CREAT BY ART
- Low power loss, high efficiency
- Guardring for overvoltage protection
- High surge current capability
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
SYMBOL UNIT
V
RRM
V
V
RMS
V
V
DC
V
I
F(AV)
A
I
RRM
A
R
θJC O
C/W
T
STG O
C
Document Number: DS_D1310009 Version: D13
45
1.0
0.63
- 55 to +150
- 55 to +200
Storage temperature range - 55 to +150
Operating temperature range
In DC forward mode T
J
Note 1: tp = 2.0 μs, 1.0KHz
Note 2: Pulse test with PW=300μs, 1% duty cycle
Maximum reverse current @ Rated V
R
T
J
=25 ℃
T
J
=125 ℃I
R
0.5 mA
50
O
C
Typical thermal resistance 3.2
V
Peak repetitive reverse surge current (Note 1)
Maximum instantaneous forward voltage (Note 2)
I
F
= 16 A V
F
Peak forward surge current, 8.3 ms single half
sine-wave superimposed on rated load I
FSM
275 A
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 16
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER MBRF16H45
45
31
Case: ITO-220AC
Polarity: As marked
Mounting torque: 5 in-lbs maximum
Weight: 1.7 g (approximately)
MBRF16H45
Taiwan Semiconductor
Isolated Schottk
y
Barrier Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA ITO-220AC
CREAT BY ART
PART NO.
PART NO.
MBRF16H45
MBRF16H45
(TA=25℃ unless otherwise noted)
Document Number: DS_D1310009 Version: D13
50 / Tube
PACKING
RATINGS AND CHARACTERISTICS CURVES
MBRF16H45 C0 C0
MBRF16H45 C0G C0 G
EXAMPLE
PREFERRED P/N PACKING CODE GREEN COMPOUND
CODE
Green compound
DESCRIPTION
MBRF16H45 C0 Suffix "G" ITO-220AC
MBRF16H45
Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE GREEN COMPOUND
CODE PACKAGE
0
4
8
12
16
20
50 60 70 80 90 100 110 120 130 140 150
AVERAGE FORWARD CURRENT (A)
CASE TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
WITH HEATSINK
0
50
100
150
200
250
300
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
JEDEC Method
0.01
0.1
1
10
100
0 20406080100120
INSTANTANEOUS REVERSE CURRENT (mA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=125℃
TJ=25℃
0.1
1
10
100
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
Pulse Width=300μs
1% Duty Cycle
CREAT BY ART
Min Max Min Max
A 4.30 4.70 0.169 0.185
B 2.50 3.10 0.098 0.122
C 2.30 2.90 0.091 0.114
D 0.46 0.76 0.018 0.030
E 6.30 6.90 0.248 0.272
F 9.60 10.30 0.378 0.406
G 3.00 3.40 0.118 0.134
H 0.00 1.60 0.000 0.063
I 0.95 1.45 0.037 0.057
J 0.50 0.90 0.020 0.035
K 2.40 3.20 0.094 0.126
L 14.80 15.50 0.583 0.610
M - 4.10 - 0.161
N - 1.80 - 0.071
O 12.60 13.80 0.496 0.543
P 4.95 5.20 0.195 0.205
P/N = Specific Device Code
G = Green Compound
YWW = Date Code
F = Factory Code
Document Number: DS_D1310009 Version: D13
MARKING DIAGRAM
MBRF16H45
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
100
1000
10000
0.1 1 10 100
JUNCTION CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1310009 Version: D13
MBRF16H45
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
