Preliminary Data Sheet PS9331L, PS9331L2 R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER DESCRIPTION The PS9331L and PS9331L2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and power MOSFETs on the output side on one chip. The PS9331L and PS9331L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9331L2 has 8 mm creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP. The PS9331L and PS9331L2 are designed specifically for high common mode transient immunity (CMR) and high switching speed. It is suitable for driving IGBTs and MOS FETs. The PS9331L is lead bending type (Gull-wing) for surface mounting. The PS9331L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. FEATURES Long creepage distance (8 mm MIN.: PS9331L2) Half size of 8-pin DIP Peak output current (2.5 A MAX., 2.0 A MIN.) High speed switching (tPLH, tPHL = 175 ns MAX.) High common mode transient immunity (CMH, CML = 50 kV/s MIN.) Operating Ambient Temperature (125 C) Embossed tape product : PS9331L-E3, PS9331L2-E3: 2 000 pcs/reel Pb-Free product Safety standards * UL approved: No. E72422 * CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) * SEMKO approved (EN 60065, EN 60950) * DIN EN 60747-5-5 (VDE 0884-5) approved (Option) PIN CONNECTION (Top View) 6 5 4 SHIELD * * * * * * * * * 1 2 1. Anode 2. NC 3. Cathode 4. VEE 5. VO 6. VCC 3 APPLICATIONS * IGBT, Power MOS FET Gate Driver * Industrial inverter * AC Servo The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 1 of 18 PS9331L, PS9331L2 PACKAGE DIMENSIONS (UNIT: mm) Lead Bending Type (Gull-wing) For Surface Mount PS9331L 4.580.3 6.80.25 (0.82) 9.70.3 0.250.15 0.20.15 3.50.2 3.70.25 7.62 1.27 0.40.1 0.80.25 0.25 M Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) PS9331L2 4.580.3 6.80.25 (0.82) 11.50.3 1.27 0.40.1 R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 0.250.15 0.20.15 3.50.2 3.70.25 7.62 0.750.25 0.25 M Page 2 of 18 PS9331L, PS9331L2 PHOTOCOUPLER CONSTRUCTION Parameter Air Distance (MIN.) Outer Creepage Distance (MIN.) Isolation Distance (MIN.) PS9331L 7 mm 7 mm 0.4 mm PS9331L2 8 mm 8 mm 0.4 mm MARKING EXAMPLE R 9331 N320 Company Initial Type Number Assembly Lot No. 1 pin Mark N 3 20 Week Assembled Year Assembled (Last 1 Digit) Rank Code ORDERING INFORMATION Part Number Order Number PS9331L PS9331L-E3 PS9331L-AX PS9331L-E3-AX PS9331L2 PS9331L2-E3 PS9331L2-AX PS9331L2-E3-AX PS9331L-V PS9331L-V-E3 PS9331L-V-AX PS9331L-V-E3-AX PS9331L2-V PS9331L2-V-AX PS9331L2-V-E3 PS9331L2-V-E3-AX Note: Solder Plating Specification Pb-Free (Ni/Pd/Au) Packing Style Safety Standard Approval 20 pcs (Tape 20 pcs cut) Standard Embossed Tape 2 000 products pcs/reel (UL, CSA, 20 pcs (Tape 20 pcs cut) SEMKO Embossed Tape 2 000 approved) pcs/reel 20 pcs (Tape 20 pcs cut) DIN EN 60747-5-5 Embossed Tape 2 000 (VDE 0884-5) pcs/reel approved 20 pcs (Tape 20 pcs cut) (Option) Embossed Tape 2 000 pcs/reel Application *1 Part Number PS9331L PS9331L2 PS9331L PS9331L2 *1. For the application of the Safety Standard, following part number should be used. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 3 of 18 PS9331L, PS9331L2 ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Diode Parameter Forward Current Symbol IF Peak Transient Forward Current (Pulse Width < 1 s) Reverse Voltage Power Dissipation *1 Detector High Level Peak Output Current *2 Low Level Peak Output Current *2 Supply Voltage Output Voltage Power Dissipation *3 Isolation Voltage *4 Operating Frequency Operating Ambient Temperature Storage Temperature Notes: *1. *2. *3. *4. IF (TRAN) VR PD IOH (PEAK) IOL (PEAK) (VCC - VEE) VO PC BV f TA Tstg Ratings 25 1.0 Unit mA A 5 45 2.5 2.5 0 to 35 0 to VCC 250 5 000 50 -40 to +125 -55 to +150 V mW A A V V mW Vr.m.s. kHz C C Reduced to 1.2 mW/C at TA = 110C or more. Maximum pulse width = 10 s, Maximum duty cycle = 0.2% Reduced to 3.9 mW/C at TA = 85C or more. AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-3 shorted together, 4-6 shorted together. