1
Product Family Data Sheet Rev. 1.4 2017.04.04
High Voltage LED Series
Chip on Board
LC013D – Gen.2
High efficacy COB LED package
well-suited for use in spotlight applications
Featur
es & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
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Table of Contents
1. Characteristics ----------------------- 3
2. Product Code Information ----------------------- 5
3. Typical Characteristics Graphs ----------------------- 8
4. Outline Drawing & Dimension ----------------------- 10
5. Reliability Test Items & Conditions ----------------------- 11
6. Label Structure ----------------------- 12
7. Precautions in Handling & Use ----------------------- 13
3
1. Characteristics
a) Absolute Maximum Rating
Item Symbol Rating Unit Condition
Ambient / Operating Temperature Ta -40 ~ +105 ºC -
Storage Temperature Tstg -40 ~ +120 ºC -
LED Junction Temperature TJ 150 ºC -
Case Temperature Tc 115 ºC
Forward Current IF 920 mA -
Power Dissipation PD 34.5 W -
ESD (HBM) - ±2 kV -
ESD (MM) - ±0.5 kV -
b) Electro-optical Characteristics (IF = 360 mA, TJ = 85 ºC)
Item Unit Rank Min. Typ. Max.
Forward Voltage (VF) V YZ 31.8 34.6 37.5
Color Rendering Index (Ra) -
5 80 - -
7 90
Thermal Resistance (junction to case point) ºC/W - 0.85 -
Beam Angle º
- 115 -
Nominal Power W 12.5
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C)
2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics (IF = 360 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ Tc = 85 °C (lm)
Min. Typ. Max.
80
2700 D2 1676 1764 -
3000 D2 1764 1857 -
3500 D2 1819 1915 -
4000 D2 1852 1950 -
5000 D2 1869 1967 -
5700 D2 1869 1967 -
6500 D2 1841 1938 -
90
2700 D2 1433 1509 -
3000 D2 1501 1580 -
3500 D2 1554 1635 -
4000 D2 1587 1670 -
5000 D2 1591 1674 -
Notes:
1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
S P H W H A H D N D 2 5 Y Z W 3 D 2
Digit PKG Information Code Specification
1 2 3 Samsung Package High Power SPH
4 5 Color WH White
6 Product Version A
7 8 Form Factor HD COB
9 Lens Type N No lens
10 Wattage or Model D LC013D
11 Internal Code 2
12 CRI & Sorting Temperature
5 Min. 80 (85℃)
7 Min. 90 (85℃)
13 14 Forward Voltage (V) YZ 31.8~37.5
15 CCT (K)
W 2700K
V 3000K
U 3500K
T 4000K
R 5000K
Q 5700K
P 6500K
16 MacAdam Step
2 MacAdam 2-step
3 MacAdam 3-step
17 18 Luminous Flux (Lm) D2
COB D-series Gen.2 level
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a) Binning Structure (IF = 360 mA, TJ = 85 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Flux
Rank
Flux Range
(Φv, lm)
80
2700
SPHWHAHDND25YZW2D2
YZ
W2
D2 1676 ~
SPHWHAHDND25YZW3D2 W3
3000
SPHWHAHDND25YZV2D2
YZ
V2
D2 1764 ~
SPHWHAHDND25YZV3D2 V3
3500
SPHWHAHDND25YZU2D2
YZ
U2
D2 1819 ~
SPHWHAHDND25YZU3D2 U3
4000
SPHWHAHDND25YZT2D2
YZ
T2
D2 1852 ~
SPHWHAHDND25YZT3D2 T3
5000 SPHWHAHDND25YZR3D2 YZ R3 D2 1869 ~
5700 SPHWHAHDND25YZQ3D2 YZ Q3 D2 1869 ~
6500 SPHWHAHDND25YZP3D2 YZ P3 D2 1841 ~
90
2700
SPHWHAHDND27YZW2D2
YZ
W2
D2 1433 ~
SPHWHAHDND27YZW3D2 W3
3000
SPHWHAHDND27YZV2D2
YZ
V2
D2 1501 ~
SPHWHAHDND27YZV3D2 V3
3500
SPHWHAHDND27YZU2D2
YZ
U2
D2 1554 ~
SPHWHAHDND27YZU3D2 U3
4000
SPHWHAHDND27YZT2D2
YZ
T2
D2 1587 ~
SPHWHAHDND27YZT3D2 T3
5000 SPHWHAHDND27YZR3D2 YZ R3 D2 1591 ~
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b) Chromaticity Region & Coordinates (IF = 360 mA, TJ = 85 ºC)
MacAdam Ellipse (W2, W3) MacAdam Ellipse (V2, V3)
Step CIE x CIE y θ a b Step CIE x CIE y θ a b
2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027
3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041
MacAdam Ellipse (U2, U3) MacAdam Ellipse (T2, T3)
Step CIE x CIE y θ a b Step CIE x CIE y θ a b
2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027
3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040
MacAdam Ellipse (R3) MacAdam Ellipse (Q3)
Step CIE x CIE y θ a b Step CIE x CIE y θ a b
3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.0950 0.0075 0.0032
MacAdam Ellipse (P3)
Step CIE x CIE y θ a b
3-step 0.3123 0.3282 58.5700 0.0067 0.0029
Note:
θ
CIE x,y
8
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 360 mA, TJ = 85 ºC)
CRI Ra 80+ CRI Ra 90+
b) Forward Current Characteristics (TJ = 85 ºC)
c) Temperature Characteristics (IF = 360mA)
0
50
100
150
200
250
00.2 0.4 0.6 0.8 1
Relative Luminous Flux(%)
Forward Current(A)
Relative luminous Flux vs. Forward Current
30
32
34
36
38
40
00.2 0.4 0.6 0.8 1
Forward Voltage
Forward Current(A)
Forward Voltage vs. Forward Current
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d) Color Shift Characteristics (TJ = 85 ºC, IF = 360mA, CRI = 80+)
