LM4865MM/NOPB - NATIONAL SEMICONDUCTOR

LM4865

LM4865 BOOMER 750 mW Audio Power Amplifier with DC Volume Controland

Headphone Switch

Literature Number: SNAS035F

LM4865

750 mW Audio Power Amplifier with DC Volume Control

and Headphone Switch

General Description

The LM4865 is a mono bridged audio power amplifier with

DC voltage volume control. The LM4865 is capable of deliv-

ering 750mW of continuous average power into an 8Ωload

with less than 1% THD when powered by a 5V power supply.

Switching between bridged speaker mode and headphone

(single ended) mode is accomplished using the headphone

sense pin. To conserve power in portable applications, the

LM4865’s micropower shutdown mode (I

= 0.7µA, typ) is

activated when less than 300mV is applied to the DC Vol/SD

pin.

Boomer audio power amplifiers are designed specifically to

provide high power audio output while maintaining high fidel-

ity. They require few external components and operate on

low supply voltages.

Applications

nGSM phones and accessories, DECT, office phones

nHand held radio

nOther portable audio devices

Key Specifications

at 1.0% THD+N into 8Ω

SO, micro SMD

750mW (typ)

at 10% THD+N into 8Ω

SO, micro SMD

1W (typ)

jShutdown current 0.7µA(typ)

jSupply voltage range 2.7V to 5.5V

Features

nDC voltage volume control

nHeadphone amplifier mode

n“Click and pop” suppression

nShutdown control when volume control pin is low

nThermal shutdown protection

Connection Diagrams

micro SMD Package

Small Outline Package (SO)

Mini Small Outline Package (MSOP)

10102536

Top View

Order Number LM4865IBP

See NS Package Number BPA08CFB

10102502

Top View

Order Number LM4865M, LM4865MM

See NS Package Number M08A, MUA08A

BOOMER™is a trademark of National Semiconductor Corporation.

October 2002

LM4865 750 mW Audio Power Amplifier with DC Volume Control and Headphone Switch

Typical Application

10102501

FIGURE 1. Typical Audio Amplifier

Application Circuit

(Numbers in ( ) are specific to the micro SMD package)

LM4865

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Absolute Maximum Ratings (Note 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage 6.0V

Storage Temperature −65˚C to +150˚C

Input Voltage −0.3V to V

+0.3V

Power Dissipation (Note 3) Internally Limited

ESD Susceptibility (Note 4) 2000V

ESD Susceptibility (Note 5) 200V

Junction Temperature 150˚C

Soldering Information

Vapor Phase (60 sec.) 215˚C

Infrared (15 sec.) 220˚C

Thermal Resistanc

(SOP) 35˚C/W

(SOP) 150˚C/W

(MSOP) 56˚C/W

(MSOP) 190˚C/W

(micro SMD) 150˚C/W

Operating Ratings

Temperature Range

MIN

≤T

MAX

−40˚C ≤T

≤+85˚C

Supply Voltage 2.7V ≤V

≤5.5V

See AN-450 “Surface Mounting and their Effects on Product

Reliability” for other methods of soldering surface mount

devices.

Electrical Characteristics (Notes 1, 2)

The following specifications apply for V

= 5V, unless otherwise specified. Limits apply for T

= 25˚C.

Symbol Parameter Conditions

LM4865

Min

(Note 7)

Typical

(Note 6)

Max

(Note 7) Units

Supply Voltage 2.7 5.5 V

Quiescent Power Supply

Current

= 0V, I

= 0A, HP Sense = 0V 4 7 mA

= 0V, I

- 0A, HP Sense = 5V 3.5 6 mA

Shutdown Current V

PIN4

≤0.3V 0.7 µA

Output Offset Voltage V

= 0V 5 50 mV

Output Power

THD = 1% (max), HP Sense <0.8V,

f = 1kHz, R

=8Ω500 750 mW

THD = 10% (max), HP Sense <0.8V,

f = 1kHz, R

=8Ω1.0 W

THD+N=1%,HPSense >4V,

f = 1kHz, R

=32Ω80 mW

THD = 10%, HP Sense >4V,

f = 1kHz, R

=32Ω110 mW

THD+N Total Harmonic Distortion +

Noise

= 300 mWrms, f = 20Hz–20kHz,

=8Ω0.6 %

PSRR Power Supply Rejection Ratio V

RIPPLE

= 200mVrms, R

=8Ω,C

1.0 µF, f = 1kHz 50 dB

Gain

RANGE

Single-Ended Gain Range Gain with V

PIN4

≥4.0V, (80% of V

) 18.8 20 dB

Gain with V

PIN4

≤0.9V, (18% of V

) −70 −72 dB

HP Sense High Input Voltage 4 V

HP Sense Low Input Voltage 0.8 V

Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.

