LMK04803BISQE/NOPB - Texas Instruments

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³GLUW\´FORFNRU

clean clock

0XOWLSOH³FOHDQ´

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CLKout2

CLKout0, 1

FPGA

CLKin0

Crystal or

VCXO

Backup

Reference

Clock CLKin1

OSCout0/

OSCout1

CLKout11 CLKout8A

DAC

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

LMK0480x Low-Noise Clock Jitter Cleaner with Dual Loop PLLs

1 Features 3 Description

The LMK0480x family is the industry's highest

1• Ultra-Low RMS Jitter Performance performance clock conditioner with superior clock

– 111 fs RMS Jitter (12 kHz to 20 MHz) jitter cleaning, generation, and distribution with

– 123 fs RMS Jitter (100 Hz to 20 MHz) advanced features to meet next generation system

requirements. The dual loop PLLatinum™

• Dual Loop PLLatinum™ PLL Architecture architecture is capable of 111 fs rms jitter (12 kHz to

• PLL1 20 MHz) using a low noise VCXO module or sub-200

– Integrated Low-Noise Crystal Oscillator Circuit fs rms jitter (12 kHz to 20 MHz) using a low cost

external crystal and varactor diode.

– Holdover Mode when Input Clocks are Lost

– Automatic or Manual Triggering/Recovery The dual loop architecture consists of two high-

performance phase-locked loops (PLL), a low-noise

• PLL2 crystal oscillator circuit, and a high-performance

– Normalized PLL Noise Floor of –227 dBc/Hz voltage controlled oscillator (VCO). The first PLL

– Phase Detector Rate up to 155 MHz (PLL1) provides low-noise jitter cleaner functionality

while the second PLL (PLL2) performs the clock

– OSCin Frequency-Doubler generation. PLL1 can be configured to either work

– Integrated Low-Noise VCO with an external VCXO module or the integrated

• 2 Redundant Input Clocks with LOS crystal oscillator with an external tunable crystal and

– Automatic and Manual Switch-Over Modes varactor diode. When paired with a very narrow loop

bandwidth, PLL1 uses the superior close-in phase

• 50 % Duty Cycle Output Divides, 1 to 1045 (Even noise (offsets below 50 kHz) of the VCXO module or

and Odd) the tunable crystal to clean the input clock. The

• 12 LVPECL, LVDS, or LVCMOS Programmable output of PLL1 is used as the clean input reference to

Outputs PLL2 where it locks the integrated VCO. The loop

bandwidth of PLL2 can be optimized to clean the far-

• Digital Delay: Fixed or Dynamically Adjustable out phase noise (offsets above 50 kHz) where the

• 25 ps Step Analog Delay Control. integrated VCO outperforms the VCXO module or

• 14 Differential Outputs. Up to 26 Single Ended. tunable crystal used in PLL1.

– Up to 6 VCXO/Crystal Buffered Outputs Device Information

• Clock Rates of up to 1536 MHz REFERENCE

• 0-Delay Mode PART NUMBER VCO FREQUENCY INPUTS

• Three Default Clock Outputs at Power Up LMK04803 1840 to 2030 MHz

• Multi-Mode: Dual PLL, Single PLL, and Clock LMK04805 2148 to 2370 MHz 2

Distribution LMK04806 2370 to 2600 MHz

• Industrial Temperature Range: –40 to 85°C LMK04808 2750 to 3072 MHz

• 3.15-V to 3.45-V Operation (1) For all available packages, see the orderable addendum at

the end of the datasheet.

• 2 Dedicated Buffered/Divided OSCin Clocks

• Package: 64-Pin WQFN (9.0 × 9.0 × 0.8 mm) Simplified Schematic

2 Applications

• Data Converter Clocking

• Wireless Infrastructure

• Networking, SONET/SDH, DSLAM

• Medical / Video / Military / Aerospace

• Test and Measurement

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMK04803

LMK04805

LMK04806

LMK04808

SNAS489K –MARCH 2011–REVISED DECEMBER 2014

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Table of Contents

8.5 Programming........................................................... 47

1 Features.................................................................. 18.6 Register Maps......................................................... 51

2 Applications ........................................................... 19 Application and Implementation ........................ 97

3 Description............................................................. 19.1 Application Information............................................ 97

4 Revision History..................................................... 29.2 Typical Applications .............................................. 114

5 Pin Configuration and Functions......................... 49.3 System Examples ................................................. 122

6 Specifications......................................................... 69.4 Do's and Don'ts..................................................... 124

6.1 Absolute Maximum Ratings ...................................... 610 Power Supply Recommendations ................... 125

6.2 ESD Ratings.............................................................. 610.1 Pin Connection Recommendations..................... 125

6.3 Recommended Operating Conditions....................... 610.2 Current Consumption and Power Dissipation

6.4 Thermal Information.................................................. 7Calculations............................................................ 126

6.5 Electrical Characteristics........................................... 711 Layout................................................................. 129

6.6 Timing Requirements.............................................. 13 11.1 Layout Guidelines ............................................... 129

6.7 Typical Characteristics: Clock Output AC 11.2 Layout Example .................................................. 130

Characteristics ......................................................... 14 12 Device and Documentation Support............... 131

7 Parameter Measurement Information ................ 15 12.1 Device Support.................................................... 131

7.1 Charge Pump Current Specification Definitions...... 15 12.2 Documentation Support ...................................... 131

7.2 Differential Voltage Measurement Terminology...... 16 12.3 Related Links ...................................................... 131

8 Detailed Description............................................ 17 12.4 Trademarks......................................................... 131

8.1 Overview................................................................. 17 12.5 Electrostatic Discharge Caution.......................... 131

8.2 Functional Block Diagram....................................... 21 12.6 Glossary.............................................................. 131

8.3 Feature Description................................................. 22 13 Mechanical, Packaging, and Orderable

8.4 Device Functional Modes........................................ 43 Information ......................................................... 131

4 Revision History

Changes from Revision J (March 2013) to Revision K Page

• Changed 90 to 80 and 80 to 90 for fCLKout-startup parameter in Electrical Characteristics....................................................... 11

• Added "Specification is not valid for CLKoutX or CLKoutY in analog delay mode" in table note for Electrical

Characteristics ..................................................................................................................................................................... 11

• Changed "Temperature" to "Ambient Temperature" in heading titled "Charge Pump Output Current Magnitude

Variation vs. Ambient Temperature" .................................................................................................................................... 15

• Added "temporarily" in VCXO/CRYSTAL Buffered Outputs ................................................................................................ 18

• Changed from "n possible" to "D possible" in 0-Delay......................................................................................................... 20

• Changed "can" to "cannot" in Input Clock Switching - Pin Select Mode.............................................................................. 24

• Deleted Clock Switch Event without Holdover in Clock Switch Event with Holdover .......................................................... 25

• Added paragraph beginning "For applications ..." in PLL2 Frequency Doubler................................................................... 29

• Changed 5 to15 in Table 11................................................................................................................................................. 42

• Deleted Mode 5 row in Table 12 .......................................................................................................................................... 43

• Added Mode 15 Additional Configurations section .............................................................................................................. 46

• In Table 16, added [27:26], [23:22], and [21:20] for Register 27 row. Added [31:20] for R28. Added [26:24] for R30.

Added [7:6]. .......................................................................................................................................................................... 51

• In Table 18, changed "Actual PLL2 N divider value used in calibration routine". Added footnote "Inversion for Status

0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06"............................................................................................ 56

• In Table 28, added "to reduce supply..." footnote for 9 through 14. Added footnote "To reduce supply switching and

crosstalk noise, it is recommended to use a complementary LVCMOS output type such as 6 or 7".................................. 64

• Added footnote "To reduce supply" for 8 through 14 in Table 32 ....................................................................................... 66

• Changed "Divide" to "Definition" in Table 39,Table 40,Table 61, and Table 62 ................................................................ 68

• Changed to "MUX OUTPUT" in Table header row in Table 42............................................................................................ 69

• In Table 43, added footnote, "Contact TI Applications for more information on using this mode". Changed to "Dual

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Revision History (continued)

PLL, External VCO (Fin), 0-Delay" for 15 (0x0F)................................................................................................................. 70

• Added "Inversion for Status 0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06" in CLKin_Sel_INV................. 78

• In FORCE_HOLDOVER, added "(EN_TRACK = 0 or 1, EN_MAN_DAC =1)". Added "(EN_TRACK = 1,

EN_MAN_DAC = 0, EN_VTUNE_RAIL_DET = 0)".............................................................................................................. 82

• Changed to R[23:14] in DAC_CNT....................................................................................................................................... 83

• In Table 90, added (0x0000), (0x0001), (0x0002), (0x0003). Changed "Divide" to "Value" in the header row................... 87

• Added (0x00) through (0x04) in Table 91............................................................................................................................. 88

• Added PLL2 Frequency Doubler.......................................................................................................................................... 88

• Changed from "Divide" to "Value" in Table 95 ..................................................................................................................... 89

• Added PLL2 Frequency Doubler reference in Table 103..................................................................................................... 92

• Added note "Unless in 0-delay..." in PLL2_N_CAL, PLL2 N Calibration Divider ................................................................ 93

• Changed "Mode_MUX1" to "VCO_MUX" in PLL2_P, PLL2 N Prescaler Divider................................................................. 94

• Changed "register" to "Defintion" in table header row for Table 110 ................................................................................... 95

• Updated Minimum Digital Lock Detect Time Calculation Example ................................................................................... 107

• Added "Performance of other LMK0480x devices will be similar" in Optional Crystal Oscillator Implementation

(OSCin/OSCin*).................................................................................................................................................................. 110

• Changed to "(fs rms)" in Table 125 ................................................................................................................................... 111

• Added text in red for Figure 40 .......................................................................................................................................... 123

• In Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs), added bullet point starting with "It is recommended..."

Changed ≤10 MHz to ≤30 MHz........................................................................................................................................ 125

• Added paragraph "It is recommended..." in Vcc5 (CLKin and OSCout1), Vcc7 (OSCin and OSCout0) ........................... 126

• Added Mode = 15. Removed Mode = 5 in Table 127........................................................................................................ 127

• Deleted "of about 2 square inches" in Layout Guidelines.................................................................................................. 129

Changes from Revision I (March 2013) to Revision J Page

• Changed layout of National Data Sheet to TI format ............................................................................................................. 1

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CLKout8

CLKout9

CLKout10*

Status_CLKin0

CLKout8*

CLKout9*

Vcc12

CLKout10

CLKout11*

CLKout11

Status_CLKin1

Vcc13

DAP

Top Down View

CLKout6*

Vcc11

CLKout7*

CLKout7

OSCout1*

Vcc2

Vcc3

CLKout4

Vcc4

CLKout4*

CLKout5*

CLKout5

GND

FBCLKin/Fin/CLKin1

FBCLKin*/Fin*/CLKin1*

Status_Holdover

CLKin0

CLKin0*

Vcc5

OSCout1

Vcc7

CPout2

Vcc9

CLKuWire

OSCin*

OSCout0

OSCout0*

Vcc8

LEuWire

DATAuWire

Vcc10

CLKout6

CPout1

Status_LD

Vcc6

OSCin

CLKout3

CLKout0

CLKout0*

CLKout1*

CLKout1

SYNC

Vcc1

LDObyp1

LDObyp2

CLKout2

CLKout2*

CLKout3*

17 1918 20 21 22 23 24 25 26 27 28 29 30 31 32

64 6263 61 60 59 58 57 56 55 54 53 52 51 50 49

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

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5 Pin Configuration and Functions

64-Pin WQFN with Exposed Pad

NKD Package

(Top View)

Pin Functions(1)

PIN I/O TYPE DESCRIPTION

NUMBER NAME

1, 2 CLKout0, CLKout0* O Programmable Clock output 0 (clock group 0).

3, 4 CLKout1*, CLKout1 O Programmable Clock output 1 (clock group 0).

6 SYNC I/O Programmable CLKout Synchronization input or programmable status pin.

5, 7, 8, 9 NC – – No Connection. These pins must be left floating.

10 Vcc1 PWR Power supply for VCO LDO.

11 LDObyp1 ANLG LDO Bypass, bypassed to ground with 10 µF capacitor.

12 LDObyp2 ANLG LDO Bypass, bypassed to ground with a 0.1 µF capacitor.

13, 14 CLKout2, CLKout2* O Programmable Clock output 2 (clock group 1).

15, 16 CLKout3*, CLKout3 O Programmable Clock output 3 (clock group 1).

17 Vcc2 PWR Power supply for clock group 1: CLKout2 and CLKout3.

18 Vcc3 PWR Power supply for clock group 2: CLKout4 and CLKout5.

(1) See Pin Connection Recommendations.

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

Pin Functions(1) (continued)

PIN I/O TYPE DESCRIPTION

NUMBER NAME

19, 20 CLKout4, CLKout4* O Programmable Clock output 4 (clock group 2).

21, 22 CLKout5*, CLKout5 O Programmable Clock output 5 (clock group 2).

23 GND PWR Ground.

24 Vcc4 PWR Power supply for digital.

CLKin1, CLKin1* Reference Clock Input Port 1 for PLL1. AC or DC Coupled.

Feedback input for external clock feedback input (0-delay

FBCLKin, FBCLKin*

25, 26 I ANLG mode). AC or DC Coupled.

External VCO input (External VCO mode). AC or DC

Fin/Fin* Coupled.

Programmable status pin, default readback output.

27 Status_Holdover I/O Programmable Programmable to holdover mode indicator. Other options

available by programming.

Reference Clock Input Port 0 for PLL1.

28, 29 CLKin0, CLKin0* I ANLG AC or DC Coupled.

30 Vcc5 PWR Power supply for clock inputs and OSCout1.

31, 32 OSCout1, OSCout1* O LVPECL Buffered output 1 of OSCin port.

Programmable status pin, default lock detect for PLL1 and

33 Status_LD I/O Programmable PLL2. Other options available by programming.

34 CPout1 O ANLG Charge pump 1 output.

35 Vcc6 PWR Power supply for PLL1, charge pump 1.

Feedback to PLL1, Reference input to PLL2.

36, 37 OSCin, OSCin* I ANLG AC Coupled.

38 Vcc7 PWR Power supply for OSCin, OSCout0, and PLL2 circuitry.(2)

39, 40 OSCout0, OSCout0* O Programmable Buffered output 0 of OSCin port.(2)

41 Vcc8 PWR Power supply for PLL2, charge pump 2.

42 CPout2 O ANLG Charge pump 2 output.

43 Vcc9 PWR Power supply for PLL2.

44 LEuWire I CMOS MICROWIRE Latch Enable Input.

45 CLKuWire I CMOS MICROWIRE Clock Input.

46 DATAuWire I CMOS MICROWIRE Data Input.

47 Vcc10 PWR Power supply for clock group 3: CLKout6 and CLKout7.

48, 49 CLKout6, CLKout6* O Programmable Clock output 6 (clock group 3).

50, 51 CLKout7*, CLKout7 O Programmable Clock output 7 (clock group 3).

52 Vcc11 PWR Power supply for clock group 4: CLKout8 and CLKout9.

53, 54 CLKout8, CLKout8* O Programmable Clock output 8 (clock group 4).

55, 56 CLKout9*, CLKout9 O Programmable Clock output 9 (clock group 4).

57 Vcc12 PWR Power supply for clock group 5: CLKout10 and CLKout11.

CLKout10,

58, 59 O Programmable Clock output 10 (clock group 5).

CLKout10*

CLKout11*,

60, 61 O Programmable Clock output 11 (clock group 5).

CLKout11 Programmable status pin. Default is input for pin control of

62 Status_CLKin0 I/O Programmable PLL1 reference clock selection. CLKin0 LOS status and

other options available by programming.

Programmable status pin. Default is input for pin control of

63 Status_CLKin1 I/O Programmable PLL1 reference clock selection. CLKin1 LOS status and

other options available by programming.

64 Vcc13 PWR Power supply for clock group 0: CLKout0 and CLKout1.

DAP DAP – GND DIE ATTACH PAD, connect to GND.

(2) See Vcc5 (CLKin and OSCout1), Vcc7 (OSCin and OSCout0) for information on configuring device for optimum performance.

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6 Specifications

6.1 Absolute Maximum Ratings(1)(2)(3)

over operating free-air temperature range (unless otherwise noted) (4)

MIN MAX UNIT

VCC Supply Voltage (5) –0.3 3.6 V

(VCC +

VIN Input Voltage –0.3 V

0.3)

TLLead Temperature (solder 4 seconds) +260 °C

TJJunction Temperature 150 °C

Differential Input Current (CLKinX/X*,

IIN ± 5 mA

OSCin/OSCin*, FBCLKin/FBCLKin*, Fin/Fin*)

MSL Moisture Sensitivity Level 3

Tstg Storage temperature range -65 150 °C

(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only to the test conditions listed.

(2) Stresses in excess of the absolute maximum ratings can cause permanent or latent damage to the device. These are absolute stress

ratings only. Functional operation of the device is only implied at these or any other conditions in excess of those given in the operation

sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability.

(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(4) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(5) Never to exceed 3.6 V.

6.2 ESD Ratings VALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

Machine model (MM) ±150

V(ESD) Electrostatic discharge V

Charged-device model (CDM), per JEDEC specification JESD22- ±750

C101(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance.

6.3 Recommended Operating Conditions MIN NOM MAX UNIT

TJJunction Temperature 125 °C

TAAmbient Temperature VCC = 3.3 V -40 25 85 °C

VCC Supply Voltage 3.15 3.3 3.45 V

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6.4 Thermal Information LMK0480x

THERMAL METRIC(1) NKD UNIT

64 PINS

RθJA Junction-to-ambient thermal resistance on 4-layer JEDEC PCB(2)(3) 25.2

RθJC(top) Junction-to-case (top) thermal resistance(4)(5) 6.9

RθJB Junction-to-board thermal resistance(6) 4.0 °C/W

ψJT Junction-to-top characterization parameter(7) 0.1

ψJB Junction-to-board characterization parameter(8) 4.0

RθJC(bot) Junction-to-case (bottom) thermal resistance(9) 0.8

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3) Specification assumes 32 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC PCB. These

vias play a key role in improving the thermal performance of the WQFN. Note that the JEDEC PCB is a standard thermal measurement

PCB and does not represent best performance a PCB can achieve. It is recommended that the maximum number of vias be used in the

board layout. R θJA is unique for each PCB.

(4) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC standard

test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(5) Case is defined as the DAP (die attach pad)

(6) The junction-to-board thermal resistance is obtained by simulating an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(7) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).

(8) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).

(9) The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

6.5 Electrical Characteristics

3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25°C,

at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

CURRENT CONSUMPTION

No DC path to ground on

ICC_PD Power down supply current 1 3 mA

OSCout1/1*(2)

All clock delays disabled,

CLKoutX_Y_DIV = 1045,

ICC_CLKS Supply current with all clocks enabled(3) 505 590 mA

CLKoutX_TYPE = 1 (LVDS),

PLL1 and PLL2 locked.

CLKin0/0* and CLKin1/1* INPUT CLOCK SPECIFICATIONS

fCLKin Clock input frequency(4) 0.001 500 MHz

SLEWCLKin(1) Clock input slew rate(5) 20% to 80% 0.15 0.5 V/ns

VIDCLKin 0.25 1.55 |V|

AC coupled

Clock input CLKinX_BUF_TYPE = 0 (Bipolar)

VSSCLKin 0.5 3.1 Vpp

Differential input voltage (see (6) and

VIDCLKin 0.25 1.55 |V|

AC coupled

Figure 4)CLKinX_BUF_TYPE = 1 (MOS)

VSSCLKin 0.5 3.1 Vpp

(1) In order to meet the jitter performance listed in the subsequent sections of this data sheet, the minimum recommended slew rate for all

input clocks is 0.5 V/ns. This is especially true for single-ended clocks. Phase noise performance will begin to degrade as the clock input

slew rate is reduced. However, the device will function at slew rates down to the minimum listed. When compared to single-ended

clocks, differential clocks (LVDS, LVPECL) will be less susceptible to degradation in phase noise performance at lower slew rates due to

their common mode noise rejection. However, it is also recommended to use the highest possible slew rate for differential clocks to

achieve optimal phase noise performance at the device outputs.

(2) If emitter resistors are placed on the OSCout1/1* pins, there will be a DC current to ground which will cause powerdown Icc to increase.

(3) Load conditions for output clocks: LVDS: 100-Ωdifferential. See Current Consumption and Power Dissipation Calculations for Icc for

specific part configuration and how to calculate Icc for a specific design.

(4) CLKin0, CLKin1 maximum is specified by characterization, production tested at 200 MHz.

(5) Specified by characterization.

(6) See Differential Voltage Measurement Terminology for definition of VID and VOD voltages.

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Electrical Characteristics (continued)

3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25°C,

at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

AC coupled to CLKinX; CLKinX* AC

coupled to Ground 0.25 2.4 Vpp

CLKinX_BUF_TYPE = 0 (Bipolar)

Clock input

VCLKin Single-ended input voltage(5) AC coupled to CLKinX; CLKinX* AC

coupled to Ground 0.25 2.4 Vpp

CLKinX_BUF_TYPE = 1 (MOS)

DC offset voltage between

VCLKin0-offset CLKin0/CLKin0* 20 mV

CLKin0* - CLKin0 Each pin AC coupled

CLKin0_BUF_TYPE = 0 (Bipolar)

DC offset voltage between

VCLKin1-offset CLKin1/CLKin1* 0 mV

CLKin1* - CLKin1

DC offset voltage between Each pin AC coupled

VCLKinX-offset CLKinX/CLKinX* 55 mV

CLKinX_BUF_TYPE = 1 (MOS)

CLKinX* - CLKinX

VCLKin- VIH High input voltage DC coupled to CLKinX; CLKinX* AC 2.0 VCC V

coupled to Ground

VCLKin- VIL Low input voltage 0.0 0.4 V

CLKinX_BUF_TYPE = 1 (MOS)

FBCLKin/FBCLKin* and Fin/Fin* INPUT SPECIFICATIONS

AC coupled

(CLKinX_BUF_TYPE = 0)

fFBCLKin Clock input frequency(5) 0.001 1000 MHz

MODE = 2 or 8; FEEDBACK_MUX =

AC coupled

fFin Clock input frequency(5) (CLKinX_BUF_TYPE = 0) 0.001 3100 MHz

MODE = 3 or 11

Single Ended AC coupled;

VFBCLKin/Fin 0.25 2.0 Vpp

Clock input voltage(5) (CLKinX_BUF_TYPE = 0)

AC coupled; 20% to 80%;

SLEWFBCLKin/Fin Slew rate on CLKin(5) 0.15 0.5 V/ns

(CLKinX_BUF_TYPE = 0)

PLL1 SPECIFICATIONS

fPD1 PLL1 phase detector frequency 40 MHz

VCPout1 = VCC/2, PLL1_CP_GAIN = 0 100

VCPout1 = VCC/2, PLL1_CP_GAIN = 1 200

PLL1 charge

ICPout1SOURCE µA

Pump source current(7) VCPout1 = VCC/2, PLL1_CP_GAIN = 2 400

VCPout1 = VCC/2, PLL1_CP_GAIN = 3 1600

VCPout1=VCC/2, PLL1_CP_GAIN = 0 -100

VCPout1=VCC/2, PLL1_CP_GAIN = 1 -200

PLL1 charge

ICPout1SINK µA

Pump sink current(7) VCPout1=VCC/2, PLL1_CP_GAIN = 2 -400

VCPout1=VCC/2, PLL1_CP_GAIN = 3 -1600

Charge pump

ICPout1%MIS VCPout1 = VCC/2, T = 25 °C 3% 10%

Sink/source mismatch

Magnitude of charge pump current 0.5 V < VCPout1 < VCC - 0.5 V

ICPout1VTUNE 4%

variation vs. charge pump voltage TA= 25 °C

Charge pump current vs.

ICPout1%TEMP 4%

temperature variation

Charge Pump TRI-STATE leakage

ICPout1 TRI 0.5 V < VCPout < VCC - 0.5 V 5 nA

current

(7) This parameter is programmable

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Electrical Characteristics (continued)

3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25°C,

at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

PLL1_CP_GAIN = 400 µA -117

PLL 1/f noise at 10 kHz offset.(8)

PN10kHz dBc/Hz

Normalized to 1 GHz Output Frequency PLL1_CP_GAIN = 1600 µA -118

PLL1_CP_GAIN = 400 µA -221.5

PN1Hz Normalized phase noise contribution(9) dBc/Hz

PLL1_CP_GAIN = 1600 µA -223

PLL2 REFERENCE INPUT (OSCin) SPECIFICATIONS

fOSCin PLL2 reference input(10) 500 MHz

PLL2 reference clock minimum slew rate

SLEWOSCin 20% to 80% 0.15 0.5 V/ns

on OSCin(5)

AC coupled; Single-ended (Unused

VOSCin Input voltage for OSCin or OSCin*(5) 0.2 2.4 Vpp

pin AC coupled to GND)

VIDOSCin 0.2 1.55 |V|

Differential voltage swing (see Figure 4) AC coupled

VSSOSCin 0.4 3.1 Vpp

DC offset voltage between

VOSCin-offset OSCin/OSCin* Each pin AC coupled 20 mV

OSCinX* - OSCinX EN_PLL2_REF_2X = 1;(11)

fdoubler_max Doubler input frequency(5) 155 MHz

OSCin Duty Cycle 40% to 60%

CRYSTAL OSCILLATOR MODE SPECIFICATIONS

fXTAL Crystal frequency range(5) RESR < 40 Ω6 20.5 MHz

Vectron VXB1 crystal, 20.48 MHz,

PXTAL Crystal power dissipation(12) RESR < 40 Ω100 µW

XTAL_LVL = 0

Input capacitance of

CIN -40 to +85 °C 6 pF

LMK0480x OSCin port

PLL2 PHASE DETECTOR and CHARGE PUMP SPECIFICATIONS

fPD2 Phase detector frequency 155 MHz

VCPout2=VCC/2, PLL2_CP_GAIN = 0 100

VCPout2=VCC/2, PLL2_CP_GAIN = 1 400

ICPoutSOURCE PLL2 charge pump source current(7) µA

VCPout2=VCC/2, PLL2_CP_GAIN = 2 1600

VCPout2=VCC/2, PLL2_CP_GAIN = 3 3200

VCPout2=VCC/2, PLL2_CP_GAIN = 0 -100

VCPout2=VCC/2, PLL2_CP_GAIN = 1 -400

ICPoutSINK PLL2 charge pump sink current(7) µA

VCPout2=VCC/2, PLL2_CP_GAIN = 2 -1600

VCPout2=VCC/2, PLL2_CP_GAIN = 3 -3200

ICPout2%MIS Charge pump sink/source mismatch VCPout2=VCC/2, TA= 25 °C 3% 10%

Magnitude of charge pump current vs. 0.5 V < VCPout2 < VCC - 0.5 V

ICPout2VTUNE 4%

charge pump voltage variation TA= 25 °C

(8) A specification in modeling PLL in-band phase noise is the 1/f flicker noise, LPLL_flicker(f), which is dominant close to the carrier. Flicker

noise has a 10 dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = LPLL_flicker(10

kHz) - 20log(Fout / 1 GHz), where LPLL_flicker(f) is the single side band phase noise of only the flicker noise's contribution to total noise,

L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade slope close to the carrier. A high compare frequency and a clean

crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f) can be masked by the reference

oscillator performance if a low power or noisy source is used. The total PLL in-band phase noise performance is the sum of LPLL_flicker(f)

and LPLL_flat(f).

(9) A specification modeling PLL in-band phase noise. The normalized phase noise contribution of the PLL, LPLL_flat(f), is defined as:

PN1HZ=LPLL_flat(f) - 20log(N) - 10log(fPDX). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a 1 Hz

bandwidth and fPDX is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f).

(10) FOSCin maximum frequency specified by characterization. Production tested at 200 MHz.

(11) The EN_PLL2_REF_2X bit (Register 13) enables/disables a frequency doubler mode for the PLL2 OSCin path.

(12) See Application Section discussion of Optional Crystal Oscillator Implementation (OSCin/OSCin*).

