SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Applications ! ! ! Product Description IEEE802.11b DSSS WLAN IEEE802.11g,n OFDM WLAN Embedded applications with Bluetooth (Mobile) Features ! ! ! ! ! ! ! Dual Mode IEEE802.11b & IEEE802.11g Integrated PA, Harmonic Filter, LNA and BT port Integrated Positive Slope Power Detector 17.5 dBm @ 4.0 % EVM, 802.11g, 54 Mbps Direct connection to battery with 3.6 V nominal supply Lead free, Halogen free and RoHS compliant Compact package, 3 x 3 x 0.6 mm, MSL 1 Ordering Information Part No. Package Remark SE2613T SE2613T-R SE2613T-EK1 16 pin QFN 16 pin QFN N/A Samples Tape and Reel Evaluation kit The SE2613T is a complete 802.11 b/g/n WLAN RF front-end module with a Bluetooth port. The device provides all the functionality of the power amplifier, power detector, harmonic filtering, switch, low noise amplifier, and associated matching. The SE2613T provides a complete 2.4 GHz WLAN RF solution from the output of the transceiver to the antenna, and from the antenna to the input of the transceiver, in an ultra compact form factor. The SE2613T is designed for ease of use, with all the critical matching and harmonic filtering integrated, also offering a simple 50 ! interface to the antenna. The SE2613T includes a low noise amplifier to increase the receive sensitivity of embedded solutions to improve range or to overcome the insertion loss of cellular filters often included for mobile applications. The SE2613T also includes a transmitter power detector with 20 dB of dynamic range and a digital enable control for transmitter power ramp on/off control. Functional Block Diagram Figure 1: Functional Block Diagram DST-00393 ! Rev 1.4 ! March-28-2011 1 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Pin Out Diagram Figure 2: SE2613T Pin out (Top View through Package) Pin Out Description Pin No. Name Description 1 Vcc2 PA Positive Power supply 2 DET Power Detector Output 3 Vcc1 PA Positive Power supply 4 TX Transmit port 5 NC 6 PEN PA enable control input Not connected 7 GND Ground 8 RX Receive port 9 VDD LNA and Switch Positive Power supply 10 LEN LNA enable control input 11 CRX Receive antenna switch control 12 BT 13 CBT Bluetooth antenna switch control 14 GND Ground 15 ANT Antenna port 16 NC Not connected Die paddle GND Bluetooth port Ground DST-00393 ! Rev 1.4 ! March-28-2011 2 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Absolute Maximum Ratings These are stress ratings only. Exposure to stresses beyond these maximum ratings (one rating applied at a time) for extended periods may cause permanent damage to, or affect the reliability of the device. Avoid operating the device outside the recommended operating conditions defined below. This device is ESD sensitive. Handling and assembly of this device should be at ESD protected workstations. Symbol Definition Min. Max. Unit VCC PA Supply Voltage on VCC1, VCC2 -0.3 6.0 V VDD LNA and Switch Supply Voltage -0.3 3.6 V DC input on control pins -0.3 3.6 V - 5 dBm Operating Temperature Range -40 85 C Storage Temperature Range -40 150 C VIN PTXIN TA TSTG ESD HBM TX Input Power, ANT terminated in 50" match JEDEC JESD22-A114 All pins 1000 V Recommended Operating Conditions Symbol Parameter Min. Typ. Max. Unit TA Ambient temperature -40 25 85 C VCC PA Supply voltage, relative to GND = 0 V 2.7 3.6 4.8 V VDD LNA supply voltage, relative to GND = 0 V 2.7 3.3 3.6 V DC Electrical Characteristics Conditions: VCC = 3.6V, PEN = VDD= 3.3 V, TA = 25 !C, as measured on SiGe Semiconductor's SE2613T-EK1 evaluation board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted Symbol Parameter Conditions Min. Typ. ICC-G Total Supply Current POUT = 17.5 dBm, 54 Mbps OFDM signal, 64QAM - 140 mA ICC-B Total Supply Current POUT = 20 dBm, 11 Mbps CCK signal, BT = 0.45 - 160 mA Quiescent Current No RF - 110 mA ICC_OFF Total Supply