Serializer
Deserializer
DS30BA101 DS30EA101
150 Mbps
to
3.125 Gbps
100: Differential Cable or
75: Coaxial Cable
Max Cable Loss ~ 50 dB @ 1.5 GHz
DS30EA101
www.ti.com
SNLS404A –FEBRUARY 2012–REVISED APRIL 2013
DS30EA101 0.15 to 3.125 Gbps Adaptive Cable Equalizer
Check for Samples: DS30EA101
1FEATURES DESCRIPTION
The DS30EA101 is an adaptive cable equalizer
2• Automatic Equalization of Coaxial and Twisted optimized for equalizing data transmitted over copper
Pair Cables cables. The equalizer operates over a range of data
• Data Rates from 150 Mbps to 3.125 Gbps rates from 150 Mbps to 3.125 Gbps and automatically
• Supports SD and HD Video Resolutions adapts to equalize signals sent over any cable length
from zero meters to lengths that attenuate the signal
• Power Consumption: 115 mW Typical by 50 dB at 1.5 GHz.
• Industrial Temperature Range: -40°C to +85°C The DS30EA101 allows either single-ended or
differential input. This enables equalization of signals
APPLICATIONS over coaxial cables as well as twisted pair cables.
• Cable Extension Additional features include an LOS detect and output
• Data Recovery Equalization enable which, when tied together, disable the output
• Security and Surveillance when no input signal is present.
The DS30EA101 is powered from a single 2.5V
supply and consumes 115 mW (typical). It operates
over the full industrial temperature range of -40°C to
+85°C and is available in a 4 x 4 mm 16-pin WQFN
package.
Typical Application
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2012–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
1
4
3
2DS30EA101
(top view)
12
9
10
11
85 6 7
1316 15 14
VEE
IN-
IN+ OUT+
OUT-
VEE
DNC
DNC LOS
VCC
VCC
EN
DAP = VEE
VEE
VEE
VEE
VEE
DS30EA101
SNLS404A –FEBRUARY 2012–REVISED APRIL 2013
www.ti.com
Connection Diagram
The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Figure 1. 16-Pin WQFN Package
See Package Number RUM0016A
PIN DESCRIPTIONS
Pin Name I/O, Type Description
1 VEE Ground Negative power supply (ground).
2 IN+ I, Data Non-inverting input.
3 IN- I, Data Inverting input.
4 VEE Ground Negative power supply (ground).
5 DNC N/A Do not connect – leave open.
6 DNC N/A Do not connect – leave open.
7 VEE Ground Negative power supply (ground).
8 VEE Ground Negative power supply (ground).
9 VEE Ground Negative power supply (ground).
10 OUT- O, LVDS Inverting output.
11 OUT+ O, LVDS Non-inverting output.
12 VEE Ground Negative power supply (ground).
13 VCC Power Positive power supply (+2.5V).
14 EN I, LVCMOS Output enable. LOS may be tied to this pin to inhibit the output when no input signal is
present. This pin has an internal pulldown.
H = Outputs disabled.
L = Outputs enabled.
15 LOS O, LVCMOS Loss of signal.
H = No input signal detected.
L = Input signal detected.
16 VCC Power Positive power supply (+2.5V).
DAP VEE Ground Connect exposed DAP to negative power supply (ground).
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Product Folder Links: DS30EA101
DS30EA101
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SNLS404A –FEBRUARY 2012–REVISED APRIL 2013
Absolute Maximum Ratings(1)
Supply Voltage 3.1V
Input Voltage (all inputs) −0.3V to VCC+0.3V
Storage Temperature Range −65°C to +150°C
Junction Temperature +125°C
Package Thermal Resistance
θJA 16-pin WQFN +40°C/W
θJC 16-pin WQFN +6°C/W
ESD Rating (HBM) ≥±6 kV
ESD Rating (MM) ≥±300V
ESD Rating (CDM) ≥±2 kV
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device my occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
Recommended Operating Conditions
Supply Voltage (VCC) 2.5V ±5%
Input Coupling Capacitance 1.0 µF
Operating Free Air Temperature (TA) -40°C to +85°C
DC Electrical Characteristics
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.(1)(2)
Parameter Test Conditions Reference Min Typ Max Units
VIN Input Voltage 0m cable length IN+, IN- 720 800 880 mVP−P
VSS Steady State Differential Output 100Ωload, Figure 2 OUT+, OUT- 500 700 900 mVP-P
Voltage
VOD Differential Output Voltage 250 350 450 mV
ΔVOD Change in Magnitude of VOD for 50 mV
Complimentary Output States
VOS Offset Voltage 1.1 1.2 1.35 V
ΔVOS Change in Magnitude of VOS for 50 mV
Complimentary Output States
IOS Output Short Circuit Current 30 mA
VIH Input Voltage High Level EN 1.7 VCC V
VIL Input Voltage Low Level VEE 0.7 V
VOH Output Voltage High Level IOH = -2 mA LOS 2.0 V
VOL Output Voltage Low Level IOL = +2 mA 0.2 V
ICC Supply Current 45 65 mA
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Typical values represent most likely parametric norms at VCC = +2.5V, TA= +25°C, and at the Recommended Operating Conditions at
the time of product characterization and are not ensured.