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Electrical Characteristics (continued)

3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25°C,

at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Charge pump current vs.

ICPout2%TEMP 4%

Temperature variation

ICPout2TRI Charge pump leakage 0.5 V < VCPout2 < VCC - 0.5 V 10 nA

PLL 1/f Noise at 10 kHz offset(8) PLL2_CP_GAIN = 400 µA -118

PN10kHz Normalized to dBc/Hz

PLL2_CP_GAIN = 3200 µA -121

1 GHz output frequency PLL2_CP_GAIN = 400 µA -222.5

PN1Hz Normalized Phase Noise Contribution(9) dBc/Hz

PLL2_CP_GAIN = 3200 µA -227

INTERNAL VCO SPECIFICATIONS

LMK04803 1840 2030

LMK04805 2148 2370

fVCO VCO tuning range MHz

LMK04806 2370 2600

LMK04808 2750 3072

Fine tuning sensitivity

(The range displayed in the typical

column indicates the lower sensitivity is

KVCO typical at the lower end of the tuning LMK04808 20 to 36 MHz/V

range, and the higher tuning sensitivity is

typical at the higher end of the tuning

range). After programming R30 for lock, no

Allowable Temperature Drift for

|ΔTCL| changes to output configuration are 125 °C

Continuous Lock(13) (5) permitted to ensure continuous lock

CLKout CLOSED LOOP JITTER SPECIFICATIONS USING a COMMERCIAL QUALITY VCXO(14)

Offset = 1 kHz -122.5

Offset = 10 kHz -132.9

LMK04808 Offset = 100 kHz -135.2

fCLKout = 245.76 MHz Offset = 800 kHz -143.9

L(f)CLKout SSB Phase noise dBc/Hz

Offset = 10 MHz; LVDS -156.0

Measured at clock outputs

Value is average for all output types(15) Offset = 10 MHz; LVPECL 1600 -157.5

mVpp

Offset = 10 MHz; LVCMOS -157.1

LMK04803(15) BW = 12 kHz to 20 MHz 112

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 121

Integrated RMS jitter

LMK04805(15) BW = 12 kHz to 20 MHz 113

fCLKout = 245.76 MHz

JCLKout BW = 100 Hz to 20 MHz 122

Integrated RMS jitter

LVDS/LVPECL/ fs rms

LMK04806(15) BW = 12 kHz to 20 MHz 115

LVCMOS fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 123

Integrated RMS jitter

LMK04808(15) BW = 12 kHz to 20 MHz 111

fCLKout = 245.76 MHz BW = 100 Hz to 20 MHz 123

Integrated RMS jitter

(13) Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was

at the time that the R30 register was last programmed, and still have the part stay in lock. The action of programming the R30 register,

even to the same value, activates a frequency calibration routine. This implies the part will work over the entire frequency range, but if

the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the R30 register to

ensure it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the

frequency range of -40 °C to 85 °C without violating specifications.

(14) VCXO used is a 122.88 MHz Crystek CVHD-950-122.880.

(15) fVCO = 2949.12 MHz, PLL1 parameters: FPD1 = 1.024 MHz, ICP1 = 100 μA, loop bandwidth = 10 Hz. 122.88 MHz Crystek CVHD-

950–122.880. PLL2 parameters: PLL2_R = 1, FPD2 = 122.88 MHz, ICP2 = 3200 μA, C1 = 47 pF, C2 = 3.9 nF, R2 = 620 Ω, PLL2_C3_LF

= 0, PLL2_R3_LF = 0, PLL2_C4_LF = 0, PLL2_R4_LF = 0, CLKoutX_Y_DIV = 12, and CLKoutX_ADLY_SEL = 0.

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Electrical Characteristics (continued)

3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25°C,

at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

CLKout CLOSED LOOP JITTER SPECIFICATIONS USING THE INTEGRATED LOW NOISE CRYSTAL OSCILLATOR CIRCUIT (16)

BW = 12 kHz to 20 MHz 192

LMK04808 XTAL_LVL = 3

fCLKout = 245.76 MHz fs rms

BW = 100 Hz to 20 MHz

Integrated RMS jitter 450

XTAL_LVL = 3

DEFAULT POWER ON RESET CLOCK OUTPUT FREQUENCY

CLKout8, LVDS, LMK04803 69 77 87

CLKout8, LVDS, LMK04805 80 90 99

Default output clock frequency at device

fCLKout-startup MHz

power on(17) CLKout8, LVDS, LMK04806 90 98 110

CLKout8, LVDS, LMK04808 90 110 130

CLOCK SKEW and DELAY

LVDS-to-LVDS, T = 25 °C,

FCLK = 800 MHz, RL= 100 Ω30

AC coupled

LVPECL-to-LVPECL,

Maximum CLKoutX to CLKoutY(5)(18) T = 25 °C,

FCLK = 800 MHz, RL= 100 Ω

|TSKEW| 30 ps

emitter resistors =

240 Ωto GND

AC coupled

Maximum skew between any two RL= 50 Ω, CL= 5 pF,

LVCMOS outputs, same CLKout or 100

T = 25 °C, FCLK = 100 MHz.

different CLKout(5)(18)

Same device, T = 25 °C,

MixedTSKEW LVDS or LVPECL to LVCMOS 750 ps

250 MHz

MODE = 2 1850

PLL1_R_DLY = 0; PLL1_N_DLY = 0

MODE = 2

PLL1_R_DLY = 0; PLL1_N_DLY = 0;

VCO Frequency = 2949.12 MHz

td0-DELAY CLKin to CLKoutX delay(18) ps

Analog delay select = 0; 0

Feedback clock digital delay = 11;

Feedback clock half step = 1;

Output clock digital delay = 5;

Output clock half step = 0;

(16) Crystal used is a 20.48 MHz Vectron VXB1-1150-20M480 and Skyworks varactor diode, SMV-1249-074LF.

(17) CLKout6 and OSCout0 also oscillate at start-up at the frequency of the VCXO attached to OSCin port.

(18) Equal loading and identical clock output configuration on each clock output is required for specification to be valid. Specification is not

valid for CLKoutX or CLKoutY in analog delay mode.

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Electrical Characteristics (continued)

3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25°C,

at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

LVDS CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 1

fCLKout Maximum frequency(5)(19) RL= 100 Ω1536 MHz

VOD 250 400 450 |mV|

Differential output voltage (see Figure 5)

VSS 500 800 900 mVpp

Change in magnitude of VOD for T = 25 °C, DC measurement

ΔVOD -50 50 mV

complementary output states AC coupled to receiver input

R = 100-Ωdifferential termination

VOS Output offset voltage 1.125 1.25 1.375 V

Change in VOS for complementary output

ΔVOS 35 |mV|

states

Output rise time 20% to 80%, RL = 100 Ω

TR/ TF200 ps

Output fall time 80% to 20%, RL = 100 Ω

ISA Output short circuit current Single-ended output shorted to GND -24 24 mA

ISB single ended T = 25 °C

ISAB Output short circuit current - differential Complimentary outputs tied together -12 12 mA

LVPECL CLOCK OUTPUTS (CLKoutX)

fCLKout Maximum frequency(5)(19) 1536 MHz

20% to 80% output rise RL = 100 Ω, emitter resistors = 240 Ω

to GND

TR/ TF150 ps

CLKoutX_TYPE = 4 or 5

80% to 20% output fall time (1600 or 2000 mVpp)

700 mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 2

VCC -

VOH Output high voltage V

1.03

T = 25 °C, DC measurement VCC -

VOL Output low voltage V

Termination = 50 Ωto 1.41

VCC - 1.4 V

VOD 305 380 440 |mV|

Output voltage (see Figure 5)

VSS 610 760 880 mVpp

1200 mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 3

VCC -

VOH Output high voltage V

1.07

T = 25 °C, DC measurement VCC -

VOL Output low voltage V

Termination = 50 Ωto 1.69

VCC - 1.7 V

VOD 545 625 705 |mV|

Output voltage (see Figure 5)

VSS 1090 1250 1410 mVpp

1600 mVpp LVPECL CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 4

VCC -

VOH Output high voltage V

1.10

T = 25 °C, DC Measurement VCC -

VOL Output low voltage V

Termination = 50 Ωto 1.97

VCC - 2.0 V

VOD 660 870 965 |mV|

Output voltage (see Figure 5)

VSS 1320 1740 1930 mVpp

2000 mVpp LVPECL (2VPECL) CLOCK OUTPUTS (CLKoutX), CLKoutX_TYPE = 5

VCC -

VOH Output high voltage V

1.13

T = 25 °C, DC Measurement VCC -

VOL Output low voltage V

Termination = 50 Ωto 2.20

VCC - 2.3 V

VOD 800 1070 1200 |mV|

Output voltage Figure 5

VSS 1600 2140 2400 mVpp

(19) Refer to Typical Characteristics: Clock Output AC Characteristics for output operation performance at higher frequencies than the

minimum maximum output frequency.

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Electrical Characteristics (continued)

3.15 V ≤VCC ≤3.45 V, -40 °C ≤TA≤85°C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA= 25°C,

at the Recommended Operating Conditions at the time of product characterization and are not specified.(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

LVCMOS CLOCK OUTPUTS (CLKoutX)

fCLKout Maximum frequency(5)(19) 5 pF Load 250 MHz

VCC -

VOH Output high voltage 1 mA Load V

0.1

VOL Output low voltage 1 mA Load 0.1 V

IOH Output high current (source) VCC = 3.3 V, VO= 1.65 V 28 mA

IOL Output low current (sink) VCC = 3.3 V, VO= 1.65 V 28 mA

VCC/2 to VCC/2, FCLK = 100 MHz

DUTYCLK Output duty cycle(5) 45% 50% 55%

T = 25 °C

20% to 80%, RL = 50 Ω,

TROutput rise time 400 ps

CL = 5 pF

80% to 20%, RL = 50 Ω,

TFOutput fall time 400 ps

CL = 5 pF

DIGITAL OUTPUTS (Status_CLKinX, Status_LD, Status_Holdover, SYNC)

VCC -

VOH High-Level output voltage IOH = -500 µA V

0.4

VOL Low-Level output voltage IOL = 500 µA 0.4 V

DIGITAL INPUTS (Status_CLKinX, SYNC)

VIH High-Level input voltage 1.6 VCC V

VIL Low-Level input voltage 0.4 V

Status_CLKinX_TYPE = 0 -5 5

(High Impedance)

High-Level input current Status_CLKinX_TYPE = 1

IIH -5 5 µA

VIH = VCC (Pull-up)

Status_CLKinX_TYPE = 2 10 80

(Pull-down)

Status_CLKinX_TYPE = 0 -5 5

(High Impedance)

Low-Level input current Status_CLKinX_TYPE = 1

IIL -40 -5 µA

VIL = 0 V (Pull-up)

Status_CLKinX_TYPE = 2 -5 5

(Pull-down)

DIGITAL INPUTS (CLKuWire, DATAuWire, LEuWire)

VIH High-Level input voltage 1.6 VCC V

VIL Low-Level input voltage 0.4 V

IIH High-Level input current VIH = VCC 5 25 µA

IIL Low-Level input current VIL = 0 -5 5 µA

6.6 Timing Requirements

See Serial MICROWIRE Timing Diagram and Advanced MICROWIRE Timing Diagrams for additional information

MIN NOM MAX UNIT

TECS LE to Clock Set Up Time See Figure 6 25 ns

TDCS Data to Clock Set Up Time See Figure 6 25 ns

TCDH Clock to Data Hold Time See Figure 6 8 ns

TCWH Clock Pulse Width High See Figure 6 25 ns

TCWL Clock Pulse Width Low See Figure 6 25 ns

TCES Clock to LE Set Up Time See Figure 6 25 ns

TEWH LE Pulse Width See Figure 6 25 ns

TCR Falling Clock to Readback Time See Figure 9 25 ns

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0 500 1000 1500 2000 2500 3000

200

400

600

800

1000

1200

VOD(mV)

FREQUENCY (MHz)

2000 mVpp

1600 mVpp

0 500 1000 1500 2000 2500 3000

100

150

200

250

300

350

400

450

500

VOD(mV)

FREQUENCY (MHz)

0 500 1000 1500 2000 2500 3000

200

400

600

800

1000

1200

VOD(mV)

FREQUENCY (MHz)

2000 mVpp

1600 mVpp

1200 mVpp

700 mVpp

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6.7 Typical Characteristics: Clock Output AC Characteristics

Figure 1. LVDS VOD vs. Frequency Figure 2. LVPECL /w 240-ΩEmitter Resistors VOD vs.

Frequency

Figure 3. LVPECL /w 120-ΩEmitter Resistors VOD vs. Frequency

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7 Parameter Measurement Information

7.1 Charge Pump Current Specification Definitions

I1 = Charge Pump Sink Current at VCPout = VCC -ΔV

I2 = Charge Pump Sink Current at VCPout = VCC/2

I3 = Charge Pump Sink Current at VCPout =ΔV

I4 = Charge Pump Source Current at VCPout = VCC -ΔV

I5 = Charge Pump Source Current at VCPout = VCC/2

I6 = Charge Pump Source Current at VCPout =ΔV

ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device.

7.1.1 Charge Pump Output Current Magnitude Variation Vs. Charge Pump Output Voltage

7.1.2 Charge Pump Sink Current Vs. Charge Pump Output Source Current Mismatch

7.1.3 Charge Pump Output Current Magnitude Variation vs. Ambient Temperature

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GND

VOD = | VA - VB | VSS = 2·VOD

VOD Definition VSS Definition for Output

Non-Inverting Clock

Inverting Clock

VOD 2·VOD

GND

VID = | VA - VB | VSS = 2·VID

VID Definition VSS Definition for Input

Non-Inverting Clock

Inverting Clock

VID 2·VID

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7.2 Differential Voltage Measurement Terminology

The differential voltage of a differential signal can be described by two different definitions causing confusion

when reading datasheets or communicating with other engineers. This section will address the measurement and

description of a differential signal so that the reader will be able to understand and discern between the two

different definitions when used.

The first definition used to describe a differential signal is the absolute value of the voltage potential between the

inverting and non-inverting signal. The symbol for this first measurement is typically VID or VOD depending on if

an input or output voltage is being described.

The second definition used to describe a differential signal is to measure the potential of the non-inverting signal

with respect to the inverting signal. The symbol for this second measurement is VSS and is a calculated

parameter. Nowhere in the IC does this signal exist with respect to ground, it only exists in reference to its

differential pair. VSS can be measured directly by oscilloscopes with floating references, otherwise this value can

be calculated as twice the value of VOD as described in the first description.

Figure 4 illustrates the two different definitions side-by-side for inputs and Figure 5 illustrates the two different

definitions side-by-side for outputs. The VID and VOD definitions show VAand VBDC levels that the non-inverting

and inverting signals toggle between with respect to ground. VSS input and output definitions show that if the

inverting signal is considered the voltage potential reference, the non-inverting signal voltage potential is now

increasing and decreasing above and below the non-inverting reference. Thus the peak-to-peak voltage of the

differential signal can be measured.

VID and VOD are often defined as volts (V) and VSS is often defined as volts peak-to-peak (VPP).

Figure 4. Two Different Definitions for Differential Input Signals

Figure 5. Two Different Definitions for Differential Output Signals

Refer to Application Note AN-912, Common Data Transmission Parameters and their Definitions (SNLA036) for

more information.

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8 Detailed Description

8.1 Overview

In default mode of operation, dual PLL mode with internal VCO, the Phase Frequency Detector in PLL1

compares the active CLKinX reference divided by CLKinX_PreR_DIV and PLL1 R divider with the external

VCXO or crystal attached to the PLL2 OSCin port divided by PLL1 N divider. The external loop filter for PLL1

should be narrow to provide an ultra clean reference clock from the external VCXO or crystal to the

OSCin/OSCin* pins for PLL2.

The Phase Frequency Detector in PLL2 compares the external VCXO or crystal to the internal VCO after the

reference and feedback dividers. The VCXO or crystal on the OSCin input is divided by PLL2 R divider. The

feedback from the internal VCO is divided by the PLL2 Prescaler, the PLL2 N divider, and optionally the VCO

divider.

The bandwidth of the external loop filter for PLL2 should be designed to be wide enough to take advantage of

the low in-band phase noise of PLL2 and the low high offset phase noise of the internal VCO. The VCO output is

also placed on the distribution path for the Clock Distribution section. The clock distribution consists of 6 groups

of dividers and delays which drive 12 outputs. Each clock group allows the user to select a divide value, a digital

delay value, and an analog delay. The 6 groups drive programmable output buffers. Two groups allow their input

signal to be from the OSCin port directly.

When a 0-delay mode is used, a clock output will be passed through the feedback mux to the PLL1 N Divider for

synchronization and 0-delay.

When an external VCO mode is used, the Fin port will be used to input an external VCO signal. PLL2 Phase

comparison will now be with this signal divided by the PLL2 N divider and N2 pre-scaler. The VCO divider may

not be used. One less clock input is available when using an external VCO mode.

When a single PLL mode is used, PLL1 is powered down. OSCin is used as a reference to PLL2.

8.1.1 System Architecture

The dual loop PLL architecture of the LMK0480x provides the lowest jitter performance over the widest range of

output frequencies and phase noise integration bandwidths. The first stage PLL (PLL1) is driven by an external

reference clock and uses an external VCXO or tunable crystal to provide a frequency accurate, low phase noise

reference clock for the second stage frequency multiplication PLL (PLL2). PLL1 typically uses a narrow loop

bandwidth (10 Hz to 200 Hz) to retain the frequency accuracy of the reference clock input signal while at the

same time suppressing the higher offset frequency phase noise that the reference clock may have accumulated

along its path or from other circuits. This “cleaned” reference clock provides the reference input to PLL2.

The low phase noise reference provided to PLL2 allows PLL2 to operate with a wide loop bandwidth (50 kHz to

200 kHz). The loop bandwidth for PLL2 is chosen to take advantage of the superior high offset frequency phase

noise profile of the internal VCO and the good low offset frequency phase noise of the reference VCXO or

tunable crystal.

Ultra low jitter is achieved by allowing the external VCXO or crystal’s phase noise to dominate the final output

phase noise at low offset frequencies and the internal (or external) VCO’s phase noise to dominate the final

output phase noise at high offset frequencies. This results in best overall phase noise and jitter performance.

The LMK0480x allows subsets of the device to be used to increase the flexibility of device. These different

modes are selected using MODE: Device Mode. For instance:

• Dual Loop Mode - Typical use case of LMK04808. CLKinX used as reference input to PLL1, OSCin port is

connected to VCXO or tunable crystal.

• Single Loop Mode - Powers down PLL1. OSCin port is used as reference input.

• Clock Distribution Mode - Allows input of CLKin1 to be distributed to output with division, digital delay, and

analog delay.

See Device Functional Modes for more information on these modes.

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Overview (continued)

8.1.2 PLL1 Redundant Reference Inputs (CLKin0/CLKin0* and CLKin1/CLKin1*)

The LMK0480x has two reference clock inputs for PLL1: CLKin0 and CLKin1. Ref Mux selects CLKin0 or

CLKin1. Automatic or manual switching occurs between the inputs.

CLKin0 and CLKin1 each have input dividers. The input divider allows different clock input frequencies to be

normalized so that the frequency input to the PLL1 R divider remains constant during automatic switching. By

programming these dividers such that the frequency presented to the input of the PLL1_R divider is the same

prevents the user from needing to reprogram the PLL1 R divider when the input reference is changed to another

CLKin port with a different frequency.

CLKin1 is shared for use as an external 0-delay feedback (FBCLKin), or for use with an external VCO (Fin).

Fast manual switching between reference clocks is possible with external pins Status_CLKin0 and

Status_CLKin1.

8.1.3 PLL1 Tunable Crystal Support

The LMK0480x integrates a crystal oscillator on PLL1 for use with an external crystal and varactor diode to

perform jitter cleaning.

The LMK0480x must be programmed to enable Crystal mode.

8.1.4 VCXO/CRYSTAL Buffered Outputs

The LMK0480x provides 2 dedicated outputs which are a buffered copy of the PLL2 reference input. This

reference input is typically a low noise VCXO or Crystal. When using a VCXO, this output can be used to clock

external devices such as microcontrollers, FPGAs, CPLDs, and so forth, before the LMK0480x is programmed.

The OSCout0 buffer output type is programmable to LVDS, LVPECL, or LVCMOS. The OSCout1 buffer is fixed

to LVPECL.

The dedicated output buffers OSCout0 and OSCout1 can output frequency lower than the VCXO or Crystal

frequency by programming the OSC Divider. The OSC Divider value range is 2 to 8. Each OSCoutX can

individually choose to use the OSC Divider output or to bypass the OSC Divider.

Two clock output groups can also be programmed to be driven by OSCin. This allows a total of 4 additional

differential outputs to be buffered outputs of OSCin. When programmed in this way, a total of 6 differential

outputs can be driven by a buffered copy of OSCin.

VCXO/Crystal buffered outputs cannot be synchronized to the VCO clock distribution outputs. The assertion of

SYNC will still cause these outputs to become low temporarily. Since these outputs will turn off and on

asynchronously with respect to the VCO sourced clock outputs during a SYNC, it is possible for glitches to occur

on the buffered clock outputs when SYNC is asserted and unasserted. If the NO_SYNC_CLKoutX_Y bits are set

these outputs will not be affected by the SYNC event except that the phase relationship will change with the

other synchronized clocks unless a buffered clock output is used as a qualification clock during SYNC.

8.1.5 Frequency Holdover

The LMK0480x supports holdover operation to keep the clock outputs on frequency with minimum drift when the

reference is lost until a valid reference clock signal is re-established.

8.1.6 Integrated Loop Filter Poles

The LMK0480x features programmable 3rd and 4th order loop filter poles for PLL2. These internal resistors and

capacitor values may be selected from a fixed range of values to achieve either a 3rd or 4th order loop filter

response. The integrated programmable resistors and capacitors compliment external components mounted near

the chip.

These integrated components can be effectively disabled by programming the integrated resistors and capacitors

to their minimum values.

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Overview (continued)

8.1.7 Internal VCO

The output of the internal VCO is routed to a mux which allows the user to select either the direct VCO output or

a divided version of the VCO for the Clock Distribution Path. This same selection is also fed back to the PLL2

phase detector through a prescaler and N-divider.

The mux selectable VCO divider has a divide range of 2 to 8 with 50% output duty cycle for both even and odd

divide values.

The primary use of the VCO divider is to achieve divides greater than the clock output divider supports alone.

8.1.8 External VCO Mode

The Fin/Fin* input allows an external VCO to be used with PLL2 of the LMK0480x.

Using an external VCO reduces the number of available clock inputs by one.

8.1.9 Clock Distribution

The LMK0480x features a total of 12 outputs driven from the internal or external VCO.

All VCO driven outputs have programmable output types. They can be programmed to LVPECL, LVDS, or

LVCMOS. When all distribution outputs are configured for LVCMOS or single ended LVPECL a total of 24

outputs are available.

If the buffered OSCin outputs OSCout0 and OSCout1 are included in the total number of clock outputs the

LMK0480x is able to distribute, then up to 14 differential clocks or up to 28 single ended clocks may be

generated with the LMK0480x.

The following sections discuss specific features of the clock distribution channels that allow the user to control

various aspects of the output clocks.

8.1.9.1 CLKout DIVIDER

Each clock group, which is a pair of outputs such as CLKout0 and CLKout1, has a single clock output divider.

The divider supports a divide range of 1 to 1045 (even and odd) with 50% output duty cycle. When divides of 26

or greater are used, the divider/delay block uses extended mode.

The VCO Divider may be used to reduce the divide needed by the clock group divider so that it may operate in

normal mode instead of extended mode. This can result in a small current saving if enabling the VCO Divider

allows 3 or more clock output divides to change from extended to normal mode.

8.1.9.2 CLKout Delay

See Clock Distribution section for details on both a fine (analog) and coarse (digital) delay for phase adjustment

of the clock outputs.

The fine (analog) delay allows a nominal 25 ps step size and range from 0 to 475 ps of total delay. Enabling the

analog delay adds a nominal 500 ps of delay in addition to the programmed value. When adjusting analog delay,

glitches may occur on the clock outputs being adjusted. Analog delay may not operate at frequencies above the

minimum-ensured maximum output frequency of 1536 MHz.

The coarse (digital) delay allows a group of outputs to be delayed by 4.5 to 12 clock distribution path cycles in

normal mode, or from 12.5 to 522 VCO cycles in extended mode. The delay step can be as small as half the

period of the clock distribution path by using the CLKoutX_Y_HS bit provided the output divide value is greater

than 1. For example, a 2-GHz VCO frequency without the use of the VCO divider results in 250 ps coarse tuning

steps.. The coarse (digital) delay value takes effect on the clock outputs after a SYNC event.

There are 3 different ways to use the digital (coarse) delay:

1. Fixed Digital Delay

2. Absolute Dynamic Digital Delay

3. Relative Dynamic Digital Delay

These are further discussed in Clock Distribution.

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Overview (continued)

8.1.9.3 Programmable Output Type

For increased flexibility all LMK0480x clock outputs (CLKoutX) and OSCout0 can be programmed to an LVDS,

LVPECL, or LVCMOS output type. OSCout1 is fixed as LVPECL.

Any LVPECL output type can be programmed to 700, 1200, 1600, or 2000 mVpp amplitude levels. The 2000

mVpp LVPECL output type is a Texas Instruments proprietary configuration that produces a 2000 mVpp

differential swing for compatibility with many data converters and is also known as 2VPECL.

8.1.9.4 Clock Output Synchronization

Using the SYNC input causes all active clock outputs to share a rising edge. See Clock Output Synchronization

(SYNC) for more information.

The SYNC event also causes the digital delay values to take effect.

8.1.10 0-Delay

The 0-delay mode synchronizes the input clock phase to the output clock phase. The 0-delay feedback may be

performed with an internal feedback loop from any of the clock groups or with an external feedback loop into the

FBCLKin port as selected by the FEEDBACK_MUX.

Without using 0-delay mode there will be D possible fixed phase relationships from clock input to clock output

depending on the clock output divide value.

Using an external 0-delay feedback reduces the number of available clock inputs by one.

8.1.11 Default Startup Clocks

Before the LMK0480x is programmed, CLKout8 is enabled and operating at a nominal frequency and CLKout6

and OSCout0 are enabled and operating at the OSCin frequency. These clocks can be used to clock external

devices such as microcontrollers, FPGAs, CPLDs, and so forth, before the LMK0480x is programmed.

For CLKout6 and OSCout0 to work before the LMK0480x is programmed, the device must not be using Crystal

mode.

8.1.12 Status Pins

The LMK0480x provides status pins which can be monitored for feedback or in some cases used for input

depending upon device programming. For example:

• The Status_Holdover pin may indicate if the device is in hold-over mode.

• The Status_CLKin0 pin may indicate the LOS (loss-of-signal) for CLKin0.

• The Status_CLKin0 pin may be an input for selecting the active clock input.

• The Status_LD pin may indicate if the device is locked.

The status pins can be programmed to a variety of other outputs including analog lock detect, PLL divider

outputs, combined PLL lock detect signals, PLL1 Vtune railing, readback, and so forth. Refer to the Programming

of this datasheet for more information. Default pin programming is captured in Table 18.

8.1.13 Register Readback

Programmed registers may be read back using the MICROWIRE interface. For readback, one of the status pins

must be programmed for readback mode.

At no time may registers be programed to values other than the valid states defined in the datasheet.

