January 2018 Rev 91/48
1
M29W400DT
M29W400DB
4 Mbit (512 Kb x 8 or 256 Kb x 16, boot block)
3 V supply Flash memory
Features
Supply voltage
–V
CC = 2.7 V to 3.6 V for Program, Erase
and Read
Access time: 45, 55, 70 ns
Programming time
–10μs per byte/word typical
11 memory blocks
– 1 boot block (top or bottom location)
– 2 parameter and 8 main blocks
Program/Erase controller
– Embedded byte/word program algorithms
Erase Suspend and Resume modes
– Read and Program another block during
Erase Suspend
Unlock bypass program command
– Faster production/batch programming
Temporary block unprotection mode
Low power consumption
– Standby and Automatic Standby
100,000 Program/Erase cycles per block
Electronic signature
– Manufacturer code: 0020h
– Top device code M29W400DT: 00EEh
– Bottom device code M29W400DB: 00EFh
– RoHS packages
Automotive Device Grade 3
– Temperature: –40 to 125 °C
– Automotive grade certified
1. These packages are no more in mass production.
TFBGA48 (ZA)(1)
6 x 9 mm
FBGA
SO44 (M)(1)
TFBGA48 (ZE)
6 x 8 mm
TSOP48 (N)
12 x 20 mm
FBGA
www.numonyx.com
Contents M29W400DT, M29W400DB
2/48
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Address inputs (A0-A17) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2 Data inputs/outputs (DQ0-DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3 Data inputs/outputs (DQ8-DQ14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4 Data input/output or Address input (DQ15A-1) . . . . . . . . . . . . . . . . . . . . 13
2.5 Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.6 Output Enable (G) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.7 Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.8 Reset/Block Temporary Unprotect (RP) . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.9 Ready/Busy output (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.10 Byte/Word Organization Select (BYTE) . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.11 VCC supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.12 VSS ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 Bus Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.2 Bus Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3 Output Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.4 Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.5 Automatic Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.6 Special bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8 Block protection and blocks unprotection . . . . . . . . . . . . . . . . . . . . . . . . . 17
4 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 Read/Reset command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.2 Auto Select command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.3 Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.4 Unlock Bypass command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.5 Unlock Bypass Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
M29W400DT, M29W400DB Contents
3/48
4.6 Unlock Bypass Reset command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.7 Chip Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.8 Block Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.9 Erase Suspend command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.10 Erase Resume command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.11 Block Protect and Chip Unprotect commands . . . . . . . . . . . . . . . . . . . . . 22
5 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1 Data Polling bit (DQ7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.2 Toggle bit (DQ6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.3 Error bit (DQ5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.4 Erase Timer bit (DQ3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.5 Alternative Toggle bit (DQ2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
7 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
9 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Appendix A Block address table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Appendix B Block protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
B.1 Programmer technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
B.2 In-system technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
List of tables M29W400DT, M29W400DB
4/48
List of tables
Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. Bus operations, BYTE = VIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 3. Bus operations, BYTE = VIH. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 4. Program, Erase times and Program, Erase endurance cycles. . . . . . . . . . . . . . . . . . . . . . 22
Table 5. Commands, 16-bit mode, BYTE = VIH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 6. Commands, 8-bit mode, BYTE = VIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 7. Status Register bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 8. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 9. Operating and AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 10. Device capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 11. DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 12. Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 13. Write AC characteristics, Write Enable controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 14. Write AC characteristics, Chip Enable controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 15. Reset/Block Temporary Unprotect AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 16. SO44 – 44 lead plastic small outline, 525 mils body width, package mechanical data . . . 35
Table 17. TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package mechanical data . . . . 36
Table 18. TFBGA48 6 x 9 mm, 6 x 8 active ball array, 0.80 mm pitch, package mechanical data. . . 37
Table 19. TFBGA48 6 x 8 mm, 6 x 8 active ball array, 0.80 mm pitch, package mechanical data. . . 38
Table 20. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 21. Top boot block addresses M29W400DT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 22. Bottom boot block addresses M29W400DB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 23. Programmer technique bus operations, BYTE =V
IH or VIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 24. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
M29W400DT, M29W400DB List of figures
5/48
List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 2. SO connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3. TSOP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 4. TFBGA connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Block addresses (x 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Block addresses (x 16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 7. Data polling flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 8. Data toggle flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 9. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 10. AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 11. Read mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 12. Write AC waveforms, Write Enable controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 13. Write AC waveforms, Chip Enable controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 14. Reset/Block Temporary Unprotect AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 15. SO44 - 44 lead plastic small outline, 525 mils body width, package outline. . . . . . . . . . . . 35
Figure 16. TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package outline . . . . . . . . . . . . 36
Figure 17. TFBGA48 6 x 9 mm, 6 x 8 active ball array, 0.80 mm pitch, bottom view package outline 37
Figure 18. TFBGA48 6 x 8 mm, 6 x 8 active ball array, 0.80 mm pitch, bottom view package outline 38
Figure 19. Programmer equipment block protect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 20. Programmer equipment chip unprotect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 21. In-system equipment block protect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 22. In-system equipment chip unprotect flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this
document, including without limitation specifications and product descriptions. This document
supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any
information set forth in this document if you obtain the product described herein from any unauthorized
distributor or other source not authorized by Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications
unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor
and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron
harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of,
directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting
directly or indirectly from any use of nonautomotive-grade products in automotive applications.
Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and
any customer of distributor/customer (1) state that Micron products are not designed or intended for use
in automotive applications unless specifically designated by Micron as automotive-grade by their
respective data sheets and (2) require such customer of distributor/customer to indemnify and hold
Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees
arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property
damage resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron
component could result, directly or indirectly in death, personal injury, or severe property or
environmental damage ("Critical Applications"). Customer must protect against death, personal injury,
and severe property and environmental damage by incorporating safety design measures into
customer's applications to ensure that failure of the Micron component will not result in such harms.
Should customer or distributor purchase, use, or sell any Micron component for any critical application,
customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors,
and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and
expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability,
personal injury, or death arising in any way out of such critical application, whether or not Micron or its
subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of
their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS
HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE
RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR
THE CUSTOMER'S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate
design, manufacturing, and operating safeguards are included in customer's applications and products to
eliminate the risk that personal injury, death, or severe property or environmental damages will result
from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or
consequential damages (including without limitation lost profits, lost savings, business interruption, costs
related to the removal or replacement of any products or rework charges) whether or not such damages
are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written
agreement executed by Micron's duly authorized representative.
Description M29W400DT, M29W400DB
6/48
1 Description
The M29W400D is a 4 Mbit (512 K x 8 or 256 K x 16) non-volatile memory that can be read,
erased and reprogrammed. These operations can be performed using a single low voltage
(2.7 to 3.6 V) supply. On power-up the memory defaults to its Read mode where it can be
read in the same way as a ROM or EPROM.
The memory is divided into blocks that can be erased independently so it is possible to
preserve valid data while old data is erased. Each block can be protected independently to
prevent accidental Program or Erase commands from modifying the memory. Program and
Erase commands are written to the command interface of the memory. An on-chip
Program/Erase controller simplifies the process of programming or erasing the memory by
taking care of all of the special operations that are required to update the memory contents.
The end of a program or erase operation can be detected and any error conditions
identified. The command set required to control the memory is consistent with JEDEC
standards.
The blocks in the memory are asymmetrically arranged, see Figure 5 and Figure 6, Block
addresses. The first or last 64 Kbytes have been divided into four additional blocks. The
16 Kbyte boot block can be used for small initialization code to start the microprocessor, the
two 8 Kbyte parameter blocks can be used for parameter storage and the remaining
32 Kbyte is a small main block where the application may be stored.
Chip Enable, Output Enable and Write Enable signals control the bus operation of the
memory. They allow simple connection to most microprocessors, often without additional
logic.
The memory is offered in SO44, TSOP48 (12 x 20 mm), TFBGA48 0.8 mm pitch (6 x 9 mm
and 6 x 8 mm) packages. The memory is supplied with all the bits erased (set to ’1’).
In order to meet environmental requirements, Numonyx offers the M29W400D in RoHS
packages, which are Lead-free. The category of second level interconnect is marked on the
package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label.
