TG-ETRX35X-PM-010-110 ETRX351 and ETRX357 Product Manual 1.20 ETRX35x ZIGBEE MODULES N ot R ec om m en de d fo r N ew D PRODUCT MANUAL es ig n Telegesis (c)2015 Silicon Labs ETRX35x Product Manual ETRX351 and ETRX357 Table of Contents 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 PRODUCT APPROVALS ................................................................................................... 6 es ig n 2 Hardware Description ....................................................................................................... 5 FCC Approvals ................................................................................................................. 6 FCC Labelling Requirements ........................................................................................... 7 IC (Industry Canada) Approvals ....................................................................................... 7 European Certification (ETSI)........................................................................................... 8 ICASA Approvals ............................................................................................................. 8 Australia and New Zealand (C-Tick) ................................................................................. 8 Brazil ................................................................................................................................ 9 Declarations of Conformity ............................................................................................... 9 IEEE 802.15.4 .................................................................................................................. 9 The ZigBee Protocol ...................................................................................................... 10 D 1.1 INTRODUCTION ................................................................................................................. 5 N ew 1 3 MODULE PINOUT ............................................................................................................ 11 4 HARDWARE DESCRIPTION ............................................................................................ 13 5.1 5.2 5.3 6 6.1 6.2 fo r 5 Hardware Interface......................................................................................................... 13 FIRMWARE DESCRIPTION ............................................................................................. 14 Token Settings ............................................................................................................... 15 Custom Firmware ........................................................................................................... 15 Software Interface .......................................................................................................... 16 m en de d 4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................... 17 Environmental Characteristics ........................................................................................ 17 Recommended Operating Conditions............................................................................. 17 DC ELECTRICAL CHARACTERISTICS ........................................................................... 18 8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 20 9 A/D CONVERTER CHARACTERISTICS .......................................................................... 21 10 AC ELECTRICAL CHARACTERISTICS ........................................................................... 21 11 PHYSICAL DIMENSIONS................................................................................................. 25 RECOMMENDED SOLDERING TEMPERATURE PROFILE ........................................... 27 ot R 12 TX Power Characteristics ............................................................................................... 23 ec 10.1 om 7 13 PRODUCT LABEL DRAWING ......................................................................................... 28 14 RECOMMENDED FOOTPRINT ........................................................................................ 29 N 14.1 14.2 14.3 Pad dimensions ............................................................................................................. 29 Recommended Placement ............................................................................................. 30 Example carrier board .................................................................................................... 32 15 RELIABILITY TESTS ........................................................................................................ 33 16 APPLICATION NOTES ..................................................................................................... 33 16.1 16.2 Safety Precautions ......................................................................................................... 33 Design Engineering Notes.............................................................................................. 33 (c)2015 Silicon Labs -2- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 17 17.1 17.2 17.3 17.4 17.5 Storage Conditions......................................................................................................... 34 PACKAGING .................................................................................................................... 34 Embossed Tape ............................................................................................................. 34 Component Orientation .................................................................................................. 35 Reel Dimensions ............................................................................................................ 35 Packaging - bag ............................................................................................................. 37 Packaging - carton ........................................................................................................ 37 es ig n 16.3 ORDERING INFORMATION ............................................................................................. 38 19 ROHS DECLARATION ..................................................................................................... 39 20 DATA SHEET STATUS .................................................................................................... 39 21 RELATED DOCUMENTS ................................................................................................. 