Current PEN = 0 V, No RF Applied, CBT = PEN =CRX= 0 V - IDD_OFF Total Supply Current PEN = 0 V, No RF Applied, CBT = PEN =CRX= 0 V - Icc_LNA LNA Supply Current LEN =3.3V - Icc_LNA_ LNA bypass supply current LEN=0 ICQ BYP DST-00393 ! Rev 1.4 ! March-28-2011 Max. Unit 10 #A 18 30 #A 10 13 mA 50 #A 3 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Control Logic Characteristics Conditions: VCC = 3.6V, VDD=3.3V, TA = 25 !C, as measured on SiGe Semiconductor's SE2613T-EK1 evaluation board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted. Symbol Parameter Conditions Min. Typ. Max. Unit VIH Logic High Voltage - 2.7 - 3.6 V VIL Logic Low Voltage - 0 - 0.4 V IIH Input Current Logic High Voltage PEN All others - IIL Input Current Logic Low Voltage - - 100 10 - 1 #A #A Control Logic Table Mode# Mode Description CBT CRX PEN LEN 0 All Off 0 0 0 0 1 TX 0 0 1 0 2 RX High gain 0 1 0 1 3 RX Low gain (Bypass) 0 1 0 0 4 BT 1 0 0 0 DST-00393 ! Rev 1.4 ! March-28-2011 4 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary AC Electrical Characteristics 802.11g Transmit Characteristics Conditions: VCC = 3.6V, PEN = VDD = 3.3 V, CBT = LEN = CRX = 0V, TA = 25 !C, as measured on SiGe Semiconductor's SE2613T-EK1 evaluation board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted. Symbol FIN Parameter Frequency Range Condition Min. Typ. - 2412 - 2484 MHz - - 4 % - 2.5 % EVM POUT = 17.5dBm, 54 Mbps OFDM signal, 64 QAM EVMLP Low Power EVM POUT = 0-15dBm, 54 Mbps OFDM S21 Small Signal Gain - Small Signal Gain Variation Over Band - EVM $S21 2f Harmonics - Max. 26 - POUT = 20 dBm, 1 Mbps, 802.11b - - 3f Unit dB 1.5 dBpp -25 dBm/MHz -25 dBm/MHz 400 nsec -10 dB tdr, tdf Delay and rise/fall Time 50 % of VPEN edge and 90/10 % of final output power level - S11 Input Return Loss TX port - STAB Stability CW, Pin = -5 dBm 0.1 GHz - 20 GHz Load VSWR = 6:1 All non-harmonically related outputs less than -43 dBm/MHz RGGD Ruggedness CW, PIN = -5 dBm 0.1 GHz - 20 GHz Load VSWR = 10:1 No permanent damage or performance degradation -12 Bluetooth Characteristics Conditions: VCC = 3.6 V, CBT = VDD = 3.3V, CRX = LEN = PEN = 0V, TA = 25 !C, as measured on SiGe Semiconductor's SE2613T-EK1 evaluation board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted. Symbol Parameter FOUT Frequency Range BTIL Insertion Loss S11 BT Port Return Loss ISOLSW Switch Isolation DST-00393 ! Rev 1.4 ! March-28-2011 Condition Min. Typ. - 2400 - 2500 MHz - 0.5 0.8 dB -12 24 Max. Unit dB dB 5 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary 2.4 GHz Receive Characteristics Conditions: VCC = 3.6 V, LEN = CRX = VDD = 3.3V, PEN = CBT = 0 V, TA = 25 !C, as measured on SiGe Semiconductor's SE2613T-EK1 evaluation board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted. Symbol Parameter FOUT Frequency Range S21 Receive Gain, LNA enabled. $S21 Gain Variation Condition Min. Typ. - 2400 - 2500 MHz 11 13 15 dB - - 0.5 dB 2400 - 2485 MHz, Over any 20MHz band NF Noise Figure - 1.8 IIP3 Third Order Intercept 4 5 S11 Input Return Loss S22 Output Return Loss IP1dB - Input P1dB CW Enable Time 10% to 90% of RX RF power, from time that LEN is at 50% S21-BYP Receive Gain, LNA bypassed LEN = 0 V S11-BYP Input Return Loss, LNA bypassed LEN = 0 V TEN ISOLSW Switch Isolation DST-00393 ! Rev 1.4 ! March-28-2011 -6 -5 Unit dB - dBm -10 dB -10 dB -5 dBm -3 -10 20 Max. 400 nsec -1 dB dB dB 6 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Power Detector Characteristics Conditions: VCC =3.6V, PEN = VDD = 3.3 V, CBT = LEN = CRX = 0V, TA = 25 !C, as measured on SiGe Semiconductor's SE2613T-EK1 evaluation board (de-embedded to device), unless otherwise noted. Symbol Parameter FOUT Frequency Range PDR Power detect range, CW PDZLOAD Output Impedance PDVNoRF Condition Min. Typ. - 2400 - 2500 MHz 0 - 22 dBm Measured at ANT Max. Unit - 2.2 K" Output Voltage, POUT = No RF Measured in to 1M" 0.2 V PDVp17.5 Output Voltage, POUT = 17.5 dBm CW Measured in to 1M" 0.8 V PDVVAR Detector variation over Voltage 3.2V to 3.9V Vcc constant detector voltage (17.5dBm@3.6V Vcc nominal) 0.5 PDBW Detector bandwidth DST-00393 ! Rev 1.4 ! March-28-2011 1 1 dBpp MHz 7 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Package Handling Information Branding Information The device branding is shown in Figure 3. 