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CLKuWire

DATAuWire

LEuWire

R1 Divider

(1 to 16,383)

CPout1

Internal VCO

Partially

Integrated

Loop Filter

Mux

R Delay

N Delay

OSCin*

OSCin

CLKout0

CLKout0*

CLKout1

CLKout1*

CLKout2

CLKout2*

CLKout3

CLKout3*

Mux

Control

Registers

PWire

Port

SYNC

Status_LD

Status_Holdover

Status_CLKin0

Device

Control

Divider

(1 to 1045)

CLKout4

CLKout4*

CLKout5

CLKout5*

CLKout10

CLKout10*

CLKout11

CLKout11*

Divider

(1 to 1045)

CLKout8

CLKout8*

CLKout9

CLKout9*

Divider

(1 to 1045)

CLKout6

CLKout6*

CLKout7

CLKout7*

Divider

(1 to 1045)

Status_CLKin1

Holdover

Divider

(1 to 1045)

Digital

Delay

Digital

Delay

Digital

Delay

Digital

Delay

Digital

Delay

CLKin0*

CLKin0

Clock Group 3

Clock Group 4

Clock Group 5

Divider

(1 to 1045) Digital

Delay

Clock Group 0

Clock Group 1

Clock Group 2

CLKout0

CLKout2

CLKout4

CLKout6

CLKout8

CLKout10

VCO Divider

(2 to 8)

Osc

Mux1

Osc

Mux2

CPout2

CLKin0 Divider

(1, 2, 4, or 8)

N1 Divider

(1 to 16,383)

R2 Divider

(1 to 4,095)

Phase

Detector

PLL1

Phase

Detector

PLL2

N2 Divider

(1 to 262,143)

Delay

Mux

Delay

Mux

Delay

Mux

Delay Mux

Mux

Delay Mux

Mux

Delay Mux

Mux

Clock Buffer 2

Clock Buffer 1

Clock Buffer 3

Clock Distribution PathN2 Prescaler

(2 to 8)

VCO

Mux

Fin/Fin*

Ref

Mux

CLKin1 Divider

(1, 2, 4, or 8)

OSCout0

OSCout0* OSCout0

_MUX OSC Divider

(2 to 8)

CLKin1*/Fin*

FBCLKin*

CLKin1/

Fin/FBCLKin

Mode

Mux2

Mode

Mux1

OSCout1

OSCout1*

OSCout0

_MUX

OSCout1

_MUX

Mode

Mux3

FBMux

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8.2 Functional Block Diagram

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D26 A0

MSB LSB

DATAuWire

CLKuWire

LEuWire

tECS

tEWH

tCWH

tCWL

tCES

tECS tDCS

D26 D25 D24 D23

tCDH tCWH tCWL

D22 D0 A4 A1 A0

MSB LSB

DATAuWire

CLKuWire

LEuWire

tCES

tEWH

tECS

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8.3 Feature Description

8.3.1 Serial MICROWIRE Timing Diagram

For timing specifications, see Timing Requirements. Register programming information on the DATAuWire pin is

clocked into a shift register on each rising edge of the CLKuWire signal. On the rising edge of the LEuWire

signal, the register is sent from the shift register to the register addressed. A slew rate of at least 30 V/µs is

recommended for these signals. After programming is complete the CLKuWire, DATAuWire, and LEuWire

signals should be returned to a low state. If the CLKuWire or DATAuWire lines are toggled while the VCO is in

lock, as is sometimes the case when these lines are shared with other parts, the phase noise may be degraded

during this programming.

Figure 6. MICROWIRE Input Timing Diagram

8.3.2 Advanced MICROWIRE Timing Diagrams

8.3.2.1 Three Extra Clocks or Double Program

For timing specifications, see Timing Requirements.Figure 7 shows the timing for the programming sequence for

loading CLKoutX_Y_DIV > 25 or CLKoutX_Y_DDLY > 12 as described in Special Programming Case for R0 to

R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY.

Figure 7. MICROWIRE Timing Diagram: Extra CLKuWire Pulses for R0 to R5

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D26 A0

MSB LSB

DATAuWire

CLKuWire

LEuWire

READBACK_LE = 0

tECS

tEWH

Readback Pin RD0RD24RD26

LEuWire

READBACK_LE = 1

tCWH

tCWL

RD25

tCR

RD23

tCR

tECS

tCES

D26 A0

MSB LSB

DATAuWire

CLKuWire

LEuWire

tCES

tCES tECS

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Feature Description (continued)

8.3.2.2 Three Extra Clocks with LEuWire High

For timing specifications, see Timing Requirements.Figure 8 shows the timing for the programming sequence

which allows SYNC_EN_AUTO = 1 when loading CLKoutX_Y_DIV > 25 or CLKoutX_Y_DDLY > 12. When

SYNC_EN_AUTO = 1, a SYNC event is automatically generated on the falling edge of LEuWire. See Special

Programming Case for R0 to R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY.

Figure 8. MICROWIRE Timing Diagram: Extra CLKuWire Pulses for R0 to R5 with LEuWire Asserted

8.3.2.3 Readback

For timing specifications, see Timing Requirements. See Readback for more information on performing a

readback operation. Figure 9 shows timing for LEuWire for both READBACK_LE = 1 and 0.

The rising edges of CLKuWire during MICROWIRE readback continue to clock data on DATAuWire into the

device during readback. If after the readback, LEuWire transitions from low to high, this data will be latched to

the decoded register. The decoded register address consists of the last 5 bits clocked on DATAuWire as shown

in Figure 9.

Figure 9. MICROWIRE Readback Timing Diagram

8.3.3 Inputs / Outputs

8.3.3.1 PLL1 Reference Inputs (CLKin0 and CLKin1)

The reference clock inputs for PLL1 may be selected from either CLKin0 or CLKin1. The user has the capability

to manually select one of the inputs or to configure an automatic switching mode of operation. See Input Clock

Switching for more info.

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Feature Description (continued)

CLKin0 and CLKin1 have dividers which allow the device to switch between reference inputs of different

frequencies automatically without needing to reprogram the PLL1 R divider. The CLKin pre-divider values are 1,

2, 4, and 8.

CLKin1 input can alternatively be used for external feedback in 0-delay mode (FBCLKin) or for an external VCO

input port (Fin).

8.3.3.2 PLL2 OSCin / OSCin* Port

The feedback from the external oscillator being locked with PLL1 drives the OSCin/OSCin* pins. Internally this

signal is routed to the PLL1 N Divider and to the reference input for PLL2.

This input may be driven with either a single-ended or differential signal and must be AC coupled. If operated in

single ended mode, the unused input must be connected to GND with a 0.1 µF capacitor.

8.3.3.3 Crystal Oscillator

The internal circuitry of the OSCin port also supports the optional implementation of a crystal based oscillator

circuit. A crystal, a varactor diode, and a small number of other external components may be used to implement

the oscillator. The internal oscillator circuit is enabled by setting the EN_PLL2_XTAL bit. See EN_PLL2_XTAL.

8.3.4 Input Clock Switching

Manual, pin select, and automatic are three different kinds clock input switching modes can be set with the

CLKin_SELECT_MODE register.

Below is information about how the active input clock is selected and what causes a switching event in the

various clock input selection modes.

8.3.4.1 Input Clock Switching - Manual Mode

When CLKin_SELECT_MODE is 0 or 1 then CLKin0 or CLKin1 respectively is always selected as the active

input clock. Manual mode will also override the EN_CLKinX bits such that the CLKinX buffer will operate even if

CLKinX is disabled with EN_CLKinX = 0.

•Entering Holdover: If holdover mode is enabled, then holdover mode is entered if Digital lock detect of PLL1

goes low and DISABLE_DLD1_DET = 0.

•Exiting Holdover: The active clock for automatic exit of holdover mode is the manually selected clock input.

8.3.4.2 Input Clock Switching - Pin Select Mode

When CLKin_SELECT_MODE is 3, the pins Status_CLKin0 and Status_CLKin1 select which clock input is

active.

•Clock Switch Event: Pins: Changing the state of Status_CLKin0 or Status_CLKin1 pins causes an input

clock switch event.

•Clock Switch Event: PLL1 DLD: To prevent PLL1 DLD high to low transition from causing a input clock

switch event and causing the device to enter holdover mode, disable the PLL1 DLD detect by setting

DISABLE_DLD1_DET = 1. This is the preferred behavior for Pin Select Mode.

•Configuring Pin Select Mode:

– The Status_CLKin0_TYPE must be programmed to an input value for the Status_CLKin0 pin to function

as an input for pin select mode.

– The Status_CLKin1_TYPE must be programmed to an input value for the Status_CLKin1 pin to function

as an input for pin select mode.

– If the Status_CLKinX_TYPE is set as output, the input value is considered 0.

– The polarity of Status_CLKin1 and Status_CLKin0 input pins cannot be inverted with the CLKin_SEL_INV

bit.

–Table 1 defines which input clock is active depending on Status_CLKin0 and Status_CLKin1 state.

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Feature Description (continued)

Table 1. Active Clock Input - Pin Select Mode

STATUS_CLKin1 STATUS_CLKin0 ACTIVE CLOCK

0 0 CLKin0

0 1 CLKin1

1 0 Reserved

1 1 Holdover

The pin select mode will override the EN_CLKinX bits such that the CLKinX buffer will operate even if CLKinX is

disabled with EN_CLKinX = 0. To switch as fast as possible, keep the clock input buffers enabled (EN_CLKinX =

1) that could be switched to.

8.3.4.2.1 Pin Select Mode and Host

When in the pin select mode, the host can monitor conditions of the clocking system which could cause the host

to switch the active clock input. The LMK0480x device can also provide indicators on the Status_LD and

Status_HOLDOVER like "DAC Rail," "PLL1 DLD", "PLL1 and PLL2 DLD" which the host can use in determining

which clock input to use as active clock input.

8.3.4.2.2 Switch Event without Holdover

When an input clock switch event is triggered and holdover mode is disabled, the active clock input immediately

switches to the selected clock. When PLL1 is designed with a narrow loop bandwidth, the switching transient is

minimized.

8.3.4.2.3 Switch Event with Holdover

When an input clock switch event is triggered and holdover mode is enabled, the device will enter holdover mode

and remain in holdover until a holdover exit condition is met as described in Holdover Mode. Then the device will

complete the reference switch to the pin selected clock input.

8.3.4.3 Input Clock Switching - Automatic Mode

When CLKin_SELECT_MODE is 4, the active clock is selected in priority order of enabled clock inputs starting

upon an input clock switch event. The priority order of the clocks is CLKin0 →CLKin1 →CLKin0, and so forth.

For a clock input to be eligible to be switched through, it must be enabled using EN_CLKinX.

8.3.4.3.1 Starting Active Clock

Upon programming this mode, the currently active clock remains active if PLL1 lock detect is high. To ensure a

particular clock input is the active clock when starting this mode, program CLKin_SELECT_MODE to the manual

mode which selects the desired clock input (CLKin0 or 1). Wait for PLL1 to lock PLL1_DLD = 1, then select this

mode with CLKin_SELECT_MODE = 4.

8.3.4.3.2 Clock Switch Event: PLL1 DLD

A loss of lock as indicated by PLL1’s DLD signal (PLL1_DLD = 0) will cause an input clock switch event if

DISABLE_DLD1_DET = 0. PLL1 DLD must go high (PLL1_DLD = 1) in between input clock switching events.

8.3.4.3.3 Clock Switch Event: PLL1 Vtune Rail

If Vtune_RAIL_DET_EN is set and the PLL1 Vtune voltage crosses the DAC high or low threshold, holdover

mode will be entered. Since PLL1_DLD = 0 in holdover a clock input switching event will occur.

8.3.4.3.4 Clock Switch Event with Holdover

Clock switch event with holdover enabled is recommended in this input clock switching mode. When an input

clock switch event occurs, holdover mode is entered and the active clock is set to the clock input defined by the

Status_CLKinX pins. When the new active clock meets the holdover exit conditions, holdover is exited and the

active clock will continue to be used as a reference until another input clock switch event. PLL1 DLD must go

high in between input clock switching events.

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8.3.4.4 Input Clock Switching - Automatic Mode with Pin Select

When CLKin_SELECT_MODE is 6, the active clock is selected using the Status_CLKinX pins upon an input

clock switch event according to Table 2.

8.3.4.4.1 Starting Active Clock

Upon programming this mode, the currently active clock remains active if PLL1 lock detect is high. To ensure a

particular clock input is the active clock when starting this mode, program CLKin_SELECT_MODE to the manual

mode which selects the desired clock input (CLKin0 or 1). Wait for PLL1 to lock PLL1_DLD = 1, then select this

mode with CLKin_SELECT_MODE = 6.

8.3.4.4.2 Clock Switch Event: PLL1 DLD

An input clock switch event is generated by a loss of lock as indicated by PLL1's DLD signal (PLL1 DLD = 0).

8.3.4.4.3 Clock Switch Event: PLL1 Vtune Rail

If Vtune_RAIL_DET_EN is set and the PLL1 Vtune voltage crosses the DAC threshold, holdover mode will be

entered. Since PLL1_DLD = 0 in holdover, a clock input switching event will occur.

8.3.4.4.4 Clock Switch Event with Holdover

Clock switch event with holdover enabled is recommended in this input clock switching mode. When an input

clock switch event occurs, holdover mode is entered and the active clock is set to the clock input defined by the

Status_CLKinX pins. When the new active clock meets the holdover exit conditions, holdover is exited and the

active clock will continue to be used as a reference until another input clock switch event. PLL1 DLD must go

high in between input clock switching events."

Table 2. Active Clock Input - Auto Pin Mode

STATUS_CLKin1(1) STATUS_CLKin0 ACTIVE CLOCK

X 1 CLKin0

1 0 CLKin1

0 0 Reserved

(1) The polarity of Status_CLKin1 and Status_CLKin0 input pins can be inverted with the CLKin_SEL_INV bit.

8.3.5 Holdover Mode

Holdover mode causes PLL2 to stay locked on frequency with minimal frequency drift when an input clock

reference to PLL1 becomes invalid. While in holdover mode, the PLL1 charge pump is TRI-STATED and a fixed

tuning voltage is set on CPout1 to operate PLL1 in open loop.

8.3.5.1 Enable Holdover

Program HOLDOVER_MODE to enable holdover mode. Holdover mode can be manually enabled by

programming the FORCE_HOLDOVER bit.

The holdover mode can be set to operate in 2 different sub-modes.

• Fixed CPout1 (EN_TRACK = 0 or 1, EN_MAN_DAC = 1).

• Tracked CPout1 (EN_TRACK = 1, EN_MAN_DAC = 0).

– Not valid when EN_VTUNE_RAIL_DET = 1.

Updates to the DAC value for the Tracked CPout1 sub-mode occurs at the rate of the PLL1 phase detector

frequency divided by DAC_CLK_DIV. These updates occur any time EN_TRACK = 1.

The DAC update rate should be programmed for <= 100 kHz to ensure DAC holdover accuracy.

When tracking is enabled the current voltage of DAC can be readback, see DAC_CNT.

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8.3.5.2 Entering Holdover

The holdover mode is entered as described in Input Clock Switching. Typically this is because:

• FORCE_HOLDOVER bit is set.

• PLL1 loses lock according to PLL1_DLD, and

– HOLDOVER_MODE = 2

– DISABLE_DLD1_DET = 0

• CPout1 voltage crosses DAC high or low threshold, and

– HOLDOVER_MODE = 2

– EN_VTUNE_RAIL_DET = 1

– EN_TRACK = 1

– DAC_HIGH_TRIP = User Value

– DAC_LOW_TRIP = User Value

– EN_MAN_DAC = 1

– MAN_DAC = User Value

8.3.5.3 During Holdover

PLL1 is run in open loop mode.

• PLL1 charge pump is set to TRI-STATE.

• PLL1 DLD will be unasserted.

• The HOLDOVER status is asserted

• During holdover If PLL2 was locked prior to entry of holdover mode, PLL2 DLD will continue to be asserted.

• CPout1 voltage will be set to:

– a voltage set in the MAN_DAC register (fixed CPout1).

– a voltage determined to be the last valid CPout1 voltage (tracked CPout1).

• PLL1 DLD will attempt to lock with the active clock input.

The HOLDOVER status signal can be monitored on the Status_HOLDOVER or Status_LD pin by programming

the HOLDOVER_MUX or LD_MUX register to "Holdover Status."

8.3.5.4 Exiting Holdover

Holdover mode can be exited in one of two ways.

• Manually, by programming the device from the host.

• Automatically, By a clock operating within a specified ppm of the current PLL1 frequency on the active clock

input. See Input Clock Switching for more detail on which clock input is active.

To exit holdover by programming, set HOLDOVER_MODE = Disabled. HOLDOVER_MODE can then be re-

enabled by programming HOLDOVER_MODE = Enabled. Care should be taken to ensure that the active clock

upon exiting holdover is as expected, otherwise the CLKin_SELECT_MODE register may need to be re-

programmed.

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6.4mV 17kHz / V 1e6

0.71ppm 153.6 MHz

± ´ ´

± =

Holdover accuracy (ppm) = ± 6.4 mV × Kv × 1e6

VCXO Frequency

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8.3.5.5 Holdover Frequency Accuracy and DAC Performance

When in holdover mode PLL1 will run in open loop and the DAC will set the CPout1 voltage. If Fixed CPout1

mode is used, then the output of the DAC will be a voltage dependant upon the MAN_DAC register. If Tracked

CPout1 mode is used, then the output of the DAC will be the voltage at the CPout1 pin before holdover mode

was entered. When using Tracked mode and EN_MAN_DAC = 1, during holdover the DAC value is loaded with

the programmed value in MAN_DAC, not the tracked value.

When in Tracked CPout1 mode the DAC has a worst case tracking error of ±2 LSBs once PLL1 tuning voltage is

acquired. The step size is approximately 3.2 mV, therefore the VCXO frequency error during holdover mode

caused by the DAC tracking accuracy is ±6.4 mV × Kv, where Kv is the tuning sensitivity of the VCXO in use.

Therefore the accuracy of the system when in holdover mode in ppm is:

(1)

Example: consider a system with a 19.2-MHz clock input, a 153.6-MHz VCXO with a Kv of 17 kHz/V. The

accuracy of the system in holdover in ppm is:

(2)

It is important to account for this frequency error when determining the allowable frequency error window to

cause holdover mode to exit.

8.3.5.6 Holdover Mode - Automatic Exit of Holdover

The LMK0480x device can be programmed to automatically exit holdover mode when the accuracy of the

frequency on the active clock input achieves a specified accuracy. The programmable variables include

PLL1_WND_SIZE and DLD_HOLD_CNT.

See Digital Lock Detect Frequency Accuracy to calculate the register values to cause holdover to automatically

exit upon reference signal recovery to within a user specified ppm error of the holdover frequency.

It is possible for the time to exit holdover to vary because the condition for automatic holdover exit is for the

reference and feedback signals to have a time/phase error less than a programmable value. Because it is

possible for two clock signals to be very close in frequency but not close in phase, it may take a long time for the

phases of the clocks to align themselves within the allowable time/phase error before holdover exits.

8.3.6 PLLs

8.3.6.1 PLL1

The maximum phase detector frequency (fPD1) of PLL1 is 40 MHz. Since a narrow loop bandwidth should be

used for PLL1, the need to operate at high phase detector rate to lower the in-band phase noise becomes

unnecessary. The maximum values for the PLL1 R and N dividers is 16,383. Charge pump current ranges from

100 to 1600 µA. PLL1 N divider may be driven by OSCin port at the OSCout0_MUX output (default) or by

internal or external feedback as selected by Feedback Mux in 0-delay mode.

Low charge pump currents and phase detector frequencies aid design of low loop bandwidth loop filters with

reasonably sized components to allow the VCXO or PLL2 to dominate phase noise inside of PLL2 loop

bandwidth. High charge pump currents may be used by PLL1 when using VCXOs with leaky tuning voltage

inputs to improve system performance.

8.3.6.2 PLL2

PLL2's maximum phase detector frequency (fPD2) is 155 MHz. Operating at highest possible phase detector rate

will ensure low in-band phase noise for PLL2 which in turn produces lower total jitter. The in-band phase noise

from the reference input and PLL is proportional to N2. The maximum value for the PLL2 R divider is 4,095. The

maximum value for the PLL2 N divider is 262,143. The N2 Prescaler in the total N feedback path can be

programmed for values 2 to 8 (all divides even and odd). Charge pump current ranges from 100 to 3200 µA.

High charge pump currents help to widen the PLL2 loop bandwidth to optimize PLL2 performance.

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PLLX Lock Count

PLLX_DLD_CNT

Phase Error < g

YES

Phase Error < g

START

PLLX

Lock Detected = False

Lock Count = 0

Increment

PLLX Lock Count

PLLX

Lock Detected = True

YES

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8.3.6.2.1 PLL2 Frequency Doubler

The PLL2 reference input at the OSCin port may be routed through a frequency doubler before the PLL2 R

Divider. The frequency doubler feature allows the phase comparison frequency to be increased when a relatively

low frequency oscillator is driving the OSCin port. By doubling the PLL2 phase detector frequency, the in-band

PLL2 noise is reduced by about 3 dB.

When using the doubler, PLL2 R Divider may be used to reduce the phase detector frequency to the limit of the

PLL2 maximum phase detector frequency.

For applications in which the OSCin frequency and PLL2 phase detector frequency are equal, the best PLL2 in-

band noise can be achieved when the doubler is enabled (EN_PLL2_REF_2X = 1) and the PLL2 R divide value

is 2. Do not use doubler disabled (EN_PLL2_REF_2X = 0) and PLL2 R divide value of 1.

8.3.6.3 Digital Lock Detect

Both PLL1 and PLL2 support digital lock detect. Digital lock detect compares the phase between the reference

path (R) and the feedback path (N) of the PLL. When the time error, which is phase error, between the two

signals is less than a specified window size (ε) a lock detect count increments. When the lock detect count

reaches a user specified value lock detect is asserted true. Once digital lock detect is true, a single phase

comparison outside the specified window will cause digital lock detect to be asserted false. This is illustrated in

Figure 10.

The incremental lock detect count feature functions as a digital filter to ensure that lock detect isn't asserted for

only a brief time when the phases of R and N are within the specified tolerance for only a brief time during initial

phase lock.

The digital lock detect signal can be monitored on the Status_LD or Status_Holdover pin. The pin may be

programmed to output the status of lock detect for PLL1, PLL2, or both PLL1 and PLL2.

See Digital Lock Detect Frequency Accuracy for more detailed information on programming the registers to

achieve a specified frequency accuracy in ppm with lock detect.

The digital lock detect feature can also be used with holdover to automatically exit holdover mode. See Holdover

Mode for more info.

Figure 10. Digital Lock Detect Flowchart

8.3.7 Status Pins

The Status_LD, Status_HOLDOVER, Status_CLKin0, Status_CLKin1, and SYNC pins can be programmed to

output a variety of signals for indicating various statuses like digital lock detect, holdover, several DAC indicators,

and several PLL divider outputs.

8.3.7.1 Logic Low

This is a vary simple output. In combination with the output _MUX register, this output can be toggled between

high and low. Useful to confirm MICROWIRE programming or as a general purpose IO.

8.3.7.2 Digital Lock Detect

PLL1 DLD, PLL2 DLD, and PLL1 + PLL2 are selectable on certain output pins. See Digital Lock Detect for more

information.

8.3.7.3 Holdover Status

Indicates if the device is in Holdover mode. See HOLDOVER_MODE for more information.

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8.3.7.4 DAC

Various flags for the DAC can be monitored including DAC Locked, DAC Rail, DAC Low, and DAC High.

When the PLL1 tuning voltage crosses the low threshold, DAC Low is asserted. When PLL1 tuning voltage

crosses the high threshold, DAC High is asserted. When either DAC Low or DAC High is asserted, DAC Rail will

also be asserted.

DAC Locked is asserted when EN_Track = 1 and DAC is closely tracking the PLL1 tuning voltage.

8.3.7.5 PLL Divider Outputs

The PLL divider outputs are useful for debugging failure to lock issues. It allows the user to measure the

frequency the PLL inputs are receiving. The settings of PLL1_R, PLL1_N, PLL2_R, and PLL2_N output pulses at

the phase detector rate. The settings of PLL1_R / 2, PLL1_N / 2, PLL2_R / 2, and PLL2_N / 2 output a 50% duty

cycle waveform at half the phase detector rate.

8.3.7.6 CLKinX_LOS

The clock input loss of signal indicator is asserted when LOS is enabled (EN_LOS) and the clock no longer

detects an input as defined by the time-out threshold, LOS_TIMEOUT.

8.3.7.7 CLKinX Selected

If this clock is the currently selected/active clock, this pin will be asserted.

8.3.7.8 MICROWIRE Readback

The readback data can be output on any pin programmable to readback mode. For more information on

readback see Readback.

8.3.8 VCO

The integrated VCO uses a frequency calibration routine when register R30 is programmed to lock VCO to target

frequency. Register R30 contains the PLL2_N register.

During the frequency calibration the PLL2_N_CAL value is used instead of PLL2_N, this allows 0-delay modes to

have a separate PLL2 N value for VCO frequency calibration and regular operation. See Register 29,Register

30, and PLL Programming for more information.

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Digital Delay Resolution

(VCO Divider bypassed or external VCO) 1

2 × VCO Frequency

Digital Delay Resolution

(with VCO Divider) VCO_DIV

2 × VCO Frequency

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8.3.9 Clock Distribution

8.3.9.1 Fixed Digital Delay

This section discussing Fixed Digital delay and associated registers is fundamental to understanding digital delay

and dynamic digital delay.

Clock outputs may be delayed or advanced from one another by up to 517.5 clock distribution path periods. By

programming a digital delay value from 4.5 to 522 clock distribution path periods, a relative clock output delay

from 0 to 517.5 periods is achieved. The CLKoutX_Y_DDLY (5 to 522) and CLKoutX_Y_HS (-0.5 or 0) registers

set the digital delay as shown in Table 3.

Table 3. Possible Digital Delay Values

CLKoutX_Y_DDLY CLKoutX_Y_HS DIGITAL DELAY

5 1 4.5

5 0 5

6 1 5.5

6 0 6

7 1 6.5

7 0 7

... ... ...

520 0 520

521 1 520.5

521 0 521

522 1 521.5

522 0 522

Note: Digital delay values only take effect during a SYNC event and if the NO_SYNC_CLKoutX_Y bit is cleared

for this clock group. See Clock Output Synchronization (SYNC) for more information.

The resolution of digital delay is determined by the frequency of the clock distribution path. The clock distribution

path is the output of Mode Mux1 (Functional Block Diagram). The best resolution of digital delay is achieved by

bypassing the VCO divider.

(3)

(4)

The digital delay between clock outputs can be dynamically adjusted with no or minimum disruption of the output

clocks. See Dynamically Programming Digital Delay for more information.

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8.3.9.2 Fixed Digital Delay - Example

Given a VCO frequency of 2949.12 MHz and no VCO divider, by using digital delay the outputs can be adjusted

in 1 / (2 * 2949.12 MHz) = ~169.54 ps steps.

To achieve quadrature (90 degree shift) between the 122.88-MHz outputs on CLKout4 and CLKout6 from a VCO

frequency of 2949.12 MHz and bypassing the VCO divider, consider the following:

1. The frequency of 122.88 MHz has a period of ~8.14 ns.

2. To delay 90 degrees of a 122.88-MHz clock period requires a ~2.03 ns delay.

3. Given a digital delay step of ~169.54 ps, this requires a digital delay value of 12 steps (2.03 ns / 169.54 ps =

12).

4. Since the 12 steps are half period steps, CLKout6_7_DDLY is programmed 6 full periods beyond 5 for a total

of 11.

This result in the following programming:

• Clock output dividers to 24. CLKout4_5_DIV = 24 and CLKout6_7_DIV = 24.

• Set first clock digital delay value. CLKout4_5_DDLY = 5, CLKout4_5_HS = 0.

• Set second 90 degree shifted clock digital delay value. CLKout6_7_DDLY = 11, CLKout6_7_HS = 0.

Table 4 shows some of the possible phase delays in degrees achievable in the above example.

Table 4. Relative Phase Shift from CLKout4 and 5 to CLKout6 and 7(1)

CLKout6_7_DDLY CLKout6_7_HS RELATIVE DIGITAL DELAY DEGREES of 122.88 MHz

5 1 -0.5 -7.5°

5 0 0.0 0°

6 1 0.5 7.5°

6 0 1.0 15.0°

7 1 1.5 22.5°

7 0 2.0 30.0°

8 1 2.5 37.5°

8 0 3.0 45.0°

9 1 3.5 52.5°

9 0 4.0 60.0°

10 1 4.5 67.5°

10 0 5.0 75.0°

11 1 5.5 82.5°

11 0 6.0 90.0°

12 1 6.5 97.5°

12 0 7.0 105.0°

13 1 7.5 112.5°

13 0 8.0 120.0°

14 1 8.5 127.5°

... ... ... ...

