AT25DF011 1-Mbit, 1.7V-3.6V Minimum SPI Serial Flash Memory DATASHEET (ADDENDUM) High Temperature Operation (125C) This data sheet addendum is to be used in conjunction with the existing AT25DF011 datasheet specifications. The Adesto AT25DF011 1Mbit Serial Flash devices will operate @ 125C with the following datasheet caveats. All other parameters will meet the existing datasheet specifications. The ordering code suffix (CAN# Code) 'HR' or 'HT' must be used to ensure correct operation at this extended temperature range. Adesto will not modify and republish the current datasheet to reflect the CAN# ordering code or the above caveats.The standard AT25DF011 datasheet is available at http://www.adestotech.com. 1. Electrical Specifications 1.1 DC and AC Operating Range AT25DF011-xxxHR Operating Temperature -40C to +125C Endurance (Maximum) 20,000 Cycles 1.2 DC, AC, Program and Erase Characteristics 1.7V to 3.6V Symbol Parameter IDPD Min 2.3V to 3.6V Typ Max Units 40 8.5 40 A 25 60 25 60 A 12 18 12 18 mA 25 MHz Typ Max Deep Power-Down Current 5 ISB Standby Current ICC3 Active Current, Program Operation fRDLF Maximum Clock Frequency for 03h tPP Page Program Time (256 Bytes) tPE Min 25 1.8 7 1.8 5 ms Page Erase Time 8 25 7 25 ms Block Erase Time (4K) 50 120 50 120 ms Block Erase Time (32K) 360 900 300 700 ms tCHPE Chip Erase Time 1400 3600 1200 2500 ms tBP Byte Program Time tCSH Chip Select High Time tBLKE 12 40 12 25 s ns DS-25DF011-052E-8/2017 2. Ordering Code 2.1 Green Package Options (Pb/Halide-free/RoHS Compliant) Ordering Code (1) Package AT25DF011-SSHNHR-T Operating Voltage Max. Freq. (MHz) 1.7V to 3.6V 104MHz Operation Range 8S1 AT25DF011-SSHNHR-B AT25DF011-XMHNHR-T 8X AT25DF011-XMHNHR-B AT25DF011-MAHNHR-T 8MA3 AT25DF011-DWFHT (2) DWF Extended (-40C to +125C) 1. The shipping carrier option code is not marked on the devices. 2. Contact Adesto for mechanical drawing or Die Sales information. Package Type 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8X 8-lead, Thin Shrink Small Outline Package 8MA3 8-pad, 2 x 3 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) DWF Die in Wafer Form 3. Revision History Revision Level - Release Date History A - September 2014 Initial release. B - October 2014 Updated AC and DC specifications. C - January 2015 Added DFN and wafer form ordering codes. Updated Vcc range. D - November 2015 Removed preliminary package note. Corrected units specification for Icc3 and tPE. E- August 2017 Updated corporate address information. Corporate Office California | USA Adesto Headquarters 3600 Peterson Way Sanat Clara, CA 95054 Phone: (+1) 408.400.0578 Email: contact@adestotech.com (c) 2015 Adesto Technologies. All rights reserved. / Rev.: DS-25DF011-052E-8/2017