DS-25DF011–052E–8/2017
High Temperature Operation (125°C)
This data sheet addendum is to be used in conjunction with the existing AT25DF011
datasheet specifications. The Adesto AT25DF011 1Mbit Serial Flash devices will
operate @ 125°C with the following datasheet caveats. All other parameters will meet
the existing datasheet specifications.
The ordering code suffix (CAN# Code) 'HR' or 'HT' must be used to ensure correct
operation at this extended temperature range. Adesto will not modify and republish the
current datasheet to reflect the CAN# ordering code or the above caveats.The
standard AT25DF011 datasheet is available at http://www.adestotech.com.
AT25DF011
1-Mbit, 1.7V-3.6V Minimum
SPI Serial Flash Memory
DATASHEET (ADDENDUM)
1. Electrical Specifications
1.2 DC, AC, Program and Erase Characteristics
1.1 DC and AC Operating Range
AT25DF011-xxxHR
Operating Temperature -40C to +125C
Endurance (Maximum) 20,000 Cycles
Symbol Parameter
1.7V to 3.6V 2.3V to 3.6V
Units
Min Typ Max Min Typ Max
IDPD Deep Power-Down Current 540 8.5 40 µA
ISB Standby Current 25 60 25 60 µA
ICC3 Active Current, Program Operation 12 18 12 18 mA
fRDLF Maximum Clock Frequency for 03h 25 25 MHz
tPP Page Program Time (256 Bytes) 1.8 71.8 5ms
tPE Page Erase Time 825 725 ms
tBLKE
Block Erase Time (4K) 50 120 50 120 ms
Block Erase Time (32K) 360 900 300 700 ms
tCHPE Chip Erase Time 1400 3600 1200 2500 ms
tBP Byte Program Time 12 12 µs
tCSH Chip Select High Time 40 25 ns
2. Ordering Code
2.1 Green Package Options (Pb/Halide-free/RoHS Compliant)
3. Revision History
Ordering Code (1)
1. The shipping carrier option code is not marked on the devices.
Package Operating Voltage
Max. Freq.
(MHz) Operation Range
AT25DF011-SSHNHR-T
8S1
1.7V to 3.6V 104MHz Extended
(-40°C to +125°C)
AT25DF011-SSHNHR-B
AT25DF011-XMHNHR-T
8X
AT25DF011-XMHNHR-B
AT25DF011-MAHNHR-T 8MA3
AT25DF011-DWFHT (2)
2. Contact Adesto for mechanical drawing or Die Sales information.
DWF
Package Type
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8X 8-lead, Thin Shrink Small Outline Package
8MA3 8-pad, 2 x 3 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)
DWF Die in Wafer Form
Revision Level – Release Date History
A - September 2014 Initial release.
B - October 2014 Updated AC and DC specifications.
C - January 2015 Added DFN and wafer form ordering codes. Updated Vcc range.
D - November 2015 Removed preliminary package note. Corrected units specification for Icc3 and tPE.
E- August 2017 Updated corporate address information.
Corporate Office
California | USA
Adesto Headquarters
3600 Peterson Way
Sanat Clara, CA 95054
Phone: (+1) 408.400.0578
Email: contact@adestotech.com
© 2015 Adesto Technologies. All rights reserved. / Rev.: DS-25DF011–052E–8/2017