39 N ot R ec om m en de d fo r N ew D 18 (c)2015 Silicon Labs -3- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 The Telegesis ETRX351 and ETRX357 modules are low power 2.4GHz ZigBee modules, based on the latest Ember EM351 and EM357 single chip ZigBeeTM solutions. es ig n These 3rd generation modules have been designed to be integrated into any device without the need for RF experience and expertise. Utilizing the EmberZNet ZigBee stack, the ETRX35x enables you to add powerful wireless networking capability to your products and quickly bring them to market. * * * * * * * * * D ot R * * * * * * * * * * * * m en de d * om * Suggested Applications Small form factor, SMT module 25mm x 19mm Side Castellations for easy soldering and optical inspection 2 antenna options: Integrated chip antenna or U.FL coaxial connector Industry's first ARM(R) Cortex-M3 based family of ZigBee modules Industry standard JTAG Programming and real time network level debugging via the Ember InSight Port 192kB (ETRX357) and 128kB (ETRX351) flash and 12kbytes of RAM Lowest Deep Sleep Current of sub 1A and multiple sleep modes Wide supply voltage range (2.1 to 3.6V) Optional 32.768kHz watch crystal can be added externally Module ships with standard Telegesis AT-style command interface based on the ZigBee PRO feature set Can act as an End Device, Router or Coordinator 24 general-purpose I/O lines including analogue inputs (all GPIOs of the EM35x are accessible) Firmware upgrades via serial port or over the air (password protected) Hardware supported encryption (AES-128) CE, FCC and IC compliance, FCC modular approval Operating temperature range: -40C to +85C Long range version with a link budget of up to 124dB available in the same form factor ec * * AMR - ZigBee Smart Energy applications Wireless Alarms and Security Home/Building Automation Wireless Sensor Networks M2M Industrial Controls Lighting and ventilation control Remote monitoring Environmental monitoring and control fo r Module Features N ew Image not shown actual size; enlarged to show detail. The module's unique AT-style command line interface allows designers to quickly integrate ZigBee technology without complex software engineering. For custom application development the ETRX35x series integrates with ease into Ember's InSight development environment. Radio Features Development Kit * New Development kit containing everything required to set up a mesh network quickly and evaluate range and performance of the ETRX35x and its long-range version. * AT-style software interface command dictionary can be modified for high volume customers. * Custom software development available upon request. Example AT-Style Commands AT+BCAST AT+UCAST:<address> AT+EN AT+JN Send a Broadcast Send a Unicast Establish PAN network Join PAN At power-up the last configuration is loaded from non-volatile S-Registers, which can eliminate the need for an additional host controller. N * Based on the Ember EM351 or EM357 single chip ZigBee solutions * 2.4GHz ISM Band * 250kbit/s over the air data rate * 16 channels (IEEE802.15.4 Channel 11 to 26) * +3dBm output power ( +8dBm in boost mode) * High sensitivity of -100dBm (-102dBm in boost mode) typically @ 1% packet error rate * RX Current: 26mA, TX Current: 31mA at 3dBm * Robust Wi-Fi and Bluetooth coexistence (c)2015 Silicon Labs -4- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 1 Introduction es ig n This document describes the Telegesis ETRX351 and ETRX357 ZigBee modules which have been designed to be easily integrated into another device and to provide a fast, simple and low cost wireless mesh networking interface. D The Telegesis ETRX3 series modules are based on the Ember ZigBee platform consisting of the single chip EM351 or EM357 combined with the ZigBee PRO compliant EmberZNet meshing stack. Integration into a wide range of applications is made easy using a simple AT style command interface and advanced hardware design. N ew The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series ZigBee modules to be used without an additional host microcontroller saving even more integration time and costs. In addition to the Telegesis AT Commandset, the ETRX351 and ETRX357 modules can be used with custom-built firmware whilst representing an ideal platform for custom firmware development in conjunction with the Ember development kits. Hardware Description m en de d 1.1 fo r No RF experience or expertise is required to add this powerful wireless networking capability to your products. The ETRX351 and ETRX357 offer fast integration opportunities and the shortest possible time to market for your product. The main building blocks of the ETRX351 and ETRX357 are the single chip EM351 and EM357 SoCs from Ember, a 24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The modules are available with on-board antenna or alternatively a U.FL coaxial connector for attaching external antennae. Modules with the U.FL connector are identified by the "HR" suffix. om The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available from the Antenova website Fehler! Verweisquelle konnte nicht gefunden werden.. Chip EM351 EM351 EM357 EM357 ot R ec Module ETRX351 ETRX351HR ETRX357 ETRX357HR Flash 128kB 128kB 192kB 192kB RAM 12kB 12kB 12kB 12kB Table 1: Memories N The ETRX351 and ETRX357 are used for ZigBee (www.zigbee.org) applications. In case it is desired to develop custom firmware instead of using the pre-loaded AT-Command interface, the Ember InSight toolchain, consisting of InSight DesktopTM together with a comprehensive integrated development environment (IDE), is required. The Ember development environment is currently not suitable for developing an IEEE802.15.4-only application that does not use the ZigBee layer. (c)2015 Silicon Labs -5- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 2 Product Approvals 2.1 es ig n The ETRX351 and ETRX357 as well as the ETRX351HR and ETRX357HR have been designed to meet all national regulations for world-wide use. In particular the following certifications have been obtained: FCC Approvals N ew D The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and the ETRX357HR including the antennas listed in Table 2 have been tested to comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter. FCC statement: This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. m en de d fo r FCC ID: S4GEM35XA Item Part No. 1 BT-Stubby (straight) BT-Stubby (right2 angle) 3 WH-2400-U2.5 Manufacturer