1Sheet No.: D1-A01801EN
Date: November 30, 2007
©SHARP Corporation
PT100MF0MPx
PT100MF0MPx Surface Mount Type, Opaque
Resin Phototransistor
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Features
1. Compact and thin SMD package
2. Top view and side view mountable
3. Plastic mold with visible light cut-off (black) resin lens
4. Peak sensitivity wavelength: 910 nm TYP.
5. Narrow directivity angle (Δθ: ±15° TYP.)
6. Lead free and RoHS directive compliant
Model Line-up
Agency Approvals/Compliance
1. Compliant with RoHS directive (2002/95/EC)
2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Prod-
ucts Regulation” (popular name: China RoHS)
(Chinese: );
refer to page 7.
Applications
1. Office automation equipment
2. Audio visual equipment
3. Home appliances
4. Telecommunication equipment
5. Measuring equipment
6. Tooling machines/Factory automation
7. Touch Panels
Model No. Packaging Mount Direction
PT100MF0MP 2000 pcs/reel Side view
PT100MF0MP1 1500 pcs/reel Top view
Sheet No.: D1-A01801EN
2
PT100MF0MPx
External Dimensions
(Center of lens)
Viewed from PCB
(Side view Mounting)
Viewed from PCB
(Top view Mounting)
Collector
Terminal connection
NOTES:
1. Unit: mm
2. Unspecified tolerance: ±0.2 mm
3. ( ): Reference dimensions
4. Au plated area
5. Do not allow circuit runs in area
3.0
2.8
0.75
(0.35)
0.65
(0.4)
1.5
2.2
(1.0) (1.0)
2.2
1.0
0.4
(0.2)
0.95
1.5
(0.65)
(0.57)
(0.57)
3.0
3.0
R0.8
1.4
1.7
0.85
1.1
1.1
1.1
1.5
1.1
1.5
1 2
1
2
1 2
Emitter
No.
Pin Arrangement
Name
2
Sheet No.: D1-A01801EN
3
PT100MF0MPx
Absolute Maximum Ratings
*1 Within 10 s (MAX.) see reflow profile on page 7.
Electro-optical Charactertistics
*1 Ee: Irradiance by CIE standard light source A (tungsten lamp)
Parameter Symbol Rating Unit
Collector-emitter voltage VCEO 35 V
Emitter-collector voltage VECO 6V
Collector current IC20 mA
Collector power dissipation PC75 mW
Operating temperature Topr -30 to +85 °C
Storage temperature Tstg -40 to + 95 °C
Soldering temperature *1 Tsol 240 °C
Parameter Symbol Conditions *1 MIN. TYP. MAX. Unit
Collector current ICEe = 1 mW/cm2, VCE = 5 V 1.15 2 3.45 mA
Collector dark current ICEO Ee = 0, VCE = 20 V 1.0 100 nA
Collector-emitter saturation voltage VCE(sat) Ee = 10 mW/cm2, IC = 0.5 mA 0.1 0.4 V
Collector-emitter breakdown voltage BVCEO IC = 0.1 mA, Ee = 0 35 V
Emitter-collector breakdown voltage BVECO IE = 0.01 mA, Ee = 0 6 V
Peak sensitivity wavelength λp–910nm
Response time (Rise) tr VCE = 2 V, IC = 2 mA,
RL = 100 Ω
–5.0– µs
Response time (Fall) tf 6.0 µs
Angle of half intensity Δθ ±15 degrees
Fig. 1 Collector Power Dissipation vs.
Ambient Temperature
Collector power dissipation P
C
(mW)
0
10
20
15
30
40
50
60
70
75
80
-30 0 25 50 8575 100
Ambient temperature Ta (°C)
Fig. 2 Collector Dark Current vs.
Ambient Temperature
Collector dark current ICEO (A)
10-10
10-9
10-8
10-7
10-6
02550 8575 100
Ambient temperature Ta (°C)
VCE = 20 V
(Ta = 25°C)
(Ta = 25°C)
Sheet No.: D1-A01801EN
4
PT100MF0MPx
Fig. 3 Relative Collector Current vs.
Ambient Temperature
Fig. 4 Collector Current vs. Irradiance
-50 -25-30
V
CE
= 5 V
Ee = 1mW/cm
2
0
20
40
60
80
100
120
140
160
100025507585
Relative collector current (%)
Ambient temperature Ta (°C)
0.1
1
10
100
Collector current I
C
(mA)
Irradiance E
e
(mW/cm
2
)
V
CE
= 5 V
Ta = 25°C
0.1 110
Fig. 5 Collector Current vs.
Collector-emitter Voltage
Fig. 6 Relative Sensitivity vs.
Wavelength (TYP.)
0
9
8
7
6
5
4
3
2
1
51012963
Collector-emitter voltage V
CE
(V)
Collector current I
C
(mA)
Ta = 25°C
0.75 mW/cm
2
1 mW/cm
2
0.5 mW/cm
2
0.25 mW/cm
2
1.5 mW/cm
2
2 mW/cm
2
0.1 mW/cm
2
2.5 mW/cm
2
Ee = 3 mW/cm
2
Pc (max)
0
20
40
60
80
100
400 500 600 700 800 900 11001000 1200
Relative sensitivity (%)
Wavelength λ (nm)
Sheet No.: D1-A01801EN
5
PT100MF0MPx
Fig. 7 Radiation Diagram (TYP.)
