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Datashee
t
Operational Amplifiers
Low Supply Current
Input/Output Full Swing
Operational Amplifier
BD12730G BD12732xxx BD12734xxx
General Description
BD12730G/BD12732xxx/BD12734xxx are input/output
full swing operational amplifiers. They have the
features of low operating supply voltage, low supply
current, low input referred noise voltage and high
phase margin. These are suitable for audio
applications and battery management.
Features
Low Operating Supply Voltage
Input/Output Full Swing
Low Supply Current
High Phase Margin
Low Input Referred Noise Voltage
Applications
Audio Application
Battery Management
General Purpose
Key Specifications
Operating Supply Voltage (Single Supply):
+1.8V to +5.5V
Operating Temperature Range: -40°C to +85°C
Input Offset Voltage: 5mV (Max)
Supply Current:
BD12730G(Single) 550µA (Max)
BD12732xxx(Dual) 900µA (Max)
BD12734xxx(Quad) 1800µA (Max)
Input Referred Noise Voltage: 10 HznV/ (Typ)
Adequate Phase Margin: 75°(Typ)
Packages W(Typ) x D(Typ) x H(Max)
SSOP5 2.90mm x 2.80mm x 1.25mm
SOP8 5.00mm x 6.20mm x 1.71mm
SOP-J8 4.90mm x 6.00mm x 1.65mm
SSOP-B8 3.00mm x 6.40mm x 1.35mm
TSSOP-B8 3.00mm x 6.40mm x 1.20mm
MSOP8 2.90mm x 4.00mm x 0.90mm
TSSOP-B8J 3.00mm x 4.90mm x 1.10mm
SOP14 8.70mm x 6.20mm x 1.71mm
SOP-J14 8.65mm x 6.00mm x 1.65mm
SSOP-B14 5.00mm x 6.40mm x 1.35mm
TSSOP-B14J 5.00mm x 6.40mm x 1.20mm
Pin Configuration
BD12730G : SSOP5
Pin No. Pin Name
1 +IN
2 GND
3 -IN
4 OUT
5 V+
1
-
+
2
3 4
5
GND
-IN
+IN V+
OUT
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
Datasheet
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BD12730G BD12732xxx BD12734xxx
BD12732F : SOP8
BD12732FJ : SOP-J8
BD12732FV : SSOP-B8
BD12732FVT : TSSOP-B8
BD12732FVM : MSOP8
BD12732FVJ : TSSOP-B8J
Pin No. Pin Name
1 OUT1
2 -IN1
3 +IN1
4 GND
5 +IN2
6 -IN2
7 OUT2
8 V+
BD12734F : SOP14
BD12734FJ : SOP-J14
BD12734FV : SSOP-B14
BD12734FVJ : TSSOP-B14J
Pin No. Pin Name
1 OUT1
2 -IN1
3 +IN1
4 V+
5 +IN2
6 -IN2
7 OUT2
8 OUT3
9 -IN3
10 +IN3
11 GND
12 +IN4
13 -IN4
14 OUT4
Ordering Information
B D 1 2 7 3 x x x x - x x
Part Number
BD12730G
BD12732xxx
BD12734xxx
Package
G : SSOP5
F : SOP8
FJ : SOP-J8
FV : SSOP-B8
FVT : TSSOP-B8
FVM : MSOP8
FVJ : TSSOP-B8J
F : SOP14
FJ : SOP-J14
FV : SSOP-B14
FVJ : TSSOP-B14J
Packaging and Forming Specification
TR: Embossed tape and reel
(SSOP5/MSOP8)
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/TSSOP-B8/
TSSOP-B8J/SOP14/SOP-J14/SSOP-B14/
TSSOP-B14J)
V+
CH1
- +
CH4
-
+
CH3
CH2
- +-
+
1
2
3
4
14
13
12
11
5
6
7
10
9
8
OUT4
OUT3
-IN4
+IN4
GND
+IN3
-IN3
OUT1
OUT2
-IN1
+IN1
+IN2
-IN2
+
CH2
-
+
CH1
- +
1
2
3
4
8
7
6
5
GND
OUT1
-IN1
+IN1
OUT2
V+
+IN2
-IN2
Datasheet
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BD12730G BD12732xxx BD12734xxx
Line-up
Operating
Temperature Channels Package Orderable Part Number
-40°C to +85°C
1ch SSOP5 Reel of 3000 BD12730G-TR
2ch
SOP8 Reel of 2500 BD12732F-E2
SOP-J8 Reel of 2500 BD12732FJ-E2
SSOP-B8 Reel of 2500 BD12732FV-E2
TSSOP-B8 Reel of 3000 BD12732FVT-E2
MSOP8 Reel of 3000 BD12732FVM-TR
TSSOP-B8J Reel of 2500 BD12732FVJ-E2
4ch
SOP14 Reel of 2500 BD12734F-E2
SOP-J14 Reel of 2500 BD12734FJ-E2
SSOP-B14 Reel of 2500 BD12734FV-E2
TSSOP-B14J Reel of 2500 BD12734FVJ-E2
Absolute Maximum Ratings (TA=25°C)
Parameter Symbol Rating Unit
BD12730G BD12732xxx BD12734xxx
Supply Voltage V+ +7.0 V
Power Dissipation PD
SSOP5 0.67
(Note 1,9) - -
W
SOP8 - 0.68
(Note 2,9) -
SOP-J8 - 0.67
(Note 1,9) -
SSOP-B8 - 0.62
(Note 3,9) -
TSSOP-B8 - 0.62
(Note 3,9) -
MSOP8 - 0.58
(Note 4,9) -
TSSOP-B8J - 0.58
(Note 4,9) -
SOP14 - - 0.56(Note 5,9)
SOP-J14 - - 1.02(Note 6,9)
SSOP-B14 - - 0.87(Note 7,9)
TSSOP-B14J - - 0.85(Note 8,9)
Differential Input Voltage (Note 10) V
ID ±3.0 V
Input Common-mode Voltage Range VICM GND to V+ V
Input Current (Note 11) I
I ±10 mA
Operating Supply Voltage Vopr +1.8 to +5.5 V
Operating Temperature Topr - 40 to +85 °C
Storage Temperature Tstg - 55 to +150 °C
Maximum Junction Temperature TJmax +150 °C
(Note 1) To use at temperature above TA=25°C, reduce by 5.4mW/°C.