Note 2: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. “Operating Ratings” indicate conditions for which the device

is functional, but do not guarantee specific performance limits. “Electrical Characteristics” state DC and AC electrical specifications under particular test conditions

that guarantee specific performance limits. This assumes that the device operates within the Operating Ratings. Specifications are not guaranteed for parameters

where no limit is given. The typical value, however, is a good indication of device performance.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature TA. The maximum

allowable power dissipation is PDMAX =(T

JMAX −T

A)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4865M, TJMAX =

150˚C.

Note 4: Human body model, 100pF discharged through a 1.5kΩresistor.

Note 5: Machine Model, 220pF–240pF discharged through all pins.

Note 6: Typicals are measured at 25˚C and represent the parametric norm.

Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 8: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.

LM4865

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External Components Description

(Figure 1 )

Components Functional Description

1. C

Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. It also creates a

highpass filter with the internal R

. The designer should note that10kOhm<(Ri)<110kOhm.Therefore f

1/(2πR

). Refer to the section, Proper Selection of External Components, for an explanation of how to

determine the value of C

2. C

Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing

section for information concerning proper placement and selection of the supply bypass capacitor.

3. C

Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of

External Components, for information concerning proper placement and selection of C

Typical Performance Characteristics

THD+N vs Frequency THD+N vs Frequency

10102505 10102506

THD+N vs Output Power THD+N vs Output Power

10102507

10102508

LM4865

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Typical Performance Characteristics (Continued)

THD+N vs Output Power THD+N vs Output Power

10102510 10102511

Power Dissipation vs Load Resistance Power Dissipation vs Output Power

10102512 10102513

Power Derating Curve Clipping Voltage vs RL

10102514 10102515

LM4865

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Typical Performance Characteristics (Continued)

Noise Floor

Frequency Response vs

Input Capacitor Size

10102516

10102517

Power Supply

Rejection Ratio

Attenuation Level vs

DC-Vol Amplitude

10102518 10102519

THD+N vs Frequency THD+N vs Frequency

10102520 10102521

LM4865

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Typical Performance Characteristics (Continued)

THD+N vs Frequency THD+N vs Output Power

10102522

10102523

THD+N vs Output Power THD+N vs Output Power

10102524 10102528

Output Power vs Load Resistance Clipping Voltage vs Supply Voltage

10102529 10102530

LM4865

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Typical Performance Characteristics (Continued)

Output Power vs Supply Voltage Output Power vs Supply Voltage

10102531 10102532

Supply Current vs Supply Voltage

10102533

Application Information

BRIDGE CONFIGURATION EXPLANATION

As shown in Figure 1, the LM4865 consists of two opera-

tional amplifiers internally. An external DC voltage sets the

closed-loop gain of the first amplifier, whereas two internal

20kΩresistors set the second amplifier’s gain at -1. The

LM4865 can be used to drive a speaker connected between

the two amplifier outputs or a monaural headphone con-

nected between V

1 and GND.

Figure 1 shows that the output of Amp1 serves as the input

to Amp2. This results in both amplifiers producing signals

that are identical in magnitude, but 180˚ out of phase.

Taking advantage of this phase difference, a load placed

between V

1 and V

2 is driven differentially (commonly

referred to as “bridge mode“ ). This mode is different from

single-ended driven loads that are connected between a

single amplifier’s output and ground.

Bridge mode has a distinct advantage over the single-ended

configuration: its differential drive to the load doubles the

output swing for a specified supply voltage. This results in

four times the output power when compared to a

single-ended amplifier under the same conditions. This in-

crease in attainable output assumes that the amplifier is not

current limited or the output signal is not clipped. To ensure

minimum output signal clipping when choosing an amplifier’s

closed-loop gain, refer to the Audio Power Amplifier De-

sign section.

Another advantage of the differential bridge output is no net

DC voltage across load. This results from biasing V

1 and

2 at half-supply. This eliminates the coupling capacitor

that single supply, single-ended amplifiers require. Eliminat-

ing an output coupling capacitor in a single-ended configu-

ration forces a single supply amplifier’s half-supply bias volt-

age across the load. The current flow created by the

half-supply bias voltage increases internal IC power dissipa-

tion and may permanently damage loads such as speakers.

POWER DISSIPATION

Power dissipation is a major concern when designing a

successful bridged or single-ended amplifier. Equation (1)

states the maximum power dissipation point for a

single-ended amplifier operating at a given supply voltage

and driving a specified output load.