EAD Ltd. [6] Type 1/4 Wave EAD Ltd. [6] 1/4 Wave Wellhope Wireless [7] 1/2 Wave 4 Antenova Chip om Rufa (on board) Impedance Gain 50 0dBi 50 0dBi 50 50 2.5dBi 2.1dBi (peak) Table 2: Approved Antennae ot R ec While the applicant for a device into which the ETRX351 (ETRX357) or ETRX351HR (ETRX357HR) with an antenna listed in Table 2 is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product. The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the equipment. N When using the ETRX351HR and ETRX357HR with approved antennae, it is required to prevent end-users from replacing them with non-approved ones. The module and associated antenna must be installed to provide a separation distance of at least 20cm from all persons and must not transmit simultaneously with any other antenna or transmitter. (c)2015 Silicon Labs -6- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 FCC Labelling Requirements 2.2 es ig n When integrating the ETRX351, ETRX357, ETRX351HR or ETRX357HR into a product it must be ensured that the FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM35XA) as well as the FCC notice shown on the previous page. This exterior label can use wording such as "Contains Transmitter Module FCC ID: S4GEM35XA" or "Contains FCC ID:S4GEM35XA" although any similar wording that expresses the same meaning may be used. IC (Industry Canada) Approvals N ew D The Telegesis ETRX351 and ETRX357 with integrated Antenna as well as the ETRX351HR and the ETRX357HR modules have been approved by Industry Canada to operate with the antenna types listed in Table 2 with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. fo r IC-ID: 8735A-EM35XA This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. * Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. ot R ec * This module complies with FCC and Industry Canada RF radiation exposure limits set forth for general population. To maintain compliance, this module must not be colocated or operating in conjunction with any other antenna or transmitter. This device has been designed to operate with the antennas listed in Table 2, and having a maximum gain of 2.5 dBi. Antennas not included in this list or having a gain greater than 2.5 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. om * m en de d * N The labelling requirements for Industry Canada are similar to those of the FCC. Again a clearly visibly label must be placed on the outside of the finished product stating something like "Contains Transmitter Module, IC: 8735A-EM35XA", although any similar wording that expresses the same meaning may be used. The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub. B - Unintentional Radiators. (c)2015 Silicon Labs -7- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 2.3 European Certification (ETSI) The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to the following standards: Radio: EMC: Safety: EN 300 328:V1.8.1 EN 301 489-17:V2.2.1 EN 60950-1:2006 / A12:2011 es ig n * * * D For this purpose the ETRX351HR and ETRX357HR have been tested with the antennae listed in Table 2. fo r N ew If the ETRX351, ETRX357, ETRX351HR or ETRX357HR module is incorporated into an OEM product, the OEM product manufacturer must ensure compliance of the final product to the European Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The final product must not exceed the specified power ratings, antenna specifications and installation requirements as specified in this user manual. If any of these specifications are exceeded in the final product then a submission must be made to a notified body for compliance testing to all of the required standards. ICASA Approvals om 2.4 m en de d The `CE' marking must be applied to a visible location on any OEM product. For more information please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Australia and New Zealand (C-Tick) ot R 2.5 ec The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in South Africa. The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in Australia and New Zealand. N In order to have a C-Tick mark on an end product integrating an ETRX35x device, a company must comply with a or b below. a). have a company presence in Australia. b). have a company/distributor/agent in Australia that will sponsor the importing of the end product. (c)2015 Silicon Labs -8- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 2.6 Brazil ot R ec om m en de d fo r N ew D es ig n The ETRX357 and ETRX357HR have been certified to be used in Brazil. 2.7 Declarations of Conformity N Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee RF Modules, which cover Radio Emissions, EMC and Safety. These documents are available from our website or on request. 2.8 IEEE 802.15.4 IEEE 802.15.4 is a standard for low data-rate, wireless networks (raw bit-rate within a radio packet of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol. (c)2015 Silicon Labs -9- ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 2.9 The ZigBee Protocol es ig n The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices over short to medium distances. The specification was originally ratified in December 2004, paving the way for companies to start making low-power networks a reality. D ZigBee uses the IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional layers for networking, security and applications. What makes the specification unique is its use of a mesh network architecture which, in bucket chain style, passes data from one node to the next until it lands at its destination. The network is self-healing and adapts its routing as link quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers, but can therefore be put into a low-power sleep state. fo r Truly self healing mesh networking Messages can now travel up to 30 hops Source-Routing for improved point to multipoint message transmission Improved security including Trust-Centre link keys New message types and options m en de d * * * * * N ew The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006, adding new features and improvements to the only global wireless communication standard enabling the development of easily deployable low-cost, low-power, monitoring and control products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced the PRO featureset which offers advantages over earlier versions, including N ot R ec om The Telegesis AT-Commandset, which by default ships on all ETRX3 series products is based on the ZigBee PRO featureset. For more information on the Telegesis