e) Beam Angle Characteristics (IF = 360 mA, TJ = 85 ºC)
f) Derating Characteristics
80
85
90
95
100
105
20 40 60 80 100
Relative Luminous Flux(%)
Tc(℃)
Relative Luminous Flux vs. Temperature
34.0
34.5
35.0
35.5
20 40 60 80 100
Forward Voltage(V)
Tc(℃)
Forward Voltage vs. Temperature
-0.02
-0.015
-0.01
-0.005
0
0.005
00.2 0.4 0.6 0.8 1
△
CIE x,
△
CIE y
Forward Current(A)
△
CIE x,
△
CIE y vs. Forward Current
△CIE x
△CIE y
-0.02
-0.015
-0.01
-0.005
0
0.005
20 40 60 80 100
△
CIE x,
△
CIE y
Tc(℃)
△
CIEx,
△
CIEy vs. Temperature
ΔCIE x
ΔCIE y
0.00
0.20
0.40
0.60
0.80
1.00
1.20
-100 -80 -60 -40 -20 0 20 40 60 80 100
Relative Luminous Intensity
Angle(
°
)
10
4. Outline Drawing & Dimension
0
0.2
0.4
0.6
0.8
1
020 40 60 80 100 120
If [ mA ]
Tc [ ℃ ]
Derating Curve
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Item Dimension Tolerance Unit
Length 13.5 ±0.15 mm
Width 13.5 ±0.15 mm
Height 1.50 ±0.20 mm
Light Emitting Surface (LES) Diameter 9.8 ±0.30 mm
Note: Denoted product information above is only an example
( LC013D28030 : LC013D, Gen2, CRI80+, 3000K )
1. Unit: mm
2. Tolerance: ± 0.30 mm
TC
SAMSUNG
XXX.....XXXX
LOT No.
Model
Description
LC013D28030
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5. Reliability Test Items & Conditions
a) Test Items
Test Item Test Condition Test Hour / Cycle
High Temperature
Humidity Life Test 60 ºC, 90 % RH,, DC Derating, IF 1000 h
High Temperature
Life Test 85 ºC, DC Derating, IF 1000 h
Low Temperature
Life Test -40 ºC, DC, Derating IF 1000 h
High Temperature
Storage 120 ºC 1000 h
Low Temperature
Storage -40 ºC 1000 h
Temperature Humidity
Storage 60 ºC, 90% RH 1000h
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max 100 cycles
ESD (HBM)
R
1
: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
5 times
ESD (MM)
R
1
: 10 MΩ
R2: 0 kΩ
C: 200 pF
5 times
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test 1500g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides) 5 times
b) Criteria for Judging the Damage
Item Symbol Test Condition
(Tc = 25 ºC)
Limit
Min. Max.
Forward Voltage VF IF = 360 mA L.S.L. * 0.9 U.S.L. * 1.1
Luminous Flux Φv IF = 360 mA L.S.L * 0.7 U.S.L * 1.3
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Bin Code
Lot Number
Product Code
YZW3D2
SPHWHAHDND25YZW3D2 YZW3D2 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
G4AZC4001 / 1001 / xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
YZW3D2
SPHWHAHDND25YZW3D2 YZW3D2 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
6. Label Structure
a) Label Structure
Note: Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ: Forward Voltage bin (refer to page 11)
ⓒⓓ: Chromaticity bin (refer to page 9-10)
ⓔⓕ: Luminous Flux bin (refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
① ③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
: Production site (S: Giheung, Korea, G: Tianjin, China)
②
: 4 (LED)
③
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
④
: Year (Z: 2015, A: 2016, B: 2017…)
⑤
: Month (1~9, A, B, C)
⑥⑦⑧⑨
: Day (1~9, A, B~V)
ⓐⓑⓒ
: Product serial number (001 ~ 999)
ⓐⓑⓒⓓⓔⓕ
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7. Packing Structure
a) Packing Structure
b) Tray
Max. quantity
Dimension(mm)
Packing material
in pcs of COB
Length
Width
Height
Tolerance
Tray 50 200 200 8 1
Al um i num Bag 250 (5 trays) 320 270 - +/- 0.5
Outer Box (Small) 500 (2 bags) 225 225 65 5
Outer Box (Middle) 1000 (4 bags) 225 225 130 5
※ Small Box ※ Middle Box
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8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required,
IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used
in the device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it
may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such
as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction
temperature should not exceed the absolute maximum rating while operation of LED lighting system.
For more information, please refer to Application Note ‘Mechanical & Thermal Guide for COB’.
9) In case of driving LEDs around the minimum current level (If_min), chips might exhibit different brightness due to the
variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
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Legal and additional information.
About Samsung Electronics Co., Ltd.
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official website at www.samsung.com and our official blog at
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Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered
trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