DMAX

=(V

)

/(2π

) Single-Ended (1)

However, a direct consequence of the increased power de-

livered to the load by a bridge amplifier is an increase in

internal power dissipation point for a bridge amplifier oper-

ating at the same given conditions.

DMAX

= 4*(V

)

/(2π

) Bridge Mode (2)

The LM4865 has two operational amplifiers in one package

and the maximum internal power dissipation is 4 times that

LM4865

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Application Information (Continued)

of a single-ended amplifier. However, even with this substan-

tial increase in power dissipation, the LM4865 does not

require heatsinking. From Equation (2), assuming a 5V

power supply and an 8Ωload, the maximum power dissipa-

tion point is 633 mW. The maximum power dissipation point

obtained from Equation (2) must not be greater than the

power dissipation that results from Equation (3):

DMAX

=(T

JMAX

–T

)/θ

(3)

For the micro SMD and SO packages, θ

= 150˚C/W. The

MSO package has a 190˚C/W θ

JMAX

= 150˚C for the

LM4865. For a given ambient temperature T

, Equation (3)

can be used to find the maximum internal power dissipation

supported by the IC packaging. If the result of Equation (2) is

greater than that of Equation (3), then either decrease the

supply voltage, increase the load impedance, or reduce the

ambient temperature. For a typical application using the

micro SMD or SO packaged LM4865, a 5V power supply,

and an 8Ωload, the maximum ambient temperature that

does not violate the maximum junction temperature is ap-

proximately 55˚C. The maximum ambient temperature for

the MSO package with the same conditions is approximately

30˚C. These results further assume that a device is a surface

mount part operating around the maximum power dissipation

point. Since internal power dissipation is a function of output

power, higher ambient temperatures are allowed as output

power decreases. Refer to the Typical Performance Char-

acteristics curves for power dissipation information at lower

output power levels.

POWER SUPPLY BYPASSING

As with any power amplifier, proper supply bypassing is

critical for low noise performance and high power supply

rejection. The capacitors connected to the bypass and power

supply pins should be placed as close to the LM4865 as

possible. The capacitor connected between the bypass pin

and ground improves the internal bias voltage’s stability,

producing improved PSRR. The improvements to PSRR

increase as the bypass pin capacitor value increases. Typi-

cal applications employ a 5V regulator with 10µF and a

0.1µF filter capacitors that aid in supply stability. Their pres-

ence, however does not eliminate the need for bypassing the

supply nodes of the LM4865. The selection of bypass ca-

pacitor values, especially C

, depends on desired PSRR

requirements, click and pop performance (as explained in

the section, Proper Selection of External Components),

system cost, and size constraints.

DC VOLTAGE VOLUME CONTROL

The LM4865 has internal volume control that is controlled by

the DC voltage applied its DC Vol/SD pin (pin 5 on the micro

SMD and pin 4 on the MSOP and SOP packages). The

volume control’s input range is from GND to V

. A graph

showing a typical volume response versus input control

voltage is shown in the Typical Performance Characteris-

ticssection. The DC Vol/SD pin also functions as the control

pin for the LM4865’s micropower shutdown feature. See

theShutdown Function section for more information.

Like all volume controls, the LM4865’s internal volume con-

trol is set while listening to an amplified signal that is applied

to an external speaker. The actual voltage applied to the DC

Vol/SD pin is a result of the volume a listener desires. As

such, the volume control is designed for use in a feedback

system that includes human ears and preferences. This

feedback system operates quite well without the need for

accurate gain. The user simply sets the volume to the de-

sired level as determined by their ear, without regard to the

actual DC voltage that produces the volume. Therefore, the

accuracy of the volume control is not critical, as long as

volume changes monotonically and step size is small

enough to reach a desired volume that is not too loud or too

soft. Since gain accuracy is not critical, there will be volume

variation from part-to-part even with the same applied DC

control voltage. The gain of a given LM4865 can be set with

a fixed external voltage, but another LM4865 may require a

different control voltage to achieve the same gain. Figure 2 is

a curve showing the volume variation of twenty typical

LM4865s as the voltage applied to the DC Vol/SD pin is

varied. For gains greater than unity, the typical part-to-part

variation can be as large as 8dB for the same control volt-

age.