(1) CLKout4_5_DDLY = 5 and CLKout4_5_HS = 0

Figure 12 illustrates clock outputs programmed with different digital delay values during a SYNC event.

Refer to Dynamically Programming Digital Delay for more information on dynamically adjusting digital delay.

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8.3.9.3 Clock Output Synchronization (SYNC)

The purpose of the SYNC function is to synchronize the clock outputs with a fixed and known phase relationship

between each clock output selected for SYNC. SYNC can also be used to hold the outputs in a low or 0 state.

The NO_SYNC_CLKoutX_Y bits can be set to disable synchronization for a clock group.

To enable SYNC, EN_SYNC must be set. See EN_SYNC, Enable Synchronization.

The digital delay value set by CLKoutX_Y_DDLY takes effect only upon a SYNC event. The digital delay due to

CLKoutX_Y_HS takes effect immediately upon programming. See Dynamically Programming Digital Delay for

more information on dynamically changing digital delay.

During a SYNC event, clock outputs driven by the VCO are not synchronized to clock outputs driven by OSCin.

OSCout0 and OSCout1 are always driven by OSCin. CLKout6, 7, 8, or 9 may be driven by OSCin depending on

the CLKoutX_Y_OSCin_Sel bit value. While SYNC is asserted, NO_SYNC_CLKoutX_Y operates normally for

CLKout6, 7, 8, and 9 under all circumstances. SYNC operates normally for CLKout6, 7, 8, and 9 when driven by

VCO.

8.3.9.3.1 Effect of SYNC

When SYNC is asserted, the outputs to be synchronized are held in a logic low state. When SYNC is

unasserted, the clock outputs to be synchronized are activated and will transition to a high state simultaneously

with one another except where different digital delay values have been programmed.

Refer to Dynamically Programming Digital Delay for SYNC functionality when SYNC_QUAL = 1.

Table 5. Steady State Clock Output Condition Given Specified Inputs

SYNC_TYPE SYNC_POL SYNC PIN CLOCK OUTPUT STATE

_INV

0,1,2 (Input) 0 0 Active

0,1,2 (Input) 0 1 Low

0,1,2 (Input) 1 0 Low

0,1,2 (Input) 1 1 Active

3, 4, 5, 6 (Output) 0 0 or 1 Active

3, 4, 5, 6 (Output) 1 0 or 1 Low

8.3.9.3.2 Methods of Generating SYNC

There are five methods to generate a SYNC event:

•Manual:

– Asserting the SYNC pin according to the polarity set by SYNC_POL_INV.

– Toggling the SYNC_POL_INV bit though MICROWIRE will cause a SYNC to be asserted.

•Automatic:

– If PLL1_SYNC_DLD or PLL2_SYNC_DLD is set, the SYNC pin will be asserted while DLD (digital lock

detect) is false for PLL1 or PLL2 respectively.

– Programming Register R30, which contains PLL2_N will generate a SYNC event when using the internal

VCO.

– Programming Register R0 through R5 when SYNC_EN_AUTO = 1.

Note: Due to the speed of the clock distribution path (as fast as ~325 ps period) and the slow slew rate of the

SYNC, the exact VCO cycle at which the SYNC is asserted or unasserted by the SYNC is undefined. The timing

diagrams show a sharp transition of the SYNC to clarify functionality.

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Distribution

Path

SYNC

(SYNC_POL

_INV=1)

CLKout0

CLKout2

CLKout4

A B C D

6 cycles 6 cycles CLKoutX_Y_DDLY &

CLKoutX_Y_HS

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8.3.9.3.3 Avoiding Clock Output Interruption Due to Sync

Any CLKout groups that have their NO_SYNC_CLKoutX_Y bits set will be unaffected by the SYNC event. It is

possible to perform a SYNC operation with the NO_SYNC_CLKoutX_Y bits cleared, then set the

NO_SYNC_CLKoutX_Y bits so that the selected clocks will not be affected by a future SYNC. Future SYNC

events will not effect these clocks but will still cause the newly synchronized clocks to be re-synchronized using

the currently programmed digital delay values. When this happens, the phase relationship between the first

group of synchronized clocks and the second group of synchronized clocks will be undefined unless the SYNC

pulse is qualified by an output clock. See Dynamically Programming Digital Delay .

8.3.9.3.4 SYNC Timing

When discussing the timing of the SYNC function, one cycle refers to one period of the clock distribution path.

CLKout0_1_DIV = 1 (valid only for external VCO mode)

CLKout2_3_DIV = 2

CLKout4_5_DIV = 4

The digital delay for all clock outputs is 5

The digital delay half step for all clock outputs is 0

SYNC_QUAL = 0 (No qualification)

Figure 11. Clock Output Synchronization Using the SYNC Pin (Active Low)

Refer to Figure 11 during this discussion on the timing of SYNC. SYNC must be asserted for greater than one

clock cycle of the clock distribution path to latch the SYNC event. After SYNC is asserted, the SYNC event is

latched on the rising edge of the distribution path clock, at time A. After this event has been latched, the outputs

will not reflect the low state for 6 cycles, at time B. Due to the asynchronous nature of SYNC with respect to the

output clocks, it is possible that a glitch pulse could be created when the clock output goes low from the SYNC

event. This is shown by CLKout4 in Figure 11 and CLKout2 in Figure 12. See Relative Dynamic Digital Delay for

more information on synchronizing relative to an output clock to eliminate or minimize this glitch pulse.

After SYNC becomes unasserted the event is latched on the following rising edge of the distribution path clock,

time C. The clock outputs will rise at time D, coincident with a rising distribution clock edge that occurs after 6

cycles plus as many more cycles as programmed by the digital delay for that clock output. Therefore, the

soonest a clock output will become high is 11 cycles after the SYNC unassertion event registration, time C, when

the smallest digital delay value of 5 is set. If CLKoutX_Y_HS = 1 and CLKoutX_Y_DDLY = 5, then the clock

output will rise 10.5 cycles after SYNC is unassertion event registration.

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Distribution

Path

SYNC

(SYNC_POL

_INV=1)

CLKout0

CLKout2

CLKout4

A B C D

CLKout5

E F

6 cycles

CLKoutX_Y_DDLY & CLKoutX_Y_HS

4.5

cycles 2.5

cycles 1 cycle

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CLKout0_1_DIV = 2, CLKout0_1_DDLY = 5

CLKout2_3_DIV = 4, CLKout2_3_DDLY = 7

CLKout4_5_DIV = 4, CLKout4_5_DDLY = 8

CLKout0_1_HS = 1

CLKout2_3_HS = 0

CLKout4_5_HS = 0

SYNC_QUAL = 0 (No qualification)

Figure 12. Clock Output Synchronization using the SYNC Pin (Active Low)

Figure 12 illustrates the timing with different digital delays programmed.

• Time A) SYNC assertion event is latched.

• Time B) SYNC unassertion latched.

• Time C) All outputs toggle and remain low. A glitch pulse can occur at this time as shown by CLKout2.

• Time D) After 6 + 4.5 = 10.5 cycles CLKout0 rises. This is the shortest time from SYNC unassertion

registration to clock rising edge possible.

• Time E) After 6 + 7 = 13 cycles CLKout2 rises. CLKout2 and CLKout4, 5 are programmed for quadrature

operation.

• Time F) After 6 + 8 = 14 cycles CLKout4 and 5 rise. Since CLKout4 and 5 are driven by the same clock

divider and delay circuit, their timing is always the same.

8.3.9.3.5 Dynamically Programming Digital Delay

To use dynamic digital delay synchronization qualification set SYNC_QUAL = 1. This causes the SYNC pulse to

be qualified by a clock output so that the SYNC event occurs after a specified time from a clock output transition.

This allows the relative adjustment of clock output phase in real-time with no or minimum interruption of clock

outputs. Hence the term "dynamic digital delay".

Note that changing the phase of a clock output requires momentarily altering in the rate of change of the clock

output phase and therefore by definition results in a frequency distortion of the signal.

Without qualifying the SYNC with an output clock, the newly synchronized clocks would have a random and

unknown digital delay (or phase) with respect to clock outputs not currently being synchronized.

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8.3.9.3.5.1 Absolute vs. Relative Dynamic Digital Delay

The clock used for qualification of SYNC is selected with the feedback mux (FEEDBACK_MUX).

If the clock selected by the feedback mux has its NO_SYNC_CLKoutX_Y = 1, then an absolute dynamic digital

delay adjustment will be performed during a SYNC event and the digital delay of the feedback clock will not be

adjusted.

If the clock selected by the feedback mux has its NO_SYNC_CLKoutX_Y = 0, then a self-referenced or relative

dynamic digital delay adjustment will be performed during a SYNC event and the digital delay of the feedback

clock will be adjusted.

Clocks with NO_SYNC_CLKoutX_Y = 1 always operate without interruption.

8.3.9.3.5.2 Dynamic Digital Delay and 0-Delay Mode

When using a 0-delay mode absolute dynamic digital delay is recommended. Using relative dynamic digital

delay with a 0-delay mode may result in a momentary clock loss on the adjusted clock also being used for 0-

delay feedback that may result in PLL1 DLD becoming low. This may result in HOLDOVER mode being activated

depending upon device configuration.

8.3.9.3.5.3 SYNC and Minimum Step Size

The minimum step size adjustment for digital delay is half a clock distribution path cycle. This is achieved by

using the CLKoutX_Y_HS bit. The CLKoutX_Y_HS bit change effect is immediate without the need for SYNC. To

shift digital delay using CLKoutX_Y_DDLY a SYNC signal must be generated for the change to take effect.

8.3.9.3.5.4 Programming Overview

To dynamically adjust the digital delay with respect to an existing clock output the device should be programmed

as follows:

• Set SYNC_QUAL = 1 for clock output qualification.

• Set CLKout4_5_PD = 0. Required for proper operation of SYNC_QUAL = 1.

• Set EN_FEEDBACK_MUX = 1 to enable the feedback buffer.

• Set FEEDBACK_MUX to the clock output that the newly synchronized clocks will be qualified by.

• Set NO_SYNC_CLKoutX_Y = 1 for the output clocks that will continue to operate during the SYNC event.

There is no interruption of output on these clocks.

– If FEEDBACK_MUX selects a clock output with NO_SYNC_CLKoutX_Y = 1, then absolute dynamic

digital delay is performed.

– If FEEDBACK_MUX selects a clock output with NO_SYNC_CLKoutX_Y = 0, then self-referenced or

relative dynamic digital delay is performed.

• The SYNC_EN_AUTO bit may be set to cause a SYNC event to begin when register R0 to R5 is

programmed. The auto SYNC feature is a convenience since does not require the application to manually

assert SYNC by toggling the SYNC_POL_INV bit or the SYNC pin when changing digital delay. However,

under the following condition a special programming sequence is required if SYNC_EN_AUTO = 1:

– The CLKoutX_Y_DDLY value being set in the programmed register is 13 or more.

• Under the following condition a SYNC_EN_AUTO must = 0:

– If the application requires a digital delay resolution of half a clock distribution path cycle in relative

dynamic digital delay mode because the HS bit must be fixed per Table 6 for a qualifying clock.

8.3.9.3.5.5 Internal Dynamic Digital Delay Timing

To dynamically adjust digital delay a SYNC must occur. Once the SYNC is qualified by an output clock, 3 cycles

later an internal one shot pulse will occur. The width of the one shot pulse is 3 cycles. This internal one shot

pulse will cause the outputs to turn off and then back on with a fixed delay with respect to the falling edge of the

qualification clock. This allows for dynamic adjustments of digital delay with respect to an output clock.

The qualified SYNC timing is shown in Figure 13 for absolute dynamic digital delay and Figure 14 for relative

dynamic digital delay.

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8.3.9.3.5.6 Other Timing Requirements

When adjusting digital delay dynamically, the falling edge of the qualifying clock selected by the

FEEDBACK_MUX must coincide with the falling edge of the clock distribution path. For this requirement to be

met, program the CLKoutX_Y_HS value of the qualifying clock group according to Table 6.

Table 6. Half Step Programming Requirement of Qualifying Clock During Sync Event

DISTRIBUTION PATH FREQUENCY CLKoutX_Y_DIV VALUE CLKoutX_Y_HS

Even Must = 1 during SYNC event.

≥1.8 GHz Odd Must = 0 during SYNC event.

Even Must = 0 during SYNC event.

< 1.8 GHz Odd Must = 1 during SYNC event.

8.3.9.3.5.7 Absolute Dynamic Digital Delay

Absolute dynamic digital delay can be used to program a clock output to a specific phase offset from another

clock output.

Pros:

• Simple direct phase adjustment with respect to another clock output.

• CLKoutX_Y_HS will remain constant for qualifying clock.

– Can easily use auto sync feature (SYNC_EN_AUTO = 1) when digital delay adjustment requires half step

digital delay requirements.

• Can be used with 0-delay mode.

Cons:

• For some phase adjustments there may be a glitch pulse due to SYNC assertion.

– For example see CLKout4 in Figure 11 and CLKout2 in Figure 12.

8.3.9.3.5.7.1 Absolute Dynamic Digital Delay - Example

To illustrate the absolute dynamic digital delay adjust procedure, consider the following example.

System Requirements:

• VCO Frequency = 2949.12 MHz

• CLKout0 = 983.04 MHz (CLKout0_1_DIV = 3)

• CLKout2 = 491.52 MHz (CLKout2_3_DIV = 6)

• CLKout4 = 245.76 MHz (CLKout4_5_DIV = 12)

• For all clock outputs during initial programming:

– CLKoutX_Y_DDLY = 5

– CLKoutX_Y_HS = 1

– NO_SYNC_CLKoutX_Y = 0

The application requires the 491.52 MHz clock to be stepped in 30 degree steps (~169.5 ps), which is the

minimum step resolution allowable by the clock distribution path requiring use of the half step bit

(CLKoutX_Y_HS). That is 1 / 2949.52 MHz / 2 = ~169.5 ps. During the stepping of the 491.52-MHz clock, the

983.04-MHz and 245.76-MHz clock must not be interrupted.

Step 1: The device is programmed from register R0 to R30 with values that result in the device being locked and

operating as desired, see the system requirements above. The phase of all the output clocks are aligned

because all the digital delay and half step values were the same when the SYNC was generated by

programming register R30. The timing of this is as shown in Figure 11.

Step 2: Now the registers will be programmed to prepare for changing digital delay (or phase) dynamically.

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Table 7. Register Setup for Absolute Dynamic Digital Delay Example

Use a clock output for qualifying the SYNC pulse for dynamically

SYNC_QUAL = 1 adjusting digital delay.

EN_SYNC = 1 (default) Required for SYNC functionality.

Required when SYNC_QUAL = 1.

CLKout4_5_PD = 0 CLKout4 and/or CLKout5 outputs may be powered down or in use.

Enable the feedback mux for SYNC operation for dynamically

EN_FEEDBACK_MUX = 1 adjusting digital delay.

FEEDBACK_MUX = 2 (CLKout4) Use the fixed 245.76-MHz clock as the SYNC qualification clock.

This clock output (983.04 MHz) won't be affected by SYNC. It will

NO_SYNC_CLKout0_1 = 1 always operate without interruption.

This clock output (245.76 MHz) won't be affected by SYNC. It will

NO_SYNC_CLKout4_5 = 1 always operate without interruption.

This clock will also be the qualifying clock in this example.

Since CLKout4 is the qualifying clock and CLKoutX_Y_DIV is even,

CLKout4_5_HS = 1 the half step bit must be set to 1. See Table 6.

SYNC_EN_AUTO = 1 Automatic generation of SYNC is allowed for this case.

After the registers in Table 7 have been programmed, the application may now dynamically adjust the digital

delay of CLKout2 (491.52 MHz).

Step 3: Adjust digital delay of CLKout2.

Refer to Table 8 for the programming values to set a specified phase offset from the absolute reference clock.

Table 8 is dependant upon the qualifying clock divide value of 12, refer to Calculating Dynamic Digital Delay

Values for any Divide for information on creating tables for any divide value.

Table 8. Programming for Absolute Digital Delay Adjustment

DEGREES OF ADJUSTMENT FROM INITIAL 491.52 MHz PHASE PROGRAMMING

+/-0 or +/-360 degrees CLKout2_3_DDLY = 7; CLKout2_3_HS = 1

30 degrees -330 degrees CLKout2_3_DDLY = 7; CLKout2_3_HS = 0

60 degrees -300 degrees CLKout2_3_DDLY = 8; CLKout2_3_HS = 1

90 degrees -270 degrees CLKout2_3_DDLY = 8; CLKout2_3_HS = 0

120 degrees -240 degrees CLKout2_3_DDLY = 9; CLKout2_3_HS = 1

150 degrees -210 degrees CLKout2_3_DDLY = 9; CLKout2_3_HS = 0

180 degrees -180 degrees CLKout2_3_DDLY = 10; CLKout2_3_HS = 1

210 degrees -150 degrees CLKout2_3_DDLY = 10; CLKout2_3_HS = 0

240 degrees -120 degrees CLKout2_3_DDLY = 5; CLKout2_3_HS = 1

270 degrees -90 degrees CLKout2_3_DDLY = 5; CLKout2_3_HS = 0

300 degrees -60 degrees CLKout2_3_DDLY = 6; CLKout2_3_HS = 1

330 degrees -30 degrees CLKout2_3_DDLY = 6; CLKout2_3_HS = 0

After setting the new digital delay values, the act of programming R1 will start a SYNC automatically because

SYNC_EN_AUTO = 1.

If the user elects to reduce the number of SYNCs because they are not required when only CLKout2_3_HS is

set, then SYNC_EN_AUTO is = 0 and the SYNC may now be generated by toggling the SYNC pin or by toggling

the SYNC_POL_INV bit. Because of the internal one shot pulse, no strict timing of the SYNC pin or

SYNC_POL_INV bit is required.

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Distribution

Path

Internal One

Shot Pulse

5 cycles CLKoutX_Y_DDLY and

CLKoutX_Y_HS

3 cycles

SYNC

5.5 cycles

AB C D E F G

CLKout0 /6

HS = 1

CLKout2 /6

HS = 1

CLKout4 /12

HS = 1

3 cycles

5.5 cycles

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After the SYNC event, the clock output will adjust according to Table 8. See Figure 13 for a detailed view of the

timing diagram. The timing diagram critical points are:

• Time A) SYNC assertion event is latched.

• Time B) First qualifying falling clock output edge.

• Time C) Second qualifying falling clock output edge.

• Time D) Internal one shot pulse begins. 5 cycles later clock outputs will be forced low

• Time E) Internal one shot pulse ends. 5 cycles + digital delay cycles later the synced clock outputs rise.

• Time F) Clock outputs are forced low. (CLKout2 is already low).

• Time G) Beginning of digital delay cycles.

• Time H) For CLKout2_3_DDLY = 6; the clock output rises now.

Figure 13. Absolute Dynamic Digital Delay Programming Example

(SYNC_QUAL = 1, Qualify with Clock Output)

8.3.9.3.5.8 Relative Dynamic Digital Delay

Relative dynamic digital delay can be used to program a clock output to a specific phase offset from another

clock output.

Pros:

• Simple direct phase adjustment with respect to same clock output.

• The clock output will always behave the same during digital delay adjustment transient. For some divide

values there will be no glitch pulse.

Cons:

• For some clock divide values there may be a glitch pulse due to SYNC assertion.

• Adjustments of digital delay requiring the half step bit (CLKoutX_Y_HS) for finer digital delay adjust is

complicated.

• Use with 0-delay mode may result in PLL1 DLD becoming low and HOLDOVER mode becoming activated.

– DISABLE_DLD1_DET can be set to prevent HOLDOVER from becoming activated due to PLL1 DLD

becoming low.

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8.3.9.3.5.8.1 Relative Dynamic Digital Delay - Example

To illustrate the relative dynamic digital delay adjust procedure, consider the following example.

System Requirements:

• VCO Frequency = 2949.12 MHz

• CLKout0 = 983.04 MHz (CLKout0_1_DIV = 3)

• CLKout2 = 491.52 MHz (CLKout2_3_DIV = 6)

• CLKout4 = 491.52 MHz (CLKout4_5_DIV = 6)

• For all clock outputs during initial programming:

– CLKoutX_Y_DDLY = 5

– CLKoutX_Y_HS = 0

– NO_SYNC_CLKoutX_Y = 0

The application requires the 491.52-MHz clock to be stepped in 30 degree steps (~169.5 ps), which is the

minimum step resolution allowable by the clock distribution path. That is 1 / 2949.52 MHz / 2 = ~169.5 ps. During

the stepping of the 491.52 MHz clocks the 983.04 MHz clock must not be interrupted.

Step 1: The device is programmed from register R0 to R30 with values that result in the device being locked and

operating as desired, see the system requirements above. The phase of all the output clocks are aligned

because all the digital delay and half step values were the same when the SYNC was generated by

programming register R30. The timing of this is as shown in Figure 11.

Step 2: Now the registers will be programmed to prepare for changing digital delay (or phase) dynamically.

Table 9. Register Setup for Relative Dynamic Digital Delay Adjustment

SYNC_QUAL = 1 Use clock output for qualifying the SYNC pulse for dynamically adjusting digital delay.

EN_SYNC = 1 (default) Required for SYNC functionality.

Required when SYNC_QUAL = 1.

CLKout4_5_PD = 0 CLKout4 and/or CLKout5 outputs may be powered down or in use.

EN_FEEDBACK_MUX = 1 Enable the feedback mux for SYNC operation for dynamically adjusting digital delay.

FEEDBACK_MUX = 1 (CLKout2) Use the clock itself as the SYNC qualification clock.

This clock output (983.04 MHz) won't be affected by SYNC. It will always operate without

NO_SYNC_CLKout0_1 = 1 interruption.

NO_SYNC_CLKout4_5 = 1 CLKout3’s phase is not to change with respect to CLKout0.

Automatic generation of SYNC is not allowed because of the half step requirement in relative

SYNC_EN_AUTO = 0 (default) dynamic digital delay mode.

SYNC must be generated manually by toggling the SYNC_POL_INV bit or the SYNC pin.

After the above registers have been programmed, the application may now dynamically adjust the digital delay of

the 491.52 MHz clocks.

Step 3: Adjust digital delay of CLKout2 by one step which is 30 degrees or ~169.5 ps.

Refer to Table 10 for the programming sequence to step one half clock distribution period forward or backwards.

Refer to Calculating Dynamic Digital Delay Values for any Divide for more information on how to calculate digital

delay and half step values for other cases.

To fulfill the qualifying clock output half step requirement in Table 6 when dynamically adjusting digital delay, the

CLKoutX_Y_HS bit must be cleared for clocks with even divides. So before any dynamic digital delay

adjustment, CLKoutX_Y_HS must be clear because the clock divide value is even. To achieve the final required

digital delay adjustment, the CLKoutX_Y_HS bit may set after SYNC.

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Distribution

Path

Internal One

Shot Pulse

5 cycles CLKoutX_Y_DDLY

and CLKoutX_Y_HS

8.5 cycles

3 cycles

SYNC

5.5 cycles

B C D E F G

CLKout0 /3

HS = 1

CLKout2 /6

HS = 1

CLKout4 /6

HS = 1

3 cycles

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Table 10. Programming Sequence for One Step Adjust

STEP DIRECTION and CURRENT HS STATE PROGRAMMING SEQUENCE

Adjust clock output one step forward. 1. CLKout2_3_HS = 1.

CLKout2_3_HS is 0. 1. CLKout2_3_DDLY = 9.

Adjust clock output one step forward. 2. Perform SYNC event.

CLKout2_3_HS is 1. 3. CLKout2_3_HS = 0.

1. CLKout2_3_HS = 1.

Adjust clock output one step backward. 2. CLKout2_3_DDLY = 5.

CLKout2_3_HS is 0. 3. Perform SYNC event.

Adjust clock output one step backward. 1. CLKout2_3_HS = 0.

CLKout2_3_HS is 1.

After programing the updated CLKout2_3_DDLY and CLKout2_3_HS values, perform a SYNC event. The SYNC

may be generated by toggling the SYNC pin or by toggling the SYNC_POL_INV bit. Because of the internal one

shot pulse, no strict timing of the SYNC pin or SYNC_POL_INV bit is required. After the SYNC event, the clock

output will be at the specified phase. See Figure 14 for a detailed view of the timing diagram. The timing diagram

critical points are:

• Time A) SYNC assertion event is latched.

• Time B) First qualifying falling clock output edge.

• Time C) Second qualifying falling clock output edge.

• Time D) Internal one shot pulse begins. 5 cycles later clock outputs will be forced low.

• Time E) Internal one shot pulse ends. 5 cycles + digital delay cycles later the synced clock outputs rise.

• Time F) Clock outputs are forced low. (CLKouts are already low).

• Time G) Beginning of digital delay cycles.

• Time H) For CLKout2_3_DDLY = 9; the clock output rises now.

(SYNC_QUAL = 1, Qualify with clock output)

Starting condition is after half step is removed (CLKout2_3_HS = 0).

Figure 14. Relative Dynamic Digital Delay Programming Example, 2nd Adjust

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8.3.10 0-Delay Mode

When 0-delay mode is enabled the clock output selected by the Feedback Mux is connected to the PLL1 N

counter to ensure a fixed phase relationship between the selected CLKin and the fed back CLKout. When all the

clock outputs are synced together, all the clock outputs will share the same fixed phase relationship between the

selected CLKin and the fed back CLKout. The feedback can be internal or external using FBCLKin port.

When 0-delay mode is enabled the lowest frequency clock output is fed back to the Feedback Mux to ensure a

repeatable fixed CLKin to CLKout phase relationship between all clock outputs.

If a clock output that is not the lowest frequency output is selected for feedback, then clocks with lower

frequencies will have an unknown phase relationship with respect the other clocks and clock input. There will be

a number of possible phase relationships equal to Feedback_Clock_Frequency / Lower_Clock_Frequency that

may occur.

The Feedback Mux selects the even clock output of any clock group for internal feedback or the FBCLKin port for

external 0-delay feedback. The even clock can remain powered down as long as the CLKoutX_Y_PD bit is = 0

for its clock group.

To use 0-delay mode, the bit EN_FEEDBACK_MUX must be set (=1) to power up the feedback mux.

See PLL Programming for more information on programming PLL1_N for 0-delay mode.

When using an external VCO mode, internal 0-delay feedback must be used since the FBCLKin port is shared

with the Fin input.

Table 11 outlines several registers to program for 0-delay mode.

Table 11. Programming 0-Delay Mode

MODE = 2 or 15 Select one of the 0-delay modes for device.

EN_FEEDBACK_MUX = 1 Enable feedback mux.

FEEDBACK_MUX = Application Specific Select CLKout or FBCLKin for 0-delay feedback.

The divide value of the clock selected by FEEDBACK_MUX is

CLKoutX_Y_DIV important for PLL2 N value calculation

PLL1_N PLL1_N value used with CLKoutX_Y_DIV in loop.

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8.4 Device Functional Modes

8.4.1 Mode Selection

The LMK0480x family is capable of operating in several different modes as programmed by MODE: Device

Mode.

Table 12. Device Mode Selection

MODE PLL1 PLL2 PLL2 VCO 0-DELAY CLOCK DIST

R11[31:27]

0 X X Internal X

2 X X Internal X X

3 X X External X

6 X Internal X

8 X Internal X X

11 X External X

15 X X External X X

16(1) X

(1) See Mode 15 Additional Configurations

In addition to selecting the device's mode of operation above, some modes require additional configuration. Also

there are other features including holdover and dynamic digital delay that can also be enabled.

