRS ETRX3588-LRS 1 ETRX3588HR1 Flash 256kB 256kB 256kB 256kB 512kB 512kB 512kB 512kB 512kB 512kB 512kB 512kB RAM 32kB 32kB 32kB 32kB 32kB 32kB 32kB 32kB 64kB 64kB 64kB 64kB Antenna Chip External Chip External Chip External Chip External Chip External Chip External USB No No Yes Yes No No Yes Yes No No Yes Yes Table 1: Memories N The LNA and RF power amplifier of the LRS devices improve the output power by 12dB and the sensitivity by 5dB which will increase the range by approximately 700% relative to the standard devices (where local regulations permit the use of the maximum output power). 1 MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR (c)2016 Silicon Labs -5- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS N ot R ec om m en de d fo r N ew D es ig n The ETRX358x and ETRX358xHR are used for ZigBee (www.zigbee.org) applications. In case it is desired to develop custom firmware, the Silicon Labs toolchain, consisting of Ember Desktop together with a comprehensive integrated development environment (IDE), is required. (c)2016 Silicon Labs -6- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 2 Product Approvals 2.1 es ig n The ETRX358x-LRS and ETRX358xHR-LRS have been designed to meet all national regulations for world-wide use. In particular the following certifications have been obtained: FCC Approvals D The Telegesis ETRX358x-LRS family integrated Antenna as well as the ETRX358xHR-LRS family including the antennas listed in and the power levels listed in section 10.2 have been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter. FCC statement: N ew This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. fo r FCC ID: S4GEM358L m en de d This module complies with the USA SAR requirements and is not intended to be operated within 20cm of the body. The following statement must be included as a CAUTION statement in manuals for OEM products to alert users on FCC RF exposure compliance. "WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operations at closer distances than this are not recommended." 2 3 ot R 4 Manufacturer om 1 Part No. BT-Stubby (straight) BT-Stubby (right-angle) CJ-2400-6603 Rufa (on board) ec Item Type EAD Ltd. [6] 1/4 Wave EAD Ltd. [6] 1/4 Wave Chang Jia 1/2 Wave Antenova Chip Impedance Gain 50 0dBi 50 50 50 0dBi 2.0dBi 2.1dBi (peak) Table 2. Approved Antennae N An end user deploying an ETRX358x-LRS or an ETRX358xHR-LRS module together with an antenna as listed in Table 2 is not required to obtain a new authorization for the module - BUT this does not preclude the possibility that some other form of authorization or testing may be required for the end product depending upon local territorial regulations. The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the equipment. When using the ETRX358x-LRS with approved antennae, it is required to prevent endusers from replacing them with non-approved ones. (c)2016 Silicon Labs -7- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 2.1.1 FCC Labelling Requirements IC (Industry Canada) Approvals D 2.2 es ig n When integrating the ETRX358x-LRS or ETRX358xHR-LRS families into a product it must be ensured that the FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM358L) as well as the notice above. This exterior label can use wording such as "Contains Transmitter Module FCC ID: S4GEM358L" or "Contains FCC ID: S4GEM358L" although any similar wording that expresses the same meaning may be used. N ew The Telegesis ETRX358x-LRS family with integrated Antenna as well as the ETRX358xHR-LRS family have been approved by Industry Canada to operate with the antenna types listed in Table 2 with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. fo r IC-ID: 8735A-EM358L m en de d * This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. * Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. om * To comply with Industry Canada RF radiation exposure limits for general population, the antenna(s) used for this transmitter must be installed such that a minimum separation distance of 20cm is maintained between the radiator (antenna) and all persons at all times ot R ec * This device has been designed to operate with the antennas listed in Table 2, and having a maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. N French Statements * Conformement a la reglementation d'Industrie Canada, le present emetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inferieur) approuve pour l'emetteur par Industrie Canada. Dans le but de reduire les risques de brouillage radioelectrique a l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnee equivalente (p.i.r.e.) ne depasse pas l'intensite necessaire a l'etablissement d'une communication satisfaisante. * Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout (c)2016 Silicon Labs -8- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. es ig n OEM Responsibilities The ETRX358x-LRS and ETRX358x-LRS families of module have been certified for integration into products only by OEM integrators under the following conditions: D 1. The antenna(s) must be installed such that a minimum separation distance of 0.75cm is maintained between the radiator (antenna) and all persons at all times. 2. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. N ew As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 2.2.1 m en de d fo r IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co-location with another transmitter), then Industry Canada certification is no longer considered valid and the IC Certification Number can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Industry Canada authorization. IC Labelling Requirements om The ETRX358x-LRS and ETRX358xHR-LRS family modules are labelled with its own IC Certification Number. If the IC Certification Number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labelled in a visible area with the following: ec "Contains Transmitter Module IC: 8735A-EM358L" or "Contains IC: 8735A-EM358L" ot R The OEM of the ETRX358x-LRS and ETRX358xHR-LRS family modules must only use the approved antenna(s) listed above, which have been certified with this module. N The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user's manual of the end product. (c)2016 Silicon Labs -9- ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 2.3 European Certification * Radio: EN 300 328:V1.9.1 * Safety: EN 60950-1:2006 / A12:2011 es ig n The ETRX358x and ETRX358xHR families are with the maximum power settings defined in section 10.2 of this document compliant to the following standards: All tests have been conducted with the antennae listed in Table 2. N ew D If the ETRX358x-LRS and ETRX358xHR-LRS families of modules are incorporated into an OEM product, the OEM product manufacturer must ensure compliance of the final product to the European Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in the R&TTE Directive. The final product must not exceed the specified power ratings, antenna specifications and installation requirements as specified in this user manual. If any of these specifications are exceeded in the final product then a submission must be made to a notified body for compliance testing to all of the required standards. 2.4 m en de d fo r The `CE' marking must be applied to a visible location on any OEM product. For more information please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Declarations of Conformity IEEE 802.15.4 ec 2.5 om Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee RF Modules, which cover Radio Emissions and Safety. These documents will be available from our website or on request N ot R IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol. (c)2016 Silicon Labs - 10 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 2.6 The ZigBee Protocol es ig n The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices over short to medium distances. The specification was originally ratified in December 2004, paving the way for companies to start making low-power networks a reality. D ZigBee uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional layers for networking, security and applications. What makes the specification unique is its use of a mesh network architecture which, in bucket chain style, passes data from one node to the next until it lands at its destination. The network is self-healing and adapts its routing as link quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers, but can therefore be put into a low-power sleep state. fo r Truly self-healing mesh networking Messages can now travel up to 30 hops Source-Routing for improved point to multipoint message transmission Improved security including Trust-Centre link keys New message types and options N ot R ec om m en de d * * * * * N ew The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006, adding new features and improvements to the only global wireless communication standard enabling the development of easily deployable low-cost, low-power, monitoring and control products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced the PRO feature-set which offers advantages over earlier feature-sets, including (c)2016 Silicon Labs - 11 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS fo r N ew D es ig n 3 Module Pinout Figure 1. ETRX3 series Module Pinout (top view) m en de d The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series modules to the application board. For more information on the alternate functions please refer to [2]. All GND pads are connected within the module, but for best RF performance all of them should be grounded externally. Name Default Use om ETRX358x pad Alternate function EM35x pin GND GND 2 PC5 {1} I/O 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PC6 PC7 PA7 {4} PB3 {2} nReset {5} PB4 {2} PA0 PA1 PA2 PA3 GND PA4 PA5 {3} PA6 {4} I/O I/O I/O I/O nReset I/O I/O I/O I/O I/O GND I/O I/O I/O 17 PB1 TXD 30 18 PB2 RXD 31 19 GND GND GND N ot R ec 1 (c)2016 Silicon Labs Alternate functions GND TX_ACTIVE CTS RTS 11 13 14 18 19 12 20 21 22 24 25 GND 26 27 29 - 12 - TX_ACTIVE. PC5 of the EM35x is used to control the FEM OSC32B, nTX_ACTIVE OSC32A, OSC32_EXT TIM1C4 SC1nCTS, SC1SCLK, TIM2C3 TIM2C4, SC1nRTS, SC1nSSEL TIM2C1, SC2MOSI,USBDM{6} TIM2C3, SC2SDA, SC2MISO,USBDP{6} TIM2C4, SC2SCL, SC2SCLK SC2nSSEL, TIM2C2 ADC4, PTI_EN, TRACEDATA2 ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3 TIM1C3 SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1 SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2 ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS Default Use GND JTCK PC2 PC3 PC4 N/C{1} PC1 PC0 {4} PB7 {4} PB6 {4} PB5 GND Vcc GND GND JTCK I/O I/O I/O N/C I/O I/O I/O I/O I/O GND Vcc GND Alternate function ADC3 ADC2 ADC1 ADC0 EM35x pin GND 32 33 34 35 36 38 40 41 42 43 GND Vcc GND Alternate functions SWCLK JTDO, SWO, TRACEDATA0 JTDI, TRACECLK JTMS, SWDIO PB0 of the EM35x is used to control the FEM ADC3, TRACEDATA3 JRST, IRQD, TRACEDATA1 ADC2, IRQC, TIM1C2 ADC1, IRQB, TIM1C1 ADC0, TIM2CLK, TIM1MSK es ig n 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Name D ETRX358x pad N ew Table 3. Pin Information Notes: fo r {1} When the alternate GPIO function is selected, TX_ACTIVE becomes an output that indicates that the EM35x radio transceiver is in transmit mode. PC5 must not be used in this mode as it is needed internally as TX_ACTIVE to control the external RF front end and power amplifier. PB0 is not available to the user. {2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively. The device sends its data on TXD and receives on RXD. m en de d {3} If PA5 is driven low at power-up or reset the module will boot up in the bootloader {4} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8) {5} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is low. This signal has a 30k Pull-Up. om {6} ETRX3588, ETRX3586, ETRX3582 and ETRX3588HR, ETRX3586HR, ETRX3582HR variants only ec Important Note: The ETRX358x series and the ETRX358x-LRS series of modules are footprint compatible, but on the ETRX358x-LRS series pins PB0 and PC5 of the EM358x are used internally to control the front-end module and are not available to the user. PC5 is still available on Pad2, but it is configured as TX_ACTIVE signal and cannot be used as a general purpose GPIO. N ot R See also the table "Module pads and functions" in the ETRX357 Development Kit Product Manual. Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin names. (c)2016 Silicon Labs - 13 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 4 Hardware Description I/O LDO 1V8 1,8Vdc integrated antenna A/D UART LDO 1V25 EM358x USB* Match RESET Match 5 24MHz RESET JTAG programming *not available on all Types fo r rf U.FL socket terminal selection, filtering and matching circuitry I/O N ew FEM es ig n Vcc D Vreg Figure 2. Hardware Diagram m en de d The ETRX358x-LRS and ETRX358x-LRS are based on the Silicon Labs EM358x family of ZigBee SoCs in addition to a frontend module containing a PA, LNA and RF switch in addition to the RFfrontend circuitry. The EM358x family of ZigBee SoCs are fully integrated 2.4GHz ZigBee transceivers with a 32-bit ARM(R) Cortex M3TM microprocessor, flash and RAM memory, and peripherals. The industry standard serial wire and JTAG programming and debugging interfaces together with the standard ARM system debug components help to streamline any custom software development. om In addition to this a number of MAC functions are also implemented in hardware to help maintain the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards. ec The new advanced power management features allow faster wakeup from sleep and new powerdown modes allow this 3rd generation module to offer a longer battery life than any 2nd generation modules on the market. N ot R The EM358x has fully integrated voltage regulators for both required 1.8V and 1.25V supply voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be connected externally to pads 3 and 4 in case more accurate timing is required. 4.1 Hardware Interface All GPIO pins of the EM358x chips are accessible on the module's pads. Whether signals are used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware. When developing custom firmware please refer to the EM358x datasheet [2]. (c)2016 Silicon Labs - 14 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 5 Firmware Description By default, the modules will be pre-loaded with a standalone bootloader which supports over-theair bootloading as well as serial bootloading of new firmware. es ig n In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure not to pull this pin down during boot-up unless the resistance to ground is >10k. (A pull-up is not required). Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. D A router is typically a mains powered device whilst a sleepy end device (SED) can be battery powered. N ot R ec om m en de d fo r N ew The module is also able to act as a coordinator and Trust Centre through external host control. (c)2016 Silicon Labs - 15 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 5.1 Token Settings D TG Default <not written> <not written> <not written> TELEGESIS <Order Code> 0x1010 0xFFFD <not written> <not written> <not written> <not written> <not written> <not written> <not written> <not written> 0xFEBF <not written> fo r N ew Description Option Bytes Optional Version Number Custom EUI Device Specific String Hardware Identifier Manufacturer ID Default Power Settings Bootloader Key EZSP related SE Security SE Installation Crystal Bias Frequency offset Crystal Stabilizing Time Security Settings CCA Threshold Secure Bootloader Key m en de d Token MFG_CIB_OBS MFG_CUSTOM_VERSION MFG_CUSTOM_EUI_64 MFG_STRING MFG_BOARD_NAME MFG_MANUF_ID MFG_PHY_CONFIG MFG_BOOTLOAD_AES_KEY MFG_EZSP_STORAGE MFG_CBKE_DATA MFG_INSTALLATION_CODE