MUTE AND SHUTDOWN FUNCTION

The LM4865’s mute and shutdown functions are controlled

through the DC Vol/SD pin. Mute is activated by applying a

voltage in the range of 500mV to 1V. A typical attenuation of

75dB is achieved is while mute is active. The LM4865’s

micropower shutdown mode turns off the amplifier’s bias

circuitry. The micropower shutdown mode is activated by

applying less than 300mV

to the DC Vol/SD pin. When

shutdown is active, they supply current is reduced to 0.7µA

(typ). A degree of uncertainty exists when the voltage applied

to the DC Vol/SD pin is in the range of 300mV to 500mV. The

LM4865 can be in mute, still fully powered, or in micropower

shutdown and fully muted. In mute mode, the LM4865 draws

the typical quiescent supply current. The DC Vol/SD pin

should be tied to GND for best shutdown mode performance.

As the DC Vol/SD is increased above 0.5V the amplifier will

follow the attenuation curve in Typical Performance Char-

acteristics.

HP-Sense FUNCTION

Applying a voltage between 4V and V

to the LM4865’s

HP-Sense headphone control pin turns off Amp2 and mutes

a bridged-connected load. Quiescent current consumption is

reduced when the IC is in this single-ended mode.

Figure 3 shows the implementation of the LM4865’s head-

phone control function. With no headphones connected to

the headphone jack, the R1-R2 voltage divider sets the

10102547

FIGURE 2. Typical part-to-part gain variation as a

function of DC-Vol control voltage

LM4865

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Application Information (Continued)

voltage applied to the HP-Sense pin (pin 3) at approximately

50mV. This 50mV enables the LM4865 and places it in

bridged mode operation.

While the LM4865 operates in bridged mode, the DC poten-

tial across the load is essentially 0V. Since the HP-Sense

threshold is set at 4V, even in an ideal situation, the output

swing cannot cause a false single-ended trigger. Connecting

headphones to the headphone jack disconnects the head-

phone jack contact pin from V

1 and allows R1 to pull the

HP Sense pin up to V

. This enables the headphone func-

tion, turns off Amp2, and mutes the bridged speaker. The

amplifier then drives the headphones, whose impedance is

in parallel with resistor R2. Resistor R2 has negligible effect

on output drive capability since the typical impedance of

headphones is 32Ω. The output coupling capacitor blocks

the amplifier’s half supply DC voltage, protecting the head-

phones.

A microprocessor or a switch can replace the headphone

jack contact pin. When a microprocessor or switch applies a

voltage greater than 4V to the HP Sense pin, a bridge-

connected speaker is muted and Amp1 drives the head-

phones.

PROPERLY SELECTING EXTERNAL COMPONENTS

Optimizing the LM4865’s performance requires properly se-

lecting external components. Though the LM4865 operates

well when using external components having wide toler-

ances, the best performance is achieved by optimizing com-

ponent values.

Input Capacitor Value Selection

Amplification of the lowest audio frequencies requires high

value input coupling capacitors. These high value capacitors

can be expensive and may compromise space efficiency in

portable designs. In many cases, however, the speakers

used in portable systems, whether internal or external, have

little ability to reproduce signals below 150Hz. In application

5 using speakers with this limited frequency response, a

large input capacitor will offer little improvement in system

performance.

Figure 1 shows that the nominal input impedance (R

)is

10kΩat maximum volume and 110kΩat minimum volume.

Together, the input capacitor, C

, and R

, produce a -3dB

high pass filter cutoff frequency that is found using Equation

(4).

(4)

As the volume changes from minimum to maximum, R

decrease from 110kΩto 10kΩ. Equation (4) reveals that the

-3dB frequency will increase as the volume increases. The

nominal value of C

for lowest desired frequency response

should be calculated with R

= 10kΩ. As an example when

using a speaker with a low frequency limit of 150Hz, C

using Equation (4) is 0.1µF. The 0.22µF C

shown in Figure 1

is optimized for a speaker whose response extends down to

75Hz.

Bypass Capacitor Value Selection

Besides minimizing the input capacitor size, careful consid-

eration should be paid to value of the bypass capacitor C

Since C

determines how fast the LM4865 turns on, its value

is the most critical when minimizing turn-on pops. The slower

the LM4865’s outputs ramp to their quiescent DC voltage

(nominally V

/2), the smaller the turn-on pop. Choosing C

equal to 1.0µF, along with a small value of C

(in the range of

0.1µF to 0.39µF), produces a clickless and popless shut-

down function. Choosing C

as small as possible helps mini-

mize clicks and pops.

