H
W
D
L
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Alumina Substrate
Copper Wraparound
Termination
2152 / 0102 / 6021 RL
Low Value Flat
Chip Resistor
LRC/LRF Series
•Standard 2512, 2010 and 1206 sizes
•Resistance values down to 0.003 ohms
•Leach resistant solder-plated copper
wrap-around termination
•Low inductance - less than 0.2nH
•AEC-Q200 Qualified
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
Electrical Data
Physical Data
04.10
A subsidiary of
TT electronics plc
Welwyn Components
23
LR1206 LR2010 LR2512
*0.2/5.10.15.0sttawC°07 ta gnitar rewoP
R1 ot 300R0R1 ot 300R0R1 ot 010R0smhoegnar ecnatsiseR
002002002stlovegatlov gnidnatshtiw cirtceleiD
)smho 050.0 woleb eulav rof yrotcaf tcatnoC( 001±C°/mppRCT
%ecnarelot ecnatsiseR ≤R005 5%, >R005 1, 2, 5%
090804C°rewop detar ta esir erutarepmeT
Pad and trace area for max power rating @ 70°C mm230 30 100
*2 Watts with total solder pad and trace size of 300 mm2
Dimensions (mm)
1DD)xam( HWLeziS
LR1206 3.20±0.305 1.63±0.203 0.8 0.48±0.25 0.48±0.25
LR2010 5.23±0.38 2.64±0.25 0.8 0.48±0.25 0.48±0.25
LR2512 6.50±0.38 3.25±0.25 0.8 0.48±0.25 0.48±0.25
LRC-LRF_E.qxd 12/23/04 10:07 AM Page 1
Low Value Flat
Chip Resistor
LRC/LRF Series
© Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com 04.10
Welwyn Components
Dimensions (mm)
A B C
LR1206 2.0 4.0 1.25
LR2010 3.05 6.5 1.5
LR2512 3.7 7.75 1.5
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies to ohmic values ≥R01.
A
C
B
LRC-LRF_E.qxd 12/23/04 10:07 AM Page 2
LRC 2512 1 watt
LRC 2512 2 watt
LRC 2010 0.5 wattLRC 2010 1 watt
LRC 1206 0.25 watt
LRC 1206 0.5 watt
25 70 150 (°C)
0
20
40
60
80
100
(%)
Power Rating
Ambient temperature
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
L R F 2 5 1 2 – R 0 1 G W
Type
Mounting
Conventional (element up)
Values > R025
F
Flip-chip (element down)
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F
1%
G
2%
J
5%
Packing
W
1206 or 2010
3000/reel
Standard
2512
1800/reel
T1
All sizes
1000/reel
Values < R025
AEC-Q200 Table 7 Method Max.
(add R05)
Typ.
(@1R0)
ref Test
3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2
4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1
6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2
7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1 0.5
14 Vibration MIL-STD-202 Method 204 R% 0.5 0.05
15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05
16 Thermal Shock MIL-STD-202 Method 107 R% 0.25 0.1
18 Solderability J-STD-002 >95% coverage
21 Board Flex AEC-Q200-005 R% 0.5 0.2
22 Terminal Strength AEC-Q200-006 R% 0.25 0.1
Short Term Overload 6.25 x Pr for 2s R% 0.5
Low Temperature Storage -65°C for 100 hours R% 0.5
Leach Resistance Solder dip at 250°C 90s minimum