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Chip Bead Array
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
X
2
C
3
2
4
8
5
B
6
B
7
1
8
2
9
1
10
U
11 12
Noise Filter
High Speed Signal Type
B
Chip size 1005 mm
x4 Array
Multilayer
Chip bead
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Packing
Embossed Carrier Taping
Code
U
Product Code Type
Characteristics
Size Nominal Impedance Form Suffix
B
Ringing Suppression Type
A
Ferrite Core
Inner Conductor Electrode
EF
A
B
D
C
■Features
● Space saving
● SSOP package (0.5 mm pitch) compatibility
● Small size and lightweight
● RoHS compliant
Type: EXC28BB
● Suitable for high speed signals (over 50 MHz)
● Excellent cross talk characteristics (100 MHz:<-25 dB)
Type: EXC28BA
● Reduces waveform ringing noise
● Excellent cross talk characteristics (100 MHz:<-30 dB)
■Explanation of Part Numbers
■ Recommended Applications
● Small digital equipment such as PCs, printers, HDD,
DVD-ROMs, CD-ROMs, LCDs.
● Digital audio and video equipment such as DSC,
DVC, CD Players, DVD Players, MD Players.
● Electronic musical instruments, and other digital
equipment.
Chip Bead Array
Type: EXC28B
■Construction ■Dimensions in mm (not to scale)
Type
(inch size)
Dimensions (mm)
Mass
(Weight)
[mg/pc.]
ABCDEF
EXC28B
(0804)
1.00±0.15 2.0±0.2 0.5±0.1 0.20±0.15 0.5±0.1 0.25±0.10
5.2
Feb. 201101
– 249 –
Chip Bead Array
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
400
350
300
250
200
150
100
50
0
110100 1000 10000
Z
X
R
Frequency(MHz)
|Z| ,R,X(액)
400
350
300
250
200
150
100
50
0
110100 1000 10000
|Z| ,R,X(액)
Frequency(MHz)
Z
X
R
400
350
300
250
200
150
100
50
0
110100 1000 10000
Frequency(MHz)
Z
X
R
|Z| ,R,X(액)
400
350
300
250
200
150
100
50
0
110100 1000 10000
Frequency(MHz)
Z
X
R
|Z| ,R,X(액)
■Ratings
■ Impedance Characteristics (Reference Data) Measured by HP4291A
● EXC28BA121U (2010) ● EXC28BB121U (2010)
● EXC28BA221U (2010) ● EXC28BB221U (2010)
Type Part Number Impedance Rated Current
(mA DC)
DC Resistance
(액) max.
(액) at 100MHz tol.(%)
BA EXC28BA121U 120
±25 100
0.5
EXC28BA221U 220 0.7
BB EXC28BB121U 120 0.5
EXC28BB221U 220 0.7
훺Z훺 : Impedance R : Resistance X : Reactance
● Category Temperature Range –40 °C to +85 °C
Feb. 201101
– 250 –
Chip Bead Array
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
876 5
1234
8765
1234
t1
t2
D0
P1P2P0
A
B
FE
W
φ
Chip component
Sprocket hole Compartment
Tape running direction
E
T
W
φD
φC
φA
φB
● Taping Reel
● Embossed Carrier Taping
Standard Reel Dimensions (mm)
Embossed Carrier Dimensions (mm)
Part Number Kind of Taping Pitch (P1) Quantity
EXC28B첸첸첸첸UEmbossed Carrier Taping 4 mm 5000 pcs./reel
■Packaging Methods (Taping)
● Standard Quantity
Part Number A B W F E P1P2P0φD0t1t2
EXC28B첸첸첸첸U
1.20±0.15 2.25±0.15 8.0±0.2 3.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 0.25±0.05 0.90±0.15
Part Number φAφBφCφDE W T
EXC28B첸첸첸첸U180–3.0 60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5 9.0±0.3 11.4±1.5
0
■Circuit Confi guration(No Polarity)
Feb. 201101
– 251 –
Chip Bead Array
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
A
DCD
EF EFE EF
B
Preheating
Peak
Heating
Temperature
Time
■Recommended Land Pattern Design
■Recommended Soldering Conditions
Recommendations and precautions are described below.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Use rosin-based fl ux or halogen-free fl ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Chip Bead Array (hereafter called the bead arrays) or pinch them with a hard tool (e.g. pliers
and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress
may damage the bead arrays. Handle with care.
4. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
60 %, where there are no rapid changes in temperature or humidity.
5. Use the bead arrays within half a year after the date of the out go ing inspection indicated on the packages.
Dimension (mm)
A 1.4
B 1.75
C 0.4
D 0.5
E 0.25
F 0.25
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 10 °C max. 10 s
Temperature Time
Preheating 150 °C to 170 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
●Recommended soldering conditions for refl ow
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
●Flow soldering
· We do not recommend fl ow soldering , because fl ow soldering may cause bridges between the electrodes.
Sep. 201000
