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Chip Bead Array
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
A
DCD
EF EFE EF
B
Preheating
Peak
Heating
Temperature
Time
■Recommended Land Pattern Design
■Recommended Soldering Conditions
Recommendations and precautions are described below.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Use rosin-based fl ux or halogen-free fl ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Chip Bead Array (hereafter called the bead arrays) or pinch them with a hard tool (e.g. pliers
and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress
may damage the bead arrays. Handle with care.
4. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
60 %, where there are no rapid changes in temperature or humidity.
5. Use the bead arrays within half a year after the date of the out go ing inspection indicated on the packages.
Dimension (mm)
A 1.4
B 1.75
C 0.4
D 0.5
E 0.25
F 0.25
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 10 °C max. 10 s
Temperature Time
Preheating 150 °C to 170 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
●Recommended soldering conditions for refl ow
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
●Flow soldering
· We do not recommend fl ow soldering , because fl ow soldering may cause bridges between the electrodes.
Sep. 201000