54F413,74F413 54F413 74F413 64 x 4 First-In First-Out Buffer Memory with Parallel I/O Literature Number: SNOS198A 54F/74F413 64 x 4 First-In First-Out Buffer Memory with Parallel I/O General Description Features The 'F413 is an expandable fall-through type high-speed First-In First-Out (FIFO) buffer memory organized as 64 words by four bits. The 4-bit input and output registers record and transmit, respectively, asynchronous data in parallel form. Control pins on the input and output allow for handshaking and expansion. The 4-bit wide, 62-bit deep fallthrough stack has self-contained control logic. Y 74F413PC 54F413DM (Note 1) Y Y Y e Package Number Military Y Separate input and output clocks Parallel input and output Expandable without external logic 15 MHz data rate Supply current 160 mA max Available in SOIC, (300 mil only) Package Description N16E 16-Lead (0.300x Wide) Molded Dual-In-Line J16A 16-Lead Ceramic Dual-In-Line et Commercial Y Note 1: Military grade device with environmental and burn-in processing. Use suffix e DMQB. Logic Symbol Connection Diagram bs ol Pin Assignment for DIP TL/F/9541 - 1 O TL/F/9541 - 2 TRI-STATEE is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9541 RRD-B30M105/Printed in U. S. A. 54F/74F413 64 x 4 First-In First-Out Buffer Memory with Parallel I/O January 1995 Unit Loading/Fan Out 54F/74F Pin Names D0 - D3 O 0 - O3 IR SI SO OR MR Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL Data Inputs Data Outputs Input Ready Shift In Shift Out Output Ready Master Reset 1.0/0.667 50/13.3 1.0/0.667 1.0/0.667 1.0/0.667 1.0/0.667 1.0/0.667 20 mA/b0.4 mA b 1 mA/8 mA 20 mA/b0.4 mA 20 mA/b0.4 mA 20 mA/b0.4 mA 20 mA/b0.4 mA 20 mA/b0.4 mA Functional Description et e Data OutputData is read from the O0 -O3 outputs. When data is shifted to the output stage, Output Ready (OR) goes HIGH, indicating the presence of valid data. When the OR is HIGH, data may be shifted out by bringing the Shift Out (SO) HIGH. A HIGH signal at SO causes the OR to go LOW. Valid data is maintained while the SO is HIGH. When SO is brought LOW, the upstream data, provided that stage has valid data, is shifted to the output stage. When new valid data is shifted to the output stage, OR goes HIGH. If the FIFO is emptied, OR stays LOW, and O0 -O3 remains as before, i.e., data does not change if FIFO is empty. Input Ready and Output Ready may also be used as status signals indicating that the FIFO is completely full (Input Ready stays LOW for at least tPT) or completely empty (Output Ready stays LOW for at least tPT). bs ol Data InputData is entered into the FIFO on D0 - D3 inputs. To enter data the Input Ready (IR) should be HIGH, indicating that the first location is ready to accept data. Data then present at the four data inputs is entered into the first location when the Shift In (SI) is brought HIGH. An SI HIGH signal causes the IR to go LOW. Data remains at the first location until SI is brought LOW. When SI is brought LOW and the FIFO is not full, IR will go HIGH, indicating that more room is available. Simultaneously, data will propagate to the second location and continue shifting until it reaches the output stage or a full location. If the memory is full, IR will remain LOW. Data TransferOnce data is entered into the second cell, the transfer of any full cell to the adjacent (downstream) empty cell is automatic, activated by an on-chip control. Thus data will stack up at the end of the device while empty locations will ``bubble'' to the front. The tPT parameter defines the time required for the first data to travel from input to the output of a previously empty device. O Block Diagram TL/F/9541 - 4 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65 C to a 150 