1. Product profile
1.1 General description
The PRTR5V0U6AS is designed to protect Input/Output (I/O) ports that are sensitive to
capacitive load, such as USB 2.0, Ethernet, DVI and HDMI from destruction by
ElectroStatic Discharge (ESD). It provides protection to downstream signal and supply
components from ESD voltages as high as ±8 kV (contact discharge).
The PRTR5V0U6AS incorporates six pairs of ultra-low capacitance rail-to-rail diodes plus
a Zener diode. The rail-to-rail diodes are connected to the Zener diode which allows ESD
protection to be independent of supply voltage with any ESD voltage discharged locally
within the device. The PRTR5V0U6AS is fabricated using monolithic silicon technology
integrating six ultra-low capacitance rail-to-rail ESD protection diodes in a miniature 8-lead
SO8 (SOT96) package.
1.2 Features
nPb-free and RoHS compliant, dark green
nESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge
nSix ultra-low input capacitance (1 pF typical) ESD rail-to-rail ESD protection diodes
nSupply voltage independent clamping due to integrated Zener diode
nSmall 8-lead SO8 (SOT96) package
1.3 Applications
nGeneral-purpose downstream ESD protection high frequency analog signals and
high-speed serial data transmission for ports inside:
uCellular and PCS mobile handsets
uPC/Notebook USB2.0/IEEE1394 ports
uDVI/HDMI interfaces
uCordless telephones
uWireless data (WAN/LAN) systems
uPDAs
PRTR5V0U6AS
High speed interface ESD protection to IEC 61000-4-2 level 4
Rev. 01 — 18 February 2008 Product data sheet
PRTR5V0U6AS_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 18 February 2008 2 of 7
NXP Semiconductors PRTR5V0U6AS
High speed interface ESD protection to IEC 61000-4-2 level 4
2. Pinning information
3. Ordering information
4. Limiting values
5. Recommended operating conditions
Table 1. Pinning
Pin Description Simplified outline Symbol
1 ESD protection I/O 1
2 ESD protection I/O 2
3 ground (GND)
4 ESD protection I/O 3
5 ESD protection I/O 4
6 ESD protection I/O 5
7 supply voltage (VCC)
8 ESD protection I/O 6
4
5
1
8
001aah388
8
7
6
5
4
3
2
1
Table 2. Ordering information
Type number Package
Name Description Version
PRTR5V0U6AS SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VIinput voltage 0 5.5 V
Vesd electrostatic discharge voltage all pins; IEC 61000-4-2; level 4
contact discharge −8+8kV
Tstg storage temperature −55 +125 °C
Table 4. Operating conditions
Symbol Parameter Conditions Min Typ Max Unit
Tamb ambient temperature −40 - +85 °C
PRTR5V0U6AS_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 18 February 2008 3 of 7
NXP Semiconductors PRTR5V0U6AS
High speed interface ESD protection to IEC 61000-4-2 level 4
6. Characteristics
[1] Measured from pin 1, 2, 4, 5, 6 and 8 to ground.
[2] Measured from pin 7 to ground.
Table 5. Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
C(I/O-GND) input/output to ground
capacitance VI = 0 V; f = 1 MHz; VCC = 3 V [1] - 1.0 - pF
ILR reverse leakage current VI = 3 V [1] - - 100 nA
VBR breakdown voltage Zener diode; II = 1 mA [2] 6- 9V
Csup supply pin to ground capacitance VI = 0 V; f = 1 MHz; VCC = 3 V [2] -30-pF
VFforward voltage - 0.7 - V
PRTR5V0U6AS_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 18 February 2008 4 of 7
NXP Semiconductors PRTR5V0U6AS
High speed interface ESD protection to IEC 61000-4-2 level 4
7. Package outline
Fig 1. Package outline SOT96-1 (SO8)
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.05 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
99-12-27
03-02-18
PRTR5V0U6AS_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 18 February 2008 5 of 7
NXP Semiconductors PRTR5V0U6AS
High speed interface ESD protection to IEC 61000-4-2 level 4
8. Abbreviations
9. Revision history
Table 6. Abbreviations
Acronym Description
DVI Digital Video Interface
ESD ElectroStatic Discharge
HDMI High Definition Multimedia interface
LAN Local Area Network
PCS Personal Computing System
PDA Personal Digital Assistant
RoHS Restriction of Hazardous Substances
USB Universal Serial Bus
WAN Wide Area Network
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PRTR5V0U6AS_1 20080218 Product data sheet - -
PRTR5V0U6AS_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 18 February 2008 6 of 7
NXP Semiconductors PRTR5V0U6AS
High speed interface ESD protection to IEC 61000-4-2 level 4
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors PRTR5V0U6AS
High speed interface ESD protection to IEC 61000-4-2 level 4
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 February 2008
Document identifier: PRTR5V0U6AS_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Recommended operating conditions. . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 6
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