M29W400DT, M29W400DB Description
7/48
Figure 1. Logi c diagram
Tabl e 1. Signal n ames
Signal name Function Direction
A0-A17 Address inputs Inputs
DQ0-DQ7 Data inputs/outputs I/O
DQ8-DQ14 Data inputs/outputs I/O
DQ15A–1 Data input/output or Address input I/O
EChip Enable Input
GOutput Enable Input
WWrite Enable Input
RP Reset/Block Temporary Unprotect Input
RB Ready/Busy output Output
BYTE Byte/word organization select Input
VCC Supply voltage
VSS Ground
NC Not connected internally
AI06853
18
A0-A17
W
DQ0-DQ14
VCC
M29W400DT
M29W400DB
E
VSS
15
G
RP
DQ15A–1
BYTE
RB
Description M29W400DT, M29W400DB
8/48
Figure 2. S O co nnections
1. NC = Not connected.
G
DQ0
DQ8
A3
A0
E
VSS
A2
A1
A13
VSS
A14
A15
DQ7
A12
A16
BYTE
DQ15A–1
DQ5DQ2
DQ3 VCC
DQ11 DQ4
DQ14
A9
W
RB
A4
RP
A7
AI06855
M29W400DT
M29W400DB
8
2
3
4
5
6
7
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
2322
20
19
18
17DQ1
DQ9
A6
A5
DQ6
DQ13
44
39
38
37
36
35
34
33
A11
A10
DQ10 21 DQ12
40
43
1
42
41
A17 A8
NC
M29W400DT, M29W400DB Description
9/48
Figure 3. TS OP connect ion s
1. NC = Not connected.
DQ3
DQ9
DQ2
A6 DQ0
W
A3
RB
DQ6
A8
A9 DQ13
A17
A10 DQ14
A2
DQ12
DQ10
DQ15A–1
VCC
DQ4
DQ5
A7
DQ7
NC
NC
AI06854
M29W400DT
M29W400DB
12
1
13
24 25
36
37
48
DQ8
NC
NC
A1
NC
A4
A5
DQ1
DQ11
G
A12
A13
A16
A11
BYTE
A15
A14 VSS
E
A0
RP
VSS
Description M29W400DT, M29W400DB
10/48
Figure 4. TFBGA c onnections (to p view through packa ge)
1. NC = Not connected.
AI06856
B
A
4321
G
F
H
DQ15
A–1
A7
A3
DQ10DQ8E
DQ13DQ11
DQ9
G
VSS
DQ6DQ1VSS
DQ14
A12
NCA17
A4
A14A10NCNCA6A2
RP A8
DQ4
DQ3
VCC
DQ12
A9
BYTE
A15A11NCA1
A16DQ7DQ5DQ2A0
NC
DQ0
A5
E
D
C
RB W A13
65
M29W400DT, M29W400DB Description
11/48
Fig u re 5. Block addr ess es (x 8)
1. Also see Appendix A: Block address table, Table 21: Top boot block addresses M29W400DT and
Table 22: Bottom boot block addresses M29W400DB for a full listing of the block addresses.
AI06857b
16 Kbyte
7FFFFh
7C000h
64 Kbyte
1FFFFh
10000h
64 Kbyte
0FFFFh
00000h
M29W400DT
Top boot block addresses (x 8)
32 Kbyte
77FFFh
70000h
64 Kbyte
60000h
6FFFFh
Total of 7
64 Kbyte blocks
16 Kbyte
7FFFFh
70000h 64 Kbyte
64 Kbyte
03FFFh
00000h
M29W400DB
Bottom boot block addresses (x 8)
32 Kbyte
6FFFFh
1FFFFh 64 Kbyte
60000h
10000h
Total of 7
64 Kbyte block
s
0FFFFh
08000h
8 Kbyte
8 Kbyte
7BFFFh
7A000h
79FFFh
78000h
8 Kbyte
8 Kbyte
07FFFh
06000h
05FFFh
04000h
Description M29W400DT, M29W400DB
12/48
Fig u re 6. Block addr ess es (x 16)
1. Also see Appendix A: Block address table, Table 21: Top boot block addresses M29W400DT and
Table 22: Bottom boot block addresses M29W400DB for a full listing of the block addresses.
AI06858b
8 Kword
3FFFFh
3E000h
32 Kword
0FFFFh
08000h
32 Kword
07FFFh
00000h
M29W400DT
Top boot block addresses (x 16)
16 Kword
3BFFFh
38000h
32 Kword
30000h
37FFFh
Total of 7
32 Kword blocks
8 Kword
3FFFFh
38000h 32 Kword
32 Kword
01FFFh
00000h
M29W400DB
Bottom boot block addresses (x 16)
16 Kword
37FFFh
0FFFFh 32 Kword
30000h
08000h
Total of 7
32 Kword blocks
07FFFh
04000h
4 Kword
4 Kword
3DFFFh
3D000h
3CFFFh
3C000h
4 Kword
4 Kword
03FFFh
03000h
02FFFh
02000h
M29W400DT, M29W400DB Signal descriptions
13/48
2 Signal descriptions
See Figure 1: Logi c diagr am, and Table : , for a brief overview of the signals connected to
this device.
2.1 Address inputs (A0-A17)
The Address inputs select the cells in the memory array to access during Bus Read
operations. During Bus Write operations they control the commands sent to the command
interface of the Program/Erase controller.
2.2 Data inputs/outputs (DQ0-DQ7)
The Data inputs/outputs output the data stored at the selected address during a Bus Read
operation. During Bus Write operations they represent the commands sent to the command
interface of the Program/Erase controller.
2.3 Data inputs/outputs (DQ8-DQ14)
The Data inputs/outputs output the data stored at the selected address during a Bus Read
operation when BYTE is High, VIH. When BYTE is Low, VIL, these pins are not used and are
high impedance. During Bus Write operations the Command Register does not use these
bits. When reading the Status Register these bits should be ignored.
2.4 Data input/output or Address input (DQ15A-1)
When BYTE is High, VIH, this pin behaves as a Data input/output pin (as DQ8-DQ14). When
BYTE is Low, VIL, this pin behaves as an address pin; DQ15A–1 Low will select the LSB of
the word on the other addresses, DQ15A–1 High will select the MSB. Throughout the text
consider references to the Data input/output to include this pin when BYTE is High and
references to the Address inputs to include this pin when BYTE is Low except when stated
explicitly otherwise.
2.5 Chip Enable (E)
The Chip Enable, E, activates the memory, allowing Bus Read and Bus Write operations to
be performed. When Chip Enable is High, VIH, all other pins are ignored.
2.6 Output Enable (G)
The Output Enable, G, controls the Bus Read operation of the memory.
Signal descripti o n s M29W 400DT , M29W 400DB
14/48
2.7 Write Enable (W)
The Write Enable, W, controls the Bus Write operation of the memory’s command interface.
2.8 Reset/Block Temporary Unprotect (RP)
The Reset/Block Temporary Unprotect pin can be used to apply a hardware reset to the
memory or to temporarily unprotect all blocks that have been protected.
A hardware reset is achieved by holding Reset/Block Temporary Unprotect Low, VIL, for at
least tPLPX. After Reset/Block Temporary Unprotect goes High, VIH, the memory will be
ready for Bus Read and Bus Write operations after tPHEL or tRHEL, whichever occurs last.
See the Ready/Busy output section, Tab l e 15: R eset/Bl ock Temporary Unprotect AC
characteristics and Figure 14: Reset/Block Temporary Unprotect AC waveforms, for more
details.
Holding RP at VID will temporarily unprotect the protected blocks in the memory. Program
and Erase operations on all blocks will be possible. The transition from VIH to VID must be
slower than tPHPHH.
2.9 Re ady/B usy output (RB)
The Ready/Busy pin is an open-drain output that can be used to identify when the memory
array can be read. Ready/Busy is high-impedance during Read mode, Auto Select mode
and Erase Suspend mode.
After a Hardware Reset, Bus Read and Bus Write operations cannot begin until Ready/Busy
becomes high-impedance. See Table 15: Re set/Bl ock Temporar y Unpr ot ect AC
characteristics and Figure 14: Reset/Block Temporary Unprotect AC waveforms.
During Program or Erase operations Ready/Busy is Low, VOL. Ready/Busy will remain Low
during Read/Reset commands or hardware resets until the memory is ready to enter Read
mode.