Table 13. Registers to Further Configure Device Mode of Operation

DYNAMIC DIGITAL

HOLDOVER_MODE 2 — —

EN_TRACK User — —

DAC_CLK_DIV User — —

EN_MAN_DAC User — —

DISABLE_DLD1_DET User — —

EN_VTUNE_RAIL_ User — —

DET

DAC_HIGH_TRIP User — —

DAC_LOW_TRIP User — —

FORCE_HOLDOVER 0 — —

SYNC_EN_AUTO — — User

SYNC_QUAL — — 1

EN_SYNC — — 1

CLKout4_5_PD — — 0

EN_ — 1 1

FEEDBACK_MUX

FEEDBACK_MUX — Feedback Clock Qualifying Clock

NO_SYNC_ — — User

CLKoutX_Y

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CLKinX

CLKinX*

Phase

Detector

PLL1

External VCXO

or Tunable

Crystal

Phase

Detector

PLL2 Internal

VCO

External

Loop Filter

Input

Buffer

CPout1

OSCoutX

OSCoutX*

LMK0480x

CPout2

Divider

Digital Delay

Analog Delay

CLKoutY

CLKoutY*

CLKoutX

CLKoutX*

Partially

Integrated

Loop Filter

12 outputs

External

Loop Filter

PLL1 PLL2

6 blocks

2 outputs

2 inputs

OSCin

Internal or external loopback, user programmable

CLKinX

CLKinX*

Phase

Detector

PLL1

External VCXO

or Tunable

Crystal

Phase

Detector

PLL2 Internal

VCO

External

Loop Filter

OSCin

CPout1

OSCoutX

OSCoutX*

LMK0480x

CPout2

Divider

Digital Delay

Analog Delay

CLKoutY

CLKoutY*

CLKoutX

CLKoutX*

Partially

Integrated

Loop Filter

12 outputs

External

Loop Filter

PLL1 PLL2

6 blocks

2 outputs

2 inputs

Input

Buffer

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8.4.2 Operating Modes

The LMK0480x is a flexible device that can be configured for many different use cases. The following simplified

block diagrams help show the user the different use cases of the device.

8.4.2.1 Dual PLL

Figure 15 illustrates the typical use case of the LMK0480x in dual loop mode. In dual loop mode the reference to

PLL1 is either CLKin0 or CLKin1. An external VCXO or tunable crystal will be used to provide feedback for the

first PLL and a reference to the second PLL. This first PLL cleans the jitter with the VCXO or low cost tunable

crystal by using a narrow loop bandwidth. The VCXO or tunable crystal output may be buffered through the two

OSCout ports and optionally on up to 4 of the CLKouts. The VCXO or tunable crystal is used as the reference to

PLL2 and may be doubled using the frequency doubler. The internal VCO drives up to six divide/delay blocks

which drive 12 clock outputs.

Holdover functionality is optionally available when the input reference clock is lost. Holdover works by fixing the

tuning voltage of PLL1 to the VCXO or tunable crystal.

It is also possible to use an external VCO in place of PLL2's internal VCO.

Figure 15. Simplified Functional Block Diagram for Dual Loop Mode

8.4.2.2 0-Delay Dual PLL

Figure 16 illustrates the use case of 0-delay dual loop mode. This configuration is very similar to Dual PLL except

that the feedback to the first PLL is driven by a clock output. This causes the clock outputs to have deterministic

phase with respect to the clock input. Since all the clock outputs can be synchronized together, all the clock

outputs can be in phase with the clock input signal. The feedback to PLL1 can be connected internally as shown,

or externally using FBCLKin (CLKin1) as an input port.

It is also possible to use an external VCO in place of PLL2's internal VCO.

Figure 16. Simplified Functional Block Diagram for 0-delay Dual Loop Mode

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Phase

Detector

PLL2 Internal

VCO

OSCin

OSCoutX

OSCoutX*

LMK0480x

CPout2

Divider

Digital Delay

Analog Delay

CLKoutY

CLKoutY*

CLKoutX

CLKoutX*

Partially

Integrated

Loop Filter

12 outputs

External

Loop Filter

PLL2

6 blocks

2 outputs

OSCin*

Internal or external loopback, user programmable

Phase

Detector

PLL2 Internal

VCO

OSCin

OSCoutX

OSCoutX*

LMK0480x

CPout2

Divider

Digital Delay

Analog Delay

CLKoutY

CLKoutY*

CLKoutX

CLKoutX*

Partially

Integrated

Loop Filter

12 outputs

External

Loop Filter

PLL2

6 blocks

2 outputs

OSCin*

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8.4.2.3 Single PLL

Figure 17 illustrates the use case of single PLL mode. In single PLL mode only PLL2 is used and PLL1 is

powered down. OSCin is used as the reference input. The internal VCO drives up to 6 divide/delay blocks which

drive 12 clock outputs. The reference at OSCin can be used to drive up to 2 OSCout ports. OSCin can also

optionally drive up to 4 of the clock outputs.

It is also possible to use an external VCO in place of PLL2's internal VCO.

Figure 17. Simplified Functional Block Diagram for Single Loop Mode

8.4.2.4 0-Delay Single PLL

Figure 18 illustrates the use case of 0-delay single PLL mode. This configuration is very similar to Single PLL

except that the feedback to PLL2 comes from a clock output. This causes the clock outputs to be in phase with

the reference input. Since all the clock outputs can be synchronized together, all the clock outputs can be in

phase with the clock input signal. The feedback to PLL2 can be performed internally as shown, or externally

using FBCLKin (CLKin1) as an input port.

It is also possible to use an external VCO in place of PLL2's internal VCO.

Figure 18. Simplified Functional Block Diagram for 0-delay Single Loop Mode

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CLKin1

CLKin1*

OSCin OSCoutX

OSCoutX*

LMK0480x

Divider

Digital Delay

Analog Delay

CLKoutY

CLKoutY*

CLKoutX

CLKoutX*

OSCin*

12 outputs

6 blocks

2 outputs

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8.4.2.5 Clock Distribution

Figure 19 illustrates the LMK0480x used for clock distribution. CLKin1 is used to drive up to 6 divide/delay blocks

which drive 12 outputs. OSCin can be used to drive up to 2 OSCout ports. OSCin can also optionally drive up to

4 of the clock outputs.

Figure 19. Simplified Functional Block Diagram for Mode Clock Distribution

8.4.2.6 Mode 15 Additional Configurations

Special considerations must be made when configuring the LMK0480x device in Dual PLL, 0-delay, External

VCO mode (Mode 15). These additional registers can be programmed in sequential order as recommended or

before R11 to ensure OSCoutX operation state is as desired when MODE register is programmed to 15 (0x0F).

• Program register R20 to 0x0784 E854 (This results in OSCout0 and 1 powered off. Program as desired).

• Program register R22 to 0x0000 0456

Additionally, OSCoutX power down functions are relocated to different register locations. Table 14 describes the

reconfiguration of these control bits.

Table 14. Mode 15 Reconfiguration of Control Bits

DUAL PLL, 0-DELAY, EXTERNAL VCO, MODE 15 ALL OTHER MODES

PD_OSCout0 R20[23] EN_OSCout0 R10[22]

OSCout0 0 = OSCout0 is enabled (POR Default) 0 = OSCout0 is disabled

1 = OSCout0 is disabled 1 = OSCout0 is enabled (POR Default)

PD_OSCout1 R20[24] EN_OSCout1 R10[23]

OSCout1 0 = OSCout1 is enabled (POR Default) 0 = OSCout1 is disabled (POR Default)

1 = OSCout1 is disabled 1 = OSCout1 is enabled

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8.5 Programming

LMK0480x devices are programmed using 32-bit registers. Each register consists of a 5-bit address field and 27-

bit data field. The address field is formed by bits 0 through 4 (LSBs) and the data field is formed by bits 5 through

31 (MSBs). The contents of each register is clocked in MSB first (bit 31), and the LSB (bit 0) last. During

programming, the LEuWire signal should be held low. The serial data is clocked in on the rising edge of the

CLKuWire signal. After the LSB (bit 0) is clocked in the LEuWire signal should be toggled low-to-high-to-low to

latch the contents into the register selected in the address field. It is recommended to program registers in

numeric order, for example R0 to R16, and R24 to R31 to achieve proper device operation. Figure 6 illustrates

the serial data timing sequence.

To achieve proper frequency calibration, the OSCin port must be driven with a valid signal before programming

order to activate the frequency calibration process.

8.5.1 Special Programming Case for R0 to R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY

In some cases when programming register R0 to R5 to change the CLKoutX_Y_DIV divide value or

CLKoutX_Y_DDLY delay value, 3 additional CLKuWire cycles must occur after loading the register for the newly

programmed divide or delay value to take effect. These special cases include:

• When CLKoutX_Y_DIV is > 25.

• When CLKoutX_Y_DDLY is > 12. Note: loading the digital delay value only prepares for a future SYNC

event.

Also, since SYNC_EN_AUTO bit = 1 automatically generates a SYNC on the falling edge of LE when R0 to R5 is

programmed, further programming considerations must be made when SYNC_EN_AUTO = 1.

These special programming cases requiring the additional three clock cycles may be properly programmed by

one of the following methods shown in Table 15.

Table 15. R0 to R5 Special Case

SYNC

CLKoutX_Y_DIV and _EN_ PROGRAMMING METHOD

CLKoutX_Y_DDLY AUTO

CLKoutX_Y_DIV ≤25 and 0 or 1 No Additional Clocks Required (Normal)

CLKoutX_Y_DDLY ≤12

CLKoutX_Y_DIV > 25 or Three Extra CLKuWire Clocks (Or program another

CLKoutX_Y_DDLY > 12 register)

CLKoutX_Y_DIV > 25 or Three Extra CLKuWire Clocks while LEuWire is

CLKoutX_Y_DDLY > 12 High

•Method: No Additional Clocks Required (Normal) No special consideration to CLKuWire is required when

changing divide value to ≤25, digital delay value to ≤12, or when the digital delay and divide value do not

change. See MICROWIRE timing Figure 6.

•Method: Three Extra CLKuWire Clocks Three extra clocks must be provided before CLKoutX_Y_DIV > 25

or CLKoutX_Y_DDLY > 12 take effect. See MICROWIRE timing Figure 7. Also, by programming another

•Method: Three Extra CLKuWire Clocks with LEuWire Asserted When SYNC_EN_AUTO = 1 the falling

edge of LEuWire will generate a SYNC event. CLKoutX_Y_DIV and CLKoutX_Y_DDLY values must be

updated before the SYNC event occurs. So 3 CLKuWire rising edges must occur before LEuWire goes low.

See MICROWIRE timing Figure 8.

•Initial Programming Sequence During the recommended programming sequence the device is programmed

in order from R0 to R31, so it is expected at least one additional register will be programmed after

programming the last CLKoutX_Y_DIV or CLKoutX_Y_DDLY value in R0 to R5. This will result in the extra

needed CLKuWire rising edges, so this special note is of little concern. If programming R0 to R5 to change

CLKout frequency or digital delay or dynamic digital delay at a later time in the application, take care to

provide these extra CLKuWire cycles to properly load the new divide and/or delay values.

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8.5.1.1 Example

In this example, all registers have been programmed, the PLLs are locked. An LMK04808 has been generating a

clock output frequency of 61.44 MHz on CLKout4 using a VCO frequency of 2949.12 MHz and a divide value of

48. SYNC_EN_AUTO = 0. At a later time the application requires a 30.72-MHz output on CLKout4. By

reprogramming register R4 with CLKout4_5_DIV = 96 twice, the divide value of 96 is set for clock outputs 4 and

5 which results in an output frequency of 30.72 MHz (2949.12 MHz / 96 = 30.72 MHz) on CLKout4.

In this example the required 3 CLKuWire cycles were achieved by reprogramming the R4 register with the same

value twice.

8.5.2 Recommended Programming Sequence

Registers are programmed in numeric order with R0 being the first and R31 being the last register programmed.

The recommended programming sequence involves programming R0 with the reset bit (b17) set to 1 to ensure

the device is in a default state. If R0 is programmed again, the reset bit must be cleared to 0 during the

programming of R0.

8.5.2.1 Overview

• Program R0 with RESET bit = 1. This ensures that the device is configured with default settings. When

RESET = 1, all other R0 bits are ignored.

– If R0 is programmed again during the initial configuration of the device, the RESET bit must be cleared.

• R0 through R5: CLKouts.

– Program as necessary to configure the clock outputs, CLKout0 to CLKout11 as desired. These registers

configure clock output controls such as powerdown, digital delay and divider value, analog delay select,

and clock source select.

• R6 through R8: CLKouts.

– Program as necessary to configure the clock outputs, CLKout0 to CLKout11 as desired. These registers

configure the output format for each clock outputs and the analog delay for the clock output groups.

• R9: Required programming

– Program this register as shown in the register map for proper operation.

• R10: OSCouts, VCO divider, and 0-delay.

– Enable and configure clock outputs OSCout0/1.

– Set and select VCO divider (VCO bypass is recommended).

– Set 0-delay feedback source if used.

• R11: Part mode, SYNC, and XTAL.

– Program to configure the mode of the part, to configure SYNC functionality and pin, and to enable crystal

mode.

• R12: Pins, SYNC, and holdover mode.

– Status_LD pin, more SYNC options to generate a SYNC upon PLL1 and/or PLL2 lock detect.

– Enable clock features such as holdover.

• R13: Pins, holdover mode, and CLKins.

– Status_HOLDOVER, Status_CLKin0, and Status_CLKin1 pin controls.

– Enable clock inputs for use in specific part modes.

• R14: Pins, LOS, CLKins, and DAC.

– Status_CLKin1 pin control.

– Loss of signal detection, CLKin type, DAC rail detect enable and high and low trip points.

• R15: DAC and holdover mode.

– Program to enable and set the manual DAC value.

– HOLDOVER mode options.

• R16: Crystal amplitude.

– Increasing XTAL_LVL can improve tunable crystal phase noise performance.

• R24: PLL1 and PLL2.

– PLL1 N and R delay and PLL1 digital lock delay value.

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– PLL2 integrated loop filter.

• R25: DAC and PLL1.

– Program to configure DAC update clock divider and PLL1 digital lock detect count.

• R26: PLL2.

– Program to configure PLL2 options.

• R27: CLKins and PLL1.

– Clock input pre-dividers.

– Program to configure PLL1 options.

• R28: PLL1 and PLL2.

– Program to configure PLL2 R and PLL1 N.

• R29: OSCin and PLL2.

– Program to configure oscillator input frequency, PLL2 fast phase detector frequency mode, and PLL2 N

calibration value.

• R30: PLL2.

– Program to configure PLL2 prescaler and PLL2 N value.

• R31: uWire lock.

– Program to set the uWire_LOCK bit.

8.5.3 Readback

At no time should the MICROWIRE registers be programmed to any value other than what is specified in the

datasheet.

For debug of the MICROWIRE interface, it is recommended to simply program an output pin mux to active low

and then toggle the output type register between output and inverting output while observing the output pin for a

low to high transition. For example, to verify MICROWIRE programming, set the LD_MUX = 0 (Low) and then

toggle the LD_TYPE register between 3 (Output, push-pull) and 4 (Output inverted, push-pull). The result will be

that the Status_LD pin will toggle from low to high.

Readback from the MICROWIRE programming registers is available. The MICROWIRE readback function can

be enabled on the Status_LD, Status_HOLDOVER, Status_CLKin0, Status_CLKin1, or SYNC pin by

programming the corresponding MUX register to “uWire Readback” and the corresponding TYPE register to

"Output (push-pull)." Power on reset defaults the Status_HOLDOVER pin to “uWire Readback.”

Figure 9 illustrates the serial data timing sequence for a readback operation for both cases of READBACK_LE =

0 (POR default) and READBACK_LE = 1.

To perform a readback operation first set the register to be read back by programming the READBACK_ADDR

CLKuWire pin. On every rising edge of the CLKuWire pin a new data bit is clocked onto the any pins

programmed for uWire Readback. If the READBACK_LE bit is set, the LEuWire pin should be left high after

LEuWire rising edge while continuing to clock the CLKuWire pin.

It is allowable to perform a register read back in the same MICROWIRE operation which set the

READBACK_ADDR register value.

Data is clocked out MSB first. After 27 clocks all the data values will have been read and the read operation is

complete. If READBACK_LE = 1, the LEuWire line may now be lowered. It is allowable for the CLKuWire pin to

be clocked additional cycles, but the data on the readback pin will be invalid.

CLKuWire must be low before the falling edge of LEuWire.

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8.5.3.1 Readback - Example

To readback register R3 perform the following steps:

• Write R31 with READBACK_ADDR = 3; READBACK_LE = 0. DATAuWire and CLKuWire are toggled as

shown in Figure 6 with new data being clocked in on rising edges of CLKuWire

• Toggle LEuWire high and then low as shown in Figure 6 and Figure 9. LEuWire is returned low because

READBACK_LE = 0.

• Toggle CLKuWire high and then low 27 times to read back all 27 bits of register R3. Data is read MSB first.

Data is valid on falling edge of CLKuWire.

• Read operation is complete.

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8.6 Register Maps

8.6.1 Register Map and Readback Register Map

Table 16 provides the register map for device programming. Normally any register can be read from the same data address it is written to. However,

READBACK_LE has a different readback address. Also, the DAC_CNT register is a read only register. Table 17 shows the address for

READBACK_LE and DAC_CNT. Bits marked as reserved are undefined upon readback.

Observe that only the DATA bits are readback during a readback which can result in an offset of 5 bits between the two register tables.

Table 16. Register Map

REG- 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ISTER

Data [26:0] Address [4:0]

R0 0 CLKout0_1_DDLY [27:18] CLKout0_1_DIV [15:5] 0 0 0 0 0

RESET

CLKout 0_1_PD

CLKout 0_1_HS

CLKout1_ ADLY_SEL

CLKout0_ ADLY_SEL

R1 0 CLKout2_3_DDLY [27:18] CLKout2_3_DIV [15:5] 0 0 0 0 1

POWERDOWN

CLKout 2_3_PD

CLKout 2_3_HS

CLKout3_ ADLY_SEL

CLKout2_ ADLY_SEL

R2 0 CLKout4_5_DDLY [27:18] 0 CLKout4_5_DIV [15:5] 0 0 0 1 0

CLKout 4_5_PD

CLKout 4_5_HS

CLKout5_ ADLY_SEL

CLKout4_ ADLY_SEL

R3 CLKout6_7_DDLY [27:18] 0 CLKout6_7_DIV [15:5] 0 0 0 1 1

CLKout 6_7_PD

CLKout 6_7_HS

CLKout7_ ADLY_SEL

CLKout6_ ADLY_SEL

CLKout6_7_ OSCin_Sel

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Table 16. Register Map (continued)

REG- 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ISTER

Data [26:0] Address [4:0]

R4 CLKout8_9_DDLY [27:18] 0 CLKout8_9_DIV [15:5] 0 0 1 0 0

CLKout 8_9_PD

CLKout 8_9_HS

CLKout9_ ADLY_SEL

CLKout8_ ADLY_SEL

CLKout8_9_ OSCin_Sel

R5 0 CLKout10_11_DDLY [27:18] 0 CLKout10_11_DIV [15:5] 0 0 1 0 1

CLKout 10_11_PD

CLKout 10_11_HS

CLKout11_ ADLY_SEL

CLKout10_ ADLY_SEL

CLKout2_3_ADLY CLKout0_1_ADLY

R6 CLKout3_TYPE [31:28] CLKout2_TYPE [27:24] CLKout1_TYPE [23:20] CLKout0_TYPE [19:16] 0 0 0 1 1 0

[15:11] [9:5]

CLKout6_7_ADLY CLKout4_5_ADLY

R7 CLKout7_TYPE [31:28] CLKout6_TYPE [27:24] CLKout5_TYPE [23:20] CLKout4_TYPE [19:16] 0 0 0 1 1 1

[15:11] [9:5]

CLKout10_11_ADLY CLKout8_9_ADLY

R8 CLKout11_TYPE [31:28] CLKout10_TYPE [27:24] CLKout9_TYPE [23:20] CLKout8_TYPE [19:16] 0 0 1 0 0 0

[15:11] [9:5]

R9 0 1010101010101010101010101001001

OSCout1_

LVPECL_ OSCout_DIV VCO_DIV FEEDBACK

R10 0 1OSCout0_TYPE [27:24] 0 10 0 1 0 1 0

AMP [18:16] [10:8] _MUX [7:5]

[31:30]

PD_OSCin

VCO_MUX

EN_OSCout1

EN_OSCout0

OSCout1_MUX

OSCout0_MUX

EN_ FEEDBACK_MUX

SYNC_MUX SYNC_TYPE

R11 MODE [31:27] 0 0 0 0 0 0 0 1 0 1 1

[19:18] [14:12]

EN_SYNC

SYNC_QUAL

EN_PLL2_XTAL

SYNC_POL_INV

SYNC_EN_AUTO

NO_SYNC_CLKout8_9

NO_SYNC_CLKout6_7

NO_SYNC_CLKout4_5

NO_SYNC_CLKout2_3

NO_SYNC_CLKout0_1

NO_SYNC_CLKout10_11

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Table 16. Register Map (continued)

REG- 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ISTER

Data [26:0] Address [4:0]

HOLDOVER

R12 LD_MUX [31:27] LD_TYPE [26:24] 0 110 0 0 0 0 0 0 0 0 _MODE 1 0 1 1 0 0

(1) [7:6]

EN_TRACK

SYNC_PLL2 _DLD

SYNC_PLL1 _DLD

Status_ Status_ Status_ CLKin

HOLDOVER

HOLDOVER_MUX CLKin1 CLKin0 CLKin0 _Select

R13 _TYPE 0 0 0 0 1 1 0 1

[31:27] _MUX _TYPE _MUX _MODE

[26:24] [22:20] [18:16] [14:12] [11:8]

EN_CLKin1

EN_CLKin0

CLKin_Sel_INV

DISABLE_ DLD1_DET

Status_

LOS_ CLKin1 DAC_HIGH_TRIP DAC_LOW_TRIP

R14 TIMEOUT 0 0 0 0 0 0 0 1 1 1 0

_TYPE [19:14] [11:6]

[31:30]

EN_LOS

[26:24]

CLKin1_BUF_TYPE

CLKin0_BUF_TYPE

EN_VTUNE_ RAIL_DET

(1) Although the value of 0 is written here, during readback the value of READBACK_LE will be read at this location. See Register Map and Readback Register Map.

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Table 16. Register Map (continued)

REG- 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

ISTER

Data [26:0] Address [4:0]

MAN_DAC HOLDOVER_DLD_CNT

R15 0 0 1 1 1 1

[31:22] [19:6]

EN_MAN_DAC

FORCE_ HOLDOVER

XTAL_

R16 0 0 0 0 0 1010101010000010000010000

LVL

PLL1_

PLL2_C4_LF PLL2_C3_LF PLL2_R4_LF PLL2_R3_LF PLL1_N_DLY PLL1_R_DLY WND_

R24 0 0 0 0 0 1 1 0 0 0

[31:28] [27:24] [22:20] [18:16] [14:12] [10:8] SIZE

[7:6]

R25 DAC_CLK_DIV [31:22] 0 0 PLL1_DLD_CNT [19:6] 0 1 1 0 0 1

PLL2_ PLL2_CP PLL2_DLD_CNT

R26 WND_SIZE _GAIN 111010 1 1 0 1 0

[19:6]

[31:30] [27:26]

PLL2_CP_TRI

PLL2_ CP_POL

EN_PLL2_ REF_2X

PLL1_CP CLKin1_ CLKin0_ PLL1_R

R27 0 0 0 _GAIN 0 0 PreR_DIV PreR_DIV 1 1 0 1 1

[19:6]

[27:26] [23: 22] [21: 20]

PLL1_CP_TRI

PLL1_CP_POL

R28 PLL2_R [31: 20] PLL1_N [19:6] 0 1 1 1 0 0

OSCin_FREQ

R29 0 0 0 0 0 PLL2_N_CAL [22:5] 1 1 1 0 1

[26:24]

PLL2_ FAST_PDF

R30 0 0 0 0 0 PLL2_P [26:24] 0 PLL2_N [22:5] 1 1 1 1 0

R31 0 0 0 0 0 0 0 0 0 0 READBACK_ADDR [20:16] 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1

uWire_LOCK

READBACK _LE

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Table 17. Readback Register Map

REG- RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD RD

ISTER 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

Data [26:0]

HOLDOVER_

RD LD_MUX [26:22] LD_TYPE [21:19] 0 110 0 0 0 0 0 0 0 0 MODE 1

R12 [2:1]

EN_TRACK

READBACK_LE

SYNC_PLL2_DLD

SYNC_PLL1_DLD

RD RESERVED [26:24] DAC_CNT [23:14] RESERVED [13:0]

R23

RD RESERVED [26:10]

R31

uWire_LOCK

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8.6.2 Default Device Register Settings After Power On Reset

Table 18 illustrates the default register settings programmed in silicon for the LMK0480x after power on or

asserting the reset bit. Capital X and Y represent numeric values.

Table 18. Default Device Register Settings after Power On/Reset

DEFAULT BIT

FIELD NAME VALUE DEFAULT STATE FIELD DESCRIPTION REGISTER LOCATION

(DECIMAL) (MSB:LSB)

GROUP

CLKout0_1_PD 1 PD R0

CLKout2_3_PD 1 PD R1

CLKout4_5_PD 1 PD R2

Powerdown control for analog and digital delay, 31

divider, and both output buffers

CLKout6_7_PD 0 Normal R3

CLKout8_9_PD 0 Normal R4

CLKout10_11_PD 1 PD R5

CLKout6_7_OSCin_Sel 1 OSCin R3 30

Selects the clock source for a clock group from

internal VCO or external OSCin

CLKout8_9_OSCin_Sel 0 VCO R4 30

CLKoutX_ADLY_SEL 0 None Add analog delay for clock output R0 to R5 28, 29

CLKoutX_Y_DDLY 0 5 Digital delay value R0 to R5 27:18 [10]

RESET 0 Not in reset Performs power on reset for device R0 17

Disabled

POWERDOWN 0 Device power down control R1 17

(device is active)

CLKoutX_Y_HS 0 No shift Half shift for digital delay R0 to R5 16

CLKout0_1_DIV 25 Divide-by-25 R0

CLKout2_3_DIV 25 Divide-by-25 R1

CLKout4_5_DIV 25 Divide-by-25 R2

Divide for clock outputs 15:5 [11]

CLKout6_7_DIV 1 Divide-by-1 R3

CLKout8_9_DIV 25 Divide-by-25 R4

Clock Output Control

CLKout10_11_DIV 25 Divide-by-25 R5

CLKout3_TYPE 0 Powerdown R6

CLKout7_TYPE 0 Powerdown R7 31:28 [4]

CLKout11_TYPE 0 Powerdown R8

CLKout2_TYPE 0 Powerdown R6

LVCMOS

CLKout6_TYPE 8 R7 27:24 [4]

(Norm/Norm) Individual clock output format. Select from

CLKout10_TYPE 0 Powerdown R8

LVDS/LVPECL/LVCMOS.

CLKout1_TYPE 0 Powerdown R6

CLKout5_TYPE 0 Powerdown R7 23:20 [4]

CLKout9_TYPE 0 Powerdown R8

CLKout0_TYPE 0 Powerdown R6

CLKout4_TYPE 0 Powerdown R7 19:16 [4]

CLKout8_TYPE 1 LVDS R8

CLKoutX_Y_ADLY 0 No delay Analog delay setting for clock group R6 to R8 15:11, 9:5 [5]

1600 mVpp

OSCout1_LVPECL_AMP 2 Set LVPECL amplitude R10 31:30 [2]

LVPECL

OSCout0_TYPE 1 LVDS OSCout0 default clock output R10 27:24 [4]

EN_OSCout1 0 Disabled Disable OSCout1 output buffer R10 23

EN_OSCout0 1 Enabled Enable OSCout0 output buffer R10 22

OSCout1_MUX 0 Bypass Divider Select OSCout divider for OSCout1 or bypass R10 21

OSCout0_MUX 0 Bypass Divider Select OSCout divider for OSCout0 or bypass R10 20

Osc Buffer Control

Allows OSCin to be powered down. For use in clock

PD_OSCin 0 OSCin powered R10 19

distribution mode.

