VDD to VSS ............................................................ -0.3V to +72V
VSS to GND ........................................................... -36V to +0.3V
VL, EN_ to GND ........ -0.3V to the lesser of (+12V, VDD + 0.3V)
A_, B_ to VSS .............................. -0.3V to (VDD + 2V) or 100mA
(whichever occurs first)
Continuous Current into A_, B_......................................±100mA
Continuous Power Dissipation (TA = +70°C)
TSSOP (derate 11.1mW/°C above +70°C) .................889mW
Operating Temperature Range ........................... -40°C to +85°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ...................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) ....................................... +260°C
TSSOP
Junction-to-Ambient Thermal Resistance (θJA) ..........90°C/W
Junction-to-Case Thermal Resistance (θJC) ...............27°C/W
(Note 1)
(VDD = +35V, VSS = -35V, VGND = 0V, VL = +3.3V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
VDD Supply-Voltage Range VDD +10 +35 V
VSS Supply-Voltage Range VSS -10 -35 V
VL Logic Supply-Voltage Range VL+1.6 +11 V
VDD Supply Current IDD(OFF) VEN_ to switch off state, VA_, VB_ = +20V 200 450 µA
IDD(ON) VEN_ to switch on state, VA_, VB_ = +20V 500 800
VSS Supply Current ISS(OFF) VEN_ to switch off state, VA_, VB_ = +20V 200 450 µA
ISS(ON) VEN_ to switch on state, VA_, VB_ = +20V 500 800
VL Current ILVL = +11V, VEN1 = VEN2 = VEN3 = VEN4 =
(0.25 x VL) or ( 0.75 x VL)0.4 mA
SWITCH
Analog-Signal Range VA_, VB_ Figure 1 VSS VDD V
Current Through Switch IA_, IB_ VA_, VB_ = +20V -50 +50 mA
On-Resistance RON IA_, IB_ = 10mA, VA_, VB_ = ±20V, Figure 1 5 10 Ω
On-Resistance Matching
Between Channels ∆RON IA_, IB_ = 10mA, VA_, VB_ = ±20V, 0V
(Note 2) 0.3 0.5 Ω
On-Resistance Flatness RFLAT(ON) IA_, IB_ = 10mA, VA_, VB_ = ±20V 0.004 Ω
On-Leakage Current IA/B_(ON)
VB_ = ±20V, VA_= unconnected, Figure 2 -5 +5
nA
VB_ = ±20V, VA_ = unconnected,
TA = +25°C, Figure 2 0.01
Off-Leakage Current IA/B_(OFF)
VB_ = ±20V, VA_ = -20V, Figure 3 -2.5 +2.5
nA
VB_ = ±20V, VA_ = -20V, TA = +25°C,
Figure 3 0.01
MAX14756/MAX14757/
MAX14758
Quad SPST +70V Analog Switches
www.maximintegrated.com Maxim Integrated
│
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics—Dual Supplies