2.10 Byte/Word Organization Select (BYTE)
The Byte/Word Organization Select pin is used to switch between the 8-bit and 16-bit Bus
modes of the memory. When Byte/Word Organization Select is Low, VIL, the memory is in 8-
bit mode, when it is High, VIH, the memory is in 16-bit mode.
M29W400DT, M29W400DB Signal descriptions
15/48
2.11 VCC supply voltage
The VCC supply voltage supplies the power for all operations (Read, Program, Erase etc.).
The command interface is disabled when the VCC supply voltage is less than the lockout
voltage, VLKO. This prevents Bus Write operations from accidentally damaging the data
during power-up, power-down and power surges. If the Program/Erase controller is
programming or erasing during this time then the operation aborts and the memory contents
being altered will be invalid.
A 0.1 μF capacitor should be connected between the VCC supply voltage pin and the VSS
ground pin to decouple the current surges from the power supply. The PCB track widths
must be sufficient to carry the currents required during program and erase operations, ICC3.
2.12 VSS ground
The VSS ground is the reference for all voltage measurements.
Bus op eratio n s M29W 400D T , M2 9W400DB
16/48
3 Bus operations
There are five standard bus operations that control the device. These are Bus Read, Bus
Write, Output Disable, Standby and Automatic Standby. See Table 2 and Table 3, Bus
operations, for a summary. Typically glitches of less than 5 ns on Chip Enable or Write
Enable are ignored by the memory and do not affect bus operations.
3.1 Bus Read
Bus Read operations read from the memory cells, or specific registers in the command
interface. A valid Bus Read operation involves setting the desired address on the Address
inputs, applying a Low signal, VIL, to Chip Enable and Output Enable and keeping Write
Enable High, VIH. The Data inputs/outputs will output the value, see F i gure 11: Re ad mode
AC wavefor ms , and Table 12: Read AC c harac t erist i cs, for details of when the output
becomes valid.
3.2 Bus Write
Bus Write operations write to the command interface. A valid Bus Write operation begins by
setting the desired address on the Address inputs. The Address inputs are latched by the
command interface on the falling edge of Chip Enable or Write Enable, whichever occurs
last. The Data inputs/outputs are latched by the command interface on the rising edge of
Chip Enable or Write Enable, whichever occurs first. Output Enable must remain High, VIH,
during the whole Bus Write operation. See Figure 12 and Figure 13, Write AC waveforms,
and Table 13 and Table 14, Write AC characteristics, for details of the timing requirements.
3.3 Output Disable
The Data inputs/outputs are in the high impedance state when Output Enable is High, VIH.
3.4 Standby
When Chip Enable is High, VIH, the memory enters Standby mode and the Data
inputs/outputs pins are placed in the high-impedance state. To reduce the Supply current to
the Standby Supply current, ICC2, Chip Enable should be held within VCC ± 0.2 V. For the
Standby current level see Tabl e 11: DC char acteri stics.
During program or erase operations the memory will continue to use the Program/Erase
Supply current, ICC3, for Program or Erase operations until the operation completes.
3.5 Automatic Standby
If CMOS levels (VCC ± 0.2 V) are used to drive the bus and the bus is inactive for 150 ns or
more the memory enters Automatic Standby where the internal Supply current is reduced to
the Standby Supply current, ICC2. The Data inputs/outputs will still output data if a Bus Read
operation is in progress.
M29W400DT, M29W400DB Bus operations
17/48
3.6 Special bus operations
Additional bus operations can be performed to read the electronic signature and also to
apply and remove block protection. These bus operations are intended for use by
programming equipment and are not usually used in applications. They require VID to be
applied to some pins.
3.7 Electronic signature
The memory has two codes, the manufacturer code and the device code, that can be read
to identify the memory. These codes can be read by applying the signals listed in Table 2
and Table 3, Bus operations.
3.8 Block protection and blocks unprotection
Each block can be separately protected against accidental Program or Erase. Protected
blocks can be unprotected to allow data to be changed.
There are two methods available for protecting and unprotecting the blocks, one for use on
programming equipment and the other for in-system use. Block Protect and Chip Unprotect
operations are described in Appendi x B: Bl ock protect i on.
Table 2. Bus operations, BYTE = VIL(1)
1. X = VIL or VIH.
Operation E G W Address inputs
DQ15A–1, A0-A17
Data inputs/outputs
DQ14-DQ8 DQ7-DQ0
Bus Read VIL VIL VIH Cell address Hi-Z Data output
Bus Write VIL VIH VIL Command address Hi-Z Data input
Output Disable X VIH VIH X Hi-Z Hi-Z
Standby VIH X X X Hi-Z Hi-Z
Read
manufacturer code VIL VIL VIH
A0 = VIL, A1 = VIL,
A9 = VID,
others VIL or VIH
Hi-Z 20h
Read device code VIL VIL VIH
A0 = VIH, A1 = VIL,
A9 = VID,
others VIL or VIH
Hi-Z
EEh
(M29W400DT)
EFh
(M29W400DB)
Bus op eratio n s M29W 400D T , M2 9W400DB
18/48
1. X = VIL or VIH.
Table 3. Bus operations, BYTE = VIH
Operation E G W Address inputs
A0-A17 Data inputs/outputs
DQ15A–1, DQ14-DQ0
Bus Read VIL VIL VIH Cell address Data output
Bus Write VIL VIH VIL Command address Data input
Output Disable X VIH VIH X Hi-Z
Standby VIH X X X Hi-Z
Read manufacturer
code VIL VIL VIH
A0 = VIL, A1 = VIL,
A9 = VID,
others VIL or VIH
0020h
Read device code VIL VIL VIH
A0 = VIH, A1 = VIL,
A9 = VID,
others VIL or VIH
00EEh (M29W400DT)
00EFh (M29W400DB)
M29W400DT, M29W400DB Command interface
19/48
4 Command interface
All Bus Write operations to the memory are interpreted by the command interface.
Commands consist of one or more sequential Bus Write operations. Failure to observe a
valid sequence of Bus Write operations will result in the memory returning to Read mode.
The long command sequences are imposed to maximize data security.
The address used for the commands changes depending on whether the memory is in 16-
bit or 8-bit mode. See either Table 5, or Table 6, depending on the configuration that is being
used, for a summary of the commands.
4.1 Read/Reset command
The Read/Reset command returns the memory to its Read mode where it behaves like a
ROM or EPROM, unless otherwise stated. It also resets the errors in the Status Register.
Either one or three Bus Write operations can be used to issue the Read/Reset command.
The Read/Reset command can be issued, between Bus Write cycles before the start of a
program or erase operation, to return the device to Read mode. Once the program or erase
operation has started the Read/Reset command is no longer accepted. The Read/Reset
command will not abort an Erase operation when issued while in Erase Suspend.
4.2 Auto Select command
The Auto Select command is used to read the manufacturer code, the device code and the
Block Protection status. Three consecutive Bus Write operations are required to issue the
Auto Select command. Once the Auto Select command is issued the memory remains in
Auto Select mode until another command is issued.
From the Auto Select mode the manufacturer code can be read using a Bus Read operation
with A0 = VIL and A1 = VIL. The other address bits may be set to either VIL or VIH. The
manufacturer code for Numonyx is 0020h.
The device code can be read using a Bus Read operation with A0 = VIH and A1 = VIL. The
other address bits may be set to either VIL or VIH. The device code for the M29W400DT is
00EEh and for the M29W400DB is 00EFh.
The Block Protection status of each block can be read using a Bus Read operation with
A0 = VIL, A1 = VIH, and A12-A17 specifying the address of the block. The other address bits
may be set to either VIL or VIH. If the addressed block is protected then 01h is output on
Data inputs/outputs DQ0-DQ7, otherwise 00h is output.
4.3 Program command
The Program command can be used to program a value to one address in the memory
array at a time. The command requires four Bus Write operations, the final write operation
latches the address and data and starts the Program/Erase controller.
If the address falls in a protected block then the Program command is ignored, the data
remains unchanged. The Status Register is never read and no error condition is given.
Command interf ace M29W400D T, M29W400DB
20/48
During the program operation the memory will ignore all commands. It is not possible to
issue any command to abort or pause the operation. Typical program times are given in
T able 4: Program, Erase times and Program, Erase endurance cycles. Bus Read operations
during the program operation will output the Status Register on the Data inputs/outputs. See
the section on the Status Register for more details.