MFG_OSC24M_BIAS_TRIM MFG_SYNTH_FREQ_OFFSET MFG_OSC24M_SETTLE_DELAY MFG_SECURITY_CONFIG MFG_CCA_THRESHOLD MFG_SECURE_BOOTLOADER_KEY es ig n The ETRX358x-LRS Series Modules' manufacturing tokens will be pre-programmed with the settings shown in the table below. Table 4. Manufacturing tokens 5.2 Custom Firmware om The ETRX358x-LRS series of modules is an ideal platform for developing custom firmware. In order to develop custom firmware the Silicon Labs Ember toolchain is required. Boost Mode vs. Normal Mode ot R 5.3 ec When writing firmware for the ETRX358x-LRS it is important to ensure that pins PB0 and PC5 are correctly configured in order that the RF front-end module can operate correctly. An application note "Writing customised firmware for the ETRX35x-LRS" can be downloaded from the Telegesis website. N The Ember EM358x chips support a "boost mode" power setting next to the "normal mode" power setting. The "boost mode" setting increases the sensitivity and output power of the radio transceiver, however with the LRS variants enabling boost mode has no positive effect on neither the output power nor the sensitivity and therefore it is recommended to not use boost mode on this platform. Section 10.2 lists the requirements for the maximum power settings for use of the LRS family in different countries. (c)2016 Silicon Labs - 16 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 6 Absolute Maximum Ratings Item Symbol Absolute Maximum Ratings Unit 1 2 Supply voltage Voltage on any Pad Voltage on any Pad pin (PA4, PA5, PB5, PB6, PB7, PC1), when used as an input to the general purpose ADC with the low voltage range selected Module storage temperature range Reel storage temperature range Operating temperature range Input RF level Reflow temperature V CC V in -0.3 to +3.6 -0.3 to V CC +0.3 Vdc Vdc V in -0.3 to +2.0 T stg T strgreel T op P max T Death -40 to +105 0 to 75 -40 to +85 +6 Please refer to chapter 12 C C C dBm C N ew 4 5 6 7 8 Vdc D 3 es ig n No. Table 5: Absolute Maximum Ratings The absolute maximum ratings given above should under no circumstances be violated. Exceeding one or more of the limiting values may cause permanent damage to the device. 1 2 3 4 ESD on any pad according to Human Body Model (HBM) circuit description ESD on non-RF pads according to Charged Device Model (CDM) circuit description ESD on RF terminal (HBM) Moisture Sensitivity Level N No. 1 2 3 4 Symbol Absolute Maximum Ratings Unit V THHBM 2 kV V THCDM 400 V V THCDM MSL 1000 MSL3, per J-STD-033 V Table 6: Absolute Maximum Ratings Recommended Operating Conditions ot R 6.2 Item om No. Environmental Characteristics ec 6.1 m en de d fo r Caution! ESD sensitive device. Precautions should be used when handling the device in order to prevent permanent damage. Item Condition / Remark Symbol Value Min Supply voltage RF Input Frequency RF Input Power Operating temperature range V CC fC p IN 2.1 2405 T op -40 Typ 3.0 Unit Max 3.6 2480 0 Vdc MHz dBm +85 C Table 7. Recommended Operating Conditions (c)2016 Silicon Labs - 17 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 7 DC Electrical Characteristics V CC = 3.0V, T AMB = 25C, NORMAL MODE (non-Boost) unless otherwise stated Symbol Value Min Serial controller current om 12 General purpose timer current General purpose ADC 14 current 15 USB Active Current USB Suspend Mode 16 Current RX Current LNA,Radio receiver MAC 17 and Baseband Receive current 18 consumption Receive current 19 consumption N ot R ec 13 V CC (c)2016 Silicon Labs Typ 2.1 1.0 4kB RAM retained I SLEEP 1.25 4kB RAM retained I SLEEP 1.6 4kB RAM retained I SLEEP 25C, 12MHz Core clock 25C, 24MHz Core clock A A 1.9 A 0,067 A fo r I RESET Vdc A N ew I SLEEP I RAMSLEEP Max 3.6 4kB RAM retained m en de d 1 Module supply voltage Deep Sleep Current Quiescent current, 2 internal RC oscillator disabled, Quiescent current, 3 internal RC oscillator enabled Quiescent current, 4 including 32.768kHz oscillator Quiescent current including internal RC 5 oscillator and 32.768kHz oscillator Additional current per 6 4kB block of RAM retained Reset Current Quiescent current 7 nReset asserted Processor and Peripheral Currents ARM(R) CortexTM M3, 8 RAM and flash memory ARM(R) CortexTM M3, 9 RAM and flash memory ARM(R) CortexTM M3, 10 RAM and flash memory sleep current ARM(R) CortexTM M3, 11 RAM and flash memory sleep current Unit es ig n Condition / Remark Item D No. 2 3 mA I MCU 7.5 mA I MCU 8.5 mA 25C, 12MHz Core clock I MCU 4.0 mA 25C, 6MHz Core clock I MCU 2.5 mA I SC 0.2 mA I TIM 0.25 mA I ADC 1.1 mA I USB 1 mA Per serial controller at max. clock rate Per timer at max. clock rate Max. Sample rate, DMA I USBSUSP ARM(R) CortexTM M3 sleeping. Total, 12MHz clock speed Total, 24MHz clock speed 2.5 mA I RX 26.5 mA I RX 30 mA I RX 31.5 mA - 18 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS TX Current Transmit current consumption Transmit Current consumption Sleep Modes & Peripheral Current MCU, RAM and flash, 22 FEM, radio off MCU, RAM and flash, 23 FEM, radio off 24 Serial Controller 25 Timer 26 ADC 21 at +20dBm module output power at min module output power 12MHz clock speed 24MHz clock speed Max data rate Max clock rate Max sample rate I TXVCC 140 mA I TXVCC 52 mA I MCU 7 I MCU 8 I SC I TMR I ADC 0.2 0.25 1.1 