AT-Commandset please refer to the separate documentation at www.telegesis.com. (c)2015 Silicon Labs - 10 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 fo r N ew D es ig n 3 Module Pinout m en de d Figure 1: ETRX3 series Module Pinout (top view) The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series modules to the application board. For more information on the alternate functions please refer to [2]. Also refer to the Telegesis AT Commandset documentation and the Telegesis development kit documentation to understand how the pre-programmed firmware makes use of the individual I/Os. All GND pads are connected within the module, but for best RF performance all of them should be grounded externally ideally to a ground plane. N ot R ec om "Important Note: If designers would like to keep open the option of using either standard or long range modules in the same product please note the following. The ETRX35x series and the ETRX35x-LRS series of modules are footprint compatible, but on the ETRX35x-LRS series pins PB0 and PC5 of the EM357 are used internally to control the front-end module and are not available to the user." (c)2015 Silicon Labs - 11 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 Name EM35x Pin Default use 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 GND PC5 {1} PC6 PC7 PA7 {5} PB3 {2,3} nReset {6} PB4 {2,3} PA0 PA1 PA2 PA3 GND PA4 PA5 {4} PA6 {5} PB1 {3} PB2 {3} GND GND JTCK PC2 PC3 PC4 PB0 PC1 PC0 {5} PB7 {5} PB6 {5} PB5 GND Vcc GND GND 11 13 14 18 19 12 20 21 22 24 25 GND 26 27 29 30 31 GND GND 32 33 34 35 36 38 40 41 42 43 GND Vcc GND GND TX_ACTIVE OSC32B, nTX_ACTIVE OSC32A, OSC32_EXT TIM1C4 SC1nCTS, SC1SCLK, TIM2C3 I/O I/O I/O I/O, CTS nReset I/O, RTS I/O I/O I/O I/O GND I/O I/O I/O TXD RXD GND GND D TIM2C4, SC1nRTS, SC1nSSEL TIM2C1, SC2MOSI TIM2C3, SC2SDA, SC2MISO TIM2C4, SC2SCL, SC2SCLK SC2nSSEL, TRACECLK, TIM2C2 N ew ADC4, PTI_EN, TRACEDATA ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3 TIM1C3 SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1 SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2 fo r SWCLK JTDO, SWO JTDI JTMS, SWDIO VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK ADC3, SWO, TRACEDATA0 JRST, IRQD, TRACEDATA1 ADC2, IRQC, TIM1C2 ADC1, IRQB, TIM1C1 ADC0, TIM2CLK, TIM1MSK m en de d I/O I/O I/O I/O, IRQ I/O I/O I/O I/O I/O GND Vcc GND Alternate Functions es ig n ETRX35x Pad Table 3: Pin Information Notes: om {1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the EM35x radio circuit is in transmit mode. PC5 is not usable on the long range version of the ETRX35x as this GPIO is used internally as TX_ACTIVE to control the external RF frontend. ec {2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively. The device sends its data on TXD and receives on RXD. ot R {3} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See the AT Command Manual. N {4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader {5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8) {6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is low See also the table "Module pads and functions" in the ETRX357 Development Kit Product Manual. Refer to Ember's EM357 manual for details of the alternate functions and pin names. (c)2015 Silicon Labs - 12 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 4 Hardware Description Vcc I/O LDO 1V8 1,8Vdc integrated antenna A/D UART LDO 1V25 EM35x RESET rf terminal selection, filtering and matching circuitry 24MHz JTAG programming fo r U.FL socket RESET N ew 5 I/O D BALUN es ig n Vreg m en de d Figure 2: Hardware Diagram The ETRX351, ETRX351HR, ETRX357 and ETRX357HR are based on the Ember EM351 and EM357 respectively. The EM351 and EM357 are fully integrated 2.4GHz ZigBee transceivers with a 32-bit ARM(R) Cortex M3TM microprocessor, flash and RAM memory, and peripherals. The industry standard serial wire and JTAG programming and debugging interfaces together with the standard ARM system debug components help to streamline any custom software development. om In addition to this a number of MAC functions are also implemented in hardware to help maintaining the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards. ec The new advanced power management features allow faster wakeup from sleep and new power down modes allowing this 3rd generation module to offer a longer battery life than any 2nd generation modules on the market. N ot R The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal can be connected externally to pads 3 and 4 in case more accurate timing is required. To utilize the external watch crystal custom firmware is required. 4.1 Hardware Interface All GPIO pins of the EM351 or EM357 are accessible on the module's pads. Whether signals are used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware. When using the Telegesis AT Commandset please refer to the AT Commandset manual and the development kit manual for this information and when developing custom firmware please refer to the EM35x datasheet [2]. (c)2015 Silicon Labs - 13 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 5 Firmware Description The modules will be pre-loaded with a standalone bootloader which supports over-the-air bootloading as well as serial bootloading of new firmware. es ig n In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and powercycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure not to pull this pin down during boot-up unless the resistance to ground is >10k. (A pull-up is not required). N ew D In addition to the standalone bootloader the modules also contain the current release of the Telegesis AT-style command interface as described in the Telegesis AT command dictionary and the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and responses pass through the serial port of the ETRX35x as ASCII text, so a simple terminal application will usually suffice. We provide Telegesis Terminal for interaction with the module but it is not an essential feature. m en de d fo r The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and receive messages via a parent router. In addition to classical sleepy and non-sleepy end devices the module firmware also supports mobile (sleepy) end devices capable of changing their parent quickly whenever they change their position within the network.] A router is typically a mains powered device whilst a sleepy end device (SED) can be battery powered. The module is also able to act as a coordinator and Trust Centre through external host control. The AT style command