(Note 2) To use at temperature above TA=25°C, reduce by 5.5mW/°C.
(Note 3) To use at temperature above TA=25°C, reduce by 5.0mW/°C.
(Note 4) To use at temperature above TA=25°C, reduce by 4.7mW/°C.
(Note 5) To use at temperature above TA=25°C, reduce by 4.5mW/°C.
(Note 6) To use at temperature above TA=25°C, reduce by 8.2mW/°C.
(Note 7) To use at temperature above TA=25°C, reduce by 7.0mW/°C.
(Note 8) To use at temperature above TA=25°C, reduce by 6.8mW/°C.
(Note 9) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
(Note 10) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs.
The input pin voltage is set to more than GND.
(Note 11) An excessive input current will flow when input voltages of more than Supply Voltage(V+)+0.6V or less than GND-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the
IC is operated over the absolute maximum ratings.
Datasheet
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BD12730G BD12732xxx BD12734xxx
Electrical Characteristics
○BD12730G (Unless otherwise specified V+=+5V, GND=0V, TA=25°C)
Parameter Symbol
Limit
Unit Conditions
Min Typ Max
Supply Current IDD - 320 550 µA RL=∞, +IN=2.5V
Input Offset Voltage(Note 12) VIO - 1 5 mV -
Input Bias Current(Note 12) I
B - 50 250 nA -
Input Offset Current(Note 12) I
IO - 5 100 nA -
Large Signal Voltage Gain AV 60 85 - dB RL=2kΩ(Note 13)
Common-mode Rejection Ratio CMRR 55 70 - dB -
Power Supply Rejection Ratio PSRR 70 85 - dB -
Maximum Output Voltage (High) VOH1 4.9 4.95 - V RL=20kΩ(Note 13)
VOH2 4.75 4.85 - V RL=2kΩ(Note 13)
Maximum Output Voltage (Low) VOL1 - 0.05 0.1 V RL=20kΩ(Note 13)
VOL2 - 0.15 0.25 V RL=2kΩ(Note 13)
Output Source Current ISOURCE - 12 - mA OUT=0V
Output Sink Current ISINK - 5 - mA OUT=5V
Input Common-mode Voltage Range VICM 0 - 5 V CMRR>55dB
Gain Bandwidth GBW - 1 - MHz f=10kHz
Unity Gain Frequency fT - 1 - MHz RL=2kΩ(Note 13)
Phase Margin θ - 75 - deg RL=2kΩ(Note 13)
Input Referred Noise Voltage VN - 10 - HznV/ f=1kHz
- 1.2 - μVrms RS=100Ω, DIN-AUDIO
Slew Rate SR - 0.4 - V/µS RL=2kΩ(Note 13)
(Note 12) Absolute value
(Note 13) Output load resistance connect to a half of V+
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BD12730G BD12732xxx BD12734xxx
Electrical Characteristics – continued
○BD12732xxx (Unless otherwise specified V+=+5V, GND=0V, TA=25°C)
Parameter Symbol
Limit
Unit Conditions
Min Typ Max
Supply Current IDD - 580 900 µA
RL=∞, +IN=2.5V
All Op-Amps
Input Offset Voltage(Note 14) V
IO - 1 5 mV -
Input Bias Current(Note 14) I
B - 50 250 nA -
Input Offset Current(Note 14) I
IO - 5 100 nA -
Large Signal Voltage Gain AV 60 85 - dB RL=2kΩ(Note 15)
Common-mode Rejection Ratio CMRR 55 70 - dB -
Power Supply Rejection Ratio PSRR 70 85 - dB -
Maximum Output Voltage (High) VOH1 4.9 4.95 - V RL=20kΩ(Note 15)
VOH2 4.75 4.85 - V RL=2kΩ(Note 15)
Maximum Output Voltage (Low) VOL1 - 0.05 0.1 V RL=20kΩ(Note 15)
VOL2 - 0.15 0.25 V RL=2kΩ(Note 15)
Output Source Current ISOURCE - 12 - mA OUT=0V
Output Sink Current ISINK - 5 - mA OUT=5V
Input Common-mode Voltage Range VICM 0 - 5 V CMRR>55dB
Gain Bandwidth GBW - 1 - MHz f=10kHz
Unity Gain Frequency fT - 1 - MHz RL=2kΩ(Note 15)
Phase Margin θ - 75 - deg RL=2kΩ(Note 15)
Input Referred Noise Voltage VN - 10 - HznV/ f=1kHz
- 1.2 - μVrms RS=100Ω, DIN-AUDIO
Slew Rate SR - 0.4 - V/µS RL=2kΩ(Note 15)
Channel Separation CS - 90 - dB f=1kHz, RL=2kΩ(Note 15)
OUT=1.2Vrms
(Note 14) Absolute value
(Note 15) Output load resistance connect to a half of V+
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BD12730G BD12732xxx BD12734xxx
Electrical Characteristics – continued
○BD12734xxx (Unless otherwise specified V+=+5V, GND=0V, TA=25°C)
Parameter Symbol
Limit
Unit Conditions
Min Typ Max
Supply Current IDD - 1200 1800 µA
RL=∞, +IN=2.5V
All Op-Amps
Input Offset Voltage(Note 16) V
IO - 1 5 mV -
Input Bias Current(Note 16) I
B - 50 250 nA -
Input Offset Current(Note 16) I
IO - 5 100 nA -
Large Signal Voltage Gain AV 60 85 - dB RL=2kΩ(Note 17)
Common-mode Rejection Ratio CMRR 55 70 - dB -
Power Supply Rejection Ratio PSRR 70 85 - dB -
Maximum Output Voltage (High) VOH1 4.9 4.95 - V RL=20kΩ(Note 17)
VOH2 4.75 4.85 - V RL=2kΩ(Note 17)
Maximum Output Voltage (Low) VOL1 - 0.05 0.1 V RL=20kΩ(Note 17)
VOL2 - 0.15 0.25 V RL=2kΩ(Note 17)
Output Source Current ISOURCE - 12 - mA OUT=0V
Output Sink Current ISINK - 5 - mA OUT=5V
Input Common-mode Voltage Range VICM 0 - 5 V CMRR>55dB