mA mA mA mA mA N ot R ec om m en de d fo r N ew D Table 8: DC Electrical Characteristics es ig n 20 (c)2016 Silicon Labs - 19 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 8 Digital I/O Specifications es ig n The digital I/Os of the ETRX358x-LRS module have the ratings shown below. V CC = 3.0V, T AMB = 25C, NORMAL MODE unless otherwise stated Condition / Remark Item Symbol Value Min 2 High Schmitt switching threshold 3 4 5 6 Input current for logic 0 Input current for logic 1 Input Pull-up resistor value Input Pull-down resistor value Output voltage for logic 0 8 Output voltage for logic 1 9 Output Source Current 10 Output Sink current 11 12 13 Output Source Current Output Sink current Total output current 0.42 x V CC V SWIH 0.62 x V CC I IL I IH I OL = 4mA (8mA) for standard (high current) pads I OH = 4mA (8mA)for standard (high current) pads Standard current pad Standard current pad High current pad (1) High current pad (1) 0.5 x V CC Vdc 0.8 x V CC MHz -0.5 0.5 A A R IPU 24 29 34 k R IPD 24 29 34 k V OL 0 0.18 x V CC V 0.82 x V CC V CC V I OHS 4 mA I OLS 4 mA I OHH I OLH I OH + I OL 8 8 40 mA mA mA m en de d 7 V SWIL Max N ew Low Schmitt switching threshold Typ fo r 1 Schmitt input threshold going from high to low Schmitt input threshold going from low to high Unit D No. V OH om Table 9. Digital I/O Specifications Low Schmitt switching threshold ot R 1 Item ec No. 2 3 4 N 5 6 High Schmitt switching threshold Input current for logic 0 Input current for logic 1 Input Pull-up resistor value Input Pull-up resistor value Condition / Remark Symbol Value Min Schmitt input threshold going from high to low Schmitt input threshold going from low to high Unit Typ Max V SWIL 0.42 x V CC 0.5 x V CC Vdc V SWIH 0.62 x V CC 0.68 x V CC Vdc -0.5 0.5 A A I IL I IH Chip not reset R IPU 24 29 34 k Chip reset R IPURESET 12 14.5 17 k Table 10. nReset Pin Specifications Notes 1) High current pads are PA6, PA7, PB6, PB7, PC0 (c)2016 Silicon Labs - 20 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 9 A/D Converter Characteristics No. es ig n The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer to the EM358x datasheet. Item 1 2 3 4 A/D resolution A/D sample time for 7-bit conversion A/D sample time for 14-bit conversion Reference Voltage Up to 14 bits 5.33s (188kHz) 682s 1.2V N ew 10 AC Electrical Characteristics D Table 11. A/D Converter Characteristics V CC = 3.0V, T AMB = 25C, NORMAL MODE measured at 50 terminal load connected to the U.FL socket No. 7 8 9 10 11 12 13 14 N 16 17 18 Value Typ 2400 -107 -3 -106 2 fo r ot R 15 Min m en de d 6 om 5 Frequency range Sensitivity for 1% Packet Error Rate (PER) Saturation (maximum input level for correct operation) High-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) Low-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) 2nd High-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) 2nd Low-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) Channel Rejection for all other channels (1% PER and desired signal -82dBm acc. to [1]) 802.11g rejection centred at +12MHz or -13MHz (1% PER and desired signal -82dBm acc. to [1]) Co-channel rejection (1% PER and desired signal -82dBm acc. to [1]) Relative frequency error (2x40ppm required by [1]) Relative timing error (2x40ppm required by [1]) Linear RSSI range Output power at highest power setting NORMAL MODE BOOST MODE Output power at lowest power setting Error vector magnitude as per IEEE802.15.4 Carrier frequency error ec 1 2 4 Receiver Unit Max 2500 -100 MHz dBm dBm 41 dB 40 dB 54 dB 52 dB tbd dB tbd dB tbd dBc -120 120 ppm -120 120 ppm 35 dB 20 20 21 21 21.5 21.5 dBm 7 -40 15 40 {1} dBm % ppm -40 {1} Table 12. AC Electrical Characteristics Notes {1} Applies across the full ranges of rated temperature and supply voltage. (c)2016 Silicon Labs - 21 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS No. Synthesiser Characteristics Limit Typ Min 2400 2500 MHz kHz 100 s 100 s 11.7 -71dBc/Hz -91dBc/Hz -103dBc/Hz -111dBc/Hz D Frequency range Frequency resolution Lock time from off state, with correct VCO DAC settings Relock time, channel change or Rx/Tx turnaround Phase noise at 100kHz offset Phase noise at 1MHz offset Phase noise at 4MHz offset Phase noise at 10MHz offset Unit Max N ew 22 23 24 25 26 27 28 29 es ig n Please Note: For the relationship between EM358x power settings and module output power please relate to chapter 10.1 of this document. When developing custom firmware the output power settings described in this document relate directly to the EM358x power settings accessible via the Ember stack API. Table 13. Synthesiser Characteristics No. V CC POR release V CC POR assert Min Limit Typ Max 0.62 0.45 0.95 0.65 1.2 0.85 Limit Typ Max fo r 30 31 Power On Reset (POR) Specifications Unit Vdc Vdc m en de d Table 14. Power On Reset Specifications No. 32 33 34 nRESET Specifications Reset Filter Time constant Reset Pulse width to guarantee a reset Reset Pulse width guaranteed not to cause reset Min 2.1 26 0 12 Unit 16 1 s s s N ot R ec om Table 15. nReset Specifications (c)2016 Silicon Labs - 22 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 10.1 TX Power Characteristics m en de d fo r N ew D es ig n The diagrams below show the typical output power and module