OSCout_DIV 0 Divide-by-8 OSCout divider value R10 18:16 [3]

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Table 18. Default Device Register Settings after Power On/Reset (continued)

DEFAULT BIT

FIELD NAME VALUE DEFAULT STATE FIELD DESCRIPTION REGISTER LOCATION

(DECIMAL) (MSB:LSB)

GROUP

VCO_MUX 0 VCO Select VCO or VCO Divider output R10 12

EN_FEEDBACK_MUX 0 Disabled Feedback MUX is powered down. R10 11

VCO_DIV 2 Divide-by-2 VCO Divide value R10 10:8 [3]

Mode

FEEDBACK_MUX 0 CLKout0 Selects CLKout to feedback into the PLL1 N divider R10 7:5 [3]

MODE 0 Internal VCO Device mode R11 31:27 [5]

EN_SYNC 1 Enabled Enables synchronization circuitry. R11 26

NO_SYNC_CLKout10_11 0 Will sync R11 25

NO_SYNC_CLKout8_9 1 Will not sync R11 24

NO_SYNC_CLKout6_7 1 Will not sync R11 23

Disable individual clock groups from becoming

synchronized.

NO_SYNC_CLKout4_5 0 Will sync R11 22

NO_SYNC_CLKout2_3 0 Will sync R11 21

NO_SYNC_CLKout0_1 0 Will sync R11 20

SYNC_MUX 0 Logic Low Mux controlling SYNC pin when set to output R11 19:18 [2]

Allows SYNC operations to be qualified by a clock

SYNC_QUAL 0 Not qualified R11 17

output.

Clock Synchronization

SYNC_POL_INV 1 Logic Low Sets the polarity of the SYNC pin when input R11 16

SYNC is not started by programming a register R0 to

SYNC_EN_AUTO 0 Manual R11 15

R5.

Input /w

SYNC_TYPE 1 SYNC IO pin type R11 14:12 [3]

Pull-up

EN_PLL2_XTAL 0 Disabled Enable Crystal oscillator for OSCin R11 5

LD_MUX 3 PLL1 and 2 DLD Lock detect mux selection when output R12 31:27 [5]

Output

LD_TYPE 3 LD IO pin type R12 26:24 [3]

(Push-Pull)

SYNC_PLL2_DLD 0 Normal Force synchronization mode until PLL2 locks R12 23

SYNC_PLL1_DLD 0 Normal Force synchronization mode until PLL1 locks R12 22

EN_TRACK 1 Enable Tracking DAC tracking of the PLL1 tuning voltage R12 8

HOLDOVER_MODE 2 Enable Holdover Causes holdover to activate when lock is lost R12 7:6 [2]

HOLDOVER_MUX 7 uWire Readback Holdover mux selection R13 31:27 [5]

Output

HOLDOVER_TYPE 3 HOLDOVER IO pin type R13 26:24 [3]

(Push-Pull)

Other Mode Control

Status_CLKin1_MUX 0 Logic Low Status_CLKin1 pin MUX selection R13 22:20 [3]

Status_CLKin0_TYPE 2 Input /w Pull-down Status_CLKin0 IO pin type R13 18:16 [3]

Disables PLL1 DLD falling edge from causing

DISABLE_DLD1_DET 0 Not Disabled R13 15

HOLDOVER mode to be entered

Status_CLKin0_MUX 0 Logic Low Status_CLKin0 pin MUX selection R13 14:12 [3]

CLKin_SELECT_MODE 3 Manual Select Mode to use in determining reference CLKin for PLL1 R13 11:9 [3]

CLKin_Sel_INV 0 Active High Invert Status 0 and 1 pin polarity for input(1) R13 8

EN_CLKin1 1 Usable Set CLKin1 to be usable R13 6

EN_CLKin0 1 Usable Set CLKin0 to be usable R13 5

LOS_TIMEOUT 0 1200 ns, 420 kHz Time until no activity on CLKin asserts LOS R14 31:30 [2]

EN_LOS 1 Enabled Loss of Signal Detect at CLKin R14 28

Status_CLKin1_TYPE 2 Input /w Pull-down Status_CLKin1 pin IO pin type R14 26:24 [3]

CLKin Control

CLKin1_BUF_TYPE 0 Bipolar CLKin1 Buffer Type R14 21

CLKin0_BUF_TYPE 0 Bipolar CLKin0 Buffer Type R14 20

(1) Inversion for Status 0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06

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Table 18. Default Device Register Settings after Power On/Reset (continued)

DEFAULT BIT

FIELD NAME VALUE DEFAULT STATE FIELD DESCRIPTION REGISTER LOCATION

(DECIMAL) (MSB:LSB)

GROUP

Voltage from Vcc at which holdover mode is entered if

DAC_HIGH_TRIP 0 ~50 mV from Vcc R14 19:14 [6]

EN_VTUNE_RAIL_DAC is enabled.

Voltage from GND at which holdover mode is entered

DAC_LOW_TRIP 0 ~50 mV from GND R14 11:6 [6]

if EN_VTUNE_RAIL_DAC is enabled.

Enable PLL1 unlock state when DAC trip points are

EN_VTUNE_RAIL_DET 0 Disabled R14 5

achieved

Writing to this register will set the value for DAC when

DAC Control

MAN_DAC 512 3 V / 2 in manual override. R15 31:22 [10]

Readback from this register is DAC value.

EN_MAN_DAC 0 Disabled Set manual DAC override R15 20

Lock must be valid n many clocks of PLL1 PDF before

HOLDOVER_DLD_CNT 512 512 counts R15 19:6 [14]

holdover mode is exited.

Holdover not

FORCE_HOLDOVER 0 Forces holdover mode. R15 5

forced

XTAL_LVL 0 1.65 Vpp Sets drive power level of Crystal R16 31:30 [2]

PLL2_C4_LF 0 10 pF PLL2 integrated capacitor C4 value R24 31:28 [4]

PLL2_C3_LF 0 10 pF PLL2 integrated capacitor C3 value R24 27:24 [4]

PLL2_R4_LF 0 200 ΩPLL2 integrated resistor R4 value R24 22:20 [3]

PLL2_R3_LF 0 200 ΩPLL2 integrated resistor R3 value R24 18:16 [3]

Delay in PLL1 feedback path to decrease lag from

PLL1_N_DLY 0 No delay R24 14:12 [3]

input to output

Delay in PLL1 reference path to increase lag from

PLL1_R_DLY 0 No delay R24 10:8 [3]

input to output

PLL1_WND_SIZE 3 40 ns Window size used for digital lock detect for PLL1 R24 7:6 [2]

DAC update clock divisor. Divides PLL1 phase

DAC_CLK_DIV 4 Divide-by-4 R25 31:22 [10]

detector frequency.

Lock must be valid n many cycles before LD is

PLL1_DLD_CNT 1024 1024 cycles R25 19:6 [14]

asserted

Reserved

PLL2_WND_SIZE 0 Window size used for digital lock detect for PLL2 R26 31:30 [2]

(2)

EN_PLL2_REF_2X 0 Disabled, 1x Doubles reference frequency of PLL2. R26 29

PLL2_CP_POL 0 Negative Polarity of PLL2 Charge Pump R26 28

PLL2_CP_GAIN 3 3.2 mA PLL2 Charge Pump Gain R26 27:26 [2]

Number of PDF cycles which phase error must be

PLL2_DLD_CNT 8192 8192 Counts R26 19:6 [14]

within DLD window before LD state is asserted.

PLL Control

PLL2_CP_TRI 0 Active PLL2 Charge Pump Active R26 5

PLL1_CP_POL 1 Positive Polarity of PLL1 Charge Pump R27 28

PLL1_CP_GAIN 0 100 uA PLL1 Charge Pump Gain R27 27:26 [2]

CLKin1_PreR_DIV 0 Divide-by-1 CLKin1 Pre-R divide value (1, 2, 4, or 8) R27 23:22 [2]

CLKin0_PreR_DIV 0 Divide-by-1 CLKin0 Pre-R divide value (1, 2, 4, or 8) R27 21:20 [2]

PLL1_R 96 Divide-by-96 PLL1 R Divider (1 to 16383) R27 19:6 [14]

PLL1_CP_TRI 0 Active PLL1 Charge Pump Active R27 5

PLL2_R 4 Divide-by-4 PLL2 R Divider (1 to 4095) R28 31:20 [12]

PLL1_N 192 Divide-by-192 PLL1 N Divider (1 to 16383) R28 19:6 [14]

OSCin_FREQ 7 448 to 511 MHz OSCin frequency range R29 26:24 [3]

PLL2 PDF > 100 When set, PLL2 PDF of greater than 100 MHz may be

PLL2_FAST_PDF 1 R29 23

MHz used

Actual PLL2 N divider value used in calibration

PLL2_N_CAL 48 Divide-by-48 R29 22:5 [18]

routine.

PLL2_P 2 Divide-by-2 PLL2 N Divider Prescaler (2 to 8) R30 26:24 [3]

PLL2_N 48 Divide-by-48 PLL2 N Divider (1 to 262143) R30 22:5 [18]

(2) This register must be reprogrammed to a value of 2 (3.7 ns) during user programming.

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Table 18. Default Device Register Settings after Power On/Reset (continued)

DEFAULT BIT

FIELD NAME VALUE DEFAULT STATE FIELD DESCRIPTION REGISTER LOCATION

(DECIMAL) (MSB:LSB)

GROUP

LEuWire Low for

READBACK_LE 0 State LEuWire pin must be in for readback R31 21

Readback

READBACK_ADDR 31 Register 31 Register to read back R31 20:16 [5]

uWire_LOCK 0 Writable The values of registers R0 to R30 are lockable R31 5

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8.6.3 Register Descriptions

8.6.3.1 Register R0 TO R5

Registers R0 through R5 control the 12 clock outputs CLKout0 to CLKout11. Register R0 controls CLKout0 and

CLKout1, Register R1 controls CLKout2 and CLKout3, and so on. All functions of the bits in these six registers

are identical except the different registers control different clock outputs. The X and Y in CLKoutX_Y_PD,

CLKoutX_ADLY_SEL, CLKoutY_ADLY_SEL, CLKoutX_Y_DDLY, CLKoutX_Y_HS, CLKoutX_Y_DIV denote the

actual clock output which may be from 0 to 11 where X is even and Y is odd. Two clock outputs CLKoutX and

CLKoutY form a clock output group and are often run together in bit names as CLKoutX_Y.

The RESET bit is only in register R0.

The POWERDOWN bit is only in register R1.

The CLKoutX_Y_OSCin_Sel bit is only in registers R3 and R4.

8.6.3.1.1 CLKoutX_Y_PD, Powerdown CLKoutX_Y Output Path

This bit powers down the clock group as specified by CLKoutX and CLKoutY. This includes the divider, digital

delay, analog delay, and output buffers.

Table 19. CLKoutX_Y_PD

R0-R5[31] STATE

0 Power up clock group

1 Power down clock group

8.6.3.1.2 CLKoutX_Y_OSCin_Sel, Clock Group Source

This bit sets the source for the clock output group CLKoutX_Y. The selected source will be either from a VCO via

Mode Mux1 or from the OSCin buffer.

This bit is valid only for registers R3 and R4, clock groups CLKout6_7 and CLKout8_9 respectively. All other

clock output groups are driven by a VCO via Mode Mux1.

Table 20. CLKoutX_Y_OSCin_Sel

R3-R4[30] CLOCK GROUP SOURCE

0 VCO

1 OSCin

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8.6.3.1.3 CLKoutY_ADLY_SEL[29], CLKoutX_ADLY_SEL[28], Select Analog Delay

These bits individually select the analog delay block (CLKoutX_Y_ADLY) for use with CLKoutX or CLKoutY. It is

not required for both outputs of a clock output group to use analog delay, but if both outputs do select the analog

delay block, then the analog delay will be the same for each output, CLKoutX and CLKoutY. When neither clock

output uses analog delay, the analog delay block is powered down. Analog delay may not operate at frequencies

above the minimum-ensured maximum output frequency of 1536 MHz.

Table 21. CLKoutY_ADLY_SEL[29], CLKoutX_ADLY_SEL[28]

R0-R5[29] R0-R5[28] STATE

0 0 Analog delay powered down

0 1 Analog delay on even CLKoutX

1 0 Analog delay on odd CLKoutY

1 1 Analog delay on both CLKouts

8.6.3.1.4 CLKoutX_Y_DDLY, Clock Channel Digital Delay

CLKoutX_Y_DDLY and CLKoutX_Y_HS sets the digital delay used for CLKoutX and CLKoutY. This value only

takes effect during a SYNC event and if the NO_SYNC_CLKoutX_Y bit is cleared for this clock group. See Clock

Output Synchronization (SYNC).

Programming CLKoutX_Y_DDLY can require special attention. See section Special Programming Case for R0 to

R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY for more details.

Using a CLKoutX_Y_DDLY value of 13 or greater will cause the clock group to operate in extended mode

regardless of the clock group's divide value or the half step value.

One clock cycle is equal to the period of the clock distribution path. The period of the clock distribution path is

equal to VCO Divider value divided by the frequency of the VCO. If the VCO divider is disabled or an external

VCO is used, the VCO divide value is treated as 1.

tclock distribution path = VCO divide value / fVCO

Table 22. CLKoutX_Y_DDLY, 10 Bits

R0-R5[27:18] DELAY POWER MODE

0 (0x00) 5 clock cycles

1 (0x01) 5 clock cycles

2 (0x02) 5 clock cycles

3 (0x03) 5 clock cycles

4 (0x04) 5 clock cycles Normal Mode

5 (0x05) 5 clock cycles

6 (0x06) 6 clock cycles

7 (0x07) 7 clock cycles

... ...

12 (0x0C) 12 clock cycles

13 (0x0D) 13 clock cycles

... ...

520 (0x208) 520 clock cycles Extended Mode

521 (0x209) 521 clock cycles

522 (0x20A) 522 clock cycles

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8.6.3.1.5 Reset

The RESET bit is located in register R0 only. Setting this bit will cause the silicon default values to be loaded.

When programming register R0 with the RESET bit set, all other programmed values are ignored. After resetting

the device, the register R0 must be programmed again (with RESET = 0) to set non-default values in register R0.

The reset occurs on the falling edge of the LEuWire pin which loaded R0 with RESET = 1.

The RESET bit is automatically cleared upon writing any other register. For instance, when R0 is written to again

with default values.

Table 23. RESET

R0[17] STATE

0 Normal operation

1 Reset (automatically cleared)

8.6.3.1.6 POWERDOWN

The POWERDOWN bit is located in register R1 only. Setting the bit causes the device to enter powerdown

mode. Normal operation is resumed by clearing this bit via MICROWIRE.

Table 24. POWERDOWN

R1[17] STATE

0 Normal operation

1 Powerdown

8.6.3.1.7 CLKoutX_Y_HS, Digital Delay Half Shift

This bit subtracts a half clock cycle of the clock distribution path period to the digital delay of CLKoutX and

CLKoutY. CLKoutX_Y_HS is used together with CLKoutX_Y_DDLY to set the digital delay value.

When changing CLKoutX_Y_HS, the digital delay immediately takes effect without a SYNC event.

Table 25. CLKoutX_Y_HS

R0-R5[16] STATE

0 Normal

Subtract half of a clock distribution path period from the total digital

1delay

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8.6.3.1.8 CLKoutX_Y_DIV, Clock Output Divide

CLKoutX_Y_DIV sets the divide value for the clock group. The divide may be even or odd. Both even and odd

divides output a 50% duty cycle clock.

Using a divide value of 26 or greater will cause the clock group to operate in extended mode regardless of the

clock group's digital delay value.

Programming CLKoutX_Y_DIV can require special attention. See section Special Programming Case for R0 to

R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY for more details.

Table 26. CLKoutX_Y_DIV, 11 Bits

R0-R5[15:5] DIVIDE VALUE POWER MODE

0 (0x00) Reserved

1 (0x01) 1 (1)

2 (0x02) 2 (2)

3 (0x03) 3

4 (0x04) 4 (2) Normal Mode

5 (0x05) 5 (2)

6 (0x06) 6

... ...

24 (0x18) 24

25 (0x19) 25

26 (0x1A) 26

27 (0x1B) 27

... ... Extended Mode

1044 (0x414) 1044

1045 (0x415) 1045

(1) CLKoutX_Y_HS must = 0 for divide by 1.

(2) After programming PLL2_N value, a SYNC must occur on channels using this divide value. Programming PLL2_N does generate a

SYNC event automatically which satisfies this requirement, but NO_SYNC_CLKoutX_Y must be set to 0 for these clock groups.

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8.6.3.2 Registers R6 TO R8

Registers R6 to R8 set the clock output types and analog delays.

8.6.3.2.1 CLKoutX_TYPE

The clock output types of the LMK0480x are individually programmable. The CLKoutX_TYPE registers set the

output type of an individual clock output to LVDS, LVPECL, LVCMOS, or powers down the output buffer. Note

that LVPECL supports four different amplitude levels and LVCMOS supports single LVCMOS outputs, inverted,

and normal polarity of each output pin for maximum flexibility.

Table 27 shows at what register and address the specified clock output CLKoutX_TYPE register is located.

The CLKoutX_TYPE table shows the programming definition for these registers.

Table 27. CLKoutX_TYPE Programming Addresses

CLKoutX PROGRAMMING ADDRESS

CLKout0 R6[19:16]

CLKout1 R6[23:20]

CLKout2 R6[27:24]

CLKout3 R6[31:28]

CLKout4 R7[19:16]

CLKout5 R7[23:20]

CLKout6 R7[27:24]

CLKout7 R7[31:28]

CLKout8 R8[19:16]

CLKout9 R8[23:20]

CLKout10 R8[27:24]

CLKout11 R8[31:28]

Table 28. CLKoutX_TYPE, 4 Bits

R6-R8[31:28, 27:24, 23:20] DEFINITION

0 (0x00) Power down

1 (0x01) LVDS

2 (0x02) LVPECL (700 mVpp)

3 (0x03) LVPECL (1200 mVpp)

4 (0x04) LVPECL (1600 mVpp)

5 (0x05) LVPECL (2000 mVpp)

6 (0x06) LVCMOS (Norm/Inv)

7 (0x07) LVCMOS (Inv/Norm)

8 (0x08) LVCMOS (Norm/Norm)

9 (0x09) LVCMOS (Inv/Inv)(1)

10 (0x0A) LVCMOS (Low/Norm)(1)

11 (0x0A) LVCMOS (Low/Inv)(1)

12 (0x0C) LVCMOS (Norm/Low)(1)

13 (0x0D) LVCMOS (Inv/Low)(1)

14 (0x0E) LVCMOS (Low/Low)(1)

(1) To reduce supply switching and crosstalk noise, it is recommended to use a complementary LVCMOS output type such as 6 or 7. See

Section Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs) for more information

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8.6.3.2.2 CLKoutX_Y_ADLY

These registers control the analog delay of the clock group CLKoutX_Y. Adding analog delay to the output will

increase the noise floor of the output. For this analog delay to be active for a clock output, it must be selected

with CLKout(X or Y)_ADL_SEL. If neither clock output in a clock group selects the analog delay, then the analog

delay block is powered down. Analog delay may not operate at frequencies above the minimum-ensured

maximum output frequency of 1536 MHz.

In addition to the programmed delay, a fixed 500 ps of delay will be added by engaging the delay block.

The programming addresses table shows at what register and address the specified clock output

CLKoutX_Y_ADLY register is located.

The CLKoutX_Y_ADLY table shows the programming definition for these registers.

Table 29. CLKoutX_Y_ADLY Programming Addresses

CLKoutX_Y_ADLY PROGRAMMING ADDRESS

CLKout0_1_ADLY R6[9:5]

CLKout2_3_ADLY R6[15:11]

CLKout4_5_ADLY R7[9:5]

CLKout6_7_ADLY R7[15:11]

CLKout8_9_ADLY R8[9:5]

CLKout10_11_ADLY R8[15:11]

Table 30. CLKoutX_Y_ADLY, 5 Bits

R6-R8[15:11, 9:5] DEFINITION

0 (0x00) 500 ps + No delay

1 (0x01) 500 ps + 25 ps

2 (0x02) 500 ps + 50 ps

3 (0x03) 500 ps + 75 ps

4 (0x04) 500 ps + 100 ps

5 (0x05) 500 ps + 125 ps

6 (0x06) 500 ps + 150 ps

7 (0x07) 500 ps + 175 ps

8 (0x08) 500 ps + 200 ps

9 (0x09) 500 ps + 225 ps

10 (0x0A) 500 ps + 250 ps

11 (0x0B) 500 ps + 275 ps

12 (0x0C) 500 ps + 300 ps

13 (0x0D) 500 ps + 325 ps

14 (0x0E) 500 ps + 350 ps

15 (0x0F) 500 ps + 375 ps

16 (0x10) 500 ps + 400 ps

17 (0x11) 500 ps + 425 ps

18 (0x12) 500 ps + 450 ps

19 (0x13) 500 ps + 475 ps

20 (0x14) 500 ps + 500 ps

21 (0x15) 500 ps + 525 ps

22 (0x16) 500 ps + 550 ps

23 (0x17) 500 ps + 575 ps

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8.6.3.3 Register R10

8.6.3.3.1 OSCout1_LVPECL_AMP, LVPECL Output Amplitude Control

The OSCout1 clock output can only be used as an LVPECL output type. OSCout1_LVPECL_AMP sets the

LVPECL output amplitude of the OSCout1 clock output.

Table 31. OSCout1_LVPECL_AMP, 2 Bits

R10[31:30] OUTPUT FORMAT

0 (0x00) LVPECL (700 mVpp)

1 (0x01) LVPECL (1200 mVpp)

2 (0x02) LVPECL (1600 mVpp)

3 (0x03) LVPECL (2000 mVpp)

8.6.3.3.2 OSCout0_TYPE

The OSCout0 clock output has a programmable output type. The OSCout0_TYPE register sets the output type to

LVDS, LVPECL, LVCMOS, or powers down the output buffer. Note that LVPECL supports four different

amplitude levels and LVCMOS supports dual and single LVCMOS outputs with inverted, and normal polarity of

each output pin for maximum flexibility.

To turn on the output, the OSCout0_TYPE must be set to a non-power down setting and enabled with

EN_OSCoutX, OSCout Output Enable.

Table 32. OSCout0_TYPE, 4 Bits

R10[27:24] DEFINITION

0 (0x00) Powerdown

1 (0x01) LVDS

2 (0x02) LVPECL (700 mVpp)

3 (0x03) LVPECL (1200 mVpp)

4 (0x04) LVPECL (1600 mVpp)

5 (0x05) LVPECL (2000 mVpp)

6 (0x06) LVCMOS (Norm/Inv)

7 (0x07) LVCMOS (Inv/Norm)

8 (0x08) LVCMOS (Norm/Norm)(1)

9 (0x09) LVCMOS (Inv/Inv)(1)

10 (0x0A) LVCMOS (Low/Norm)(1)

11 (0x0B) LVCMOS (Low/Inv)(1)

12 (0x0C) LVCMOS (Norm/Low)(1)

13 (0x0D) LVCMOS (Inv/Low)(1)

14 (0x0E) LVCMOS (Low/Low)(1)

(1) To reduce supply switching and crosstalk noise, it is recommended to use a complementary LVCMOS output type such as 6 or 7. See

Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs) for more information"

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8.6.3.3.3 EN_OSCoutX, OSCout Output Enable

EN_OSCoutX is used to enable an oscillator buffered output.

Table 33. EN_OSCout1

R10[23] OUTPUT STATE

0 OSCout1 Disabled

1 OSCout1 Enabled

Table 34. EN_OSCout0

R10[22] OUTPUT STATE

0 OSCout0 Disabled

1 OSCout0 Enabled

OSCout0 note: In addition to enabling the output with EN_OSCout0. The OSCout0_TYPE must be programmed

to a non-power down value for the output buffer to power up.

8.6.3.3.4 OSCoutX_MUX, Clock Output Mux

Sets OSCoutX buffer to output a divided or bypassed OSCin signal. The divisor is set by OSCout_DIV, Oscillator

Output Divide.

Table 35. OSCout1_MUX

R10[21] MUX OUTPUT

0 Bypass divider

1 Divided

Table 36. OSCout0_MUX

R10[20] MUX OUTPUT

0 Bypass divider

1 Divided

8.6.3.3.5 PD_OSCin, OSCin Powerdown Control

Except in clock distribution mode, the OSCin buffer must always be powered up.

In clock distribution mode, the OSCin buffer must be powered down if not used.

Table 37. PD_OSCin

R10[19] OSCin BUFFER

0 Normal Operation

1 Powerdown

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8.6.3.3.6 OSCout_DIV, Oscillator Output Divide

The OSCout divider can be programmed from 2 to 8. Divide by 1 is achieved by bypassing the divider with

OSCoutX_MUX, Clock Output Mux.

Note that OSCout_DIV will be in the PLL1 N feedback path if OSCout0_MUX selects divided as an output. When

OSCout_DIV is in the PLL1 N feedback path, the OSCout_DIV divide value must be accounted for when

programming PLL1 N.

See PLL Programming for more information on programming PLL1 to lock.

Table 38. OSCout_DIV, 3 Bits

R10[18:16] DIVIDE

0 (0x00) 8

1 (0x01) 2

2 (0x02) 2

3 (0x03) 3

4 (0x04) 4

5 (0x05) 5

6 (0x06) 6

7 (0x07) 7

8.6.3.3.7 VCO_MUX

When the internal VCO is used, the VCO divider can be selected to divide the VCO output frequency to reduce

the frequency on the clock distribution path. It is recommended to use the VCO directly unless:

• Very low output frequencies are required.

• If using the VCO divider results in three or more clock output divider/delays changing from extended to

normal power mode, a small power savings may be achieved by using the VCO divider.

A consequence of using the VCO divider is a small degradation in phase noise.

Table 39. VCO_MUX

R10[12] DEFINITION

0 VCO selected

1 VCO divider selected

8.6.3.3.8 EN_FEEDBACK_MUX

When using 0-delay or dynamic digital delay (SYNC_QUAL = 1), EN_FEEDBACK_MUX must be set to 1 to

power up the feedback mux.

Table 40. EN_FEEDBACK_MUX

R10[11] DEFINITION

0 Feedback mux powered down

1 Feedback mux enabled

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8.6.3.3.9 VCO_DIV, VCO Divider

Divide value of the VCO Divider.

See PLL Programming for more information on programming PLL2 to lock.

Table 41. VCO_DIV, 3 Bits

R10[10:8] DIVIDE

0 (0x00) 8

1 (0x01) 2

2 (0x02) 2

3 (0x03) 3

4 (0x04) 4

5 (0x05) 5

6 (0x06) 6

7 (0x07) 7

8.6.3.3.10 FEEDBACK_MUX

When in 0-delay mode, the feedback mux selects the clock output to be fed back into the PLL1 N Divider.

Table 42. FEEDBACK_MUX, 3 Bits

R10[7:5] MUX OUTPUT

0 (0x00) CLKout0

1 (0x01) CLKout2

2 (0x02) CLKout4

3 (0x03) CLKout6

4 (0x04) CLKout8

5 (0x05) CLKout10

6 (0x06) FBCLKin/FBCLKin*

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8.6.3.4 Register R11

8.6.3.4.1 MODE: Device Mode

MODE determines how the LMK0480x operates from a high level. Different blocks of the device can be powered

up and down for specific application requirements from a dual loop architecture to clock distribution.

The LMK0480x can operate in:

• Dual PLL mode with the internal VCO or an external VCO.

• Single PLL mode uses PLL2 and powers down PLL1. OSCin is used for PLL reference input.

• Clock Distribution mode allows use of CLKin1 to distribute to clock outputs CLKout0 through CLKout11, and

OSCin to distribute to OSCout0, OSCout1, and optionally CLKout6 through CLKout9.

For the PLL modes, deterministic phase delay with respect to the input can be achieved with the 0-delay mode.

For the PLL modes it is also possible to use an external VCO.