After the program operation has completed the memory will return to the Read mode, unless
an error has occurred. When an error occurs the memory will continue to output the Status
Register. A Read/Reset command must be issued to reset the error condition and return to
Read mode.
Note that the Program command cannot change a bit set at ’0’ back to ’1’. One of the Erase
commands must be used to set all the bits in a block or in the whole memory from ’0’ to ’1’.
4.4 Unlock Bypass command
The Unlock Bypass command is used in conjunction with the Unlock Bypass Program
command to program the memory. When the access time to the device is long (as with
some EPROM programmers) considerable time saving can be made by using these
commands. Three Bus Write operations are required to issue the Unlock Bypass command.
Once the Unlock Bypass command has been issued the memory will only accept the Unlock
Bypass Program command and the Unlock Bypass Reset command. The memory can be
read as if in Read mode.
4.5 Unlock Bypass Program command
The Unlock Bypass Program command can be used to program one address in memory at
a time. The command requires two Bus Write operations, the final write operation latches
the address and data and starts the Program/Erase controller.
The Program operation using the Unlock Bypass Program command behaves identically to
the Program operation using the Program command. A protected block cannot be
programmed; the operation cannot be aborted and the Status Register is read. Errors must
be reset using the Read/Reset command, which leaves the device in Unlock Bypass mode.
See the Program command for details on the behavior.
4.6 Unlock Bypass Reset co mmand
The Unlock Bypass Reset command can be used to return to Read/Reset mode from
Unlock Bypass mode. Two Bus Write operations are required to issue the Unlock Bypass
Reset command. Read/Reset command does not exit from Unlock Bypass mode.
4.7 Chip Erase command
The Chip Erase command can be used to erase the entire chip. Six Bus Write operations
are required to issue the Chip Erase command and start the Program/Erase controller.
If any blocks are protected then these are ignored and all the other blocks are erased. If all
of the blocks are protected the Chip Erase operation appears to start but will terminate
M29W400DT, M29W400DB Command interface
21/48
within about 100 μs, leaving the data unchanged. No error condition is given when protected
blocks are ignored.
During the erase operation the memory will ignore all commands. It is not possible to issue
any command to abort the operation. Typical chip erase times are given in Table 4. All Bus
Read operations during the Chip Erase operation will output the Status Register on the Data
inputs/outputs. See the section on the Status Register for more details.
After the Chip Erase operation has completed the memory will return to the Read mode,
unless an error has occurred. When an error occurs the memory will continue to output the
Status Register. A Read/Reset command must be issued to reset the error condition and
return to Read mode.
The Chip Erase command sets all of the bits in unprotected blocks of the memory to ’1’. All
previous data is lost.
4.8 Block Erase command
The Block Erase command can be used to erase a list of one or more blocks. Six Bus Write
operations are required to select the first block in the list. Each additional block in the list can
be selected by repeating the sixth Bus Write operation using the address of the additional
block. The Block Erase operation starts the Program/Erase controller about 50 μs after the
last Bus Write operation. Once the Program/Erase controller starts it is not possible to select
any more blocks. Each additional block must therefore be selected within 50 μs of the last
block. The 50 μs timer restarts when an additional block is selected. The Status Register
can be read after the sixth Bus Write operation. See the Status Register for details on how to
identify if the Program/Erase controller has started the Block Erase operation.
If any selected blocks are protected then these are ignored and all the other selected blocks
are erased. If all of the selected blocks are protected the Block Erase operation appears to
start but will terminate within about 100 μs, leaving the data unchanged. No error condition
is given when protected blocks are ignored.
During the Block Erase operation the memory will ignore all commands except the Erase
Suspend command. Typical block erase times are given in Table 4. All Bus Read operations
during the Block Erase operation will output the Status Register on the Data inputs/outputs.
See the section on the Status Register for more details.
After the Block Erase operation has completed the memory will return to the Read mode,
unless an error has occurred. When an error occurs the memory will continue to output the
Status Register. A Read/Reset command must be issued to reset the error condition and
return to Read mode.
The Block Erase command sets all of the bits in the unprotected selected blocks to ’1’. All
previous data in the selected blocks is lost.
4.9 Erase Suspend command
The Erase Suspend command may be used to temporarily suspend a Block Erase
operation and return the memory to Read mode. The command requires one Bus Write
operation.
The Program/Erase controller will suspend within the Erase Suspend Latency time after the
Erase Suspend command is issued (see Table 4 for numerical values). Once the
Command interf ace M29W400D T, M29W400DB
22/48
Program/Erase controller has stopped the memory will be set to Read mode and the Erase
will be suspended. If the Erase Suspend command is issued during the period when the
memory is waiting for an additional block (before the Program/Erase controller starts) then
the Erase is suspended immediately and will start immediately when the Erase Resume
command is issued. It is not possible to select any further blocks to erase after the Erase
Resume.
During Erase Suspend it is possible to Read and Program cells in blocks that are not being
erased; both Read and Program operations behave as normal on these blocks. If any
attempt is made to program in a protected block or in the suspended block then the Program
command is ignored and the data remains unchanged. The Status Register is not read and
no error condition is given. Reading from blocks that are being erased will output the Status
Register.
It is also possible to issue the Auto Select and Unlock Bypass commands during an Erase
Suspend. The Read/Reset command must be issued to return the device to Read Array
mode before the Resume command will be accepted.
4.10 Erase Resume command
The Erase Resume command must be used to restart the Program/Erase controller from
Erase Suspend. An erase can be suspended and resumed more than once.
4.11 Block Protect and Chip Unprot ect comm ands
Each block can be separately protected against accidental program or erase. The whole
chip can be unprotected to allow the data inside the blocks to be changed.
Block Protect and Chip Unprotect operations are described in App endix B : Bl ock protect i on.
Table 4. Program, Erase times and Program, Erase endura nce cycles
Parameter Min Typ(1)(2)
1. Typical values measured at room temperature and nominal voltages.
Max(2)
2. Sampled, but not 100% tested.
Unit
Chip Erase (all bits in the memory set to ‘0’) 2.5 s
Chip Erase 6 12(3)
3. Maximum value measured at worst case conditions for both temperature and VCC after 100,000
Program/Erase cycles.
s
Block Erase (64 Kbytes) 0.8 1.6(4)
4. Maximum value measured at worst case conditions for both temperature and VCC.
s
Program (byte or word) 10 200(3) μs
Chip Program (byte by byte) 5.5 30(3) s
Chip Program (word by word) 2.8 15(3) s
Erase Suspend latency time 18 25(4) μs
Program/Erase cycles (per block) 100,000 cycles
Data retention 20 years
M29W400DT, M29W400DB Command interface
23/48
Ta ble 5. C om m ands , 16-bit mode , BYTE = VIH(1)
Command
Length
Bus Write operations
1st 2nd 3rd 4th 5th 6th
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Read/Reset 1X F0
3 555 AA 2AA 55 X F0
Auto Select 3 555 AA 2AA 55 555 90
Program 4 555 AA 2AA 55 555 A0 PA PD
Unlock Bypass 3 555 AA 2AA 55 555 20
Unlock Bypass
Program 2 X A0 PA PD
Unlock Bypass
Reset 2X 90 X00
Chip Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 555 10
Block Erase 6+ 555 AA 2AA 55 555 80 555 AA 2AA 55 BA 30
Erase Suspend 1 X B0
Erase Resume 1 X 30
1. X Don’t care, PA Program Address, PD Program Data, BA Any address in the block. All values in the table are in
hexadecimal. The command interface only uses A-1; A0-A10 and DQ0-DQ7 to verify the commands; A11-A17, DQ8-DQ14
and DQ15 are Don't care. DQ15A-1 is A-1 when BYTE is VIL or DQ15 when BYTE is VIH.
Ta ble 6. C om m ands , 8-bit mode, BYTE = VIL(1)
Command
Length
Bus Write operations
1st 2nd 3rd 4th 5th 6th
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Read/Reset
1X F0
3 AAA AA 555 55 X F0
Auto Select 3 AAA AA 555 55 AAA 90
Program 4 AAA AA 555 55 AAA A0 PA PD
Unlock Bypass 3 AAA AA 555 55 AAA 20
Unlock Bypass
Program 2X A0PAPD
Unlock Bypass Reset 2 X 90 X 00
Chip Erase 6 AAA AA 555 55 AAA 80 AAA AA 555 55 AAA 10
Block Erase 6+ AAA AA 555 55 AAA 80 AAA AA 555 55 BA 30
Erase Suspend 1 X B0
Erase Resume 1 X 30
1. X Don’t care, PA Program Address, PD Program Data, BA Any address in the block. All values in the table are in
hexadecimal. The command interface only uses A-1; A0-A10 and DQ0-DQ7 to verify the commands; A11-A17, DQ8-DQ14
and DQ15 are Don't care. DQ15A-1 is A-1 when BYTE is VIL or DQ15 when BYTE is VIH.