current in dependency on EM358x-LRS power setting in NORMAL MODE at 3.6V and room temperature. N ot R ec om Figure 3. Output Power vs. Power Setting Figure 4. Module Current vs. Power Setting (c)2016 Silicon Labs - 23 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 10.2 Power Settings for Regulatory Compliance es ig n Because of the high gain of the frontend module output power of up to 22dBm can be achieved When the antenna gain is included the output power of the EM358x transceivers needs to be reduced for regulatory compliance. The following tables list the maximum permitted power setting for the antenna types listed in Table 2. Note that this is the power out of the EM358x chip, and the power delivered to the antenna will be higher by the gain of the RF power amplifier. (V CC = 3.3V, T AMB = 25C, NORMAL MODE) Channel 25 -17 -17 -17 Channel 26 -17 -17 -17 D Channels 11-24 -17 -17 -17 N ew Antenna 1/2 Wave 1/4 Wave On Board Table 16: Maximum Power Settings for European Compliance Finally Table 17 the maximum Power settings for FCC and IC compliance. Channel 25 -12 -8 -7 fo r Channels 11-24 -8 -8 -7 Channel 26 -43 -26 -26 m en de d Antenna 1/2 Wave 1/4 Wave On Board N ot R ec om Table 17: Maximum Power Settings for FCC, IC Compliance (c)2016 Silicon Labs - 24 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 10.3 Temperature behaviour m en de d fo r N ew D es ig n Figure 5 and Figure 6 illustrate the temperature behaviour of the ETRX358x-LRS series of modules. Please note that although the temperature behaviour was measured to up to 100 degrees Celsius the absolute maximum rating is 85 degrees Celsius. N ot R ec om Figure 5. Sensitivity vs. Temperature Figure 6. TX Power vs. Temperature (c)2016 Silicon Labs - 25 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS fo r N ew D es ig n 11 Physical Dimensions m en de d Figure 7. ETRX3 Physical Dimensions Explanation L W H A1 A2 R1 R2 X1 X2 Length of the module Width of the module Height of the module Distance centre of pad PCB edge Pitch Keep-out Zone from corner of PCB Keep-out Zone from corner of PCB Distance centre of Antenna connector PCB edge Distance centre of Antenna connector PCB edge Distance 25.0mm 19.0mm 3.8mm 0.9mm 1.27mm 17.5mm 4.1mm 3.8mm 2.8mm Table 18. ETRX3 Physical Dimensions ec om Symbol N ot R For ideal RF performance when using the on-board antenna, the antenna should be located at the corner of the carrier PCB. There should be no components, tracks or copper planes in the "keepout" area which should be as large as possible. When using the U.FL RF connector the "keep-out" area does not have to be kept. NB: The modules' transmit/receive range will depend on the antenna used and also the housing of the finished product. (c)2016 Silicon Labs - 26 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 12 Recommended Reflow Profile Recommended temperature profile for reflow soldering 60 +60-20s 230C -250C max. es ig n Temp.[C] 220C N ew D 150C - 200C 90 30s fo r Time [s] Figure 8. Recommended Reflow Profile m en de d Use of "No-Clean" solder paste is recommended to avoid the requirement for a cleaning process. Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent and other residuals are remaining underneath the shielding can as well as in the gap between the module and the host board. N ot R ec om Please Note: Maximum number of reflow cycles: 2 Opposite-side reflow is prohibited due to the module's weight. (i.e. you must not place the module on the bottom / underside of your PCB and re-flow). (c)2016 Silicon Labs - 27 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS D es ig n 13 Product Label Drawing N ew Figure 9. Product Label Description 02 ot R FCC ID: S4GEM358L IC: 8735A-EM358L CE 2D-Barcode N Indication for the serial number. Production Date Code in the format YYMMDD, e.g. 090602 Indication for batch number Indication for the production location (first character) and the hardware revision (second character) FCC ID code for this product The IC ID The CE Mark Information in the 2D-Barcode are the serial number [6 characters], the Part-Order code, identifier for the batch number [2 characters], the identifier for the hardware release [2 characters] and the production date code in the format Year-Month-Day [6 characters], all separated by a semicolon. ec 000001 090101 01 om ETRX3587HR-LRS Module Order code Possible codes are: - ETRX3581-LRS - ETRX3581HR-LRS - ETRX3582-LRS - ETRX3582HR-LRS - ETRX3585-LRS - ETRX3585HR-LRS - ETRX3586-LRS - ETRX3586HR-LRS - ETRX3587-LRS - ETRX3587HR-LRS - ETRX3588-LRS - ETRX3588HR-LRS m en de d Imprint fo r The label dimensions are 16mm x 14 mm. The label will withstand temperatures used during reflow soldering. The characters "HR" are only present on the versions with the Hirose connector, (c)2016 Silicon Labs Table 19. ETRX358x-LRS Label Details - 28 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 14 Recommended Footprint es ig n In order to surface mount an ETRX3 series module, we recommend that you use pads which are 1mm wide and 1.2mm high. Unless using the "HR" variants the "keep-out" zone shown in section 11 must be retained, and it must be ensured that this area is free of copper tracks and/or copper planes/layers. You must also ensure