line supplies all the tools required to set up and manage a ZigBee network by allowing easy access to the low-level functionality of the stack. om The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome many of the limitations of the tree network topology of the ZigBee 2006 stack by using the ZigBee PRO featureset. N ot R ec The Telegesis firmware allows low-level access to physical parameters such as channel and power level. Parameters that define the functionality of the ETRX35x module and also allow standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The SPI and I2C buses are not supported by the current firmware release, but can be used with custom firmware. (c)2015 Silicon Labs - 14 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 5.1 Token Settings D TG Default <not written> <not written> <not written> TELEGESIS <Order Code> 0x1010 0xFF26 <not written> <not written> <not written> <not written> <not written> N ew Description Option Bytes Optional Version Number Custom EUI Device Specific String Hardware Identifier Manufacturer ID Default Power Settings Bootloader Key EZSP related SE Security SE Installation Crystal Bias fo r Token MFG_CIB_OBS MFG_CUSTOM_VERSION MFG_CUSTOM_EUI_64 MFG_STRING MFG_BOARD_NAME MFG_MANUF_ID MFG_PHY_CONFIG MFG_BOOTLOAD_AES_KEY MFG_EZSP_STORAGE MFG_CBKE_DATA MFG_INSTALLATION_CODE MFG_OSC24M_BIAS_TRIM es ig n The ETRX3 Series Modules' tokens will be pre-programmed with the settings shown in the table below. 5.2 m en de d Table 4. Manufacturing tokens Custom Firmware N ot R ec om For high volume customers the firmware can be customised on request. In addition to this the ETRX3 series of modules is an ideal platform for developing custom firmware. In order to develop custom firmware the Ember Insight toolchain is required. (c)2015 Silicon Labs - 15 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 5.3 Software Interface es ig n Using the default firmware the ETRX35x is controlled using a simple AT-style command interface and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-Commands, please refer to the AT command dictionary document which corresponds to the firmware revision you intend to use. In addition to the command dictionary there are user guides explaining the features of the firmware in more detail. If you need to find out which firmware resides on your module simply type "ATI" followed by a carriage return and you will be prompted with the module's manufacturing information. N ot R ec om m en de d fo r N ew D The Development Kit manual describes how to upgrade the firmware either via a serial link or over the air. (c)2015 Silicon Labs - 16 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 6 Absolute Maximum Ratings Item Symbol Absolute Maximum Ratings Unit 1 2 Supply voltage Voltage on any Pad Voltage on any Pad pin (PA4, PA5, PB5, PB6, PB7, PC1), when used as an input to the general purpose ADC with the low voltage range selected Module storage temperature range Reel storage temperature range Operating temperature range Input RF level Reflow temperature V CC V in -0.3 to +3.6 -0.3 to V CC +0.3 Vdc Vdc V in -0.3 to +2.0 T stg T strgreel T op P max T Death -40 to +105 0 to 75 -40 to +85 15 Please refer to chapter 12 4 5 6 7 8 Vdc D 3 es ig n No. C C C dBm C N ew Table 5: Absolute Maximum Ratings The absolute maximum ratings given above should under no circumstances be violated. Exceeding one or more of the limiting values may cause permanent damage to the device. No. 1 2 3 Item ESD on any pad according to Human Body Model (HBM) circuit description ESD on non-RF pads according to Charged Device Model (CDM) circuit description ESD on RF terminal according to Charged Device Model (CDM) circuit description Moisture Sensitivity Level ot R ec 4 Environmental Characteristics om 6.1 m en de d fo r Caution! ESD sensitive device. Precautions should be used when handling the device in order to prevent permanent damage. N 6.2 No. Symbol Absolute Maximum Ratings Unit V THHBM 2 kV V THCDM 400 V V THCDM 225 V MSL MSL3 Table 6: Absolute Maximum Ratings Recommended Operating Conditions Item Condition / Remark Symbol Value Min 1 2 3 4 Supply voltage RF Input Frequency RF Input Power Operating temperature range Typ Unit Max V CC fC p IN 2.1 2405 3.6 2480 0 Vdc MHz dBm T op -40 +85 C Table 7: Recommended Operating Conditions (c)2015 Silicon Labs - 17 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 7 DC Electrical Characteristics V CC = 3.0V, T AMB = 25C, NORMAL MODE (non-Boost) unless otherwise stated Condition / Remark Item Symbol Value Min om ec ot R N (c)2015 Silicon Labs Typ 2.1 Max 3.6 Vdc I SLEEP 0.4 I SLEEP 0.7 D V CC I SLEEP 1.0 A 1.3 A A A N ew I SLEEP 1.2 I MCU 6.0 mA I MCU 7.5 mA I MCU 3.0 mA I MCU 2.0 mA I SC 0.2 mA I TIM 0.25 mA I ADC 1.1 mA I RX 22 mA I RX 25 mA I RX 26.5 mA I RX 27 mA I RX 28.5 mA fo r I RESET m en de d 1 Module supply voltage Deep Sleep Current Quiescent current, 2 internal RC oscillator disabled Quiescent current, 3 internal RC oscillator enabled Quiescent current, 4 including 32.768kHz oscillator Quiescent current including internal RC 5 oscillator and 32.768kHz oscillator Reset Current Quiescent current 6 nReset asserted Processor and Peripheral Currents ARM(R) CortexTM M3, 25C, 12MHz 7 RAM and flash memory Core clock ARM(R) CortexTM M3, 25C, 24MHz 8 RAM and flash memory Core clock ARM(R) CortexTM M3, 25C, 12MHz 9 RAM and flash memory Core clock sleep current ARM(R) CortexTM M3, 25C, 6MHz Core 10 RAM and flash memory clock sleep current Per serial 11 Serial controller current controller at max. clock rate General purpose timer Per timer at max. 12 current clock rate General purpose ADC Max. Sample 13 current rate, DMA RX Current Radio receiver MAC and ARM(R) CortexTM 14 Baseband M3 sleeping. Receive current Total, 12MHz 15 consumption clock speed Receive current Total, 24MHz 16 consumption clock speed Receive current Total, 12MHz 17 consumption clock speed BOOST MODE Receive current Total, 24MHz 18 consumption clock speed BOOST MODE Unit es ig n No. - 18 - 2.0 mA ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 Wake time from deep sleep 24 Shutdown time I TXVCC 31 mA at +8dBm module output power I TXVCC 42 mA I TXVCC 28.5 mA I TXVCC 23.5 at +0dBm module output power at min. module output power From wakeup event to 1st instruction From last instruction into deep sleep 100 5 mA s s N ew Table 8: DC Electrical Characteristics es ig n 23 at +3dBm module output power D TX Current Transmit current 19 consumption Transmit