C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55 C to a 125 C Free Air Ambient Temperature Military Commercial b 55 C to a 125 C 0 C to a 70 C Supply Voltage Military Commercial b 55 C to a 175 C b 55 C to a 150 C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATEE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) e Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Symbol Parameter et DC Electrical Characteristics 54F/74F Min VIH Input HIGH Voltage VIL Input LOW Voltage VOH Units 2.0 Input Clamp Diode Voltage VCC V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.5 V Min Min IOH e b1 mA IOH e b1 mA IOH e b1 mA 0.5 0.5 V Min IOL e 8 mA IOL e 8 mA 54F 74F 20.0 5.0 mA Max VIN e 2.7V Input HIGH Current 54F Breakdown Test 74F 100 7.0 mA Max VIN e 7.0V Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current IIH IBVI ICEX Output LOW Voltage 54F 10% VCC 74F 10% VCC Input HIGH Current O VID 54F 10% VCC 74F 10% VCC 74F 5% VCC IOS Output Short-Circuit Current ICCH Power Supply Current 2.4 2.4 2.7 IIN e b18 mA V VOL Output HIGH Voltage Conditions Max bs ol VCD Typ 4.75 b 20 115 3 b 0.4 mA Max VIN e 0.5V b 130 mA Max VOUT e 0V 160 mA Max VO e HIGH AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25 C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ Max Min Max Min Units Max fmax Shift In Rate 10 8.0 10 fmax Shift Out Rate 10 8.0 10 tPLH tPHL Propagation Delay Shift In to IR 1.5 1.5 44.0 31.0 1.5 1.5 50.0 37.0 1.5 1.5 48.0 35.0 ns tPLH tPHL Propagation Delay Shift Out to OR 1.5 1.5 52.0 31.0 1.5 1.5 57.0 37.0 1.5 1.5 55.0 35.0 ns tPLH tPHL Propagation Delay Output Data Delay 1.5 1.5 46.0 34.0 1.5 1.5 52.0 39.0 1.5 1.5 50.0 37.0 ns tPLH Propagation Delay Master Reset to IR 1.5 27.0 1.5 33.0 1.5 31.0 ns tPLH Propagation Delay Master Reset to OR 1.5 30.0 1.5 Symbol e 34.0 1.5 32.0 74F 54F 74F TA e a 25 C VCC e a 5.0V TA, VCC e Mil TA, VCC e Com Min Min Max Min Max 10.0 10.0 10.0 10.0 10.0 10.0 Shift In Pulse Width HIGH or LOW 5.0 10.0 5.0 10.0 5.0 10.0 Shift Out Pulse Width HIGH or LOW 7.5 10.0 8.5 10.0 7.5 10.0 Input Ready Pulse Width, HIGH 7.5 8.5 7.5 ns Output Ready Pulse Width, LOW 5.0 5.0 5.0 ns Master Reset Pulse Width, LOW 10.0 10.0 10.0 ns trec Recovery Time, MR to SI 32.0 tPT Data Throughput Time tw(H) tw(L) tw(H) tw(L) O tw(L) Hold Time, HIGH or LOW Dn to SI Max Units 1.0 1.0 tw(H) tw(L) 1.0 1.0 ns 1.0 1.0 th(H) th(L) Setup Time, HIGH or LOW Dn to SI bs ol ts(H) ts(L) Parameter MHz et AC Operating Requirements MHz 35.0 0.9 ns 35.0 1.0 4 ns ns 1.0 ms Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 413 P Temperature Range Family 74F e Commercial 54F e Military C X Special Variations QB e Military grade device with environmental and burn-in processing Device Type Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) Package Code P e Plastic DIP D e Ceramic DIP bs ol et e Physical Dimensions inches (millimeters) O 16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A 5 e et 16-Lead (0.300x Wide) Molded Dual-In-Line Package (P) NS Package Number N16E bs ol 54F/74F413 64 x 4 First-In First-Out Buffer Memory with Parallel I/O Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY O NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 1111 West Bardin Road Arlington, TX 76017 Tel: 1(800) 272-9959 Fax: 1(800) 737-7018 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Europe Fax: (a49) 0-180-530 85 86 Email: cnjwge @ tevm2.nsc.com Deutsch Tel: (a49) 0-180-530 85 85 English Tel: (a49) 0-180-532 78 32 Fran3ais Tel: (a49) 0-180-532 93 58 Italiano Tel: (a49) 0-180-534 16 80 National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductor Japan Ltd. Tel: 81-043-299-2309 Fax: 81-043-299-2408 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated