CRA12E, CRA12S
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Revision: 24-Jun-13 1Document Number: 31003
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Thick Film Chip Resistor Array
FETAURES
Convex terminal array available with either
scalloped corners (E version) or square corners
(S version)
Wide ohmic range: 10R to 1M0
8 or 10 terminal package with isolated resistors
Pure tin solder contacts on Ni barrier layer,
provides compatibility with lead (Pb)-free and lead
containing soldering processes
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Note
(1) Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
Note
(2) Preferred way for ordering products is by use of the PART NUMBER.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL CIRCUIT
POWER RATING
P70 °C
W
LIMITING ELEMENT
VOLTAGE MAX.
V
TEMPERATURE
COEFFICIENT
± ppm/K
TOLERANCE
± %
RESISTANCE
RANGE
SERIES
CRA12E
CRA12S
01; 02; 20 0.100 50 100 1 10 to 1M E24; E96
03 0.125 200 2; 5 10 to 1M E24
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 1.5 A
TECHNICAL SEPCIFICATIONS
PARAMETER UNIT CRA12E AND CRA12S
CIRCUIT 01; 02; 20
CRA12E AND CRA12S
CIRCUIT 03
Rated dissipation at P70 (1) W per element 0.1 0.125
Limiting element voltage
Umax. AC/DC V50
Insulation voltage Uins (1 min) V 100
Insulation resistance > 109
Category temperature range °C - 55 to + 155
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRA12E08347K0JTR (2)
MODEL TERMINAL
STYLE PIN CIRCUIT VALUE TOLERANCE PACKAGING SPECIAL
CRA12 S
E
08
10
1 = 01
2 = 02
3 = 03
8 = 20
R = Decimal
K = Thousand
M = Million
0000 = 0
Jumper
F = ± 1 %
G = ± 2 %
J = ± 5 %
Z = 0 Jumper
TR Up to 2 digits
TL
Product Description: CRA12E 08 03 47K 5 % RB8 e3
CRA12E 08 03 47K 5% RB8 e3
MODEL PIN CIRCUIT RESISTANCE
VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE
CRA12E
CRA12S
08
10
01
02
03
20
10R = 10
47K = 47 k
1M = 1M
0R0 = Jumper
± 1 %
± 2 %
± 5 %
RB8
RD7
e3 = Pure tin
termination finish
A12E 8340CR JRK0T7
CRA12E, CRA12S
www.vishay.com Vishay
Revision: 24-Jun-13 2Document Number: 31003
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CIRCUIT
AVAILABLE TYPES AND RANGES
MODEL TERMINAL
COUNT CIRCUIT TEMPERATURE
COEFFICIENT TOLERANCE
CRA12S 10
01
02
03
20 ± 100 ppm/K
± 200 ppm/K ± 1 %; ± 2 %; ± 5 %
CRA12E
08 01
02
03
20
10
PACKAGING
MODEL TAPE WIDTH DIAMETER PITCH PIECES/REEL
BLISTER TAPE
ACC. IEC 60286-3, TYPE II
PART NUMBER PRODUCT DESCRIPTION
CRA12E 08
CRA12E 10
CRA12S 10
12 mm 180 mm/7"
330 mm/13" 8 mm 2000
5000
TR
TL
RB8
RD7
Pin 1 10 pin
02 Circuit
Pin 1 8 pin 10 pin
01 Circuit
03 Circuit 20 Circuit
Pin 1
8 pin 10 pin
CRA12E, CRA12S
www.vishay.com Vishay
Revision: 24-Jun-13 3Document Number: 31003
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DERATING
DIMENSIONS
- 55 - 25 0 25 50 75 100 125 155 175
120
100
80
60
40
20
0
70 Ambient Temperature in °C
Fraction of Rated Dissipation in %
W
e
a
a
a
e
b
c
d
p
B
T
A
L
PIN 1
W
B*
A*
P
1 0 3
S-Version
W
a
b
c
p
B
T
A
L
PIN 1
W
B*
A*
P
1 0 3
E-Version
MODEL
PIN
NO
#
DIMENSIONS in millimeters
LAA*BB*PTW
CRA12E 8 5.08 0.79 - 0.51 0.38 1.27 0.55 3.05
CRA12E 10 6.40 0.79 - 0.51 0.38 1.27 0.55 3.05
CRA12S 10 6.40 0.79 0.89 0.51 0.38 1.27 0.55 3.05
TOL.
± 0.15 ± 0.15 ± 0.15 ± 0.25 ± 0.2 ± 0.1 ± 0.15 ± 0.15
SOLDER PAD DIMENSIONS in millimeters
cwdpabe
WAVE 2.2 4.3 0.57 1.27 0.71 1.05 1.09
REFLOW 2.2 3.9 0.57 1.27 0.71 0.86 1.09
CRA12E, CRA12S
www.vishay.com Vishay
Revision: 24-Jun-13 4Document Number: 31003
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
(1) Figures are given for a single element.
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2 environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (R)(1)
STABILITY CLASS 1
OR BETTER
STABILITY CLASS 2
OR BETTER
Stability for product type: 10 to 1 M
CRA12E/CRA12S
4.5 - Resistance - ± 1 % ± 2 %, ± 5 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown
4.13 - Short time overload  2 x Umax.;
Duration according to style ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.17.2 58 (Td) Solderability
Solder bath method; Sn60Pb40;
non-activated flux;
(235 ± 5) °C; (2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux;
(245 ± 5) °C; (3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient (20/- 55/20) °C and (20/125/20) °C ± 100 ppm/K ± 200 ppm/K
4.32 21 (UU3) Shear (adhesion) 45 N No visible damage
4.33 21 (UU1) Substrate bending Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 )
4.19 14 (Na) Rapid change of temperature
30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
4.23 - Dry heat -
± (1 % R + 0.05 (2 % R + 0.1 )
4.23.2 2 (Ba) Damp heat, cyclic 125 °C; 16 h
4.23.3 30 (Db) Cold 55 °C; 90 % RH; 24 h; 1 cycle
4.23.4 1 (Aa) Low air pressure - 55 °C; 2 h
4.23.5 13 (M) - 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH; 24 h; 5 cycle
4.23.7 - DC load
4.25.1 - Endurance at 70 °C 1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (4 % R + 0.1 )
4.18.2 58 (Td) Resistance to soldering heat Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.35 - Flammability, needle flame test IEC 60695-11-5; 10 s No burning after 30 s
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 )
4.25.3 - Endurance at
upper category temperature 155 °C; 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
4.40 - Electrostatic discharge
(human body model)
IEC 61340-3-1;
3 positive and 3 negative discharges;
ESD voltage: 500 V
± (1 % R + 0.05 )
4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage
4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1;
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc) Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz; x, y, z 1.5 mm;
A 200 m/s2; 10 sweeps per axis ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.37 - Periodic electric overload 0.1 s on; 2.5 s off; 1000 cycles ± (1 % R + 0.05 )
4.27 - Single pulse high voltage
overload, 10 μs/700 μs 10 pulses ± (1 % R + 0.05 )
U2.5 x P70 x R=
UP
70 x R=
UP70 x RUmax.
=
U15 x P70 x R2 x Umax.
=
Û10 x P70 x R2 x Umax.
=
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Revision: 02-Oct-12 1Document Number: 91000
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