Current 20 consumption BOOST MODE Transmit current 21 consumption Transmit current 22 consumption N ot R ec om m en de d fo r Please Note: The average current consumption during operation is dependent on the firmware and the network load, therefore these figures are provided in the command dictionary of the respective firmware. (c)2015 Silicon Labs - 19 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 8 Digital I/O Specifications The digital I/Os of the ETRX35x module No. Condition / Remark Item Symbol Value 2 High Schmitt switching threshold 3 4 Input current for logic 0 Input current for logic 1 Input Pull-up resistor value Input Pull-down resistor value 5 6 Output voltage for logic 0 8 Output voltage for logic 1 9 Output Source Current 10 Output Sink current 11 12 13 Output Source Current Output Sink current Total output current V SWIL 0.42 x V CC 0.5 x V CC Vdc V SWIH 0.62 x V CC 0.8 x V CC Vdc -0.5 0.5 A A I IL I IH I OL = 4mA (8mA) for standard (high current) pads I OH = 4mA (8mA)for standard (high current) pads Standard current pad Standard current pad High current pad (1) High current pad (1) R IPU 24 29 34 k R IPD 24 29 34 k V OL 0 0.18 x V CC V V CC V I OHS 4 mA I OLS 4 mA I OHH I OLH I OH + I OL 8 8 40 mA mA mA V OH m en de d 7 Max N ew Low Schmitt switching threshold Typ fo r 1 Unit D Min Schmitt input threshold going from high to low Schmitt input threshold going from low to high es ig n V CC = 3.0V, T AMB = 25C, NORMAL MODE unless otherwise stated 0.82 x V CC Notes om Table 9. Digital I/O Specifications N ot R ec 1) High current pads are PA6, PA7, PB6, PB7, PC0 (c)2015 Silicon Labs - 20 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 9 A/D Converter Characteristics Item A/D resolution A/D sample time for 7-bit conversion A/D sample time for 14-bit conversion Reference Voltage Max current drain from Vref pin Up to 14 bits 5.33s 682s 1.2V 1mA D No. 1 2 3 4 5 es ig n The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer to section 10 of the EM35x datasheet. N ew Table 10. A/D Converter Characteristics 10 AC Electrical Characteristics No. Receiver fo r V CC = 3.0V, T AMB = 25C, NORMAL MODE measured at 50 terminal load connected to the U.FL socket Min 7 8 9 10 11 ot R 12 m en de d 6 13 14 N 15 16 17 18 19 20 Unit Typ Max -100 -102 2500 -94 -96 2400 0 om 5 Frequency range Sensitivity for 1% Packet Error Rate (PER) Sensitivity for 1% Packet Error Rate (PER) BOOST MODE Saturation (maximum input level for correct operation) High-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) Low-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) 2nd High-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) 2nd Low-Side Adjacent Channel Rejection (1% PER and desired signal -82dBm acc. to [1]) Channel Rejection for all other channels (1% PER and desired signal -82dBm acc. to [1]) 802.11g rejection centred at +12MHz or -13MHz (1% PER and desired signal -82dBm acc. to [1]) Co-channel rejection (1% PER and desired signal -82dBm acc. to [1]) Relative frequency error (2x40ppm required by [1]) Relative timing error (2x40ppm required by [1]) Linear RSSI range Output power at highest power setting NORMAL MODE BOOST MODE Output power at lowest power setting Error vector magnitude as per IEEE802.15.4 Carrier frequency error PSD mask relative 3.5MHz distance from carrier PSD mask absolute 3.5MHz distance from carrier ec 1 2 3 4 Value MHz dBm dBm dBm 41 dB 44 dB 53 dB 52 dB 40 dB 36 dB -6 dBc -120 120 ppm -120 120 ppm 40 0 dB 3 8 -55 5 -40 (1) dBm 15 40 (1) dBm % ppm -20 dB -30 dBm Table 11. AC Electrical Characteristics (c)2015 Silicon Labs - 21 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 Notes (1) Applies across the full ranges of rated temperature and supply voltage. Synthesiser Characteristics Limit Typ Min 2400 11.7 2500 MHz kHz 100 s 100 s N ew Frequency range Frequency resolution Lock time from off state, with correct VCO DAC settings Relock time, channel change or Rx/Tx turnaround Phase noise at 100kHz offset Phase noise at 1MHz offset Phase noise at 4MHz offset Phase noise at 10MHz offset Unit Max -75dBc/Hz -100dBc/Hz -108dBc/Hz -114dBc/Hz fo r 22 23 24 25 26 27 28 29 D No. es ig n Please Note: For the relationship between EM35x power settings and module output power please relate to chapter 10.1 of this document. When developing custom firmware the output power settings described in this document relate directly to the EM35x power settings accessible via the Ember stack API. No. 30 31 m en de d Table 12: Synthesiser Characteristics Power On Reset (POR) Specifications V CC POR release V CC POR assert Min Limit Typ Max Unit 0.62 0.45 0.95 0.65 1.2 0.85 Vdc Vdc Min Reset Filter Time constant Reset Pulse width to guarantee a reset Reset Pulse width guaranteed not to cause reset Input pull-up resistor value while the chip is not reset Input pull-up resistor value while the chip is reset 2.1 26 0 24 12 Limit Typ Unit Max 12 16 29 14.5 1 34 17 s s s k k Table 14: nReset Specifications N ot R 32 33 34 35 36 nRESET Specifications ec No. om Table 13: Power On Reset Specifications (c)2015 Silicon Labs - 22 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 10.1 TX Power Characteristics Figure 3: Output Power vs. Power Setting N ot R ec om m en de d fo r N ew D es ig n The diagrams below show the typical output power and module current in dependency on module EM35x power setting. Power settings above 3dBm have Boost Mode enabled. Please note that the output power is independent of the supply voltage as the radio is supplied by an internally regulated voltage. (c)2015 Silicon Labs - 23 - ETRX35x Product Manual (Rev 1.20) m en de d fo r N ew D Transmit current A es ig n ETRX351 and ETRX357 N ot R ec om Figure 4: Module Current vs. Power Setting (c)2015 Silicon Labs - 24 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 fo r N ew D es ig n 11 Physical Dimensions m en de d Figure 5: ETRX3 Physical Dimensions Explanation L W H A1 A2 R1 R2 X1 Length of the module Width of the module Height of the module Distance centre of pad PCB edge Pitch Keep-out Zone from corner of PCB Keep-out Zone from corner of PCB Distance centre of Antenna connector PCB edge Distance centre of Antenna connector PCB edge Tolerances 25.0mm 19.0mm 3.8mm 0.9mm 1.27mm 17.5mm 4.1mm 3.8mm 0.13mm 0.13mm 0.1mm 0.13mm n/a n/a n/a 0.13mm 2.8mm 0.13mm Table 15: ETRX3 Physical Dimensions ot R ec X2 Typical Distance om Symbol N For ideal RF performance when using the on-board antenna, the antenna should be located at the corner of the carrier PCB. There should be no components, tracks or copper planes in the keep-out area which should be as large as possible. When using the U.FL RF connector the keep-out area does not have to be obeyed. Note: The modules' transmit/receive range will depend on the antenna used and also the housing of the finished product. (c)2015 Silicon Labs - 25 - ETRX35x Product Manual (Rev 1.20) fo r N ew D es ig n ETRX351 and ETRX357 Figure 6. Typical pad dimensions N ot R ec om m en de d Module weight: 2.9-3.0g depending on variant (c)2015 Silicon Labs - 26 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 12 Recommended Soldering Temperature Profile Recommended temperature profile for reflow soldering 60 +60-20s es ig n Temp.