© Semiconductor Components Industries, LLC, 2020
June, 2020 − Rev. 1 1Publication Order Number:
RGF1M/D
Fast Rectifiers
RGF1A - RGF1M
Features
•Glass Passivated Junction
•For Surface Mounted Applications
•Low Forward Voltage Drop
•High Current Capability
•Easy Pick and Place
•High Surge Current Capability
•NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
•These Devices are Pb−Free and are RoHS Compliant
ORDERING INFORMATION
Part Number
Top Mark
Package
Shipping†
RGF1A
RGF1A SMA
(Pb−Free) 7500 / Tape & Reel
NRVRGF1A
RGF1B
RGF1B SMA
(Pb−Free) 7500 / Tape & Reel
NRVRGF1B
RGF1D
RGF1D SMA
(Pb−Free) 7500 / Tape & Reel
NRVRGF1D
RGF1G
RGF1G SMA
(Pb−Free) 7500 / Tape & Reel
NRVRGF1G
RGF1J
RGF1J SMA
(Pb−Free) 7500 / Tape & Reel
NRVRGF1J
RGF1K
RGF1K SMA
(Pb−Free) 7500 / Tape & Reel
NRVRGF1K
RGF1M
RGF1M SMA
(Pb−Free) 7500 / Tape & Reel
NRVRGF1M
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
SMA
CASE 403AE
www.onsemi.com
MARKING DIAGRAM
&Y = ON Semiconductor Logo
&Z = Assembly Plant Code
&3 = Date Code (Year & Week)
RGF1x = Specific Device Code
x = A/B/D/G/J/K/M
&Y&Z&3
RGF1x
RGF1A − RGF1M
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2
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
°
C unless otherwise noted)
Symbol Parameter
Value
Unit
RGF1A
RGF1B
RGF1D
RGF1G
RGF1J
RGF1K
RGF1M
V
RRM
50
100
200
400
600
800
1000
V
I
F(AV)
TL = 125°C
1.0
A
I
FSM
Current: 8.3 ms Single Half−Sine Wave
30
A
T
J
−65 to +175
°
C
T
STG
−65 to +175
°
C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
THERMAL CHARACTERISTICS (T
A
= 25
°
C unless otherwise noted)
Symbol
Parameter
Value
Unit
P
D
Power Dissipation
1.76
W
R
qJA
Junction−to−Ambient Thermal Resistance (Note 1)
85
°
C/W
R
qJL
Junction−to−Lead Thermal Resistance (Note 1)
28
°
C/W
1. Device mounted on FR−4 PCB 0.013 mm.
ELECTRICAL CHARACTERISTICS (T
A
= 25
°
C unless otherwise noted)
Symbol Parameter Conditions
Value
Unit
RGF1A
RGF1B
RGF1D
RGF1G
RGF1J
RGF1K
RGF1M
V
F
Forward Voltage
I
F
= 1.0 A
1.3
V
t
rr
Reverse Recovery Time
I
F
= 0.5 A,
IR = 1.0 A,
IRR = 0.25 A
150
250
500
ns
IRReverse Current at Rated
VR
T
A
= 25
°
C
5.0
mA
T
A
= 125
°
C
100
C
T
Total Capacitance
V
R
= 4.0 V,
f = 1.0 MHz
8.5
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
RGF1A − RGF1M
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3
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 1. Forward Current Derating Curve Figure 2. Non−Repetitive Surge Current
Figure 3. Forward Voltage Characteristics Figure 4. Reverse Current vs. Reverse Voltage
Figure 5. Total Capacitance
0 25 50 75 100 125 150 175
0
0.25
0.5
0.75
1
1.25
RESISTIVE OR
INDUCTIVE LOAD
P.C.B. MOUNTED
ON 0.2 x 0.2"
(5.0 x 5.0 mm)
COPPER PAD AREAS
Average Rectified Forward Current, IF [A]
Ambient Temperature [°C]
1 2 51020 50100
0
10
20
30
40
50
Number of Cycles at 60 Hz
Peak Forward Surge Current, IFSM [A]
0.4
0.01
0.1
1
10
20
Forward Voltage, VF [V]
0.6 0.8 1 1.2 1.4 1.6 1.8
Pulse Width = 300 ms
2% Duty Cycle
TA = 25°C
TA = 125°C
Forward Current, IF [A]
0 20 40 60 80 100 120 140
0.01
0.1
1
10
30
Percent of Rated Peak Reverse Voltage [%]
Reverse Current, IR [mA]
TA = 150°C
TA = 100°C
TA = 25°C
1 2 51020 50100
1
2
5
10
20
50
Reverse Voltage, VR [V]
Total Capacitance, CT [pF]
SMA
CASE 403AE
ISSUE O
DATE 31 AUG 2016
2.65
4.30
1.75
2.50 MAX
2.20
1.90
0.30
0.05
B0.203
0.050
2.05
1.95
A
C
B1.65
1.20
2.95
2.50
B5.60
4.80
B4.75
4.00
A
B
0.41
0.15
1.52
0.75
R0.15 4X
8
0
0.45
8
0
DETAIL A
SCALE 20 : 1
GAGE PLANE
NOTES:
A. EXCEPT WHERE NOTED, CONFORMS
TO JEDEC DO214 VARIATION AC.
BDOES NOT COMPLY JEDEC STANDARD
VALUE.
C. ALL DIMENSIONS ARE IN MILLIMETERS.
D. DIMENSIONS ARE EXCLUSIVE OF
BURRS, MOLD FLASH AND TIE BAR
PROTRUSIONS.
E. DIMENSIONS AND TOLERANCE AS
PER ASME Y14.5−2009.
E. LAND PATTERN STD. DIOM5025X231M
LAND PATTERN RECOMMENDATION
TOP VIEW
SIDE VIEW
0.13 MCBA
0.13 MCBA
°
°
°
°
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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DOCUMENT NUMBER:
DESCRIPTION:
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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SMA
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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1
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Phone: 011 421 33 790 2910
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