Stat u s Regi ster M29W 400D T , M29W 400DB
24/48
5 Status Register
Bus Read operations from any address always read the Status Register during Program
and Erase operations. It is also read during Erase Suspend when an address within a block
being erased is accessed.
The bits in the Status Register are summarized in Tab l e 7: Status Re gi ster bits.
5.1 Data Polling bit (DQ7)
The Data Polling bit can be used to identify whether the Program/Erase controller has
successfully completed its operation or if it has responded to an Erase Suspend. The Data
Polling bit is output on DQ7 when the Status Register is read.
During Program operations the Data Polling bit outputs the complement of the bit being
programmed to DQ7. After successful completion of the Program operation the memory
returns to Read mode and Bus Read operations from the address just programmed output
DQ7, not its complement.
During Erase operations the Data Polling bit outputs ’0’, the complement of the erased state
of DQ7. After successful completion of the Erase operation the memory returns to Read
mode.
In Erase Suspend mode the Data Polling bit will output a ’1’ during a Bus Read operation
within a block being erased. The Data Polling bit will change from a ’0’ to a ’1’ when the
Program/Erase controller has suspended the Erase operation.
Figure 7: Dat a polling flowchart, gives an example of how to use the Data Polling bit. A valid
address is the address being programmed or an address within the block being erased.
5.2 Toggle bit (DQ6)
The Toggle bit can be used to identify whether the Program/Erase controller has
successfully completed its operation or if it has responded to an Erase Suspend. The Toggle
bit is output on DQ6 when the Status Register is read.
During Program and Erase operations the Toggle bit changes from ’0’ to ’1’ to ’0’, etc., with
successive Bus Read operations at any address. After successful completion of the
operation the memory returns to Read mode.
During Erase Suspend mode the Toggle bit will output when addressing a cell within a block
being erased. The Toggle bit will stop toggling when the Program/Erase controller has
suspended the Erase operation.
If any attempt is made to erase a protected block, the operation is aborted, no error is
signalled and DQ6 toggles for approximately 100 μs. If any attempt is made to program a
protected block or a suspended block, the operation is aborted, no error is signalled and
DQ6 toggles for approximately 1 μs.
Figure 8: Data toggle flowchart, gives an example of how to use the Data Toggle bit.
M29W400DT, M29W400DB Status Register
25/48
5.3 Error bit (DQ5)
The Error bit can be used to identify errors detected by the Program/Erase controller. The
Error bit is set to ’1’ when a Program, Block Erase or Chip Erase operation fails to write the
correct data to the memory. If the Error bit is set a Read/Reset command must be issued
before other commands are issued. The Error bit is output on DQ5 when the Status Register
is read.
Note that the Program command cannot change a bit set to ’0’ back to ’1’ and attempting to
do so will set DQ5 to ‘1’. A Bus Read operation to that address will show the bit is still ‘0’.
One of the Erase commands must be used to set all the bits in a block or in the whole
memory from ’0’ to ’1’
5.4 Erase Timer bit (DQ3)
The Erase Timer bit can be used to identify the start of Program/Erase controller operation
during a Block Erase command. Once the Program/Erase controller starts erasing, the
Erase Timer bit is set to ’1’. Before the Program/Erase controller starts the Erase Timer bit is
set to ‘0’ and additional blocks to be erased may be written to the command interface. The
Erase Timer bit is output on DQ3 when the Status Register is read.
5.5 Alternative Toggle bit (DQ2)
The Alternative Toggle bit can be used to monitor the Program/Erase controller during Erase
operations. The Alternative Toggle bit is output on DQ2 when the Status Register is read.
During Chip Erase and Block Erase operations the Toggle bit changes from ’0’ to ’1’ to ’0’,
etc., with successive Bus Read operations from addresses within the blocks being erased.
A protected block is treated the same as a block not being erased. Once the operation
completes the memory returns to Read mode.
During Erase Suspend the Alternative Toggle bit changes from ’0’ to ’1’ to ’0’, etc. with
successive Bus Read operations from addresses within the blocks being erased. Bus Read
operations to addresses within blocks not being erased will output the memory cell data as if
in Read mode.
After an Erase operation that causes the Error bit to be set the Alternative Toggle bit can be
used to identify which block or blocks have caused the error. The Alternative Toggle bit
changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read operations from addresses
within blocks that have not erased correctly. The Alternative Toggle bit does not change if
the addressed block has erased correctly.
Tabl e 7. Status Register bits(1)
Operation Address DQ7 DQ6 DQ5 DQ3 DQ2 RB
Program Any address DQ7 Toggle0––0
Program during
Erase Suspend Any address DQ7 Toggle0––0
Program Error Any address DQ7 Toggle1––0
Chip Erase Any address 0 Toggle 0 1 Toggle 0
Stat u s Regi ster M29W 400D T , M29W 400DB
26/48
Figure 7. Data polling flowchart
Block Erase
before timeout
Erasing block 0 Toggle 0 0 Toggle 0
Non-erasing
block 0 Toggle 0 0 No
To g g le 0
Block Erase
Erasing block 0 Toggle 0 1 Toggle 0
Non-erasing
block 0 Toggle 0 1 No
To g g le 0
Erase Suspend
Erasing block 1 No
To g g le 0–Toggle1
Non-erasing
block Data read as normal 1
Erase Error
Good block
address 0 Toggle 1 1 No
To g g le 0
Faulty block
address 0 Toggle 1 1 Toggle 0
1. Unspecified data bits should be ignored.
Tabl e 7. Status Register bits(1) (continue d)
Operation Address DQ7 DQ6 DQ5 DQ3 DQ2 RB
READ DQ5 & DQ7
at VALID ADDRESS
START
READ DQ7
at VALID ADDRESS
FAIL PASS
AI03598
DQ7
=
DATA YES
NO
YES
NO
DQ5
= 1
DQ7
=
DATA YES
NO
M29W400DT, M29W400DB Status Register
27/48
Figure 8. Da ta tog gle flowchart
READ DQ6
START
READ DQ6
TWICE
FAIL PASS
AI01370C
DQ6
=
TOGGLE NO
NO
YES
YES
DQ5
= 1
NO
YES
DQ6
=
TOGGLE
READ
DQ5 & DQ6
Max im u m rating M29W 400D T , M2 9W400DB
28/48
6 Maximum rating
Stressing the device above the rating listed in Table 8: Absolute maximum ratings may
cause permanent damage to the device. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability. These are stress ratings only and
operation of the device at these or any other conditions above those indicated in the
operating sections of this specification is not implied. Refer also to the Numonyx SURE
Program and other relevant quality documents.
Tabl e 8. Absol u te maximu m ra tings
Symbol Parameter Min Max Unit
TBIAS Temperature under bias –50 125 °C
TSTG Storage temperature –65 150 °C
TLEAD Lead temperature during soldering (1)
1. Compliant with the JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assermbly), the Numonyx RoHS
specification, and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
°C
VIO Input or output voltage(2)(3)
2. Minimum voltage may undershoot to –2 V during transition and for less than 20 ns during transitions.
3. Maximum voltage may overshoot to VCC+2 V during transition and for less than 20 ns during transitions.
–0.6 VCC+0.6 V
VCC Supply voltage –0.6 4 V
VID Identification voltage –0.6 13.5 V
M29W400DT, M29W400DB DC and AC parameters
29/48
7 DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables that
follow, are derived from tests performed under the measurement conditions summarized in
Table 9: Ope rat i ng and AC m easu rem ent condit i ons. Designers should check that the
operating conditions in their circuit match the operating conditions when relying on the
quoted parameters.
