Top RF layer is .020” Rogers-4003, єr = 3.45, 4 total layers
(0.062” thick) for mechanical rigidity. Metal layers are 1-oz
copper. Microstrip line details: width = .040”, spacing = .020”.
External DC blocking capacitors are required on RFin and RFout
pins of the device. The supply voltage for the DSA is supplied
externally through pin Vdd. Frequency bypassing for this pin is
supplied by surface mount capacitor 0.1 uF (C4). This capacitor
is placed close to the device pin in the board layout. To ensure
application circuit is compatible with different standard power
supplies, 15 (R4) dropping resistor is highly recommended on
Vdd supply line.
R1, R2 and R3 are used as termination for digital noise or any
noise reflection on Serial Input, CLK and LE pins.
RF layout is critical for getting the best performance. RF trace
impedance needs to be 50 ohm. For measuring the actual device
performance on connectorized PC board, input losses due to RF
traces need to be subtracted from the data measured through
SMA connectors. The calibration microstrip line J6-J7 estimates
the PCB insertion loss for removal from the evaluation board
measured data. All data shown on the datasheet are de-
embedded up to the device input/output pins.
The PC board is designed to test using USB control interface
board, Evaluation Board Host (EVH). Each TQP4M9072
evaluation board is supplied with the EVH board, USB cable and
EVH graphical user interface (EVH GUI) to change attenuation
states. Manual for using EVH and Application note describing
the EVH are also available. Refer to TriQuint’s website for more
information
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB land
pattern has been developed to accommodate lead and package
tolerances. Since surface mount processes vary from company to
company, careful process development is recommended.