that there is no exposed copper on your layout which may contact with the underside of the ETRX3 series module. ec om m en de d fo r N ew D For best RF performance it is required to provide good ground connections to the ground pads of the module. It is recommended to use multiple vias between each ground pad and a solid ground plane to minimize inductivity in the ground path. Figure 10. Recommended Footprint ot R The land pattern dimensions above serve as a guideline. N We recommend that you use the same pad dimensions for the solder paste screen as you have for the copper pads. However these sizes and shapes may need to be varied depending on your soldering processes and your individual production standards. We recommend a paste screen thickness of 120m to 150m. Figure 11 shows the typical pad dimensions of the module and Figure 12-Figure 14 in section 14.1 show examples of how to align the module on its host PCB. Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as through-hole vias, planes or tracks on your board component layer, should be located below the (c)2016 Silicon Labs - 29 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS m en de d fo r N ew D es ig n ETRX3 series module in order to avoid `shorts'. All ETRX3 series modules use a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have an additional copper plane directly under the ETRX3 series module. Figure 11. Typical pad dimensions N ot R ec om Finally it is recommended to use no clean flux when soldering the ETRX358x family of modules and to not use a washing process after reflow. If the process does require washing then care must be taken that no washing agent is trapped underneath the shielding can after the drying process has completed. (c)2016 Silicon Labs - 30 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 14.1 Recommended Placement fo r N ew D es ig n When placing the module please either locate the antenna in the corner as shown in Figure 12 so that the recommended antenna keepout zone is being followed, or add a no copper zone as indicated in Figure 14. Figure 13. How to not place the Module N ot R ec om m en de d Figure 12. Typical placement (c)2016 Silicon Labs - 31 - ETRX358x-LRS Product Manual N ew D es ig n ETRX358x-LRS and ETRX358xHR-LRS N ot R ec om m en de d fo r Figure 14. Adding a no copper / no component area (c)2016 Silicon Labs - 32 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 14.2 Example carrier board m en de d fo r N ew D es ig n Since the RF performance of the module with the on board antenna is strongly dependent on the proper location of the module on its carrier board, shows the reference carrier board which was used during testing by Telegesis. Figure 15. Reference Board For best performance it is recommended to locate the antenna towards the corner of the carrier board and to respect the recommended keep-out areas as described in section 11. N ot R ec om Finally to provide a good reference ground to the on board antenna, the carrier board should have a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice, but a degradation in radio performance could be the result. (c)2016 Silicon Labs - 33 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 15 Reliability Tests No Item es ig n The following measurements will be conducted after the module has been exposed to standard room temperature and humidity for 1 hour. Limit Condition Vibration test Electrical parameter should be in specification 2 Shock test the same as the above 3 Heat cycle test the same as the above 5 6 Low temp. test High temp. test the same as the above the same as the above Dropped onto hard wood from height of 50cm for 10 times -40C for 30min. and +85C for 30min.; each temperature 300 cycles -40C, 300h +85C, 300h N ew D 1 Freq.:40Hz,Amplitude:1.5mm 20min. / cycle,1hrs. each of X and Y axis Table 20: Reliability Tests 16.1 Safety Precautions fo r 16 Application Notes m en de d These specifications are intended to preserve the quality assurance of products as individual components. Before use, check and evaluate their operation when mounted on your products. Abide by these specifications when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions as a minimum: Ensure the safety of the whole system by installing a protection circuit and a protection device. (2) Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. om (1) 16.2 Design Engineering Notes Heat is the major cause of shortening the life of these products. Avoid assembly and use of the target equipment in conditions where the product's temperature may exceed the maximum allowable. ot R ec (1) Failure to do so may result in degrading of the product's functions and damage to the product. (3) If pulses or other transient loads (a large load applied in a short time) are applied to the products, before use, check and evaluate their operation when assembled onto your products. (4) These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully, to determine whether or not they can be used in such a manner. N (2) (c)2016 Silicon Labs - 34 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. (6) In direct sunlight, outdoors, or in a dusty environment (7) In an environment where condensation occurs. (8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx) (9) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. D es ig n (5) N ew (10) Mechanical stress during assembly of the board and operation has to be avoided. (11) Pressing on parts of the metal cover or fastening objects to the metal cover is not permitted. 