Gain Bandwidth GBW - 1 - MHz f=10kHz
Unity Gain Frequency fT - 1 - MHz RL=2kΩ(Note 17)
Phase Margin θ - 75 - deg RL=2kΩ(Note 17)
Input Referred Noise Voltage VN - 10 - HznV/ f=1kHz
- 1.2 - μVrms RS=100Ω, DIN-AUDIO
Slew Rate SR - 0.4 - V/µS RL=2kΩ(Note 17)
Channel Separation CS - 133 - dB f=1kHz, RL=2kΩ(Note 17)
OUT=1.2Vrms
(Note 16) Absolute value
(Note 17) Output load resistance connect to a half of V+
Datasheet
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BD12730G BD12732xxx BD12734xxx
Description of electrical characteristics
Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown.
Note that item name, symbol and their meaning may differ from those on other manufacturer’s document or general
documents.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (V+/GND)
Indicates the maximum voltage that can be applied between the V+ terminal and GND terminal without deterioration
or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Supply Current (IDD)
Indicates the current that flows within the IC under specified no-load conditions.
(2) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(5) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(6) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(7) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR = (Change of power supply voltage)/(Input offset fluctuation)
(8) Maximum Output Voltage (High/Low Level Output Voltage) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(9) Output Source Current/ Output Sink Current (ISOURCE / ISINK)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(10) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(11) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(12) Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
(13) Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(14) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
(15) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(16) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
Datasheet
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BD12730G BD12732xxx BD12734xxx
Typical Performance Curves
○BD12730G
0
1
2
3
4
5
6
123456
Supply Voltage [V]
Maximum Output Voltage (High) [V]
0
50
100
150
200
250
300
350
400
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Supply Current [µA]
0
50
100
150
200
250
300
350
400
123456
Supply Voltage [V]
Supply Current [µA]
0.0
0.2
0.4
0.6
0.8
0 25 50 75 100 125 150
Ambient Temperature [℃]
Power Dissipation [W]
Figure 2.
Supply Current vs Supply Voltage
Figure 3.
Supply Current vs Ambient Temperature
Figure 4.
Maximum Output Voltage (High) vs Supply Voltage
(RL=20kΩ)
-40℃
25℃
Figure 1.
Power Dissipation vs Ambient Temperature
(Derating Curve)
85
(*)The data above are measurement values of typical sample, it is not guaranteed.
BD12730G
85℃
5.0V
1.8V
3.0V
-40℃
25℃
85℃
Datasheet
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BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12730G
0
1
2
3
4
5
6
123456
Supply Voltage [V]
Maximum Output Voltage (High) [V]
0
3
6
9
12
15
18
-50-250255075100
Ambient Temperature [℃]
Maximum Output Voltage (Low) [mV]
0
3
6
9
12
15
18
123456
Supply Voltage [V]
Maximum Output Voltage (Low) [mV]
0
1
2
3
4
5
6
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Maximum Output Voltage (High) [V]
Figure 7.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=20kΩ)
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 6.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=20kΩ)
Figure 5.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=20kΩ)
1.8V
3.0V
5.0V
85℃
-40℃
25℃
Figure 8.
Maximum Output Voltage (High) vs Supply Voltage
(RL=2kΩ)
-40℃
85℃
1.8V
3.0V
5.0V
25℃
Datasheet
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BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12730G
-3
-2
-1
0
1
2
3
123456
Supply Voltage [V]
Input Offset Voltage [mV]
0
20
40
60
80
100
120
-50-25 0 255075100
Ambient Temperature [°C]
Maximum Output Voltage (Low) [V]
0
20
40
60
80
100
120
123456
Supply Voltage [V]
Maximum Output Voltage (Low) [mV]
0
1
2
3
4
5
6
-50-25 0 255075100
Ambient Temperature [℃]
Maximum Output Voltage (High) [V]
Figure 11.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=2kΩ)
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 10.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=2kΩ)
Figure 9.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V
5.0V
-40℃
Figure 12.