Figure 9. AC meas ureme n t I/O waveform
Fig u re 10. AC me asureme n t load circuit
Table 9. Operating and AC measurement conditions
Parameter
M29W400D
Unit45 55 70
Min Max Min Max Min Max
VCC supply voltage 3.0 3.6 2.7 3.6 2.7 3.6 V
Ambient operating temperature (range 6) –40 85 –40 85 –40 85
°C
Ambient operating temperature (range 1) 0 70 0 70 0 70
Load capacitance (CL) 30 30 100 pF
Input rise and fall times 10 10 10 ns
Input pulse voltages 0 to VCC 0 to VCC 0 to VCC V
Input and output timing ref. voltages VCC/2 VCC/2 VCC/2 V
AI04498
VCC
0 V
VCC/2
AI0449
9
CL
CL includes JIG capacitance
DEVICE
UNDER
TEST
25 kΩ
VCC
25 kΩ
VCC
0.1 µF
DC and AC parameters M29W400D T , M29W 400DB
30/48
Figure 11 . Re ad mode A C waveforms
Table 10. Device capacitance(1)
1. Sampled only, not 100% tested.
Symbol Parameter Test Condition Min M ax Unit
CIN Input capacitance VIN = 0 V 6 pF
COUT Output capacitance VOUT = 0 V 12 pF
Tabl e 11. DC ch arac teris tics
Symbol Parameter Test condition Min Max Unit
ILI Input Leakage current 0 V ≤ VIN ≤ VCC ±1 μA
ILO Output Leakage current 0 V ≤ VOUT ≤ VCC ±1 μA
ICC1 Supply current (Read) E=V
IL, G =V
IH,
f=6MHz 10 mA
ICC2 Supply current (Standby) E = VCC ±0.2V,
RP =V
CC ±0.2V 100 μA
ICC3(1)
1. Sampled only, not 100% tested.
Supply current
(Program/Erase)
Program/Erase
controller active 20 mA
VIL Input Low voltage –0.5 0.8 V
VIH Input High voltage 0.7VCC VCC +0.3 V
VOL Output Low voltage IOL = 1.8 mA 0.45 V
VOH Output High voltage IOH = –100 μAV
CC –0.4 V
VID Identification voltage 11.5 12.5 V
IID Identification current A9 = VID 100 μA
VLKO
Program/Erase Lockout supply
voltage 1.8 2.3 V
AI02907
tAVAV
tAVQV tAXQX
tELQX tEHQZ
tGLQV
tGLQX tGHQX
VALID
A0-A17/
A–1
G
DQ0-DQ7/
DQ8-DQ15
E
tELQV tEHQX
tGHQZ
VALID
tBHQV
tELBL/tELBH tBLQZ
BYTE
M29W400DT, M29W400DB DC and AC parameters
31/48
Table 12. Read AC ch aracte risti cs
Symbol Alt Parameter Test condition M29W400D Unit
45 55 70
tAVAV tRC Address Valid to Next Address Valid E=V
IL,
G=V
IL
Min 45 55 70 ns
tAVQV tACC Address Valid to Output Valid E=V
IL,
G=V
IL
Max 45 55 70 ns
tELQX(1) tLZ Chip Enable Low to Output Transition G =V
IL Min000ns
tELQV tCE Chip Enable Low to Output Valid G =V
IL Max 45 55 70 ns
tGLQX(1) tOLZ
Output Enable Low to Output
Transition E=V
IL Min000ns
tGLQV tOE Output Enable Low to Output Valid E =V
IL Max 25 30 35 ns
tEHQZ(1) tHZ Chip Enable High to Output Hi-Z G =V
IL Max 20 25 30 ns
tGHQZ(1) tDF Output Enable High to Output Hi-Z E =V
IL Max 20 25 30 ns
tEHQX
tGHQX
tAXQX
tOH
Chip Enable, Output Enable or
Address Transition to Output
Transition
Min000ns
tELBL
tELBH
tELFL
tELFH
Chip Enable to BYTE Low or High Max 5 5 5 ns
tBLQZ tFLQZ BYTE Low to Output Hi-Z Max 25 25 30 ns
tBHQV tFHQV BYTE High to Output Valid Max 30 30 40 ns
1. Sampled only, not 100% tested.
DC and AC parameters M29W400D T , M29W 400DB
32/48
Figu re 12. Wri te AC waveform s, Write Enab le controlled
AI01869C
E
G
W
A0-A17/
A–1
DQ0-DQ7/
DQ8-DQ15
VALID
VALID
VCC
tVCHEL
tWHEH
tWHWL
tELWL
tAVWL
tWHGL
tWLAX
tWHDX
tAVAV
tDVWH
tWLWHtGHWL
RB
tWHRL
Table 13. W r ite AC char acteri s tics, W rite En ab l e co n troll ed
Symbol Alt Parameter M29W400D Unit
45 55 70
tAVAV tWC Address Valid to Next Address Valid Min 45 55 70 ns
tELWL tCS Chip Enable Low to Write Enable Low Min 0 0 0 ns
tWLWH tWP Write Enable Low to Write Enable High Min 30 30 30 ns
tDVWH tDS Input Valid to Write Enable High Min 25 30 45 ns
tWHDX tDH Write Enable High to Input Transition Min 0 0 0 ns
tWHEH tCH Write Enable High to Chip Enable High Min 0 0 0 ns
tWHWL tWPH Write Enable High to Write Enable Low Min 30 30 30 ns
tAVWL tAS Address Valid to Write Enable Low Min 0 0 0 ns
tWLAX tAH Write Enable Low to Address Transition Min 40 45 45 ns
tGHWL Output Enable High to Write Enable Low Min 0 0 0 ns
tWHGL tOEH Write Enable High to Output Enable Low Min 0 0 0 ns
tWHRL(1) tBUSY Program/Erase Valid to RB Low Max 30 30 35 ns
tVCHEL tVCS VCC High to Chip Enable Low Min 50 50 50 μs
1. Sampled only, not 100% tested.
M29W400DT, M29W400DB DC and AC parameters
33/48
Figure 13. Write AC wave form s, Chip Enable cont rolled
AI01870C
E
G
W
A0-A17/
A–1
DQ0-DQ7/
DQ8-DQ15
VALID
VALID
VCC
tVCHWL
tEHWH
tEHEL
tWLEL
tAVEL
tEHGL
tELAX
tEHDX
tAVAV
tDVEH
tELEHtGHEL
RB
tEHRL
Table 14. Write AC characteristics, Chip Enable controlled
Symbol Alt Parameter M29W400D Unit
45 55 70
tAVAV tWC Address Valid to Next Address Valid Min 45 55 70 ns
tWLEL tWS Write Enable Low to Chip Enable Low Min 0 0 0 ns
tELEH tCP Chip Enable Low to Chip Enable High Min 30 30 30 ns
tDVEH tDS Input Valid to Chip Enable High Min 25 30 45 ns
tEHDX tDH Chip Enable High to Input Transition Min 0 0 0 ns
tEHWH tWH Chip Enable High to Write Enable High Min 0 0 0 ns
tEHEL tCPH Chip Enable High to Chip Enable Low Min 30 30 30 ns
tAVEL tAS Address Valid to Chip Enable Low Min 0 0 0 ns
tELAX tAH Chip Enable Low to Address Transition Min 40 45 45 ns
tGHEL Output Enable High Chip Enable Low Min 0 0 0 ns
tEHGL tOEH Chip Enable High to Output Enable Low Min 0 0 0 ns
tEHRL(1) tBUSY Program/Erase Valid to RB Low Max 30 30 35 ns
tVCHWL tVCS VCC High to Write Enable Low Min 50 50 50 μs
1. Sampled only, not 100% tested.
DC and AC parameters M29W400D T , M29W 400DB
34/48
Fig ur e 14. Reset/Block Tempo rary Unpro tect A C wavefo rms
AI02931
RB
W,
RP tPLPX
tPHWL, tPHEL, tPHGL
tPLYH
tPHPHH
E, G
tRHWL, tRHEL, tRHGL
Table 15. Res et/ Blo ck Tempo rary Unpro tect AC characte ri stic s
Symbol Alt Parameter M29W400D Unit
45 55 70
tPHWL(1)
tPHEL
tPHGL(1)
tRH
RP High to Write Enable Low, Chip Enable
Low, Output Enable Low Min 505050 ns
tRHWL(1)
tRHEL(1)
tRHGL(1)
tRB
RB High to Write Enable Low, Chip Enable
Low, Output Enable Low Min000 ns
tPLPX tRP RP Pulse width Min 500 500 500 ns
tPLYH(1) tREADY RP Low to Read mode Max 10 10 10 μs
tPHPHH(1) tVIDR RP Rise time to VID Min 500 500 500 ns
1. Sampled only, not 100% tested.
M29W400DT, M29W400DB Package mechanical
35/48
8 Package mechanical
Figure 15. SO44 - 44 lead plastic small outline, 525 mils body wid th, package outline
1. Drawing is not to scale.
Table 16. SO44 – 44 lead plastic smal l outline , 525 mils body wi dth, package
mechani cal data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 2.80 0.110
A1 0.10 0.004
A2 2.30 2.20 2.40 0.091 0.087 0.094
b 0.40 0.35 0.50 0.016 0.014 0.020
C 0.15 0.10 0.20 0.006 0.004 0.008
CP 0.08 0.003
D 28.20 28.00 28.40 1.110 1.102 1.118
E 13.30 13.20 13.50 0.524 0.520 0.531
EH 16.00 15.75 16.25 0.630 0.620 0.640
e 1.27 – – 0.050 – –
L 0.80 0.031
a8 8
N44 44
SO-d
E
N
D
C
LA1 α
EH
A
1
eCP
b
A2
Package mechanical M29W400DT, M29W400DB
36/48
Figure 16. TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package outline
1. Drawing is not to scale.
Table 17. TSOP48 – 48 lead plastic thin small outline, 12 x 20 mm, package
mechani cal data
Symbol millimeters inches
Typ Min Max Typ Min Max
A1.200.047
A1 0.10 0.05 0.15 0.004 0.002 0.006
A2 1.00 0.95 1.05 0.039 0.037 0.041
B 0.22 0.17 0.27 0.009 0.007 0.011
C 0.10 0.21 0.004 0.008
CP 0.08 0.003
D1 12.00 11.90 12.10 0.472 0.468 0.476
E 20.00 19.80 20.20 0.787 0.779 0.795
E1 18.40 18.30 18.50 0.724 0.720 0.728
e 0.50 – – 0.020 – –
L 0.60 0.50 0.70 0.024 0.020 0.028
L1 0.80 0.031
a305305
TSOP-G
B
e
DIE
C
LA1 α
E1
E
A
A2
1
24
48
25
D1
L1
CP
M29W400DT, M29W400DB Package mechanical
37/48
Figu r e 17. TFBGA48 6 x 9 mm , 6 x 8 active ba ll array, 0 .80 mm pitch , bottom view
package outline
1. Drawing is not to scale.
Table 18. T FBGA 48 6 x 9 mm, 6 x 8 active b all array, 0.80 mm pi tch, package
mechani cal data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 1.20 0.047
A1 0.20 0.008
A2 1.00 0.039
b 0.40 0.35 0.45 0.016 0.014 0.018
D 6.00 5.90 6.10 0.236 0.232 0.240
D1 4.00 – – 0.157 – –
ddd 0.10 0.004
E 9.00 8.90 9.10 0.354 0.350 0.358
e 0.80 – – 0.031 – –
E1 5.60 – – 0.220 – –
FD 1.00 – – 0.039 – –
FE 1.70 – – 0.067 – –
SD 0.40 – – 0.016 – –
SE 0.40 – – 0.016 – –
E1E
D1
D
eb
A2
A1
A
BGA-Z00
ddd
FD
FE SD
SE
e
BALL "A1"
Package mechanical M29W400DT, M29W400DB
38/48
Figu r e 18. TFBGA48 6 x 8 mm , 6 x 8 active ba ll array, 0.80 mm pitc h , bottom view
package outline
1. Drawing is not to scale.
Table 19. T FBGA 48 6 x 8 mm, 6 x 8 active b all array, 0.80 mm pi tch, package
mechani cal data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 1.20 0.047
A1 0.26 0.010
A2 0.90 0.035
b 0.35 0.45 0.014 0.018
D 6.00 5.90 6.10 0.236 0.232 0.240
D1 4.00 – – 0.157 – –
ddd 0.10 0.004
E 8.00 7.90 8.10 0.315 0.311 0.319
E1 5.60 – – 0.220 – –
e 0.80 – – 0.031 – –
FD 1.00 – – 0.039 – –
FE 1.20 – – 0.047 – –
SD 0.40 – – 0.016 – –
SE 0.40 – – 0.016 – –
E1E
D1
D
eb
A2
A1
A
BGA-Z32
ddd
FD
FE SD
SE
e
BALL "A1"
M29W400DT, M29W400DB Part numbering
39/48
9 Part numbering
Table 20. Ordering information scheme
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact the Numonyx Sales Office nearest to you.
Example: M29W400DT 55 N 6 T
Device ty p e
M29
Operating voltage
W = VCC = 2.7 to 3.6 V
Device Function
400D = 4 Mbit (512 K x 8 or 256 K x 16), boot block
Arra y matrix
T = Top boot
B = Bottom boot
Speed
45 = 45 ns
55 = 55 ns
70 = 70 ns
Package
M = SO44
N = TSOP48: 12 x 20 mm
ZA = TFBGA48: 6 x 9 mm
ZE = TFBGA48: 6 x 8 mm
Temp erature range
6 = –40 to 85 °C
3(1) = Automotive grade certified(2) (–40 to 125 °C)
1. Automotive grade 3 part is available only for the speed class 55 ns, package type TSOP48, 12 x 20 mm,
bottom configuration.
2. The part is qualfied and tested according to the AEC-Q100 rev. G specifications.
1 = 0 to 70 °C
Option
Blank = Standard packing
T = Tape & Reel packing
E = RoHS package, standard packing
F = RoHS package, Tape & Reel packing
Block address table M29W400DT, M29W400DB
40/48
Appendix A Block address table
Tabl e 21. Top bo ot block addresses M 29W40 0DT
# Size (Kbytes) Address range (x 8) Address rang e (x 16)
10 16 7C000h-7FFFFh 3E000h-3FFFFh
9 8 7A000h-7BFFFh 3D000h-3DFFFh
8 8 78000h-79FFFh 3C000h-3CFFFh
7 32 70000h-77FFFh 38000h-3BFFFh
6 64 60000h-6FFFFh 30000h-37FFFh
5 64 50000h-5FFFFh 28000h-2FFFFh
4 64 40000h-4FFFFh 20000h-27FFFh
3 64 30000h-3FFFFh 18000h-1FFFFh
2 64 20000h-2FFFFh 10000h-17FFFh
1 64 10000h-1FFFFh 08000h-0FFFFh
0 64 00000h-0FFFFh 00000h-07FFFh
Table 22. Bottom boot block addresses M29W400DB
# Size (Kbytes) Address range (x 8) Address rang e (x 16)
10 64 70000h-7FFFFh 38000h-3FFFFh
9 64 60000h-6FFFFh 30000h-37FFFh
8 64 50000h-5FFFFh 28000h-2FFFFh
7 64 40000h-4FFFFh 20000h-27FFFh
6 64 30000h-3FFFFh 18000h-1FFFFh
5 64 20000h-2FFFFh 10000h-17FFFh
4 64 10000h-1FFFFh 08000h-0FFFFh
3 32 08000h-0FFFFh 04000h-07FFFh
2 8 06000h-07FFFh 03000h-03FFFh
1 8 04000h-05FFFh 02000h-02FFFh
0 16 00000h-03FFFh 00000h-01FFFh
M29W400DT, M29W400DB Block protection
41/48
Appendix B Block protection
Block protection can be used to prevent any operation from modifying the data stored in the
Flash. Each block can be protected individually. Once protected, Program and Erase
operations on the block fail to change the data.
There are three techniques that can be used to control block protection, these are the
programmer technique, the in-system technique and temporary unprotection. temporary
unprotection is controlled by the Reset/Block Temporary Unprotection pin, RP; this is
described in the Section 2: Signal descriptions.
Unlike the command interface of the Program/Erase controller, the techniques for protecting
and unprotecting blocks change between different Flash memory suppliers. For example,
the techniques for AMD parts will not work on Numonyx parts. Care should be taken when
changing drivers for one part to work on another.
B.1 Programmer technique
The programmer technique uses high (VID) voltage levels on some of the bus pins. These
cannot be achieved using a standard microprocessor bus, therefore the technique is
recommended only for use in programming equipment.
To protect a block follow the flowchart in Figu re 19: Programmer eq ui pment bl ock prote ct
flowchart. To unprotect the whole chip it is necessary to protect all of the blocks first, then all
blocks can be unprotected at the same time. To unprotect the chip follow Figure 20:
Pr ogramm er eq ui pm ent chip unp rote ct flowchart. Table 23: Progra m mer techni que bu s
operati ons, B YTE = VIH or VI L, gives a summary of each operation.
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not abort the procedure before
reaching the end. Chip Unprotect can take several seconds and a user message should be
provided to show that the operation is progressing.
B.2 In-system technique
The in-system technique requires a high voltage level on the Reset/Blocks Temporary
Unprotect pin, RP. This can be achieved without violating the maximum ratings of the
components on the microprocessor bus, therefore this technique is suitable for use after the
Flash has been fitted to the system.
To protect a block follow the flowchart in Figu re 21: In-sys tem eq ui pment bloc k protect
flowchart. To unprotect the whole chip it is necessary to protect all of the blocks first, then all
the blocks can be unprotected at the same time. To unprotect the chip follow Figure 22: In-
sy st em equipment chip unprotect fl owchart.
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not allow the microprocessor to
service interrupts that will upset the timing and do not abort the procedure before reaching
the end. Chip Unprotect can take several seconds and a user message should be provided
to show that the operation is progressing.
Bl o ck pro tect ion M29W400D T , M29W 400DB
42/48
Table 23. Progra mme r techni que bus operati ons, BYTE =V
IH or VIL
Operation E G W Address inputs
A0-A17 Data inputs/outputs
DQ15A–1, DQ14-DQ0
Block Protect VIL VID
VIL
pulse
A9 = VID,
A12-A17 block address,
others = X
X
Chip Unprotect VID VID
VIL
pulse
A9 = VID, A12 = VIH, A15 = VIH,
others = X X
Block Protection
Verify VIL VIL VIH
A0 = VIL, A1 = VIH, A6 = VIL,
A9 = VID,
A12-A17 block address,
others = X
Pass = XX01h
Retry = XX00h
Block
Unprotection
Verify
VIL VIL VIH
A0 = VIL, A1 = VIH, A6 = VIH,
A9 = VID,
A12-A17 block address,
others = X
Retry = XX01h
Pass = XX00h
M29W400DT, M29W400DB Block protection
43/48
Figure 19. Programmer equipm ent block protect flowch art
ADDRESS = BLOCK ADDRESS
AI03469
G, A9 = VID,
E = VIL
n = 0
Wait 4 µs
Wait 100 µs
W = VIL
W = VIH
E, G = VIH,
A0, A6 = VIL,
A1 = VIH
A9 = VIH
E, G = VIH
++n
= 25
START
FAIL
PASS
YES
NO
DATA
=
01hYES
NO
W = VIH
E = VIL
Wait 4 µs
G = VIL
Wait 60 ns
Read DATA
Verify Protect Set-upEnd
A9 = VIH
E, G = VIH
Bl o ck pro tect ion M29W400D T , M29W 400DB
44/48
Figure 20. Programmer equipment chip unprotect flowchart
PROTECT ALL BLOCKS
AI03470
A6, A12, A15 = VIH
E, G, A9 = VID
DATA
W = VIH
E, G = VIH
ADDRESS = CURRENT BLOCK ADDRESS
A0 = VIL, A1, A6 = VIH
Wait 10 ms
=
00h
INCREMENT
CURRENT BLOCK
n = 0
CURRENT BLOCK = 0
Wait 4 µs
W = VIL
++n
= 1000
START
YES
YESNO
NO LAST
BLOCK
YES
NO
E = VIL
Wait 4 µs
G = VIL
Wait 60 ns
Read DATA
FAIL PASS
Verify Unprotect Set-upEnd
A9 = VIH
E, G = VIH A9 = VIH
E, G = VIH
M29W400DT, M29W400DB Block protection
45/48
Figure 21. In-syst em equipm ent block prot ect flowchart
AI03471
WRITE 60h
ADDRESS = BLOCK ADDRESS
A0 = VIL, A1 = VIH, A6 = VIL
n = 0
Wait 100 µs
WRITE 40h
ADDRESS = BLOCK ADDRESS
A0 = VIL, A1 = VIH, A6 = VIL
RP = VIH ++n
= 25
START
FAIL
PASS
YES
NO
DATA
=
01hYES
NO
RP = VIH
Wait 4 µs
Verify Protect Set-upEnd
READ DATA
ADDRESS = BLOCK ADDRESS
A0 = VIL, A1 = VIH, A6 = VIL
RP = VID
ISSUE READ/RESET
COMMAND
ISSUE READ/RESET
COMMAND
WRITE 60h
ADDRESS = BLOCK ADDRESS
A0 = VIL, A1 = VIH, A6 = VIL
Bl o ck pro tect ion M29W400D T , M29W 400DB
46/48
Figure 22. I n-system equipment chip unprotect flowchart
AI03472
WRITE 60h
ANY ADDRESS WITH
A0 = VIL, A1 = VIH, A6 = VIH
n = 0
CURRENT BLOCK = 0
Wait 10 ms
WRITE 40h
ADDRESS = CURRENT BLOCK ADDRESS
A0 = VIL, A1 = VIH, A6 = VIH
RP = VIH
++n
= 1000
START
FAIL PASS
YES
NO
DATA
=
00h
YESNO
RP = VIH
Wait 4 µs
READ DATA
ADDRESS = CURRENT BLOCK ADDRESS
A0 = VIL, A1 = VIH, A6 = VIH
RP = VID
ISSUE READ/RESET
COMMAND
ISSUE READ/RESET
COMMAND
PROTECT ALL BLOCKS
INCREMENT
CURRENT BLOCK
LAST
BLOCK
YES
NO
WRITE 60h
ANY ADDRESS WITH
A0 = VIL, A1 = VIH, A6 = VIH
Verify Unprotect Set-upEnd
M29W400DT, M29W400DB Revision history
10 Revision history
Table 24. Document revis ion history
Date Revision
Changes
26-Jul-2002 01 Initia l rel ease
19-Feb-2003 2.0
Revision numbering modified: a minor revision will be indicated by
incrementing the digit after the dot, and a major revision, by incrementing
the digit before the dot (revision version 01 equals 1.0). Revision history
moved to end of document.
Typical after 100k W/E cycles column removed from Table 4: Program ,
Erase times and Program, Erase endurance cycles, Data retention and
Erase Suspend latency time parameters added. Common Flash
interface removed from datasheet.
Lead-free package options E and F added to Table 20: Ordering
informati on schem e.
Document promoted from Product Preview to Preliminary Data status.
28-May-2003 2.1
tWLWH and tELEH parameters modified for all speed classes in Table 13:
Write AC characteristics, Write Enable controlled and Table
14: Write AC
characteristics, Chip Enable controlled. Minor text changes. TSOP48
package updated (Figure 16 and Table 17).
30-Sep-2003 2.2 Document status changed to Full datasheet. TFBGA48 6 x 8 package
added.
TLEAD parameter added in Table 8: Absolute maximum ratings.
6-Oct-2003 2.3 tGLQV modified in Table 12: Read AC characteristics.
16-Jan-2004
3
RB pin description corrected in Table : .
8-Jun-2004
4
Tape and Reel option upda t ed in Table 20: Ordering information scheme
.
Lead-free pac kag ing prom otio n updated in S ect ion 1: Descr i ption ,
Section 6: Maximum rating and Section 9: Part numbering.
07-Aug-2007
5
RoHS text added in Section 1: Description.
Updated options E and F in Ta ble 20: Order ing inform ation scheme.
Small text changes.
10-Dec-2007
6
Applied Numonyx branding.
2-March 2009
7
Added Automotive Grade 3 part information to cover page and part
ordering information.
7-April-2009
8
Revised BYTE signal name from “output” to “input” in Table 1.: Signal
names;
Revised Chip Erase signal value (maxim um ) in Table
4.: Program, Erase
times and Program, Erase endurance cycles from 35 to 12 seconds.
Revised Block Erase (64-Kbytes) signal value (maximum) in Table 4.:
Program, Erase times and Program, Erase endurance cycles from 6 to
1.6 seconds.
29-Jan 2018
9
Added Important Notes and Warnings section for further clarification
aligning to industry standards.
47/48
M29W400DT, M29W400DB
48/48