16.3 Storage Conditions The module must not be stressed mechanically during storage. (2) Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance, may well be adversely affected: (3) Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX (4) Storage (before assembly of the end product) of the modules for more than one year after the date of delivery at your company even if all the above conditions (1) to (3) have been met, should be avoided. N ot R ec om m en de d fo r (1) (c)2016 Silicon Labs - 35 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 17 Packaging 17.1 Embossed Tape Dimension of the tape (2) Cover tape peel force m en de d fo r N ew D es ig n (1) Force direction Speed = 300mm/min. Cover tape peel force =0.0980.68N (1070g) Empty pockets N ot R ec (3) om = 10deg NB: Empty pockets in the component packed area will be less than two per reel and those empty pockets will not be consecutive. (c)2016 Silicon Labs - 36 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 17.2 Component Orientation Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the carrier tape es ig n (top view) Component Orientation D Part No. Direction 17.3 Reel Dimensions Quantity per reel: 600 pieces (5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on the reel N ot R ec om m en de d fo r N ew (4) (c)2016 Silicon Labs - 37 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 17.4 Packaging (6) Each reel will be packed in a hermetically-sealed bag (7) Marking: label Description Imprint fo r N ew D es ig n Reel / Antistatic Packaging / Reel Box and outer Box will carry the following Internal use Internal use Telegesis Module Order Code. Quantity of modules inside the reel/carton Six digit unique Reel number counting up from 000001 Date:120824 Date Code in the format YYMMDD, e.g. 120824 P/C: ETRX3587-LRSR308 Module product code with reference to firmware/module type selected during ATE. If needed multiline. Information in the 32x32 Datamatrix 2D-Barcode are and identifier "!REEL" [5 characters], the reel number [6 characters], the Module Order code [max 18 characters ], the quantity [max 4 characters] , the date code in the format Year-Month-Day [6 characters] and the product code [max 40 characters] , all separated by a semicolon. N ot R ec om 2D-Barcode m en de d MFG P/N: 99X902DL Lot: 00 P/N:ETRX3587-LRS Quantity:600 Reel No: 000001 (c)2016 Silicon Labs - 38 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 18 Ordering Information Description ETRX3581-LRS 2 ETRX3582-LRS2 ETRX3585-LRS2 ETRX3586-LRS2 ETRX3587-LRS ETRX3588-LRS2 Power amplified Telegesis Wireless Mesh Networking Module with Silicon Labs ZigBee Technology: ETRX3581HR-LRS2 ETRX3582HR-LRS2 ETRX3585HR-LRS2 ETRX3586HR-LRS2 ETRX3587HR-LRS ETRX3588HR-LRS2 Power amplified Telegesis Wireless Mesh Networking Module with Silicon Labs ZigBee Technology: ETRX357DVK Telegesis Development Kit with: Based on Silicon Labs EM358x SoC Integrated 2.4GHz Antenna Based on Silicon Labs EM358x SoC U.FL coaxial Antenna Connector om m en de d fo r * * N ew D * * es ig n Ordering/Product Code 3 x ETRX3DVK Development Boards 3 x USB cables 2 x ETRX357 on carrier boards 2 x ETRX357HR on carrier boards 2 x ETRX357-LRS on carrier boards 2 x ETRX357HR-LRS on carrier boards 1 x ETRX3USB USB stick 2 x 1/2-wave antennae 2 x 1/4-wave antennae * * * * 2 x ETRX3587 on carrier boards 2 x ETRX3587HR on carrier boards 2 x ETRX3587-LRS on carrier boards 2 x ETRX3587HR-LRS on carrier boards ot R ec ETRX3587 Expansion Pack * * * * * * * * * N Notes: * Customers' PO's must state the Ordering/Product Code. * There is no "blank" version of the ETRX358x modules available. 2 MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR (c)2016 Silicon Labs - 39 - ETRX358x-LRS Product Manual ETRX358x-LRS and ETRX358xHR-LRS 19 RoHS Declaration Declaration of environmental compatibility for supplied products: Lead and lead compounds Mercury and mercury compounds Chromium (VI) PBB (polybrominated biphenyl) category PBDE (polybrominated biphenyl ether) category D * * * * * es ig n Hereby we declare based on the declaration of our suppliers that this product does not contain any of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous materials for: And a maximum concentration of 0.01% by weight in homogeneous materials for: Cadmium and cadmium compounds N ew * 20 Data Sheet Status 21 Life Support Policy fo r Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design. m en de d This product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting. 22 Related Documents IEEE Standard 802.15.4 -2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs) [2] Datasheet EM35x, Ember. (www.silabs.com) ec om [1] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height N ot R [3] [4] The ZigBee specification (www.zigbee.org) [5] Specification for Antenova Rufa Antenna (www.antenova.com) [6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com) (c)2016 Silicon Labs - 40 - ETRX358x-LRS Product Manual