Input Offset Voltage vs Supply Voltage
1.8V
3.0V
5.0V
25℃
-40℃
85℃
25℃ 85℃
Datasheet
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BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12730G
-15
-10
-5
0
5
10
15
-50-25 0 25 50 75100
Ambient Temperature [°C]
Input Offset Current [nA]
0
10
20
30
40
50
60
-50-25 0 25 50 75100
Ambient Temperature [℃]
Input Bias Current [nA]
-5
-4
-3
-2
-1
0
1
2
3
4
5
-10123456
Input Voltage [V]
Input Offset Voltage [mV]
-5
-4
-3
-2
-1
0
1
2
3
4
5
-50 -25 0 25 50 75 100
Ambient Temperature [°C]
Input Offset Voltage [mV]
Figure 15.
Input Bias Current vs Ambient Temperature
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 14.
Input Common Mode Voltage Range
(V+=5V)
Figure 13.
Input Offset Voltage vs Ambient Temperature
1.8V 3.0V
5.0V
-40℃
Figure 16.
Input Offset Current vs Ambient Temperature
1.8V
3.0V
5.0V
25℃
85℃
1.8V
5.0V
3.0V
Datasheet
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BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12730G
-40
-20
0
20
40
60
80
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04
Frequency [Hz]
Voltage Gain [dB]
-100
-50
0
50
100
150
200
Phase [deg]
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature [°C]
Power Supply Rejection Ratio [dB]
40
50
60
70
80
90
100
-50-250255075100
Ambient Temperature [°C]
Common Mode Rejection Ratio [dB]
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Large Signal Voltage Gain [dB]
Figure 19.
Power Supply Rejection Ratio vs Ambient Temperature
(V+=1.8V to 5.0V)
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 18.
Common Mode Rejection Ratio vs Ambient Temperature
Figure 17.
Large Signal Voltage Gain vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V
5.0V
Figure 20.
Voltage Gain・Phase vs Frequency
(V+=5V, RL=2kΩ, TA=25°C)
102 10
3 10
4 10
5 10
6 10
7
Gain
Phase
1.8V
3.0V
5.0V
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 13/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12730G
0
20
40
60
80
100
10 100 1000 10000
Load Capacitance [pF]
Phase Margin [deg]
0
0.4
0.8
1.2
1.6
2
10 100 1000 10000
Load Capacitance [pF]
Unity Gain Frequency [MHz] .
0
0.2
0.4
0.6
0.8
1
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Slew Rate H-L [V/µs]
0
0.2
0.4
0.6
0.8
1
-50-250 255075100
Ambient Temperature [℃]
Slew Rate L-H [V/µs]
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 22.
Slew Rate H-L vs Ambient Temperature
(RL=2kΩ)
Figure 21.
Slew Rate L-H vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V
5.0V
1.8V
3.0V
5.0V
Figure 23.
Unity Gain Frequency vs Load Capacitance
(V+=5V, TA=25°C)
Figure 24.
Phase Margin vs Load Capacitance
(V+=5V, TA=25°C)
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 14/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12730G
0.0
0.4
0.8
1.2
1.6
2.0
123456
Supply Voltage [V]
Input Referred Noise Voltage [µVrms] .
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 26.
Total Harmonic Distortion + Noise vs Output Voltage
(V+=5V, RL=2kΩ, TA=25°C)
Figure 25.
Input Referred Noise Voltage vs Supply Voltage
(TA=25°C)
0.0001
0.0010
0.0100
0.1000
1.0000
0.01 0.10 1.00 10.00
Output Voltage [Vrm s]
Total Harmonic Distortion + Noise [%] .
1kHz
20Hz
20kHz
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 15/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12732xxx
0
1
2
3
4
5
6
123456
Ambient Temperature [℃]
Maximum Output Voltage (High) [V]
0
100
200
300
400
500
600
700
800
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Supply Current [µA]
0
100
200
300
400
500
600
700
800
123456
Supply Voltage [V]
Supply Current [µA]
0.0
0.2
0.4
0.6
0.8
0 25 50 75 100 125 150
Ambient Temperature [°C]
Power Dissipation [W]
(*)The data above are measurement values of typical sample, it is not guaranteed.
-40℃
25℃
85℃
Figure 28.
Supply Current vs Supply Voltage
Figure 29.
Supply Current vs Ambient Temperature
Figure 30.
Maximum Output Voltage (High) vs Supply Voltage
(RL=20kΩ)
-40℃
25℃
Figure 27.
Power Dissipation vs Ambient Temperature
(Derating Curve)
85
BD12732F
85℃
5.0V
1.8V
3.0V
BD12732FJ
BD12732FV
BD12732FVT
BD12732FVM
BD12732FVJ
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 16/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12732xxx
0
1
2
3
4
5
6
123456
Supply Voltage [V]
Maximum Output Voltage (High) [V]
0
3
6
9
12
15
18
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Maximum Output Voltage (Low) [mV]
0
3
6
9
12
15
18
123456
Supply Voltage [V]
Maximum Output Voltage (Low) [mV]
0
1
2
3
4
5
6
-50-250255075100
Ambient Temperature [℃]
Maximum Output Voltage (High) [V]
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 33.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=20kΩ)
Figure 32.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=20kΩ)
Figure 31.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=20kΩ)
1.8V
3.0V
5.0V
85℃
-40℃
25℃
Figure 34.
Maximum Output Voltage (High) vs Supply Voltage
(RL=2kΩ)
-40℃
85℃
1.8V
3.0V
5.0V
25℃
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 17/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12732xxx
-3
-2
-1
0
1
2
3
123456
Supply Voltage [V]
Input Offset Voltage [mV]
0
20
40
60
80
100
120
-50-25 0 255075100
Ambient Temperature [℃]
Maximum Output Voltage Low [mV]
0
20
40
60
80
100
120
123456
Supply Voltage [V]
Maximum Output Voltage (Low) [mV]
0
1
2
3
4
5
6
-50-25 0 255075100
Ambient Temperature [℃]
Maximum Output Voltage (High) [V]
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 37.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=2kΩ)
Figure 36.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=2kΩ)
Figure 35.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V
5.0V
-40℃
Figure 38.
Input Offset Voltage vs Supply Voltage
1.8V
3.0V
5.0V
25℃
-40℃
85℃
25℃
85℃
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 18/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12732xxx
-15
-10
-5
0
5
10
15
-50 -25 0 25 50 75 100
Ambient Temperature [°C]
Input Offset Current [nA]
-5
-4
-3
-2
-1
0
1
2
3
4
5
-10123456
Input voltage [V]
Input Offset Voltage [mV]
-5
-4
-3
-2
-1
0
1
2
3
4
5
-50-250 255075100
Ambient Temperature [℃]
Input Offset Voltage [mV]
0
10
20
30
40
50
60
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Input Bias Current [nA]
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 41.
In
p
ut Bias Current vs Ambient Tem
p
erature
Figure 40.
Input Common Mode Voltage Range
(V+=5V)
Figure 39.
Input Offset Voltage vs Ambient Temperature
1.8V 3.0V
5.0V
-40℃
Figure 42.
Input Offset Current vs Ambient Temperature
1.8V
3.0V
5.0V
25℃
85℃
3.0V
1.8V
5.0V
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 19/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12732xxx
-40
-20
0
20
40
60
80
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04
Frequency [Hz]
Voltage Gain [dB]
-100
-50
0
50
100
150
200
Phase [deg]
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Power Supply Rejection Ratio [dB]
40
50
60
70
80
90
100
-50-25 0 255075100
Ambient Temperature [°C]
Common Mode Rejection Ratio [dB]
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Large Signal Voltage Gain [dB]
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 45.
Power Supply Rejection Ratio vs Ambient Temperature
(V+=1.8V to 5.0V)
Figure 44.
Common Mode Rejection Ratio vs Ambient Temperature
Figure 43.
Large Signal Voltage Gain vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V 5.0V
Figure 46.
Voltage Gain・Phase vs Frequency
(V+=5V, RL=2kΩ, TA=25°C)
102 10
3 10
4 10
5 10
6 10
7
Gain
Phase
1.8V
3.0V
5.0V
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 20/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12732xxx
0
20
40
60
80
100
10 100 1000 10000
Load Capacitance [pF]
Phase Margin [deg]
0
0.2
0.4
0.6
0.8
1
-50-25 0 25 50 75100
Ambient Temperature [℃]
Slew Rate H-L [V/µs]
0
0.2
0.4
0.6
0.8
1
-50-250 255075100
Ambient Temperature [℃]
Slew Rate L-H [V/µs]
0
0.4
0.8
1.2
1.6
2
10 100 1000 10000
Load Capacitance [pF]
Unity Gain Frequency [MHz] .
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 48.
Slew Rate H-L vs Ambient Temperature
(RL=2kΩ)
Figure 47.
Slew Rate L-H vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V
5.0V
1.8V
3.0V
5.0V
Figure 49.
Unity Gain Frequency vs Load Capacitance
(V+=5V, TA=25°C)
Figure 50.
Phase Margin vs Load Capacitance
(
V+=5V
,
TA=25°C
)
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 21/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12732xxx
80
90
100
110
120
123456
Supply Voltage [V]
Channel Separation [dB]
0.0
0.4
0.8
1.2
1.6
2.0
123456
Supply Voltage [V]
Input Referred Noise Voltage [µVrms] .
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 52.
Total Harmonic Distortion + Noise vs Output Voltage
(V+=5V, RL=2kΩ, TA=25°C)
Figure 51.
Input Referred Noise Voltage vs Supply Voltage
(TA=25°C)
Figure 53.
Channel Separation vs Supply Voltage
85ºc
25ºC
-40ºC
0.0001
0.0010
0.0100
0.1000
1.0000
0.01 0.10 1.00 10.00
Output Voltage [Vrm s]
Total Harmonic Distortion + Noise [%] .
1kHz
20Hz
20kHz
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 22/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12734xxx
0
1
2
3
4
5
6
123456
Supply Voltage [V]
Maximum Output Voltage (High) [V]
0
200
400
600
800
1000
1200
1400
1600
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Supply Current [µA]
0
200
400
600
800
1000
1200
1400
1600
123456
Supply Voltage [V]
Supply Current [µA]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125 150
Ambient Temperature [℃]
Power Dissipation [W]
-40℃
25℃
85℃
Figure 55.
Supply Current vs Supply Voltage
Figure 56.
Supply Current vs Ambient Temperature
Figure 57.