CLICK AND POP CIRCUITRY

The LM4865 contains circuitry that minimizes turn-on and

shutdown transients or ’clicks and pops’. For this discussion,

turn-on refers to either applying the power supply voltage or

when the shutdown mode is deactivated. While the power

supply is ramping to its final value, the LM4865’s internal

amplifiers are configured as unity gain buffers. An internal

current source changes the voltage of the bypass pin in a

controlled, linear manner. Ideally, the input and outputs track

the voltage applied to the bypass pin. The gain of the internal

amplifiers remains unity until the voltage on the bypass pin

reaches 1/2 V

. As soon as the voltage on the bypass pin

is stable, the device becomes fully operational and the gain

is set by the external voltage applied to the DC Vol/SD pin.

Although the bypass pin current cannot be modified, chang-

ing the size of C

alters the device’s turn-on time and the

magnitude of ’clicks and pops’. Increasing the value of C

reduces the magnitude of turn-on pops. However, this pre-

sents a tradeoff: as the size of C

increases, the turn-on time

increases. There is a linear relationship between the size of

CB and the turn-on time. Shown below are some typical

turn-on times for various values of C

0.01µF 20ms

0.1µF 200ms

0.22µF 420ms

0.47µF 840ms

1.0µF 2sec

In order eliminate ’clicks and pops’, all capacitors must be

discharged before turn-on. Rapidly switching V

may not

allow the capacitors to fully discharge, which may cause

’clicks and pops’. In a single-ended configuration, the output

coupling capacitor, C

OUT

, is of particular concern. This ca-

pacitor discharges through an internal 20kΩresistor. De-

pending on the size of C

OUT

, the time constant can be

relatively large. To reduce transients in single-ended mode,

10102534

FIGURE 3. Headphone Circuit

LM4865

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Application Information (Continued)

an external 1kΩ-5kΩresistor can be placed in parallel with

the internal 20kΩresistor. The tradeoff for using this resistor

is increased quiescent current.

RECOMMENDED PRINTED CIRCUIT BOARD LAYOUT

Figure 4 through Figure 6 show the recommended two-layer

PC board layout that is optimized for the SO-8 packaged

LM4865 and associated external components. Figure 7

through Figure 11 show the recommended four-layer PC

board layout for the micro SMD packaged LM4865. A

four-layer board is recommended when using the micro

SMD packaged LM4865: the two inner layers, one con-

nected to the GND pin, the other to the V

pin, provide

heatsinking. Both layouts are designed for use with an ex-

ternal 5V supply, 8Ωspeakers, and 32Ωheadphones. The

schematic for both recommended PC board layouts is Figure

Both circuit boards are easy to use. Apply a 5V supply

voltage and ground to the board’s V

and GND pads,

respectively. Connect a speaker with an 8Ωminimum imped-

ance between the board’s -OUT and +OUT pads. For head-

phone use, the layout has provisions for a headphone jack,

J1. When a jack is connected as shown, inserting a head-

phone plug automatically switches off the external speaker.

10102538

FIGURE 4. Recommended SO PC board layout:

component side silkscreen

10102539

FIGURE 5. Recommended SO PC board layout:

component side layout

10102540

FIGURE 6. Recommended SO PC board layout:

bottom side layout

LM4865

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Application Information (Continued)

10102541

FIGURE 7. Recommended micro SMD PC board layout:

component side silkscreen

10102542

FIGURE 8. Recommended micro SMD PC board layout:

component side layout

10102543

FIGURE 9. Recommended micro SMD PC board layout:

Inner layer V

layout

10102544

FIGURE 10. Recommended micro SMD PC board

layout:

Inner layer ground layout

LM4865

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Application Information (Continued)

10102545

FIGURE 11. Recommended micro SMD PC board

layout:

bottom side layout

LM4865

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Physical Dimensions inches (millimeters) unless otherwise noted

Order Number LM4865M

NS Package Number M08A

LM4865

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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

8-Lead (0.118’ Wide) Molded Mini Small Outline Package

Order Number LM4865MM

NS Package Number MUAO8A

LM4865

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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

8-Bump micro SMD

Order Number LM4865IBP, LM4865IBPX

NS Package Number BPA08CFB

X1 = 1.336±0.03 X2 = 1.412±0.03 X3 = 0.850±0.10

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COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:

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systems which, (a) are intended for surgical implant

into the body, or (b) support or sustain life, and

whose failure to perform when properly used in

accordance with instructions for use provided in the

labeling, can be reasonably expected to result in a

significant injury to the user.

2. A critical component is any component of a life

support device or system whose failure to perform

can be reasonably expected to cause the failure of

the life support device or system, or to affect its

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www.national.com

LM4865 750 mW Audio Power Amplifier with DC Volume Control and Headphone Switch

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

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specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265