MADS-001317-1500AP - M/A-COM Technology Solutions - Product.Network

1

Solderable GaAs Flip Chip Schottky Diode

Rev. V1

MADS-001317-1500

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and prod uct information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes

to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

• Low Series Resistance

• Low Capacitance

• High Cutoff Frequency

• Silicon Nitride Passivation

• Polyimide Scratch Protection

• Lead Free (RoHS Compliant)

• Designed for Easy Circuit Insertion

• Available in Pocket Tape and Reel

• Can be Mounted with Solder or Conductiv e

Epoxy

Description and Applications

M/A-COM's MADS-001317-1500 single is a gal-

lium arsenide flip chip Schottky barrier diode.

This device is fabricated on OMCVD epitaxial

material using a process designed for high de-

vice uniformity and extremely low parasitics.

This diode is fully passivated with silicon nitride

and has an additional layer of polyimide for

scratch protection. The protective coating pre-

vents damage to the junction during automated

or manual handling. The flip chip configuration

is suitable for pick and place insertion. This de-

vice with can be attached with solder or conduc-

tive epoxy. The high cutoff frequency of this

diode allows use through millimeter wave fre-

quencies. Typical applications include single

and double balanced mixers in PCN transceiv-

ers and radios, police radar detectors, and auto-

motive radar detectors. This diode can be used

through 80 GHz.

.

MADS-001317– 1500

Ordering Information

Part Number Package

MADS-001317-1500AG Gel Pack

MADS-001317-1500AP Pocket Tape and Reel

2

Solderable GaAs Flip Chip Schottky Diode

Rev. V1

MADS-001317-1500

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and prod uct information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes

to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Electrical Specifications @ + 25 °C

Parameters and Test Conditions Symbol Units MADS-001317-1500

Min. Typ. Max.

Junction Capacitance at 0V at 1 MHz Cj pF .020

Total Capacitance at 0V at 1 MHz1 Ct pF .030 .045 .060

Dynamic Resistance at 9.5 - 10.5mA Rs Ohms 4 7

Forward Voltage at +1mA Vf1 Volts .60 .70 .80

Reverse Breakdown Voltage at -10uA Vbr Volts 4.5 7

Notes:

1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.

3

Solderable GaAs Flip Chip Schottky Diode

Rev. V1

MADS-001317-1500

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and prod uct information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes

to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Absolute Maximum Ratings 1

Parameter Absolute Maximum

Operating Temperature -65 °C to +125 °C

Storage Temperature -65 °C to +150 °C

Incident LO Power +20 dBm

Incident RF Power +20 dBm .

Mounting Temperature +260 °C

Electrostatic Discharge ( ESD ) Classification 2 Class 0

1. Operation of this device above any one of these parameters may cause permanent damage.

2. Human Body Model

Forward Current vs Temperature

0.00

0.01

0.10

1.00

10.00

100.00

0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00

Forward Voltage (V)

Fo rw ard Cu rrent (mA)

- 50°C

+125°C 25°C

4

Solderable GaAs Flip Chip Schottky Diode

Rev. V1

MADS-001317-1500

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and prod uct information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes

to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Mounting Techniques

Die attach for these devices is made simple through the use of surface mount die attach techno logy.

This chip was designed to be inserted onto hard or soft substrates with the junction side down. This chip can be

mounted with conductive epoxy or with solder.

Solder Die Attach:

This device can be mounted with Sn63/Pb37 or RoHS compliant solder.

Typical reflow profiles are provided on M/A-Com application note M538, “ Surface Mounting Instructions”

which can be found @ www.macomtech.com

Epoxy Die Attach:

This device can also be attached with condu ctive epoxy. The assembly can be preheated to 125 - 15 0°C.

Use a minimum amount of epoxy. Cure epoxy as per manufacturer’ s instructions.

Handling Procedures

The following precautions sho uld be observed to avoid damaging these chips:

Cleanliness: The chips should be handled in a clea n environment.

Do not attempt to clean die after installation.

Static Sensitivity: Schottky barrier diodes are ESD sensitive and can be damaged by static

electricity. Proper ESD techniques should be used when handling these devices.

General Handling: The protective polymer coating on the active areas of these die provides scratch

protection, particularly for the metal air bridge which conta cts the anode. Die can

be handled with tweezers or vacuum pickups and ar e suitable for use with

automatic pick-and-place equipment.

5

Solderable GaAs Flip Chip Schottky Diode

Rev. V1

MADS-001317-1500

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and prod uct information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes

to the product(s) or information contained herein without notice.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Flip Chip Outline Drawing