2613T Figure 3: SE2613T Branding and Pin 1 Location Package Diagram The package diagram is shown in Figure 4. 16 15 14 13 13 14 15 16 1 12 12 1 2 11 11 2 3 10 10 3 4 9 9 4 5 6 7 8 8 7 6 5 TOP SIDE BOTTOM SIDE Figure 4: SE2613T Package Diagram DST-00393 ! Rev 1.4 ! March-28-2011 8 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Recommended PCB Footprint and Solder pattern 16 15 14 13 1 12 2 11 3 10 4 9 16 14 7 5 6 7 8 5 16 15 14 13 16 15 14 13 1 12 1 12 2 11 2 11 3 10 3 10 4 9 4 9 5 6 7 5 8 6 7 8 Figure 5: PCB Footprint and Solder pattern Package Handling Information Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE2613T is capable of withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For details on both attachment techniques, precautions, and handling procedures recommended by SiGe, please refer to: ! SiGe's Application Note: "QFN solder reflow and rework information application note", Document Number QAD00045 ! SiGe's Application Note: "Handling, packing, shipping and use of moisture sensitive QFN application note", Document Number QAD-00044 DST-00393 ! Rev 1.4 ! March-28-2011 9 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Tape and Reel Information Parameter Devices Per Reel Reel Diameter Tape Width Value 3000 13 inches 12 millimeters Figure 6: SE2613T-R Tape and Reel Information. DST-00393 ! Rev 1.4 ! March-28-2011 10 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary Document Change History Revision Date Notes 1.0 June-28-2010 Initial Release 1.1 October-01-2010 Updated package, pin out and technical specifications 1.2 October-11-2010 Updated Quiescent current 1.3 November-16-2010 Fixed typos. 1.4 March-28-2011 Updated specifications DST-00393 ! Rev 1.4 ! March-28-2011 11 of 12 SE2613T 2.4 GHz Wireless LAN/BT Front End Preliminary http://www.sige.com Email: sales@sige.com Customer Service Locations: North America: 1050 Morrison Drive, Suite 100 Ottawa ON K2H 8K7 Canada Hong Kong Phone: +852 3428 7222 Fax: +852 3579 5450 Phone: +1 613 820 9244 Fax: +1 613 820 4933 San Diego Phone: +1 858 668 3541 (ext. 226) Fax: +1 858 668 3546 United Kingdom Phone: +44 1279 464217 Fax: +44 1279 464201 Product Preview The datasheet contains information from the product concept specification. SiGe Semiconductor, Inc. reserves the right to change information at any time without notification. Preliminary Information The datasheet contains information from the design target specification. SiGe Semiconductor, Inc. reserves the right to change information at any time without notification. Production testing may not include testing of all parameters. Information furnished is believed to be accurate and reliable and is provided on an "as is" basis. SiGe Semiconductor, Inc. assumes no responsibility or liability for the direct or indirect consequences of use of such information nor for any infringement of patents or other rights of third parties, which may result from its use. No license or indemnity is granted by implication or otherwise under any patent or other intellectual property rights of SiGe Semiconductor, Inc. or third parties. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SiGe Semiconductor, Inc. products are NOT authorized for use in implantation or life support applications or systems without express written approval from SiGe Semiconductor, Inc. Copyright 2011 SiGe Semiconductor, Inc. All Rights Reserved DST-00393 ! Rev 1.4 ! March-28-2011 12 of 12