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Data Sheet FUJITSU Component Connector FCN-118X
Page 4 of 4 http://us.fujitsu.com/connectors
■
FG Spring 製品規格
DAPD-13-0048 1
2
7.半田付け条件(参考)Soldering condition (Reference only)
リフロー半田付け(赤外線リフロー) IR-Heat reflow
半田ペースト厚さ:0.12mm
Solder paste thickness
鉛フリーはんだ
Lead free solder
(1)温度上昇勾配
Temperature rising slope
4℃/秒以下
4℃/second or less
(2)予備加熱
Pre heat
160~180℃、160 秒以下
160~180℃、160 second Max.
(3)温度上昇勾配
Temperature rising slope
4℃/秒以下
4℃/second or less
(4)ʼ 220℃以上、40 秒以下
220℃ or more, 40 second Max.
(4)本加熱
Real heat
255~260℃、10 秒以下
255~260℃、10 second Max.
(5) 温度下降勾配
Temperature decreasing slope
自然空冷、または4℃/秒以下
Nature air-cooled or 4℃/second or less
260℃
220℃
160~180℃
(4)
(1)
(2) (3)
(5)
Peak temperature
Max. 260 degC
220 degC
Max. 4 degC/sec.
Max. 4 degC/sec.
255 to 260 degC
Min. 220 degC
Min. 40 sec.
160 to 180 degC
Preheat
Real heat Max. 10 sec.
Air cooling or max.4 degC
2.1
Pick & place point
Pick & place point
(Max. Ø 1.0)
0.125
Pick & place point
1.4
1.15
1.2
0.53
2.05
3.7
0.7
(0.8)
Contact point
PCB layout
(2.375)
Pick & place point
3.5
1.8
1.6
1.7
0.9
1.6
‘Operating range’ is the range where can get adequate electrical contacts when applied force to the spring.
‘Amount of displacement is the distance that the spring moves from the initial position (= no load) when applied force to the spring.
‘Working range’ is the distance from PCB surface to top of the spring inside operating range
■
Initial position (no load)
(1)
(2)
Operating range
PCB surface