Maximum Output Voltage (High) vs Supply Voltage
(RL=20kΩ)
-40℃
25℃
Figure 54.
Power Dissipation vs Ambient Temperature
(Derating Curve)
85
(*)The data above are measurement values of typical sample, it is not guaranteed.
BD12734F
85℃
5.0V
1.8V
3.0V
BD12734FVJ
BD12734FV
BD12734FJ
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 23/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12734xxx
0
1
2
3
4
5
6
123456
Supply Voltage [V]
Maximum Output Voltage (High) [V]
0
3
6
9
12
15
18
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Maximum Output Voltage (Low) [mV]
0
3
6
9
12
15
18
123456
Supply Voltage [V]
Maximum Output Voltage (Low) [mV]
0
1
2
3
4
5
6
-50-25 0 255075100
Ambient Temperature [℃]
Maximum Output Voltage (High) [V]
Figure 60.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=20kΩ)
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 59.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=20kΩ)
Figure 58.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=20kΩ)
1.8V
3.0V
5.0V
85℃
-40℃
25℃
Figure 61.
Maximum Output Voltage (High) vs Supply Voltage
(RL=2kΩ)
-40℃
85℃
1.8V
3.0V
5.0V
25℃
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 24/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12734xxx
-3
-2
-1
0
1
2
3
123456
Supply Voltage [V]
Input Offset Voltage [mV]
0
20
40
60
80
100
120
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Maximum Output Voltage (Low) [mV]
0
20
40
60
80
100
120
123456
Supply Voltage [V]
Maximum Output Voltage (Low) [mV]
0
1
2
3
4
5
6
-50-25 0 255075100
Ambient Temperature [
℃
]
Maximum Output Voltage (High) [V]
Figure 64.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=2kΩ)
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 63.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=2kΩ)
Figure 62.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V
5.0V
-40℃
Figure 65.
Input Offset Voltage vs Supply Voltage
1.8V
3.0V
5.0V
25℃
-40℃
85℃
25℃
85℃
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 25/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12734xxx
-15
-10
-5
0
5
10
15
-50-250 255075100
Ambient temperature [°C]
Input Offset Current [nA]
0
10
20
30
40
50
60
-50-250 255075100
Ambient Temperature [℃]
Input Bias Current [nA]
-5
-4
-3
-2
-1
0
1
2
3
4
5
-10123456
Input Voltage [V]
Input Offset Voltage [mV]
-5
-4
-3
-2
-1
0
1
2
3
4
5
-50-25 0 25 50 75100
Ambient Temperature [℃]
Input Offset Voltage [mV]
Figure 68.
Input Bias Current vs Ambient Temperature
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 67.
Input Common Mode Voltage Range
(V+=5V)
Figure 66.
Input Offset Voltage vs Ambient Temperature
1.8V 3.0V
5.0V
-40℃
Figure 69.
Input Offset Current vs Ambient Temperature
1.8V
3.0V
5.0V
25℃
85℃
1.8V
5.0V
3.0V
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 26/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12734xxx
-40
-20
0
20
40
60
80
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04
Frequency [Hz]
Voltage Gain [dB]
-100
-50
0
50
100
150
200
Phase [deg]
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient temperature [℃]
Power Supply Rejection Ratio [dB]
40
60
80
100
120
140
-50-25 0 255075100
Ambient Temperature [°C]
Common Mode Rejection Ratio [dB]
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Large Signal Voltage Gain [dB]
Figure 72.
Power Supply Rejection Ratio vs Ambient Temperature
(V+=1.8V to 5.0V)
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 71.
Common Mode Rejection Ratio vs Ambient Temperature
Figure 70.
Large Signal Voltage Gain vs Ambient Temperature
(RL=2kΩ)
1.8V
3.0V
5.0V
Figure 73.
Voltage Gain・Phase vs Frequency
(V+=5V, RL=2kΩ, TA=25°C)
102 10
3 10
4 10
5 10
6 10
7
Gain
Phase
1.8V
3.0V
5.0V
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 27/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12734xxx
0
20
40
60
80
100
10 100 1000 10000
Load Capacitance [pF]
Phase Margin [deg]
0
0.4
0.8
1.2
1.6
2
10 100 1000 10000
Load Capacitance [pF]
Unity Gain Frequency [MHz] .
0
0.2
0.4
0.6
0.8
1
-50 -25 0 25 50 75 100
Ambient Temperature [℃]
Slew Rate H-L [V/µs]
0
0.2
0.4
0.6
0.8
1
-50-250 255075100
Ambient Temperature [℃]
Slew Rate L-H [V/µs]
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 75.
Slew Rate H-L vs Ambient Temperature
(RL=2kΩ)
Figure 74.
Slew Rate L-H vs Ambient Temperature
(RL=2kΩ)
1.8V
5.0V
1.8V
3.0V
5.0V
Figure 76.
Unity Gain Frequency vs Load Capacitance
(V+=5V, TA=25°C)
Figure 77.
Phase Margin vs Load Capacitance
(V+=5V, TA=25°C)
3.0V
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 28/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Typical Performance Cu rves – Continued
○BD12734xxx
80
90
100
110
120
123456
Supply Voltage [V]
Channel Separation [dB]
0.0
0.4
0.8
1.2
1.6
2.0
123456
Supply Voltage [V]
Input Referred Noise Voltage [µVrms] .
(*)The data above are measurement values of typical sample, it is not guaranteed.