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Forward Current (ON) Forward Voltage (OFF) Operating Ambient Temperature R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Symbol (VCC - VEE) IF (ON) VF (OFF) TA MIN. 15 8 -2 -40 TYP. 10 MAX. 30 12 0.8 125 Unit V mA V C Page 4 of 18 PS9331L, PS9331L2 ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS, VEE = GND, unless otherwise specified) Diode Detector Parameter Forward Voltage Reverse Current Input Capacitance High Level Output Current Symbol VF IR CIN IOH Low Level Output Current IOL High Level Output Voltage Low Level Output Voltage High Level Supply Current Low Level Supply Current UVLO Threshold VOH VOL ICCH ICCL VUVLO+ VUVLO- UVLOHYS UVLO Hysteresis Coupled Notes: *1. *2. *3. *4. Conditions IF = 10 mA, TA = 25C VR = 3 V, TA = 25C f = 1 MHz, VF = 0 V VO = (VCC - 4 V) *2 VO = (VCC - 15 V) *3 VO = (VEE + 2.5 V) *2 VO = (VEE + 15 V) *3 IO = -100 mA *4 IO = 100 mA VO = Open VO = Open VO > 5 V, IF = 10 mA VO > 5 V, IF = 10 mA Threshold Input Current (L H) IFLH IO = 0 mA, VO > 5 V Threshold Input Voltage (H L) VFHL IO = 0 mA, VO < 5 V MIN. 1.35 0.5 2.0 0.5 2.0 VCC - 3.0 10.8 9.5 0.4 TYP.*1 1.56 MAX. 1.75 10 30 2.2 Unit V A pF A 2.4 A VCC - 1.3 0.2 1.7 1.7 12.3 11.0 1.3 0.5 2.2 2.2 13.4 12.5 V V mA mA V 1.7 4.0 V 0.8 mA V Typical values at TA = 25C, VCC - VEE = 30 V. Maximum pulse width = 50 s, Maximum duty cycle = 0.5%. Maximum pulse width = 10 s, Maximum duty cycle = 0.2%. VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle = 20%). SWITCHING CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS, VEE = GND, unless otherwise specified) Parameter Symbol Propagation Delay Time (L H) tPLH Propagation Delay Time (H L) tPHL Pulse Width Distortion (PWD) |tPHL-tPLH| tPHL-tPLH Propagation Delay Time (Difference Between Any Two Products) Rise Time tr Fall Time tf |CMH| Common Mode Transient Immunity at High Level Output |CML| Common Mode Transient Immunity at Low Level Output Conditions Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty Cycle = 50%, IF = 10 mA MIN. TYP.*1 80 105 25 -90 40 40 MAX. 175 175 75 90 Unit ns ns ns ns ns ns TA = 25C, IF = 10 mA, VCC = 30 V, VCM = 1.5 kV 50 kV/s TA = 25C, IF = 0 mA, VCC = 30 V, VCM = 1.5 kV 50 kV/s Notes: *1. Typical values at TA = 25C, VCC-VEE = 30 V. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 5 of 18 PS9331L, PS9331L2 TEST CIRCUIT Fig. 1 IOH Test Circuit 1 6 2 5 3 4 IF VCC Fig. 2 IOL Test Circuit 1 6 2 5 3 4 1.0 F 1.0 F IOH SHIELD IOL SHIELD Fig. 3 VOH Test Circuit IF VCC 1 6 2 5 3 4 VCC 1.0 F VOH 100 mA SHIELD Fig. 4 VOL Test Circuit 1 6 2 5 3 4 VCC 1.0 F VOL 100 mA SHIELD Fig. 5 ICCH/ICCL Test Circuit 1 6 VCC 2 5 1.0 F Fig. 6 UVLO Test Circuit IF = 10 mA 1 6 2 5 1.0 F VCC VO > 5 V 3 4 SHIELD R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 3 4 SHIELD Page 6 of 18 PS9331L, PS9331L2 Fig. 7 IFLH Test Circuit IF 1 6 VCC 2 5 1.0 F 3 4 VO > 5 V SHIELD Fig. 8 tPLH, tPHL, tr, tf Test Circuit and Wave Forms IF = 10 mA 1 6 2 5 VCC IF 1.0 F tr tf VO 10 kHz 50% DUTY CYCLE 3 80% 50% 20% 10 10 nF 4 VOUT tPLH SHIELD tPHL Fig. 9 CMR Test Circuit and Wave Forms IF A 6 1 B 2 5 3 4 SHIELD + VCM = 1.5 kV R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 VCC = 30 V 1.0 F VO 90% 1 500 V VCM 0V 10% VO (Switch A: IF = 10 mA) VO (Switch B: IF = 0 mA) tr tr VOH 26 V 1V VOL Page 7 of 18 PS9331L, PS9331L2 TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE 50 Diode Power Dissipation PD (mW) Detector Power