Board Level Heat Sinks P/N: 821702B00000 TO--220 PRODUCT SPECIFICATIONS * Multiple Holes for Device Attachment * Dual Device Cooling Heat Sink * RoHS Compliant Customized Heat Sinks * Specialized Plating * Specialized Body Configurations * Contact Applications Engineering 0 200 400 600 800 1000 100 10 80 8 60 6 40 4 20 2 0 0 0 2 4 6 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 8 10 Thermal Resistance - oC/ Watt (Mounting Surface to Ambient) FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient -oC (Mounting Surface) * Devices: TO-220 * Size: 36.8 x 19.8 x 21.6mm * Material: Aluminum, 1.0mm Thick * Type: Stamped * Finish: Black Anodized * PCB Mounting: Solderable Device Leads * Package: Bulk * Accessories: Hardware & Thermal Interface Materal