Figure 79.
Total Harmonic Distortion + Noise vs Output Voltage
(V+=5V, RL=2kΩ, TA=25°C)
Figure 78.
Input Referred Noise Voltage vs Supply Voltage
(TA=25°C)
-40℃
25℃
85℃
Figure 80.
Channel Separation vs Supply Voltage
0.0001
0.0010
0.0100
0.1000
1.0000
0.01 0.10 1.00 10.00
Output Voltage [Vrms]
Total Harmonic Distortion + Noise [%] .
1kHz
20Hz
20kHz
Datasheet
www.rohm.com TSZ02201-0GMG0G200600-1-2
©2013 ROHM Co., Ltd. All rights reserved. 29/50 14.July.2016.Rev004
TSZ22111･15･001
BD12730G BD12732xxx BD12734xxx
Application Information
NULL method condition for Test Circuit 1
V+, GND, V
RL, EK, VICM Unit: V
Parameter VF S1 S2 S3 V+ GND VRL R
L Ω E
K V
ICM
Calculation
Input Offset Voltage VF1 ON ON OFF 5.0 0 - open -2.5 2.5 1
Large Signal Voltage Gain
VF2
ON ON ON 5.0 0 2.5 2k
-4.5
2.5 2
VF3 -0.5
Common Mode Rejection Ratio
(Input Common-mode
Voltage Range)
VF4
ON ON OFF 5.0 0 - open -2.5
0
3
VF5 5.0
Power Supply Rejection Ratio
VF6
ON ON OFF
5.0
0 - open -0.9 0.9 4
VF7 1.8
－ Calculation －
1. Input Offset Voltage (VIO)
2. Large Signal Voltage Gain (AV)
3. Common-mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
Figure 81. Test Circuit 1
V+
RF=50kΩ
RI=10kΩ
0.1µF
RS=50Ω
RL
SW2
500kΩ
500kΩ 0.01µF
EK 15V
DUT
GND
VRL
50kΩ
VICM
SW1
0.1µF
RI=10kΩ
Vo
VF
RS=50Ω 1000pF
0.1µF
-15V
NULL
SW3
VIO |VF1|
=1+RF/RS [V]
A
v|VF2-VF3|
=∆EK × (1+RF/RS) [dB]
20Log
CMRR
|VF4 - VF5|
=ΔVICM ×
(
1+RF/RS
)
[dB]
20Log
PSRR
|VF6 - VF7|
=ΔV+ × (1+ RF/RS) [dB]
20Log
Datasheet
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BD12730G BD12732xxx BD12734xxx
Application Information – continued
Switch Condition for Test Circuit 2
SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
Output Current OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF
Slew Rate OFF OFF ON OFF OFF OFF ON ON OFF OFF OFF ON
Unity Gain Frequency ON OFF OFF ON ON OFF OFF ON OFF OFF OFF ON
Figure 83. Slew Rate Input Output Wave
VH
VL
Input wave
t
Input voltage
VH
VL
∆
t
∆
V
Output wave
SR=∆V/∆t
t
Output voltage
90%
10%
Figure 82. Test Circuit 2
Figure 84. Test Circuit 3 (Channel separation)
R2=100kΩ
R1=1kΩ
V+
GND
OUT1
=1Vrms
IN R1//R2
R2=100kΩ
R1=1kΩ
V+
GND
OUT2
R1//R2
CS=20Log
100×OUT1
OUT2
SW5
SW3
● ●
SW1 SW2
－
＋ SW9 SW10 SW11SW8
SW6 SW7
CL
SW12
SW4
R1
1kΩ
RL
GND
V+
Vo
-IN +IN VRL
R2 100kΩ
Datasheet
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BD12730G BD12732xxx BD12734xxx
Application Example
○Voltage follower
○Inverting amplifier
○Non-inverting amplifier
Figure 86. Inverting Amplifier Circuit
Figure 87. Non-inverting Amplifier Circuit
For inverting amplifier, input voltage (IN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
For non-inverting amplifier, input voltage (IN) is amplified
by a voltage gain, which depends on the ratio of R1 and
R2. The output voltage (OUT) is -INphase with the input
voltage (IN) and is shown in the next expression.
OUT=(1 + R2/R1)・IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
Figure 85. Voltage Follower
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is configured
to be equal to the input voltage (IN). This circuit also
stabilizes the output voltage (OUT) due to high input
impedance and low output impedance. Computation for
output voltage (OUT) is shown below.
OUT=IN
GND
OUT
IN
V+
GND
R2
V+
IN
OUT
R1
R2
R1
GND
R1 // R2
IN
OUT
V+
Datasheet
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BD12730G BD12732xxx BD12734xxx
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 88(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax－TA) / PD °C/W
The Derating curve in Figure 88(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 88(c) to € shows an example of the derating curve for BD12730G,
BD12732xxx and BD12734xxx.