Table 43. MODE, 5 Bits

R11[31:27] VALUE

0 (0x00) Dual PLL, Internal VCO

1 (0x01) Reserved

Dual PLL, Internal VCO,

2 (0x02) 0-Delay

3 (0x03) Dual PLL, External VCO (Fin)

4 (0x04) Reserved

Dual PLL, External VCO (Fin),

5 (0x05) 0-Delay(1)

6 (0x06) PLL2, Internal VCO

7 (0x07) Reserved

PLL2, Internal VCO,

8 (0x08) 0–Delay

9 (0x09) Reserved

10 (0x0A) Reserved

11 (0x0B) PLL2, External VCO (Fin)

12 (0x0C) Reserved

13 (0x0D) Reserved

14 (0x0E) Reserved

15 (0x0F) Dual PLL, External VCO (Fin), 0-Delay(2)

16 (0x10) Clock Distribution

(1) Contact TI Applications for more information on using this mode.

(2) See Mode 15 Additional Configurations for additional configuration steps required.

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8.6.3.4.2 EN_SYNC, Enable Synchronization

The EN_SYNC bit (default on) must be enabled for synchronization to work. Synchronization is required for

dynamic digital delay.

The synchronization enable may be turned off once the clocks are operating to save current. If EN_SYNC is set

after it has been cleared (a transition from 0 to 1), a SYNC is generated that can disrupt the active clock outputs.

Setting the NO_SYNC_CLKoutX_Y bits will prevent this SYNC pulse from affecting the output clocks. Setting the

EN_SYNC bit is not a valid method for synchronizing the clock outputs. See the Clock Output Synchronization

section for more information on synchronization.

Table 44. EN_SYNC

R11[26] DEFINITION

0 Synchronization disabled

1 Synchronization enabled

8.6.3.4.3 NO_SYNC_CLKoutX_Y

The NO_SYNC_CLKoutX_Y bits prevent individual clock groups from becoming synchronized during a SYNC

event. A reason to prevent individual clock groups from becoming synchronized is that during synchronization,

the clock output is in a fixed low state or can have a glitch pulse.

By disabling SYNC on a clock group, it will continue to operate normally during a SYNC event.

Digital delay requires a SYNC operation to take effect. If NO_SYNC_CLKoutX_Y is set before a SYNC event, the

digital delay value will be unused.

Setting the NO_SYNC_CLKoutX_Y bit has no effect on clocks already synchronized together.

Table 45. NO_SYNC_CLKoutX_Y Programming Addresses

NO_SYNC_CLKoutX_Y PROGRAMMING ADDRESS

CLKout0 and 1 R11:20

CLKout2 and 3 R11:21

CLKout4 and 5 R11:22

CLKout6 and 7 R11:23

CLKout8 and 9 R11:24

CLKout10 and 11 R11:25

Table 46. NO_SYNC_CLKoutX_Y

R11[25, 24, 23, 22, 21, 20] DEFINITION

0 CLKoutX_Y will synchronize

1 CLKoutX_Y will not synchronize

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8.6.3.4.4 SYNC_MUX

Mux controlling SYNC pin when type is an output.

All the outputs logic is active high when SYNC_TYPE = 3 (Output). All the outputs logic is active low when

SYNC_TYPE = 4 (Output Inverted). For example, when SYNC_MUX = 0 (Logic Low) and SYNC_TYPE = 3

(Output) then SYNC outputs a logic low. When SYNC_MUX = 0 (Logic Low) and SYNC_TYPE = 4 (Output

Inverted) then SYNC outputs a logic high.

Table 47. SYNC_MUX, 2 Bits

R11[19:18] SYNC PIN OUTPUT

0 (0x00) Logic Low

1 (0x01) Reserved

2 (0x02) Reserved

3 (0x03) uWire Readback

8.6.3.4.5 SYNC_QUAL

When SYNC_QUAL is set, clock outputs will be synchronized to an existing clock output selected by

FEEDBACK_MUX. By using the NO_SYNC_CLKoutX_Y bits, selected clock outputs will not be interrupted

during the SYNC event.

Qualifying the SYNC by an output clock means that the pulse which turns the clock outputs off and on will have a

fixed time relationship to the qualifying output clock.

SYNC_QUAL = 1 requires CLKout4_5_PD = 0 for proper operation. CLKout4_TYPE and CLKout5_TYPE may be

set to Powerdown mode.

See Clock Output Synchronization (SYNC) for more information.

Table 48. SYNC_QUAL

R11[17] MODE

0 No qualification

Qualification by clock output from feedback mux

1 (Must set

CLKout4_5_PD = 0)

8.6.3.4.6 SYNC_POL_INV

Sets the polarity of the SYNC pin when input. When SYNC is asserted the clock outputs will transition to a low

state.

See Clock Output Synchronization (SYNC) for more information on SYNC. A SYNC event can be generated by

toggling this bit through the MICROWIRE interface.

Table 49. SYNC_POL_INV

R11[16] POLARITY

0 SYNC is active high

1 SYNC is active low

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8.6.3.4.7 SYNC_EN_AUTO

When set, causes a SYNC event to occur when programming register R0 to R5 to adjust digital delay values.

The SYNC event will coincide with the LEuWire pin falling edge.

Refer to Special Programming Case for R0 to R5 for CLKoutX_Y_DIV and CLKoutX_Y_DDLY for more

information on possible special programming considerations when SYNC_EN_AUTO = 1.

Table 50. SYNC_EN_AUTO

R11[15] MODE

0 Manual SYNC

1 SYNC Internally Generated

8.6.3.4.8 SYNC_TYPE

Sets the IO type of the SYNC pin.

Table 51. SYNC_TYPE, 3 Bits

R11[14:12] POLARITY

0 (0x00) Input

1 (0x01) Input /w pull-up resistor

2 (0x02) Input /w pull-down resistor

3 (0x03) Output (push-pull)

4 (0x04) Output inverted (push-pull)

5 (0x05) Output (open source)

6 (0x06) Output (open drain)

When in output mode, the SYNC input is forced to 0 regardless of the SYNC_MUX setting. A synchronization

can then be activated by uWire by programming the SYNC_POL_INV register to active low to assert SYNC.

SYNC can then be released by programming SYNC_POL_INV to active high. Using this uWire programming

method to create a SYNC event saves the need for an IO pin from another device.

8.6.3.4.9 EN_PLL2_XTAL

If an external crystal is being used to implement a discrete VCXO, the internal feedback amplifier must be

enabled with this bit in order to complete the oscillator circuit.

Table 52. EN_PLL2_XTAL

R11[5] OSCILLATOR AMPLIFIER STATE

0 Disabled

1 Enabled

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8.6.3.5 Register R12

8.6.3.5.1 LD_MUX

LD_MUX sets the output value of the LD pin.

All the outputs logic is active high when LD_TYPE = 3 (Output). All the outputs logic is active low when

LD_TYPE = 4 (Output Inverted). For example, when LD_MUX = 0 (Logic Low) and LD_TYPE = 3 (Output) then

Status_LD outputs a logic low. When LD_MUX = 0 (Logic Low) and LD_TYPE = 4 (Output Inverted) then

Status_LD outputs a logic high.

Table 53. LD_MUX, 5 Bits

R12[31:27] MODE

0 (0x00) Logic Low

1 (0x01) PLL1 DLD

2 (0x02) PLL2 DLD

3 (0x03) PLL1 and PLL2 DLD

4 (0x04) Holdover Status

5 (0x05) DAC Locked

6 (0x06) Reserved

7 (0x07) uWire Readback

8 (0x08) DAC Rail

9 (0x09) DAC Low

10 (0x0A) DAC High

11 (0x0B) PLL1_N

12 (0x0C) PLL1_N/2

13 (0x0D) PLL2 N

14 (0x0E) PLL2 N/2

15 (0x0F) PLL1_R

16 (0x10) PLL1_R/2

17 (0x11) PLL2 R (1)

18 (0x12) PLL2 R/2 (1)

(1) Only valid when HOLDOVER_MUX is not set to 2 (PLL2_DLD) or 3 (PLL1 and PLL2 DLD).

8.6.3.5.2 LD_TYPE

Sets the IO type of the LD pin.

Table 54. LD_TYPE, 3 Bits

R12[26:24] POLARITY

0 (0x00) Reserved

1 (0x01) Reserved

2 (0x02) Reserved

3 (0x03) Output (push-pull)

4 (0x04) Output inverted (push-pull)

5 (0x05) Output (open source)

6 (0x06) Output (open drain)

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8.6.3.5.3 SYNC_PLLX_DLD

By setting SYNC_PLLX_DLD a SYNC mode will be engaged (asserted SYNC) until PLL1 and/or PLL2 locks.

SYNC_QUAL must be 0 to use this functionality.

Table 55. SYNC_PLL2_DLD

R12[23] SYNC MODE FORCED

0 No

1 Yes

Table 56. SYNC_PLL1_DLD

R12[22] SYNC MODE FORCED

0 No

1 Yes

8.6.3.5.4 EN_TRACK

Enable the DAC to track the PLL1 tuning voltage. For optional use in in holdover mode.

Tracking can be used to monitor PLL1 voltage by readback of DAC_CNT register in any mode.

Table 57. EN_TRACK

R12[8] DAC TRACKING

0 Disabled

1 Enabled

8.6.3.5.5 HOLDOVER_MODE

Enable the holdover mode.

Table 58. HOLDOVER_MODE, 2 Bits

R12[7:6] HOLDOVER MODE

0 Reserved

1 Disabled

2 Enabled

3 Reserved

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8.6.3.6 Register R13

8.6.3.6.1 HOLDOVER_MUX

HOLDOVER_MUX sets the output value of the Status_Holdover pin.

The outputs are active high when HOLDOVER_TYPE = 3 (Output). The outputs are active low when

HOLDOVER_TYPE = 4 (Output Inverted).

Table 59. HOLDOVER_MUX, 5 Bits

R13[31:27] DEFINITION

0 (0x00) Logic Low

1 (0x01) PLL1 DLD

2 (0x02) PLL2 DLD

3 (0x03) PLL1 and PLL2 DLD

4 (0x04) Holdover Status

5 (0x05) DAC Locked

6 (0x06) Reserved

7 (0x07) uWire Readback

8 (0x08) DAC Rail

9 (0x09) DAC Low

10 (0x0A) DAC High

11 (0x0B) PLL1 N

12 (0x0C) PLL1 N/2

13 (0x0D) PLL2 N

14 (0x0E) PLL2 N/2

15 (0x0F) PLL1 R

16 (0x10) PLL1 R/2

17 (0x11) PLL2 R (1)

18 (0x12) PLL2 R/2 (1)

(1) Only valid when LD_MUX is not set to 2 (PLL2_DLD) or 3 (PLL1 and PLL2 DLD).

8.6.3.6.2 HOLDOVER_TYPE

Sets the IO mode of the Status_Holdover pin.

Table 60. HOLDOVER_TYPE, 3 Bits

R13[26:24] POLARITY

0 (0x00) Reserved

1 (0x01) Reserved

2 (0x02) Reserved

3 (0x03) Output (push-pull)

4 (0x04) Output inverted (push-pull)

5 (0x05) Output (open source)

6 (0x06) Output (open drain)

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8.6.3.6.3 Status_CLKin1_MUX

Status_CLKin1_MUX sets the output value of the Status_CLKin1 pin. If Status_CLKin1_TYPE is set to an input

type, this register has no effect. This MUX register only sets the output signal.

The outputs are active high when Status_CLKin1_TYPE = 3 (Output). The outputs are active low when

Status_CLKin1_TYPE = 4 (Output Inverted).

Table 61. Status_CLKin1_MUX, 3 Bits

R13[22:20] DEFINITION

0 (0x00) Logic Low

1 (0x01) CLKin1 LOS

2 (0x02) CLKin1 Selected

3 (0x03) DAC Locked

4 (0x04) DAC Low

5 (0x05) DAC High

6 (0x06) uWire Readback

8.6.3.6.4 Status_CLKin0_TYPE

Status_CLKin0_TYPE sets the IO type of the Status_CLKin0 pin.

Table 62. Status_CLKin0_TYPE, 3 Bits

R13[18:16] DEFINITION

0 (0x00) Input

1 (0x01) Input /w pull-up resistor

2 (0x02) Input /w pull-down resistor

3 (0x03) Output (push-pull)

4 (0x04) Output inverted (push-pull)

5 (0x05) Output (open source)

6 (0x06) Output (open drain)

8.6.3.6.5 DISABLE_DLD1_DET

DISABLE_DLD1_DET disables the HOLDOVER mode from being activated when PLL1 lock detect signal

transitions from high to low.

When using Pin Select Mode as the input clock switch mode, this bit should normally be set.

Table 63. DISABLE_DLD1_DET

R13[15] HOLDOVER DLD1 DETECT

0 PLL1 DLD causes clock switch event

1 PLL1 DLD does not cause clock switch event

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8.6.3.6.6 Status_CLKin0_MUX

CLKin0_MUX sets the output value of the Status_CLKin0 pin. If Status_CLKin0_TYPE is set to an input type, this

The outputs logic is active high when Status_CLKin0_TYPE = 3 (Output). The outputs logic is active low when

Status_CLKin0_TYPE = 4 (Output Inverted).

Table 64. Status_CLKin0_MUX, 3 Bits

R13[14:12] DIVIDE

0 (0x00) Logic Low

1 (0x01) CLKin0 LOS

2 (0x02) CLKin0 Selected

3 (0x03) DAC Locked

4 (0x04) DAC Low

5 (0x05) DAC High

6 (0x06) uWire Readback

8.6.3.6.7 CLKin_SELECT_MODE

CLKin_SELECT_MODE sets the mode used in determining reference CLKin for PLL1.

Table 65. CLKin_SELECT_MODE, 3 Bits

R13[11:9] MODE

0 (0x00) CLKin0 Manual

1 (0x01) CLKin1 Manual

2 (0x02) Reserved

3 (0x03) Pin Select Mode

4 (0x04) Auto Mode

5 (0x05) Reserved

6 (0x06) Auto mode and next clock pin select

7 (0x07) Reserved

8.6.3.6.8 CLKin_Sel_INV

CLKin_Sel_INV sets the input polarity of Status_CLKin0 and Status_CLKin1 pins.

Inversion for Status 0 and 1 pins is only valid for CLKin_SELECT_MODE = 0x06.

Table 66. CLKin_Sel_INV

R13[8] INPUT

0 Active High

1 Active Low

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8.6.3.6.9 EN_CLKinX

Each clock input can individually be enabled to be used during auto-switching CLKin_SELECT_MODE. Clock

input switching priority is always CLKin0 →CLKin1.

Table 67. EN_CLKin1

R13[6] ENABLED

0 No

1 Yes

Table 68. EN_CLKin0

R13[5] ENABLED

0 No

1 Yes

8.6.3.7 Register 14

8.6.3.7.1 LOS_TIMEOUT

This bit controls the amount of time in which no activity on a CLKin causes LOS (Loss-of-Signal) to be asserted.

Table 69. LOS_TIMEOUT, 2 Bits

R14[31:30] TIMEOUT

0 (0x00) 1200 ns, 420 kHz

1 (0x01) 206 ns, 2.5 MHz

2 (0x02) 52.9 ns, 10 MHz

3 (0x03) 23.7 ns, 22 MHz

8.6.3.7.2 EN_LOS

Enables the LOS (Loss-of-Signal) timeout control.

Table 70. EN_LOS

R14[28] LOS

0 Disabled

1 Enabled

8.6.3.7.3 Status_CLKin1_TYPE

Sets the IO type of the Status_CLKin1 pin.

Table 71. Status_CLKin1_TYPE, 3 Bits

R14[26:24] POLARITY

0 (0x00) Input

1 (0x01) Input /w pull-up resistor

2 (0x02) Input /w pull-down resistor

3 (0x03) Output (push-pull)

4 (0x04) Output inverted (push-pull)

5 (0x05) Output (open source)

6 (0x06) Output (open drain)

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8.6.3.7.4 CLKinX_BUF_TYPE, PLL1 CLKinX/CLKinX* Buffer Type

There are two input buffer types for the PLL1 reference clock inputs: either bipolar or CMOS. Bipolar is

recommended for differential inputs such as LVDS and LVPECL. CMOS is recommended for DC coupled single

ended inputs.

When using bipolar, CLKinX and CLKinX* input pins must be AC coupled when using a differential or single

ended input.

When using CMOS, CLKinX and CLKinX* input pins may be AC or DC coupled with a differential input.

When using CMOS in single ended mode, the unused clock input pin (CLKinX or CLKinX*) must be AC

grounded. The used clock input pin (CLKinX* or CLKinX) may be AC or DC coupled to the signal source.

The programming addresses table shows at what register and address the specified CLKinX_BUF_TYPE bit is

located.

The CLKinX_BUF_TYPE table shows the programming definition for these registers.

Table 72. CLKinX_BUF_TYPE Programming Addresses

CLKinX_BUF_TYPE PROGRAMMING ADDRESS

CLKin1_BUF_TYPE R14[21]

CLKin0_BUF_TYPE R14[20]

Table 73. CLKinX_BUF_TYPE

R14[21, 20] CLKinX BUFFER TYPE

0 Bipolar

1 CMOS

8.6.3.7.5 DAC_HIGH_TRIP

Voltage from Vcc at which holdover mode is entered if EN_VTUNE_RAIL_DAC is enabled. This will also set flags

which can be monitored out Status_LD/Status_Holdover pins.

Step size is ~51 mV

Table 74. DAC_HIGH_TRIP, 6 Bits

R14[19:14] TRIP VOLTAGE FROM VCC (V)

0 (0x00) 1 × Vcc / 64

1 (0x01) 2 × Vcc / 64

2 (0x02) 3 × Vcc / 64

3 (0x03) 4 × Vcc / 64

4 (0x04) 5 × Vcc / 64

... ...

61 (0x3D) 62 × Vcc / 64

62 (0x3E) 63 × Vcc / 64

63 (0x3F) 64 × Vcc / 64

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8.6.3.7.6 DAC_LOW_TRIP

Voltage from GND at which holdover mode is entered if EN_VTUNE_RAIL_DAC is enabled. This will also set

flags which can be monitored out Status_LD/Status_Holdover pins.

Step size is ~51 mV

Table 75. DAC_LOW_TRIP, 6 Bits

R14[11:6] TRIP VOLTAGE from GND (V)

0 (0x00) 1 × Vcc / 64

1 (0x01) 2 × Vcc / 64

2 (0x02) 3 × Vcc / 64

3 (0x03) 4 × Vcc / 64

4 (0x04) 5 × Vcc / 64

... ...

61 (0x3D) 62 × Vcc / 64

62 (0x3E) 63 × Vcc / 64

63 (0x3F) 64 × Vcc / 64

8.6.3.7.7 EN_VTUNE_RAIL_DET

Enables the DAC Vtune rail detection. When the DAC achieves a specified Vtune, if this bit is enabled, the

current clock input is considered invalid and an input clock switch event is generated.

Table 76. EN_VTUNE_RAIL_DET

R14[5] STATE

0 Disabled

1 Enabled

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8.6.3.8 REGISTER 15

8.6.3.8.1 MAN_DAC

Sets the DAC value when in manual DAC mode in ~3.2 mV steps.

Table 77. MAN_DAC, 10 Bits

R15[31:22] DAC VOLTAGE

0 (0x00) 0 × Vcc / 1023

1 (0x01) 1 × Vcc / 1023

2 (0x02) 2 × Vcc / 1023

... ...

1023 (0x3FF) 1023 × Vcc / 1023

8.6.3.8.2 EN_MAN_DAC

This bit enables the manual DAC mode.

Table 78. EN_MAN_DAC

R15[20] DAC MODE

0 Automatic

1 Manual

8.6.3.8.3 HOLDOVER_DLD_CNT

Lock must be valid for this many clocks of PLL1 PDF before holdover mode is exited.

Table 79. HOLDOVER_DLD_CNT, 14 Bits

R15[19:6] EXIT COUNTS

0 (0x00) Reserved

1 (0x01) 1

2 (0x02) 2

... ...

16,383 (0x3FFF) 16,383

8.6.3.8.4 FORCE_HOLDOVER

This bit forces the holdover mode.

When holdover is forced, if in fixed CPout1 mode (EN_TRACK = 0 or 1, EN_MAN_DAC =1) , then the DAC will

set the programmed MAN_DAC value. If in tracked CPout1 mode (EN_TRACK = 1, EN_MAN_DAC = 0,

EN_VTUNE_RAIL_DET = 0), then the DAC will set the current tracked DAC value.

Setting FORCE_HOLDOVER does not constitute a clock input switch event unless DISABLE_DLD1_DET = 0,

since when in holdover mode, PLL1_DLD = 0 will trigger the clock input switch event.

Table 80. FORCE_HOLDOVER

R15[5] HOLDOVER

0 Disabled

1 Enabled

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8.6.3.9 Register 16

8.6.3.9.1 XTAL_LVL

Sets the peak amplitude on the tunable crystal.

Increasing this value can improve the crystal oscillator phase noise performance at the cost of increased current

and higher crystal power dissipation levels.

Table 81. XTAL_LVL, 2 Bits

R15[31:22] PEAK AMPLITUDE(1)

0 (0x00) 1.65 Vpp

1 (0x01) 1.75 Vpp

2 (0x02) 1.90 Vpp

3 (0x03) 2.05 Vpp

(1) At crystal frequency of 20.48 MHz

8.6.3.10 Register 23

This register must not be programmed, it is a readback only register.

8.6.3.10.1 DAC_CNT

The DAC_CNT register is 10 bits in size and located at readback bit position R[23:14]. When using tracking

mode for holdover, the DAC value can be readback at this address.

8.6.3.11 Register 24

8.6.3.11.1 PLL2_C4_LF, PLL2 Integrated Loop Filter Component

Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without

requiring external components.

Internal loop filter capacitor C4 can be set according to Table 82.

Table 82. PLL2_C4_LF, 4 Bits

R24[31:28] LOOP FILTER CAPACITANCE (pF)

0 (0x00) 10 pF

1 (0x01) 15 pF

2 (0x02) 29 pF

3 (0x03) 34 pF

4 (0x04) 47 pF

5 (0x05) 52 pF

6 (0x06) 66 pF

7 (0x07) 71 pF

8 (0x08) 103 pF

9 (0x09) 108 pF

10 (0x0A) 122 pF

11 (0x0B) 126 pF

12 (0x0C) 141 pF

13 (0x0D) 146 pF

14 (0x0E) Reserved

15 (0x0F) Reserved

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8.6.3.11.2 PLL2_C3_LF, PLL2 Integrated Loop Filter Component

Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without

requiring external components.

Internal loop filter capacitor C3 can be set according to Table 83.

Table 83. PLL2_C3_LF, 4 Bits

R24[27:24] LOOP FILTER CAPACITANCE (pF)

0 (0x00) 10 pF

1 (0x01) 11 pF

2 (0x02) 15 pF

3 (0x03) 16 pF

4 (0x04) 19 pF

5 (0x05) 20 pF

6 (0x06) 24 pF

7 (0x07) 25 pF

8 (0x08) 29 pF

9 (0x09) 30 pF

10 (0x0A) 33 pF

11 (0x0B) 34 pF

12 (0x0C) 38 pF

13 (0x0D) 39 pF

14 (0x0E) Reserved

15 (0x0F) Reserved

8.6.3.11.3 PLL2_R4_LF, PLL2 Integrated Loop Filter Component

Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without

requiring external components.

Internal loop filter resistor R4 can be set according to Table 84.

Table 84. PLL2_R4_LF, 3 Bits

R24[22:20] RESISTANCE

0 (0x00) 200 Ω

1 (0x01) 1 kΩ

2 (0x02) 2 kΩ

3 (0x03) 4 kΩ

4 (0x04) 16 kΩ

5 (0x05) Reserved

6 (0x06) Reserved

7 (0x07) Reserved

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8.6.3.11.4 PLL2_R3_LF, PLL2 Integrated Loop Filter Component

Internal loop filter components are available for PLL2, enabling either 3rd or 4th order loop filters without

requiring external components.

Internal loop filter resistor R3 can be set according to Table 85.

Table 85. PLL2_R3_LF, 3 Bits

R24[18:16] RESISTANCE

0 (0x00) 200 Ω

1 (0x01) 1 kΩ

2 (0x02) 2 kΩ

3 (0x03) 4 kΩ

4 (0x04) 16 kΩ

5 (0x05) Reserved

6 (0x06) Reserved

7 (0x07) Reserved

8.6.3.11.5 PLL1_N_DLY

Increasing delay of PLL1_N_DLY will cause the outputs to lead from CLKinX. For use in 0-delay mode.

Table 86. PLL1_N_DLY, 3 Bits

R24[14:12] DEFINITION

0 (0x00) 0 ps

1 (0x01) 205 ps

2 (0x02) 410 ps

3 (0x03) 615 ps

4 (0x04) 820 ps

5 (0x05) 1025 ps

6 (0x06) 1230 ps

7 (0x07) 1435 ps

8.6.3.11.6 PLL1_R_DLY

Increasing delay of PLL1_R_DLY will cause the outputs to lag from CLKinX. For use in 0-delay mode.

Table 87. PLL1_R_DLY, 3 Bits

R24[10:8] DEFINITION

0 (0x00) 0 ps

1 (0x01) 205 ps

2 (0x02) 410 ps

3 (0x03) 615 ps

4 (0x04) 820 ps

5 (0x05) 1025 ps

6 (0x06) 1230 ps

7 (0x07) 1435 ps

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8.6.3.11.7 PLL1_WND_SIZE

PLL1_WND_SIZE sets the window size used for digital lock detect for PLL1. If the phase error between the

reference and feedback of PLL1 is less than specified time, then the PLL1 lock counter increments.

Refer to Digital Lock Detect Frequency Accuracy for more information.

Table 88. PLL1_WND_SIZE, 2 Bits

R24[7:6] DEFINITION

0 5.5 ns

1 10 ns

2 18.6 ns

3 40 ns

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8.6.3.12 Register 25

8.6.3.12.1 DAC_CLK_DIV

The DAC update clock frequency is the PLL1 phase detector frequency divided by the divisor listed in Table 89.

Table 89. DAC_CLK_DIV, 10 Bits

R25[31:22] DIVIDE

0 (0x00) Reserved

1 (0x01) 1

2 (0x02) 2

3 (0x03) 3

... ...

1,022 (0x3FE) 1022

1,023 (0x3FF) 1023

8.6.3.12.2 PLL1_DLD_CNT

The reference and feedback of PLL1 must be within the window of phase error as specified by PLL1_WND_SIZE

for this many phase detector cycles before PLL1 digital lock detect is asserted.

Refer to Digital Lock Detect Frequency Accuracy for more information.

Table 90. PLL1_DLD_CNT, 14 Bits

R25[19:6] VALUE

0 (0x0000) Reserved

1 (0x0001) 1

2 (0x0002) 2

3 (0x0003) 3

... ...

16,382 (0x3FFE) 16,382

16,383 (0x3FFF) 16,383

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8.6.3.13 Register 26

8.6.3.13.1 PLL2_WND_SIZE

PLL2_WND_SIZE sets the window size used for digital lock detect for PLL2. If the phase error between the

reference and feedback of PLL2 is less than specified time, then the PLL2 lock counter increments. This value

must be programmed to 2 (3.7 ns).

Refer to Digital Lock Detect Frequency Accuracy for more information.

Table 91. PLL2_WND_SIZE, 2 Bits

R26[31:30] DEFINITION

0 (0x00) Reserved

1 (0x01) Reserved

2 (0x02) 3.7 ns

3 (0x03) Reserved

8.6.3.13.2 EN_PLL2_REF_2X, PLL2 Reference Frequency Doubler

Enabling the PLL2 reference frequency doubler allows for higher phase detector frequencies on PLL2 than would

normally be allowed with the given VCXO or Crystal frequency.

Higher phase detector frequencies reduces the PLL N values which makes the design of wider loop bandwidth

filters possible.

Table 92. EN_PLL2_REF_2X

R26[29] DESCRIPTION

0 Reference frequency normal

1 Reference frequency doubled (2x). See PLL2 Frequency Doubler

8.6.3.13.3 PLL2_CP_POL, PLL2 Charge Pump Polarity

PLL2_CP_POL sets the charge pump polarity for PLL2. The internal VCO requires the negative charge pump

polarity to be selected. Many VCOs use positive slope.

A positive slope VCO increases output frequency with increasing voltage. A negative slope VCO decreases

output frequency with increasing voltage.