Fig. 8 Collector-emitter Saturation
Voltage vs. Irradiance
0
-10° +10° +20°-20°
-30°
-40°
-50°
-60°
-70°
-8
-90°
+30°
+40°
+50°
+60°
+70°
+8
+90°
Angular displacement θ
Relative sensitivity (%)
100
80
60
40
20
Ta = 25°C
Irradiance Ee (mW/cm2)
Collector-emitter saturation voltage VCE (sat) (V)
0
0.01 0.1 1 10
1.2
1.4
1.0
0.8
0.6
0.4
0.2
Ta = 25°C
IC = 0.05 mA
0.5 mA
0.1 mA
1 mA
2 mA
Fig. 9 Relative Output vs.
Distance to Detector
Relative output (%)
0.01
0.1
1
10
100
0.1 1 10 100 1000
Distance to detector (mm)
IF = constant
Ta = 25°C
(Emitter: GL100MN0MP)
Sheet No.: D1-A01801EN
6
PT100MF0MPx
Design Considerations
Design Guidelines
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
Manufacturing Guidelines
Soldering Instructions
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the Reflow Soldering Temperature Profile shown in Fig. 10. Sharp
recommends checking the process to make sure these parameters are not exceeded; exceeding these param-
eters can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires,
or other similar failure modes.
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
4. If hand soldering, use temperatures 260° for 3 seconds. Do not dip-solder or VPS-solder this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Fig. 10 Reflow Soldering Temperature Profile
200°C
25°C
240°C MAX.
120 s MAX. 90 s MAX.
60 s MAX.
10 s MAX.
165°C MAX.
1 ~ 4°C/s
1 ~ 4°C/s
1 ~ 4°C/s
Sheet No.: D1-A01801EN
7
PT100MF0MPx
Storage and Handling
1. Store these parts between 5°C and 30°C, at a relative humidity of less than 70%.
2. After breaking the package seal, maintain the environment within 5°C to 25°C, at a relative humidity of less than
60%, and mount the parts within two days. If unable to do so, bake before mounting.
3. When storing the parts after breaking the seal, Sharp recommends storage of no longer than two weeks in a dry
box or by resealing the parts in a moisture-proof bag with a desiccant. If unable to do so, bake before mounting.
4. When baking the parts before mounting, Sharp recommends baking the parts only once and only if in a metal
tray or mounted on a PCB. Recommended conditions are for 16 to 24 hours, at a temperature of 125°C.
Presence of ODCs (RoHS Compliance)
This product shall not contain the following materials, and they are not used in the production process for this
product:
Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific
brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
Content information about the six substances specified in “Management Methods for Control of Pollution
Caused by Electronic Information Products Regulation” (Chinese: )
NOTE: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006 standard.
Taping Specifications
1. Tape structure and dimensions conforms to those shown in Fig. 11 to 16.
2. Product insertion will have the collector to the hole side of the tape.
3. Cover tape peel-separation force: F = 0.2 to 1.0 N (where θ 160° to 180°)
4. Quantity per reel = 2000 pcs. (PT100MF0MP) or 1500 pcs. (PT100MF0MP1)
5. Product mass: 0.01 g (approx.)
6. Packaging:
a. Reels are sealed inside an aluminum bag, along with a humidity indicator card.
b. Bags are labeled and securely packed.
Category
Toxic and Hazdardous Substances
Lead (Pb) mercury (Hg) Cadmium (Cd) Hexavalent
chromiun (Cr6+)
Polybrominated
biphenyls (PBB)
Polybrominated
diphenyl ethers
(PBDE)
Photo Transistor ✓✓✓
Sheet No.: D1-A01801EN
8
PT100MF0MPx
Packing Specifications
PT100MF0MPx (Side view mount, 2000 pcs/reel)
Fig. 11 Tape Shape and Dimension
Fig. 12 Reel Shape and Dimension
4.0 ±0.1
2.0 ±0.05
4.0 ±0.1
1.6 ±0.1
2.5 ±0.1
1.75 ±0.1
0.3 ±0.05
5.5 ±0.1
3.5 ±0.05
8.0 ±0.3
1.75 ±0.1
φ1.5 +0.1
-0
3.3 ±0.1
1.7 ±0.1
180.0
NOTE: Unit: mm
11.4 ±1
2.0 ±0.5
φ13.0 ±0.2
9.0
+0.3
-0
60.0
+1
-0
Sheet No.: D1-A01801EN
9
PT100MF0MPx
PT100MF0MP1 (Top view mount, 1500 pcs/reel)
Fig. 13 Product Insertion Direction
Fig. 14 Tape Shape and Dimension
Pull-out direction
4.0 ±0.1
2.0 ±0.05
4.0 ±0.1
1.8 ±0.1
2.45 ±0.1
0.3 ±0.05
5.5 ±0.1
3.5 ±0.05
8.0 ±0.3
1.75 ±0.1
3.3 ±0.1
φ1.5 +0.1
-0
Sheet No.: D1-A01801EN
10
PT100MF0MPx
Fig. 15 Reel Shape and Dimension
Fig. 16 Product Insertion Direction
180.0
NOTE: Unit: mm
11.4 ±1
2.0 ±0.5
φ13.0 ±0.2
9.0 +0.3
-0
60.0 +1
-0
Pull-out direction
Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, struc-
ture, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
Sheet No.: D1-A01801EN
11
PT100MF0MPx