Dissipation PC (mW) 300 250 200 150 100 50 0 25 50 75 100 125 25 50 75 125 100 150 THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE Threshold Input Current IFLH / IFHL (mA) Forward Current IF (mA) 10 FORWARD CURRENT vs. FORWARD VOLTAGE TA = 125C 100C 85C 50C 25C -20C -40C 0.1 1.2 1.4 1.6 1.8 2.0 2.2 2.4 3 VCC = 30 V, VEE = GND, Vth = 5 V IFLH 2 1 IFHL 0 -50 -25 0 25 50 75 100 125 150 Forward Voltage VF (V) Ambient Temperature TA (C) OUTPUT VOLTAGE vs. FORWARD CURRENT HIGH LEVEL OUTPUT VOLTAGE - SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT 35 High Level Output Voltage - Supply Voltage VOH - VCC (V) 0 VCC = 30 V, VEE = GND 25 20 15 10 5 0 0 20 Ambient Temperature TA (C) 1 30 30 Ambient Temperature TA (C) 10 0.01 1.0 40 0 150 100 Output Voltage VO (V) <R> 1 2 3 Forward Current IF (mA) VCC = 30 V, VEE = GND, IF = 10 mA -1 -2 TA = -40C -3 -4 TA = 25C TA = 125C -5 -6 0.0 0.5 1.0 1.5 2.0 2.5 High Level Output Current IOH (A) Remark The graphs indicate nominal characteristics. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 8 of 18 PS9331L, PS9331L2 VCC = 30 V, VEE = GND, IF = 0 mA 4 TA = 25C 2 TA = -40C 0.0 0.5 1.0 1.5 2.0 2.5 VEE = GND, IF = 10 mA, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty cycle = 50% tPHL 75 tPLH 50 PWD 25 20 25 30 tPHL 75 tPLH 50 PWD 25 0 6 8 10 12 14 16 175 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 , f = 10 kHz, Duty cycle = 50% 150 125 100 tPHL 75 tPLH 50 PWD 25 0 0 10 30 20 40 50 Supply Voltage VCC (V) Load Capacitance Cg (nF) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD RESISTANCE PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE 175 VCC = 30 V, VEE = GND, IF = 10 mA, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 125 100 tPHL 75 tPLH 50 PWD 25 0 0 100 PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD CAPACITANCE 100 150 125 PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. SUPPLY VOLTAGE 125 0 15 VCC = 30 V, VEE = GND, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 150 Forward Current IF (mA) 175 150 175 Low Level Output Current IOL (A) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) 0 Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) TA = 125C 25 50 75 Load Resistance Rg () Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) Low Level Output Voltage VOL (V) 6 PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. FORWARD CURRENT Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL - tPLH (ns) LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT 175 150 125 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty cycle = 50% tPHL 100 tPLH 75 50 25 0 -50 PWD -25 0 25 50 75 100 125 150 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 9 of 18 PS9331L, PS9331L2 SUPPLY CURRENT vs. AMBIENT TEMPERATURE SUPPLY CURRENT vs. SUPPLY VOLTAGE 2.5 2.0 High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) 2.5 ICCH ICCL 1.5 1.0 VCC = 30 V, VEE = GND, VO = OPEN 0.5 0.0 -50 -25 0 25 50 75 2.0 ICCH (IF = 10 mA) 1.5 ICCL (IF = 0 mA) 1.0 0.5 0.0 15 100 125 150 20 30 Supply Voltage VCC (V) HIGH LEVEL OUTPUT VOLTAGE - SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE 0.5 Low Level Output Voltage VOL (V) -0.5 VCC = 30 V, VEE = GND, IF = 10 mA, IO = -100 mA -1.0 -1.5 -2.0 -2.5 -3.0 -50 -25 0 25 50 75 0.4 VCC = 30 V, VEE = GND, IF = 10 mA, IO = 100 mA 0.3 0.2 0.1 0.0 -50 -25 100 125 150 25 50 75 100 125 150 LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 3.0 Low Level Output Current IOL (A) 3.0 2.5 2.0 1.5 1.0 0.5 0 Ambient Temperature TA (C) Ambient Temperature TA (C) High Level Output Current IOH (A) 25 Ambient Temperature TA (C) 0.0 High Level Output Voltage - Supply Voltage VOH - VCC (V) VEE = GND, VO = OPEN VCC = 30 V, VEE = GND, IF = 10 mA, VCC-VO = 4 V 0.0 -50 -25 0 25 50 75 100 125 150 Ambient Temperature TA (C) 2.5 2.0 1.5 1.0 0.5 VCC = 30 V, VEE = GND, IF = 10 mA, VO = 2.5 V 0.0 -50 -25 0 25 50 75 100 125 150 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 10 of 18 PS9331L, PS9331L2 OUTPUT VOLTAGE vs. SUPPLY VOLTAGE 14 Output Voltage VO (V) 12 10 8 UVLOHYS 6 4 0 0 VUVLO+ (12.3 V) VUVLO- (11.0 V) 2 5 10 15 20 Supply Voltage VCC - VEE (V) Remark The graphs indicate nominal characteristics. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 11 of 18 PS9331L, PS9331L2 TAPING SPECIFICATIONS (UNIT: mm) 7.50.1 1.5 +0.1 -0 4.5 MAX. 10.20.1 4.00.1 16.00.3 2.00.1 1.750.1 Outline and Dimensions (Tape) 1.5 +0.1 -0 0.35 8.00.1 4.050.1 5.080.1 Tape Direction PS9331L-E3 Outline and Dimensions (Reel) R 1.0 1001.0 2.00.5 13.00.2 3302.0 2.00.5 21.00.8 17.51.0 21.51.0 Packing: 2 000 pcs/reel R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 12 of 18 PS9331L, PS9331L2 11.50.1 1.5 +0.1 -0 4.5 MAX. 12.00.1 4.00.1 24.00.3 2.00.1 1.750.1 Outline and Dimensions (Tape) 2.0 +0.1 -0 8.00.1 0.35 4.050.1 5.080.1 Tape Direction PS9331L2-E3 Outline and Dimensions (Reel) R 1.0 1001.0 2.00.5 13.00.2 3302.0 2.00.5 21.00.8 25.51.0 29.51.0 Packing: 2 000 pcs/reel R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 13 of 18 PS9331L, PS9331L2 RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) B C D A Part Number Lead Bending A B C D PS9331L lead bending type (Gull-wing) for surface mount 9.2 1.27 0.8 2.2 PS9331L2 lead bending type (Gull-wing) for long creepage distance (surface mount) 10.2 1.27 0.8 2.2 R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 14 of 18 PS9331L, PS9331L2 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 120 30 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 15 of 18 PS9331L, PS9331L2 USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 1.0 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might affect the photocoupler's LED input, leading to malfunction or degradation of characteristics. (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly evaluate operation.) (3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. Note: *1. NC: Non-Connection (No Connection). 3. Make sure the rise/fall time of the forward current is 0.5 s or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/s or less. 5. Avoid storage at a high temperature and high humidity. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 16 of 18 PS9331L, PS9331L2 SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Climatic test class (IEC 60068-1/DIN EN 60068-1) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.6 x UIORM., Pd < 5 pC Spec. Unit 40/125/21 UIORM Upr 1 130 1 808 Vpeak Vpeak Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 x UIORM., Pd < 5 pC Upr 2 119 Vpeak Highest permissible overvoltage UTR 8 000 Vpeak CTI 175 Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) 2 Material group (DIN EN 60664-1 VDE0110 Part 1) III a Storage temperature range Tstg -55 to +150 C Operating temperature range TA -40 to +125 C Ris MIN. Ris MIN. 1012 11 10 Tsi Isi Psi 175 400 700 C mA mW Ris MIN. 109 Isolation resistance, minimum value VIO = 500 V dc at TA = 25C VIO = 500 V dc at TA MAX. at least 100C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 17 of 18 PS9331L, PS9331L2 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. R08DS0111EJ0200 Rev.2.00 Jun 21, 2013 Page 18 of 18 Revision History PS9331L, PS9331L2 Data Sheet Rev. Date Page 1.00 2.00 May 24, 2013 Jun 21, 2013 - pp.8 to 11 Description Summary First edition issued Addition of TYPICAL CHARACTERISTICS All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. 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