[C] 230C -250C max. 220C N ew D 150C - 200C 90 30s fo r Time [s] Figure 7. Recommended Reflow Profile m en de d Use of "No-Clean" solder paste is recommended to avoid the requirement for a cleaning process. Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent and other residuals are remaining underneath the shielding can as well as in the gap between the module and the host board. N ot R ec om Please Note: Maximum number of reflow cycles: 2 Opposite-side reflow is prohibited due to the module's weight. (i.e. you must not place the module on the bottom / underside of your PCB and re-flow). (c)2015 Silicon Labs - 27 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 N ew D es ig n 13 Product Label Drawing Figure 8: Product Label Description Imprint Model:ETRX357 000001 090101 01 02 Module Order Code. Indication for the serial number. Starting at 000000 for each batch incrementing with each module Production Date Code in the format YYMMDD, e.g. 090101 Indication for batch number Indication for the production location (first character) and the hardware revision (second character) The FCC ID The IC ID The CE Mark Information in the 2D-Barcode are the serial number [6 characters], the Part-Order code [12 characters filled with trailing spaces e.g. "ETRX357 " instead of "ETRX357"], identifier for the batch number [2 characters], the identifier for the hardware release [2 characters] and the production date code in the format Year-Month-Day [6 characters], separated by a semicolon. Table 16: ETRX35x Label Details N ot R ec om FCC ID: S4GEM35XA IC: 8735A-EM35XA CE 2D-Barcode m en de d fo r The label dimensions are 16.0mm x 14.0 mm. The label will withstand temperatures and chemicals used during a typical manufacturing process. (c)2015 Silicon Labs - 28 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 14 Recommended Footprint 14.1 Pad dimensions es ig n In order to surface mount an ETRX3 series module, we recommend that you use pads which are 1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 12, and ensure that this keep-out area is free of components, copper tracks and/or copper planes/layers. You must also ensure that there is no exposed copper on your layout which may contact with the underside of the ETRX3 series module. Figure 9: Recommended Footprint ot R ec om m en de d fo r N ew D For best RF performance it is required to provide good ground connections to the ground pads of the module. It is recommended to use multiple vias between each ground pad and a solid ground plane to minimize inductance in the ground path. The land pattern dimensions above serve as a guideline. N We recommend that you use the same pad dimensions for the solder paste screen as you have for the copper pads. However these sizes and shapes may need to be varied depending on your soldering processes and your individual production standards. We recommend a paste screen thickness of 120m to 150m. Figure 6 shows the typical pad dimensions of the module and Figure 10 - Figure 12 in section 14.2 show examples of how to align the module on its host PCB. (c)2015 Silicon Labs - 29 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 es ig n Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as uncovered through-hole vias, planes or tracks on your board component layer, should be located below the ETRX3 series module in order to avoid `shorts'. All ETRX3 series modules use a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have an additional copper plane directly under the ETRX3 series module. 14.2 Recommended Placement m en de d fo r N ew D When placing the module please either locate the antenna in the corner as shown in Figure 10 so that the recommended antenna keepout zone is being followed, or add a no copper zone as indicated in Figure 12. N ot R ec om Figure 10. Typical placement (c)2015 Silicon Labs Figure 11. How to not place the Module - 30 - ETRX35x Product Manual (Rev 1.20) N ew D es ig n ETRX351 and ETRX357 N ot R ec om m en de d fo r Figure 12. Adding a no copper / no component area (c)2015 Silicon Labs - 31 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 14.3 Example carrier board m en de d fo r N ew D es ig n Since the RF performance of the module with the on board antenna is strongly dependent on the proper location of the module on its carrier board, Figure 13 shows the reference carrier board which was used during testing by Telegesis. Figure 13. Reference Board om For best performance it is recommended to locate the antenna towards the corner of the carrier board and to respect the recommended keep-out areas as described in section 11. N ot R ec Finally to provide a good reference ground to the on board antenna, the carrier board should have a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice, but degradation in radio performance could be the result. (c)2015 Silicon Labs - 32 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 15 Reliability Tests No Item es ig n The measurements below have been conducted on random samples out of mass production and passed after the module has been exposed to standard room temperature and humidity for 1 hour. Limit Condition Vibration test Electrical parameter should be in specification 2 Shock test the same as the above 3 Heat cycle test the same as the above 4 5 6 Moisture test Low temp. test High temp. test the same as the above the same as the above the same as the above Dropped onto hard wood from height of 50cm for 3 times -40C for 30min. and +85C for 30min.; each temperature 300 cycles +60C, 90% RH, 300h -40C, 300h +85C, 300h N ew D 1 Freq.:40Hz,Amplitude:1.5mm 20min. / cycle,1hrs. each of X and Y axis Table 17: Reliability Tests 16.1 Safety Precautions fo r 16 Application Notes m en de d These specifications are intended to preserve the quality assurance of products as individual components. Before use, check and evaluate the module's operation when mounted on your products. Abide by these specifications when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions as a minimum: (2) Ensure the safety of the whole system by installing a protection circuit and a protection device. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. om (1) ec 16.2 Design Engineering Notes Heat is the major cause of shortening the life of the modules. Avoid assembly and use of the target equipment in conditions where the product's temperature may exceed the maximum allowable. Failure to do so may result in degrading of the product's functions and damage to the product. If pulses or other transient loads (a large load applied in a short time) are applied to the products, before use, check and evaluate their operation when assembled onto your products. These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully, to determine whether or not they can be used in such a manner. In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. ot R (1) (2) N (3) (4) (5) (c)2015 Silicon Labs - 33 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 In direct sunlight, outdoors, or in a dusty environment In an environment where condensation occurs. In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx) (9) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. (10) Mechanical stress during assembly of the board and operation has to be avoided. (11) Pressing on parts of the metal cover or fastening objects to the metal cover is not permitted. es ig n (6) (7) (8) (6) N ew (4) (5) fo r (3) The module must not be stressed mechanically during storage. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance, may well be adversely affected: Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX Storage in direct sunlight Storage in an environment where the temperature may be outside the range of 5C to 35C range, or where the humidity may be outside the 45 to 85% range. Storage (before assembly of the end product) of the modules for more than one year after the date of delivery at your company even if all the above conditions (1) to (3) have been met, should be avoided. 17 Packaging m en de d (1) (2) D 16.3 Storage Conditions 17.1 Embossed Tape Dimensions of the tape N ot R ec om (1) (c)2015 Silicon Labs - 34 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 (2) Cover tape peel force = 10deg Speed = 300mm/min. es ig n Force direction Empty pockets fo r N ew (3) D Cover tape peel force =0.0980.68N (1070g) m en de d NB: Empty pockets in the populated area will be less than two per reel and those empty pockets will not be consecutive. 17.2 Component Orientation Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the carrier tape (top view) Component Orientation ec Part No. om Direction ot R 17.3 Reel Dimensions Quantity per reel: 600 pieces Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on the reel N (4) (5) (c)2015 Silicon Labs - 35 - ETRX35x Product Manual (Rev 1.20) N ot R ec om m en de d fo r N ew D es ig n ETRX351 and ETRX357 (c)2015 Silicon Labs - 36 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 17.4 Packaging - bag (7) Each reel will be packed in a hermetically-sealed bag containing desiccant and a humidity indicator card Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code es ig n (6) 17.5 Packaging - carton (8) N ot R ec om m en de d fo r N ew D (9) Each reel and bag will be placed in a cardboard carton of nominal dimensions 343 x 338 x 68 mm. Weight of carton containing reel of 600 modules: 2.51kg approx. (c)2015 Silicon Labs - 37 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 18 Ordering Information Description ETRX351 ETRX357 Telegesis Wireless Mesh Networking Module with Ember ZigBee Technology: * ETRX351HR ETRX357HR D Telegesis Wireless Mesh Networking Module with Ember ZigBee Technology: Telegesis Development Kit with: * * * * * * * * * 3 x ETRX35xDV Development Boards 3 x USB cables 2 x ETRX35x on carrier boards 2 x ETRX35xHR on carrier boards 2 x ETRX35x-LR on carrier boards 2 x ETRX35xHR-LR on carrier boards 1 x ETRX2USB USB stick 2 x 1/2-wave antennae 2 x 1/4-wave antennae ec om m en de d * Based on Ember EM351 or EM357 Telegesis AT Style Command Interpreter based on EmberZNet meshing and self-healing ZigBee PRO stack U.FL coaxial Antenna Connector fo r * * * ETRX3DVK Based on Ember EM351 or EM357 Telegesis AT Style Command Interpreter based on EmberZNet meshing and self-healing ZigBee PRO stack Integrated 2.4GHz Antenna N ew * * * es ig n Ordering/Product Code N ot R Notes: * Customers' PO's must state the Ordering/Product Code. * There is no "blank" version of the ETRX35x modules available. All Modules are preprogrammed with the Telegesis AT style command interpreter based on the EmberZNet stack. (In case it is desired to program custom firmware the pre-programmed firmware can simply be overwritten). (c)2015 Silicon Labs - 38 - ETRX35x Product Manual (Rev 1.20) ETRX351 and ETRX357 19 RoHS Declaration Declaration of environmental compatibility for supplied products: D Lead and lead compounds Mercury and mercury compounds Chromium (VI) PBB (polybrominated biphenyl) category PBDE (polybrominated biphenyl ether) category N ew * * * * * es ig n Hereby we declare based on the declaration of our suppliers that this product does not contain any of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous materials for: And a maximum concentration of 0.01% by weight in homogeneous materials for: * Cadmium and cadmium compounds fo r 20 Data Sheet Status m en de d Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design. 21 Related Documents [1] IEEE Standard 802.15.4 -2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2] Datasheet EM35x, Silicon Labs. (www.silabs.com) [5] Specification for Antenova Rufa Antenna (www.antenova.com) Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com) ot R [6] The ZigBee specification (www.zigbee.org) ec [4] om [3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height Wellhope Communication Equipment (www.wellhope-wireless.com) N [7] (c)2015 Silicon Labs - 39 - ETRX35x Product Manual (Rev 1.20) es ig n D N ew fo r om m en de d Smart. Connected. Energy-Friendly. Products www.silabs.com/products Quality www.silabs.com/quality Support and Community community.silabs.com N ot R ec Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. 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