2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS ISM97 Series
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/12/15_C
Page 1 of 2
Recommended Pad layout
1.3
1.4
2.0
2.6
Dimension Units: mm
Pin Connection
1 Enable
2 GND
3 Output
4 Vcc
Product Features: Applications:
Low Jitter, Non-PLL Based Output Fibre Channel
CMOS/TTL Compatible Logic Levels Server & Storage
Compatible with Leadfree Processing Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters.
Frequency 1.000 MHz to 152.250 MHz
Output Level
HC-MOS
TTL
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
Duty Cycle Specify 50% ±10% or ±5% See Table in Part Number Guide
Rise / Fall Time 6 nS Max.
Output Load See Table in Part Number Guide
Frequency Stability See Frequency Stability Table (Includes room temperature tolerance and
stability over operating temperature)
Start-up Time 10 mS Max.
Enable / Disable
Time
100 nS Max. N.C. or ≥ 70% Vdd = Enable. ≤ 30% Vdd
= Disable.
Supply Voltage See Input Voltage Table, tolerance ±5 %
Current 25 mA Max. (5.0V)
20 mA Max. (1.8V-3.3V)
Operating See Operating Temperature Table in Part Number Guide
Storage -55 C to +125 C
Jitter:
RMS(1sigma)
1 MHz-60 MHz
5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods)
Max Integrated
1 MHz-60 MHz
1.5 pS RMS (1 sigma -12KHz to 20MHz)
Max Total Jitter
1 MHz-60 MHz
50 pS p-p (100K adjacent periods)
Part Number Guide Sample Part Number: ISM97 - 3251BH - 20.000
Package Input
Voltage Operating
Temperature Symmetry
(Duty Cycle) Output Stability
(in ppm) Enable /
Disable Frequency
ISM97 -
5 = 5.0 V 1 = 0 C to +70 C 5 = 45 / 55 Max. 1 = 10TTL / 15 pF HC-MOS **E = 10 H = Enable
- 20.000 MHz
3 = 3.3 V 6 = -10 C to +70 C 6 = 40 / 60 Max. 6 = 30 pF **D = 15 O = N/C
7 = 3.0 V 3 = -20 C to +70 C 5 = 50 pF HC-MOS (<40 MHz) **F = 20
2 = 2.7 V 4 = -30 C to +75 C
**A = 25
6 = 2.5 V 2 = -40 C to +85 C B = 50
1 = 1.8 V* C = 100
2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, TTL / HC-MOS ISM97 Series
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 08/12/15_C
Page 2 of 2
Pb Free Solder Reflow Profile: Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic; storage life is unlimited under normal room conditions.
Termination = e4 (Au over Ni over W base metalization.
Tape and Reel Information:
Environmental Specifications
Thermal Shock MIL-STD-883, Method 1011, Condition A
Moisture Resistance MIL-STD-883, Method 1004
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Mechanical Vibration MIL-STD-883, Method 2007, Condition A
Resistance to Soldering Heat J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Hazardous Substance Pb-Free / RoHS / Green Compliant
Solderability JESD22-B102-D Method 2 (Preconditioning E)
Terminal Strength MIL-STD-883, Method 2004, Test Condition D
Gross Leak MIL-STD-883, Method 1014, Condition C
Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
Solvent Resistance MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
PROPRIETARY AND CONFIDENTIAL
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY
PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America.
Quantity per
Reel 3000
A 8.0 +/-.2
B 4.0 +/-.2
C 5.5 +/-.1
D 9.0 +/-1
E 50 / 60 / 80
F 180
