ESDZV18-1BF4 Low clamping, low capacitance bidirectional single line ESD protection Datasheet - production data Description The ESDZV18-1BF4 is a bidirectional single line TVS diode designed to protect the data line or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. Figure 1: Functional diagram 0201 package Features Low clamping voltage Bidirectional device Low leakage current < 100 nA 0201 package ECOPACK(R)2 compliant component Exceeds IEC 61000-4-2 level 4 standard: 30 kV (air discharge) 30 kV (contact discharge) Applications Where transient over voltage protection in ESD sensitive equipment is required, such as: Smartphones, mobile phones and accessories Tablets and notebooks Portable multimedia devices and accessories Wearable, home automation, healthcare Highly integrated systems November 2017 DocID030880 Rev 1 This is information on a product in full production. 1/9 www.st.com Characteristics 1 ESDZV18-1BF4 Characteristics Table 1: Absolute ratings (Tamb = 25 C) Symbol Parameter Value Unit 30 30 kV 140 W IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge VPP Peak pulse voltage PPP Peak pulse power dissipation (8/20 s) IPP Peak pulse current (8/20 s) 6 A Tj Operating junction temperature range -55 to +150 C Tstg Storage temperature range -65 to +150 C TL Maximum lead temperature for soldering during 10 s 260 C Figure 2: Electrical characteristics (definitions) I Symbol VTrig VCL IRM VRM IPP = = = = = Parameter Trigger voltage Clamping voltage Leakage current @ VRM Stand-off voltage Peak pulse current RD VH = = Dynamic resistance Holding voltage CLINE = Input capacitance per line RD VCL VTrig VBR VRM V IRM I V IR IPP Table 2: Electrical characteristics (Tamb = 25 C) Symbol Test condition Min. Higher voltage than VTrig guarantees the protection turn-on 18 VH Lower voltage than VH guarantees the protection turn-off 16 IRM VRM(1) = 16 V VCL 8 kV contact discharge after 30 ns, IEC 61000-4-2 VCL VTrig CLINE RD Typ. Max. Unit 24 V V 17.3 100 nA 21.5 V 8/20 s waveform, IPP = 1 A 18 V F = 1 MHz, VLINE = 0 V, VOSC = 30 mV 3 Pulse duration 100 ns 0.2 4 pF Notes: (1)Application note: when used to protect a line connected to a DC source, the DC voltage must be lower than the minimum VH to enable the diode to return to its non-conducting state after the transient. 2/9 DocID030880 Rev 1 ESDZV18-1BF4 1.1 Characteristics Characteristics (curves) Figure 3: Leakage current versus junction temperature (typical values) Figure 4: Junction capacitance versus reverse voltage applied (typical values) Ir(nA) C (pF ) 10 3.5 3 2.5 2 5 1.5 1 0.5 V R (V) 0 Tj(C) 0 2 4 6 8 10 12 14 16 0 0 25 50 75 100 125 150 Figure 5: ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 6: ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20V/div 20 V/div 1 2 3 4 Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns Clamping voltage at 100 ns 4 2 71 V 1 -20 V 22 V 2 18 V 3 3 -17 V -18 V 15 V Peak clamping voltage Clamping voltage at 30 ns Clamping voltage at 60 ns 4 Clamping voltage at 100 ns 1 1 4 2 -72 V 3 20 ns/div 20 ns/div Figure 8: S21 attenuation measurement result Figure 7: TLP characteristic 0 I(A) S21(dB) 20 -3 -6 10 -9 f (Hz) VCL(V) 0 0 10 20 -12 10M DocID030880 Rev 1 30M 100M 300M 1G 3G 3/9 Package information 2 ESDZV18-1BF4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 0201 package information Figure 9: 0201 package outline The marking codes can be rotated by 90 or 180 to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. 4/9 DocID030880 Rev 1 Package information ESDZV18-1BF4 Table 3: 0201 package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. A 0.270 0.300 0.330 b 0.1675 0.1875 0.2075 D 0.560 0.580 0.600 D1 0.3375 E 0.260 0.280 0.300 E1 0.205 0.225 0.245 fD 0.0175 0.0275 0.0375 fE 0.0175 0.0275 0.0375 Figure 10: Tape and reel specification (in mm) Dot indicates Pin 1 4.0 0.1 O 1.5 0.1 1.75 0.1 2.0 0.05 0.27 0.03 3.5 0.05 0.67 0.03 8.0 +0.03 -0.01 0.2 0.02 0.34 0.03 2.0 0.05 All dimensions in mm User direction of unreeling DocID030880 Rev 1 5/9 Recommendation on PCB assembly ESDZV18-1BF4 3 Recommendation on PCB assembly 3.1 Footprint 1. Footprint in mm a. SMD footprint design is recommended. Figure 11: Footprint in mm 3.2 Stencil opening design 1. Reference design a. Stencil opening thickness: 75 m / 3 mils Figure 12: Recommended stencil window position in mm 3.3 Solder paste 1. 2. 3. 4. 6/9 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed. Use solder paste with fine particles: powder particle size 20-38 m. DocID030880 Rev 1 Recommendation on PCB assembly ESDZV18-1BF4 3.4 Placement 1. 2. 3. 4. 5. 6. 3.5 PCB design preference 1. 2. 3.6 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. Reflow profile Figure 13: ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC JSTD-020. DocID030880 Rev 1 7/9 Ordering information 4 ESDZV18-1BF4 Ordering information Figure 14: Ordering information scheme ESD Z V 18 - 1 B F4 ESD protection Z : Ultra low Clamping snapback effect V : Very Low Capacitance 18 : Minimum trigger voltage Number of lines B = Bi-directional Package F4 = 0201 Table 4: Ordering information Order code Marking Package Weight Base qty. Delivery mode ESDZV18-1BF4 1(1) 0201 0.116 mg 15000 Tape and reel Notes: (1)The 5 marking can be rotated by multiples of 90 to differentiate assembly location Revision history Table 5: Document revision history 8/9 Date Revision 15-Nov-2017 1 Changes First issue. DocID030880 Rev 1 ESDZV18-1BF4 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2017 STMicroelectronics - All rights reserved DocID030880 Rev 1 9/9