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS30EA101
20%
80%
VOD-
VOD+
VOS
VSS = (VOD+) ± (VOD-)
0V differential
tTLH
+ VOD
20%
80%
tTHL
VSS
- VOD
DS30EA101
SNLS404A –FEBRUARY 2012–REVISED APRIL 2013
www.ti.com
AC Electrical Characteristics
Over recommended supply voltage and operating temperature ranges, unless otherwise specified.(1)(2)
Parameter Test Conditions Reference Min Typ Max Units
DRIN Input Data Rate IN+, IN- 150 3125 Mbps
tJIT Total Jitter at BER 10-12 (3) 3.125 Gbps, UI
0.35
0-10 meters CAT6
2.5 Gbps, UI
0.35
0-25 meters CAT6
1.5 Gbps, UI
0.35
0-50 meters CAT6
3.125 Gbps, UI
0.3
0-100 meters RG59
2.5 Gbps, UI
0.35
0-110 meters RG59
1.5 Gbps, UI
0.2
0-120 meters RG59
tTLH Transition Time Low to High 20% - 80%, 100Ωload, (4), OUT+, OUT- 90 130 ps
Figure 2
tTHL Transition Time High to Low 90 130 ps
(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) Typical values represent most likely parametric norms at VCC = +2.5V, TA= +25°C, and at the Recommended Operating Conditions at
the time of product characterization and are not ensured.
(3) The total jitter at BER 10-12 is calculated as DJ + (14 x RJ), where DJ is deterministic jitter and RJ is random jitter. The jitter is
expressed as a portion of the unit interval (UI). The UI is the reciprocal of the data rate.
(4) Specification is ensured by characterization and is not tested in production.
TIMING DIAGRAMS
Figure 2. LVDS Output Voltage, Offset, and Timing Parameters
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Product Folder Links: DS30EA101
DS30BA101
OUT-
IN+
IN-
OUT+
0.1 PF
50:
50:
953:
100:
1 PF
1 PF
1 PF
1 PFDS30EA101
IN+
IN-
100:
OUT+
OUT-
VCC
100: Differential TP Cable
RVO
DS30EA101
www.ti.com
SNLS404A –FEBRUARY 2012–REVISED APRIL 2013
DEVICE OPERATION
The DS30EA101 equalizes data transmitted over copper cables. It automatically adjusts its gain to reverse the
effects of the cable loss and restore the original signal. For proper operation, the launch amplitude of the signal
going into the cable (the signal amplitude prior to the cable attenuation) must be set appropriately. If the signal is
single-ended, its single-ended amplitude must be 800 mVP-P ±10%. If the signal is differential, its differential
amplitude must be 800 mVP-P ±10% (400 mVP-P single-ended).
INPUT INTERFACING
The DS30EA101 accepts either differential or single-ended input. The input must be AC coupled. Figure 3 and
Figure 4 show the typical configurations for differential input and single-ended input, respectively. For single-
ended input, the unused input must be properly terminated as shown.
OUTPUT INTERFACING
The DS30EA101 output signals (OUT+ and OUT- ) are internally terminated 100ΩLVDS outputs. These outputs
can be DC coupled to most common differential receivers.
LOS AND EN
LOS indicates the loss of signal at the DS30EA101 input. LOS is high when no input signal is present and low
when a valid input signal is detected.
EN can be used to manually disable or enable the OUT+ and OUT- output signals. Applying a high input to EN
will disable the DS30EA101 outputs by forcing the output to a logic 1, and applying a low input to EN will force
the outputs to be active. EN has an internal pulldown to enable the outputs by default.
LOS and EN may be tied together to automatically disable the DS30EA101 outputs when no input signal is
present.
APPLICATION INFORMATION
CABLE EXTENDER APPLICATION
The DS30EA101 together with the DS30BA101 form a cable extender chipset optimized for extending serial data
streams from serializer/deseralizer (SerDes) pairs and FPGAs over 100Ωdifferential cables and 75Ωcoaxial
cables. Setting the correct DS30BA101 output amplitude and proper cable termination are essential for optimal
operation. Figure 3 shows the recommended chipset configuration for 100Ωdifferential cable and Figure 4 shows
the recommended chipset configuration for 75Ωcoaxial cable.
Figure 3. Cable Extender Chipset Application Circuit for 100ΩDifferential Cable
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DS30EA101
DS30BA101
OUT-
IN+
IN-
OUT+
0.1 PF
75:
75:
750:
100:
1 PF1 PF
1 PFDS30EA101
IN+
IN-
75:
OUT+
OUT-
VCC
37.4:
RVO 75: Coaxial Cable
1 PF
75:
DS30EA101
SNLS404A –FEBRUARY 2012–REVISED APRIL 2013
www.ti.com
Figure 4. Cable Extender Chipset Application Circuit for 75ΩCoaxial Cable
6Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: DS30EA101
DS30EA101
www.ti.com
SNLS404A –FEBRUARY 2012–REVISED APRIL 2013
REVISION HISTORY
Changes from Original (April 2013) to Revision A Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: DS30EA101
PACKAGE OPTION ADDENDUM
www.ti.com 15-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
DS30EA101SQ/NOPB ACTIVE WQFN RUM 16 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 30EA101
DS30EA101SQE/NOPB ACTIVE WQFN RUM 16 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 30EA101
DS30EA101SQX/NOPB ACTIVE WQFN RUM 16 4500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 30EA101
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS30EA101SQ/NOPB WQFN RUM 16 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
DS30EA101SQE/NOPB WQFN RUM 16 250 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
DS30EA101SQX/NOPB WQFN RUM 16 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS30EA101SQ/NOPB WQFN RUM 16 1000 213.0 191.0 55.0
DS30EA101SQE/NOPB WQFN RUM 16 250 213.0 191.0 55.0
DS30EA101SQX/NOPB WQFN RUM 16 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
www.ti.com
SQB16A (Rev A)
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