(c) BD12730G (d) BD12732xxx
050 75 100 125 150
25
Ambient temperature TA [ °C ]
Power dissipation of LSI [W]
PDmax
θJA2 < θJA1
P1
P2
θJA2
θJA1
TJmax
Power dissipation of IC
0.0
0.2
0.4
0.6
0.8
0 25 50 75 100 125 150
Ambient Temperature [
℃
]
Power Dissipation [W]
85
BD12730G(Note 18)
0.0
0.2
0.4
0.6
0.8
0 25 50 75 100 125 150
Ambient Temperature [°C]
Power Dissipation [W]
85
BD12732F(Note 19)
BD12732FJ(Note 18)
BD12732FV(Note 20)
BD12732FVT(Note 20)
BD12732FVM(Note 21)
BD12732FVJ(Note 21)
θJA=(TJmax-TA)/ PD °C/W
A
mbient temperature TA [ °C ]
Chip surface temperature TJ [ °C ]
(a) Thermal Resistance (b) Derating Curve
Datasheet
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BD12730G BD12732xxx BD12734xxx
When using the unit above TA=25°C, subtract the value above per °C. Permissible dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted
(Note 18) (Note 19) (Note 20) (Note 21) (Note 22) (Note 23) (Note 24) (Note 25) Unit
5.4 5.5 5.0 4.7 4.5 8.2 7.0 6.8 mW/°C
Figure 88. Thermal Resistance and Derating Curve
(e) BD12734xxx
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125 150
Ambient Temperature [
℃
]
Power Dissipation [W]
85
BD12734F(Note 22)
BD12734FVJ(Note 25)
BD12734FV(Note 24)
BD12734FJ(Note 23)
Datasheet
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BD12730G BD12732xxx BD12734xxx
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Bo ards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So, unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
Datasheet
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BD12730G BD12732xxx BD12734xxx
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 89. Example of monolithic IC structure
13. Ap plied voltage to the input terminal
For normal circuit operation of voltage comparator, please input voltage for its input terminal within input common
mode voltage V+ + 0.3V. Then, regardless of power supply voltage, GND-0.3V can be applied to input terminals
without deterioration or destruction of its characteristics.
14. Power supply (single / dual)
The operational amplifiers operate when the voltage supplied is between V+ and GND. Therefore, the single supply
operational amplifiers can be used as dual supply operational amplifiers as well.
15. Power dissipation (Pd)
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a
rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power
dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal
derating curves for more information.
16. IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
17. The IC destruction caused by capacitive load
The transistors in circuits may be damaged when V+ terminal and GND terminal is shorted with the charged output
terminal capacitor.When IC is used as a operational amplifier or as an application circuit, where oscillation is not
activated by an output capacitor, the output capacitor must be kept below 0.1μF in order to prevent the damage
mentioned above.
18. Latch up
Be careful in the application of input voltage that exceeds the V+ and GND. For CMOS device, sometimes latch up
operation occurs. Also protect the IC from abnormal noise.
19. Decoupling capacitor
Insert a decoupling capacitor between V+ and GND for a stable operation of the operational amplifier.
Datasheet
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BD12730G BD12732xxx BD12734xxx
Operational Notes – continued
20. Unused circuits
When there are unused Op-amps, it is recommended that they are
connected as in Figure 90, setting the non-inverting input terminal to a
potential within the Input Common-mode Voltage Range (VICM).
Figure 90. Example of Application
Circuit for Unused Op-Amp
Keep this potential
in VICM
VICM
GND
V+
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information
Package Name SSOP5
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name SOP8
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
(Max 5.35 (include.BURR))
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name SOP-J8
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name SSOP-B8
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
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Physical Dimension, Tape and Reel Information - continued
Package Name TSSOP-B8
Direction of feed
Reel ∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
1pin
Datasheet
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Physical Dimension, Tape and Reel Information - continued
Package Name MSOP8
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name TSSOP-B8J
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
1pin
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name SOP14
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
(Max 9.05 (include.BURR))
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name SOP-J14
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name SSOP-B14
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
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BD12730G BD12732xxx BD12734xxx
Physical Dimension, Tape and Reel Information - continued
Package Name TSSOP-B14J
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
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BD12730G BD12732xxx BD12734xxx
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Marking Diagram
TSSOP-B8J(TOP VIEW)
Part Number Marking
LOT Numbe
r
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP-J8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number Marking
SSOP5(TOP VIEW)
LOT Number
Datasheet
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BD12730G BD12732xxx BD12734xxx
Marking Diagram - continued
Product Name Package Type Marking
BD12730 G SSOP5 K7
BD12732
F SOP8 D2732
FJ SOP-J8 D2732
FV SSOP-B8 2732
FVT TSSOP-B8 D2732
FVM MSOP8 D2732
FVJ TSSOP-B8J D2732
BD12734
F SOP14 BD12734F
FJ SOP-J14 D2734
FV SSOP-B14 D2734
FVM TSSOP-B14J D2734
TSSOP-B14J (TOP VIEW)
Part Number Marking
LOT Numbe
r
1PIN MARK
SOP-J14(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP14(TOP VIEW)
Part Number Marking
LOT Numbe
r
1PIN MARK
SSOP-B14(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Datasheet
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BD12730G BD12732xxx BD12734xxx
Revision History
Date Revision Changes
30.Nov.2013 001 New Release
11.Feb.2013 002 Added BD12732F and BD12734F
1.Apr.2014 003 BD12732FJ/FV/FVT/FVM/FVJ and BD12734FJ/FV/FVJ package variation added
4.July.2016 004
Change Operating Voltage Range Before:1.8V to 5V After:1.8V to 5.5V,
Correction of erroneous description(P.28)
14.July.2016 005
Key Specifications : Temperature Range → Operating Temperature Range(P.1)
Line-up : Topr → Operating Temperature(P.3)
Delete Land Pattern Data(P.50)
Correction of erroneous description (P.49 Diagr-m → Diagram)
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