Table 93. PLL2_CP_POL

R26[28] DESCRIPTION

0 Negative Slope VCO/VCXO

1 Positive Slope VCO/VCXO

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8.6.3.13.4 PLL2_CP_GAIN, PLL2 Charge Pump Current

This bit programs the PLL2 charge pump output current level. Table 94 also illustrates the impact of the PLL2

TRI-STATE bit in conjunction with PLL2_CP_GAIN.

Table 94. PLL2_CP_GAIN, 2 Bits

PLL2_CP_TRI

R26[27:26] CHARGE PUMP CURRENT (µA)

R26[5]

X 1 Hi-Z

0 (0x00) 0 100

1 (0x01) 0 400

2 (0x02) 0 1600

3 (0x03) 0 3200

8.6.3.13.5 PLL2_DLD_CNT

The reference and feedback of PLL2 must be within the window of phase error as specified by PLL2_WND_SIZE

for PLL2_DLD_CNT cycles before PLL2 digital lock detect is asserted.

Refer to Digital Lock Detect Frequency Accuracy for more information

Table 95. PLL2_DLD_CNT, 14 Bits

R26[19:6] VALUE

0 (0x00) Reserved

1 (0x01) 1

2 (0x02) 2

3 (0x003) 3

... ...

16,382 (0x3FFE) 16,382

16,383 (0x3FFF) 16,383

8.6.3.13.6 PLL2_CP_TRI, PLL2 Charge Pump TRI-STATE

This bit allows for the PLL2 charge pump output pin, CPout2, to be placed into TRI-STATE.

Table 96. PLL2_CP_TRI

R26[5] DESCRIPTION

0 PLL2 CPout2 is active

1 PLL2 CPout2 is at TRI-STATE

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8.6.3.14 REGISTER 27

8.6.3.14.1 PLL1_CP_POL, PLL1 Charge Pump Polarity

PLL1_CP_POL sets the charge pump polarity for PLL1. Many VCXOs use positive slope.

A positive slope VCXO increases output frequency with increasing voltage. A negative slope VCXO decreases

output frequency with increasing voltage.

Table 97. PLL1_CP_POL

R27[28] DESCRIPTION

0 Negative Slope VCO/VCXO

1 Positive Slope VCO/VCXO

8.6.3.14.2 PLL1_CP_GAIN, PLL1 Charge Pump Current

This bit programs the PLL1 charge pump output current level. Table 98 also illustrates the impact of the PLL1

TRI-STATE bit in conjunction with PLL1_CP_GAIN.

Table 98. PLL1_CP_GAIN, 2 Bits

PLL1_CP_TRI

R26[27:26] CHARGE PUMP CURRENT (µA)

R27[5]

X 1 Hi-Z

0 (0x00) 0 100

1 (0x01) 0 200

2 (0x02) 0 400

3 (0x03) 0 1600

8.6.3.14.3 CLKinX_PreR_DIV

The pre-R dividers before the PLL1 R divider can be programmed such that when the active clock input is

switched, the frequency at the input of the PLL1 R divider will be the same. This allows PLL1 to stay in lock

without needing to re-program the PLL1 R register when different clock input frequencies are used. This is

especially useful in the auto CLKin switching modes.

Table 99. CLKinX_PreR_DIV Programming Addresses

CLKinX_PreR_DIV PROGRAMMING ADDRESS

CLKin1_PreR_DIV R27[23:22]

CLKin0_PreR_DIV R27[21:20]

Table 100. CLKinX_PreR_DIV, 2 Bits

R27[23:22, 21:20] DIVIDE

0 (0x00) 1

1 (0x01) 2

2 (0x02) 4

3 (0x03) 8

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8.6.3.14.4 PLL1_R, PLL1 R Divider

The reference path into the PLL1 phase detector includes the PLL1 R divider. Refer to PLL Programming for

more information on how to program the PLL dividers to lock the PLL.

The valid values for PLL1_R are shown in Table 101.

Table 101. PLL1_R, 14 Bits

R27[19:6] DIVIDE

0 (0x00) Reserved

1 (0x01) 1

2 (0x02) 2

3 (0x03) 3

... ...

16,382 (0x3FFE) 16,382

16,383 (0x3FFF) 16,383

8.6.3.14.5 PLL1_CP_TRI, PLL1 Charge Pump TRI-STATE

This bit allows for the PLL1 charge pump output pin, CPout1, to be placed into TRI-STATE.

Table 102. PLL1_CP_TRI

R27[5] DESCRIPTION

0 PLL1 CPout1 is active

1 PLL1 CPout1 is at TRI-STATE

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8.6.3.15 Register 28

8.6.3.15.1 PLL2_R, PLL2 R Divider

The reference path into the PLL2 phase detector includes the PLL2 R divider.

Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.

The valid values for PLL2_R are shown in Table 103.

Table 103. PLL2_R, 12 Bits

R28[31:20] DIVIDE

0 (0x00) Not Valid

1 (0x01) 1(1).

See PLL2 Frequency Doubler

2 (0x02) 2

3 (0x03) 3

... ...

4,094 (0xFFE) 4,094

4,095 (0xFFF) 4,095

(1) When using PLL2_R divide value of 1, the PLL2 reference doubler should be used (EN_PLL2_REF_2X = 1).

8.6.3.15.2 PLL1_N, PLL1 N Divider

The feedback path into the PLL1 phase detector includes the PLL1 N divider.

Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.

The valid values for PLL1_N are shown in Table 104.

Table 104. PLL1_N, 14 Bits

R28[19:6] DIVIDE

0 (0x00) Not Valid

1 (0x01) 1

2 (0x02) 2

... ...

4,095 (0xFFF) 4,095

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8.6.3.16 Register 29

8.6.3.16.1 OSCin_FREQ, PLL2 Oscillator Input Frequency Register

The frequency of the PLL2 reference input to the PLL2 Phase Detector (OSCin/OSCin* port) must be

programmed in order to support proper operation of the frequency calibration routine which locks the internal

VCO to the target frequency.

Table 105. OSCin_FREQ, 3 Bits

R29[26:24] OSCin FREQUENCY

0 (0x00) 0 to 63 MHz

1 (0x01) >63 MHz to 127 MHz

2 (0x02) >127 MHz to 255 MHz

3 (0x03) Reserved

4 (0x04) >255 MHz to 400 MHz

8.6.3.16.2 PLL2_FAST_PDF, High PLL2 Phase Detector Frequency

When PLL2 phase detector frequency is greater than 100 MHz, set the PLL2_FAST_PDF to ensure proper

operation of device.

Table 106. PLL2_FAST_PDF

R29[23] PLL2 PDF

Less than or

0equal to 100 MHz

1 Greater than 100 MHz

8.6.3.16.3 PLL2_N_CAL, PLL2 N Calibration Divider

During the frequency calibration routine, the PLL uses the divide value of the PLL2_N_CAL register instead of

the divide value of the PLL2_N register to lock the VCO to the target frequency.

NOTE: Unless in 0-delay mode, PLL2_N_CAL should be set equal to PLL2_N

Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.

Table 107. PLL2_N_CAL, 18 Bits

R29[22:5] DIVIDE

0 (0x00) Not Valid

1 (0x01) 1

2 (0x02) 2

... ...

262,143 (0x3FFFF) 262,143

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8.6.3.17 Register 30

If an internal VCO mode is used, programming Register 30 triggers the frequency calibration routine. This

calibration routine will also generate a SYNC event. See Clock Output Synchronization (SYNC) for more details

on a SYNC.

8.6.3.17.1 PLL2_P, PLL2 N Prescaler Divider

The PLL2 N Prescaler divides the output of the VCO as selected by VCO_MUX and is connected to the PLL2 N

divider.

Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.

Table 108. PLL2_P, 3 Bits

R30[26:24] DIVIDE VALUE

0 (0x00) 8

1 (0x01) 2

2 (0x02) 2

3 (0x03) 3

4 (0x04) 4

5 (0x05) 5

6 (0x06) 6

7 (0x07) 7

8.6.3.17.2 PLL2_N, PLL2 N Divider

The feeback path into the PLL2 phase detector includes the PLL2 N divider.

Each time register 30 is updated via the MICROWIRE interface, a frequency calibration routine runs to lock the

VCO to the target frequency. During this calibration PLL2_N is substituted with PLL2_N_CAL.

Refer to PLL Programming for more information on how to program the PLL dividers to lock the PLL.

The valid values for PLL2_N are shown in Table 109.

Table 109. PLL2_N, 18 Bits

R30[22:5] DIVIDE

0 (0x00) Not Valid

1 (0x01) 1

2 (0x02) 2

...

262,143 (0x3FFFF) 262,143

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8.6.3.18 Register 31

8.6.3.18.1 READBACK_LE

Sets the required state of the LEuWire pin when performing register readback.

Refer to Readback.

Table 110. READBACK_LE

R31[21] DEFINITION

0 LE must be low for readback

1 LE must be high for readback

8.6.3.18.2 READBACK_ADDR

Sets the address of the register to read back when performing readback.

When reading register 12, the READBACK_ADDR will be read back at R12[20:16].

When reading back from R31 bits 6 to 31 should be ignored. Only uWire_LOCK is valid.

Refer to Register Readback for more information on readback.

Table 111. READBACK_ADDR, 5 Bits

R31[20:16] REGISTER

0 (0x00) R0

1 (0x01) R1

2 (0x02) R2

3 (0x03) R3

4 (0x04) R4

5 (0x05) R5

6 (0x06) R6

7 (0x07) R7

8 (0x08) R8

9 (0x09) Reserved

10 (0x0A) R10

11 (0x0B) R11

12 (0x0C) R12

13 (0x0D) R13

14 (0x0E) R14

15 (0x0F) R15

16 (0x10) Reserved

17 (0x11) Reserved

... ...

22 (0x16) Reserved

23 (0x17) Reserved

24 (0x18) R24

25 (0x19) R25

26 (0x1A) R26

27 (0x1B) R27

28 (0x1C) R28

29 (0x1D) R29

30 (0x1E) R30

31 (0x1F) R31

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8.6.3.18.3 uWire_LOCK

Setting uWire_LOCK will prevent any changes to uWire registers R0 to R30. Only by clearing the uWire_LOCK

bit in R31 can the uWire registers be unlocked and written to once more.

It is not necessary to lock the registers to perform a readback operation.

Table 112. uWire_LOCK

R31[5] STATE

0 Registers unlocked

1 Registers locked, Write-protect

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

To assist customers in frequency planning and design of loop filters, Texas Instruments provides the Clock

Design Tool and Clock Architect.

9.1.1 Loop Filter

Each PLL of the LMK0480x family requires a dedicated loop filter.

9.1.1.1 PLL1

The loop filter for PLL1 must be connected to the CPout1 pin. Figure 20 shows a simple 2-pole loop filter. The

output of the filter drives an external VCXO module or discrete implementation of a VCXO using a crystal

resonator and external varactor diode. Higher order loop filters may be implemented using additional external R

and C components. It is recommended the loop filter for PLL1 result in a total closed loop bandwidth in the range

of 10 Hz to 200 Hz. The design of the loop filter is application specific and highly dependent on parameters such

as the phase noise of the reference clock, VCXO phase noise, and phase detector frequency for PLL1. TI's

Clock Conditioner Owner’s Manual covers this topic in detail and Texas Instruments Clock Design Tool can be

used to simulate loop filter designs for both PLLs. These resources may be found at:

http://www.ti.com/lsds/ti/analog/clocksandtimers/clocks_and_timers.page

9.1.1.2 PLL2

As shown in Figure 20, the charge pump for PLL2 is directly connected to the optional internal loop filter

components, which are normally used only if either a third or fourth pole is needed. The first and second poles

are implemented with external components. The loop must be designed to be stable over the entire application-

specific tuning range of the VCO. The designer should note the range of KVCO listed in the table of Electrical

Characteristics and how this value can change over the expected range of VCO tuning frequencies. Because

loop bandwidth is directly proportional to KVCO, the designer should model and simulate the loop at the expected

extremes of the desired tuning range, using the appropriate values for KVCO.

When designing with the integrated loop filter of the LMK0480x family, considerations for minimum resistor

thermal noise often lead one to the decision to design for the minimum value for integrated resistors, R3 and R4.

Both the integrated loop filter resistors (R3 and R4) and capacitors (C3 and C4) also restrict the maximum loop

bandwidth. However, these integrated components do have the advantage that they are closer to the VCO and

can therefore filter out some noise and spurs better than external components. For this reason, a common

strategy is to minimize the internal loop filter resistors and then design for the largest internal capacitor values

that permit a wide enough loop bandwidth. In situations where spur requirements are very stringent and there is

margin on phase noise, a feasible strategy would be to design a loop filter with integrated resistor values larger

than their minimum value.

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0.1 PF

0.1 PFLMK0480x

Input

100:

100:Trace

(Differential)

CLKinX

CLKinX*

LVPECL

Ref Clk

240:240:

0.1 PF

0.1 PFLMK0480x

Input

100:

100:Trace

(Differential)

CLKinX

CLKinX*

LVDS

PLL2

Phase

Detector

R3 R4

LMK0480x PLL2

PLL2 Internal Loop Filter

PLL2 External Loop

Filter

LMK0480x PLL1

PLL1 External Loop

Filter

CPout2

External VCXO

Internal VCO

PLL1

Phase

Detector

LF1_C2

LF1_R2

LF1_C1

CPout1

LF2_C2

LF2_R2

LF2_C1

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Application Information (continued)

Figure 20. PLL1 and PLL2 Loop Filters

9.1.2 Driving CLKin and OSCin Inputs

9.1.2.1 Driving CLKin Pins with a Differential Source

Both CLKin ports can be driven by differential signals. It is recommended that the input mode be set to bipolar

(CLKinX_BUF_TYPE = 0) when using differential reference clocks. The LMK0480x family internally biases the

input pins so the differential interface should be AC coupled. The recommended circuits for driving the CLKin

pins with either LVDS or LVPECL are shown in Figure 21 and Figure 22.

Figure 21. CLKinX/X* Termination for an LVDS Reference Clock Source

Figure 22. CLKinX/X* Termination for an LVPECL Reference Clock Source

Finally, a reference clock source that produces a differential sine wave output can drive the CLKin pins using the

following circuit. Note: the signal level must conform to the requirements for the CLKin pins listed in Electrical

Characteristics.

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0.1 PF

50:Trace

50:LMK0480x

Clock Source

CLKinX

CLKinX*

0.1 PF

0.1 PFLMK0480x

Input

100:

100:Trace

(Differential)

Differential

Sinewave Clock

Source

CLKinX

CLKinX*

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Application Information (continued)

Figure 23. CLKinX/X* Termination for a Differential Sinewave Reference Clock Source

9.1.2.2 Driving CLKin Pins with a Single-Ended Source

The CLKin pins of the LMK0480x family can be driven using a single-ended reference clock source, for example,

either a sine wave source or an LVCMOS/LVTTL source. Either AC coupling or DC coupling may be used. In the

case of the sine wave source that is expecting a 50-Ωload, it is recommended that AC coupling be used as

shown in Figure 24 with a 50-Ωtermination.

NOTE

The signal level must conform to the requirements for the CLKin pins listed in Electrical

Characteristics. CLKinX_BUF_TYPE in Register 11 is recommended to be set to bipolar

mode (CLKinX_BUF_TYPE = 0).

Figure 24. CLKinX/X* Single-Ended Termination

If the CLKin pins are being driven with a single-ended LVCMOS/LVTTL source, either DC coupling or AC

coupling may be used. If DC coupling is used, the CLKinX_BUF_TYPE should be set to MOS buffer mode

(CLKinX_BUF_TYPE = 1) and the voltage swing of the source must meet the specifications for DC coupled,

MOS-mode clock inputs given in the table of Electrical Characteristics. If AC coupling is used, the

CLKinX_BUF_TYPE should be set to the bipolar buffer mode (CLKinX_BUF_TYPE = 0). The voltage swing at

the input pins must meet the specifications for AC coupled, bipolar mode clock inputs given in the table of

Electrical Characteristics. In this case, some attenuation of the clock input level may be required. A simple

resistive divider circuit before the AC coupling capacitor is sufficient.

Figure 25. DC Coupled LVCMOS/LVTTL Reference Clock

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CLKoutX*

LVPECL

Receiver

50:

100:Trace

(Differential)

50:

Vcc - 2 V

LVPECL

Driver

CLKoutX

CLKoutX*

LVDS

Receiver

100:

100:Trace

(Differential)

LVDS

Driver

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Application Information (continued)

9.1.3 Termination and Use of Clock Output (Drivers)

When terminating clock drivers keep in mind these guidelines for optimum phase noise and jitter performance:

• Transmission line theory should be followed for good impedance matching to prevent reflections.

• Clock drivers should be presented with the proper loads. For example:

– LVDS drivers are current drivers and require a closed current loop.

– LVPECL drivers are open emitters and require a DC path to ground.

• Receivers should be presented with a signal biased to their specified DC bias level (common mode voltage)

for proper operation. Some receivers have self-biasing inputs that automatically bias to the proper voltage

level. In this case, the signal should normally be AC coupled.

It is possible to drive a non-LVPECL or non-LVDS receiver with an LVDS or LVPECL driver as long as the above

guidelines are followed. Check the datasheet of the receiver or input being driven to determine the best

termination and coupling method to be sure that the receiver is biased at its optimum DC voltage (common mode

voltage). For example, when driving the OSCin/OSCin* input of the LMK0480x family, OSCin/OSCin* should be

AC coupled because OSCin/OSCin* biases the signal to the proper DC level (See Figure 39) This is only slightly

different from the AC coupled cases described in Driving CLKin Pins with a Single-Ended Source because the

DC blocking capacitors are placed between the termination and the OSCin/OSCin* pins, but the concept remains

the same. The receiver (OSCin/OSCin*) sets the input to the optimum DC bias voltage (common mode voltage),

not the driver.

9.1.3.1 Termination for DC Coupled Differential Operation

For DC coupled operation of an LVDS driver, terminate with 100 Ωas close as possible to the LVDS receiver as

shown in Figure 26.

Figure 26. Differential LVDS Operation, DC Coupling, No Biasing of the Receiver

For DC coupled operation of an LVPECL driver, terminate with 50 Ωto VCC - 2 V as shown in Figure 27.

Alternatively, terminate with a Thevenin equivalent circuit (120-Ωresistor connected to VCC and an 82-Ωresistor

connected to ground with the driver connected to the junction of the 120-Ωand 82-Ωresistors) as shown in

Figure 28 for VCC = 3.3 V.

Figure 27. Differential LVPECL Operation, DC Coupling

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0.1 PF

LVDS

Receiver

100:Trace

(Differential)

LVDS

Driver

100:

CLKoutX

CLKoutX*

0.1 PF

LVDS

Receiver

50:

100:Trace

(Differential)

LVDS

Driver

50:

Vbias

CLKoutX

CLKoutX*

LVPECL

Receiver

120:

100:Trace

(Differential)

120:

Vcc

LVPECL

Driver

82:82:

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Application Information (continued)

Figure 28. Differential LVPECL Operation, DC Coupling, Thevenin Equivalent

9.1.3.2 Termination for AC Coupled Differential Operation

AC coupling allows for shifting the DC bias level (common mode voltage) when driving different receiver

standards. Since AC coupling prevents the driver from providing a DC bias voltage at the receiver it is important

to ensure the receiver is biased to its ideal DC level.

When driving non-biased LVDS receivers with an LVDS driver, the signal may be AC coupled by adding DC

blocking capacitors, however the proper DC bias point needs to be established at the receiver. One way to do

this is with the termination circuitry in Figure 29.

Figure 29. Differential LVDS Operation, AC Coupling,

External Biasing at the Receiver

Some LVDS receivers may have internal biasing on the inputs. In this case, the circuit shown in Figure 29 is

modified by replacing the 50-Ωterminations to Vbias with a single 100-Ωresistor across the input pins of the

receiver, as shown in Figure 30. When using AC coupling with LVDS outputs, there may be a startup delay

observed in the clock output due to capacitor charging. The previous figures employ a 0.1 µF capacitor. This

value may need to be adjusted to meet the startup requirements for a particular application.

Figure 30. LVDS Termination for a Self-Biased Receiver

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CLKoutX

CLKoutX*

50:Trace

120:

Load

Vcc

82:

120:

Vcc

LVPECL

Driver

CLKoutX

CLKoutX* 50:

50:Trace

50:

Load

Vcc - 2V

LVPECL

Driver

CLKoutX

CLKoutX*

120:120:

0.1 PF

0.1 PFLVPECL

Receiver

100:Trace

(Differential)

LVPECL

Driver

82:

120:

Vcc

82:

120:

Vcc

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Application Information (continued)

LVPECL drivers require a DC path to ground. When AC coupling an LVPECL signal use 120-Ωemitter resistors

close to the LVPECL driver to provide a DC path to ground as shown in Figure 31. For proper receiver operation,

the signal should be biased to the DC bias level (common mode voltage) specified by the receiver. The typical

DC bias voltage for LVPECL receivers is 2 V. A Thevenin equivalent circuit (82-Ωresistor connected to VCC and

a 120-Ωresistor connected to ground with the driver connected to the junction of the 82-Ωand 120-Ωresistors)

is a valid termination as shown in Figure 31 for VCC = 3.3 V. Note this Thevenin circuit is different from the DC

coupled example in Figure 28.

Figure 31. Differential LVPECL Operation, AC Coupling, Thevenin Equivalent,

External Biasing at the Receiver

9.1.3.3 Termination for Single-Ended Operation

A balun can be used with either LVDS or LVPECL drivers to convert the balanced, differential signal into an

unbalanced, single-ended signal.

It is possible to use an LVPECL driver as one or two separate 800 mVpp signals. When using only one LVPECL

driver of a CLKoutX/CLKoutX* pair, be sure to properly terminate the unused driver. When DC coupling one of

the LMK0480x family clock LVPECL drivers, the termination should be 50 Ωto VCC - 2 V as shown in Figure 32.

The Thevenin equivalent circuit is also a valid termination as shown in Figure 33 for Vcc = 3.3 V.

Figure 32. Single-Ended LVPECL Operation, DC Coupling

Figure 33. Single-Ended LVPECL Operation, DC Coupling,

Thevenin Equivalent

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CLKoutX

CLKoutX*

120:

0.1 PF

50:Trace

50:

Load

50:

LVPECL

Driver

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Application Information (continued)

When AC coupling an LVPECL driver use a 120-Ωemitter resistor to provide a DC path to ground and ensure a

50-Ωtermination with the proper DC bias level for the receiver. The typical DC bias voltage for LVPECL

receivers is 2 V (See Driving CLKin Pins with a Single-Ended Source). If the companion driver is not used it

should be terminated with either a proper AC or DC termination. This latter example of AC coupling a single-

ended LVPECL signal can be used to measure single-ended LVPECL performance using a spectrum analyzer or

phase noise analyzer. When using most RF test equipment no DC bias point (0 VDC) is required for safe and

proper operation. The internal 50-Ωtermination of the test equipment correctly terminates the LVPECL driver

being measured as shown in Figure 34.

Figure 34. Single-Ended LVPECL Operation, AC Coupling

9.1.4 Frequency Planning with the LMK0480x Family

Calculating the value of the output dividers for use with the LMK0480x family is simple due to the architecture of

the LMK0480x. That is, the VCO divider may be bypassed and the clock output dividers allow for even and odd

output divide values from 2 to 1045. For most applications it is recommended to bypass the VCO divider.

The procedure for determining the needed LMK0480x device and clock output divider values for a set of clock

output frequencies is straightforward.

1. Calculate the least common multiple (LCM) of the clock output frequencies.

2. Determine which VCO ranges will support the target clock output frequencies given the LCM.

3. Determine the clock output divide values based on VCO frequency.

4. Determine the PLL2_P, PLL2_N, and PLL2_R divider values given the OSCin VCXO or crystal frequency

and VCO frequency.

For example, given the following target output frequencies: 200 MHz, 120 MHz, and 25 MHz with a VCXO

frequency of 40 MHz:

•First determine the LCM of the three frequencies. LCM(200 MHz, 120 MHz, 25 MHz) = 600 MHz. The LCM

frequency is the lowest frequency for which all of the target output frequencies are integer divisors of the

LCM. Note: if there is one frequency which causes the LCM to be very large, greater than 3 GHz for

example, determine if there is a single frequency requirement which causes this. It may be possible to select

the VCXO/crystal frequency to satisfy this frequency requirement through OSCout or CLKout6/7/8/9 driven by

OSCin. In this way it is possible to get non-integer related frequencies at the outputs.

•Second, since the LCM is not in a VCO frequency range supported by the LMK0480x family, multiply the

LCM frequency by an integer which causes it to fall into a valid VCO frequency range of an LMK0480x

device. In this case 600 MHz * 5 = 3000 MHz which is valid for the LMK04808.

•Third, continuing the example by using a VCO frequency of 3000 MHz and the LMK04808, the CLKout

dividers can be calculated by simply dividing the VCO frequency by the output frequency. To output 200 MHz,

120 MHz, and 25 MHz the output dividers will be 12, 20, and 96 respectively.

– 3000 MHz / 200 MHz = 15

– 3000 MHz / 120 MHz = 25

– 3000 MHz / 25 MHz = 120

•Fourth, PLL2 must be locked to its input reference. Refer to PLL Programming for more information on this

topic. By programming the clock output dividers and the PLL2 dividers the VCO can lock to the frequency of

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Application Information (continued)

3000 MHz and the clock outputs dividers will each divide the VCO frequency down to the target output

frequencies of 200 MHz, 120 MHz, and 25 MHz.

Refer to Application Note AN-1865, Frequency Synthesis and Planning for PLL Architectures (SNAA061) for

more information on this topic and LCM calculations.

9.1.5 PLL Programming

To lock a PLL the divided reference and divided feedback from VCO or VCXO must result in the same phase

detector frequency. The tables below illustrate how the divides are structured for the reference path (R) and

feedback path (N) depending on the MODE of the device.

Table 113. PLL1 Phase Detector Frequency — Reference Path (R)

MODE PLL1 PDF (R) =

All CLKinX Frequency / (CLKinX_PreR_DIV * PLL1_R)

Table 114. PLL1 Phase Detector Frequency — Feedback Path (N)

MODE VCO_MUX OSCout0 PLL1 PDF (N) =

— Bypass VCXO Frequency / PLL1_N

Dual PLL, Internal VCO — Divided VCXO Frequency / (OSCin_DIV * PLL1_N)

Bypass — VCO Frequency / (CLKoutX_Y_DIV * PLL1_N) (1)

Dual PLL, Internal VCO, 0-Delay Divided — VCO Frequency / (VCO_DIV * CLKoutX_Y_DIV * PLL1_N) (1)

Dual PLL, External VCO, 0-Delay — — VCO Frequency / (CLKoutX_Y_DIV * PLL1_N) (1)

(1) The actual CLKoutX_Y_DIV used is selected by the feedback mux. See EN_FEEDBACK_MUX.

Table 115. PLL2 Phase Detector Frequency — Reference Path (R)

EN_PLL2_REF_2X PLL2 PDF (R) =

Disabled OSCin Frequency / PLL2_R(1)(2)

Enabled OSCin Frequency * 2 / PLL2_R(1)(2)

(1) For applications in which the OSCin frequency and PLL2 phase detector frequency are equal, the best PLL2 in-band noise can be

achieved when the doubler is enabled (EN_PLL2_REF_2X = 1) and the PLL2 R divide value is 2. Do not use doubler disabled

(EN_PLL2_REF_2X = 0) and PLL2 R divide value of 1.

(2) See PLL2 Frequency Doubler

Table 116. PLL2 Phase Detector Frequency — Feedback Path (N)

MODE VCO_MUX PLL2 PDF (N) =

Dual PLL, Internal VCO

Dual PLL, Internal VCO, 0-Delay VCO VCO Frequency / (PLL2_P * PLL2_N)

Single PLL, Internal VCO

Dual PLL, Internal VCO

Dual PLL, Internal VCO, 0-Delay VCO Divider VCO Frequency / (VCO_DIV * PLL2_P * PLL2_N)

Single PLL, Internal VCO

Dual PLL, External VCO

Dual PLL External VCO, 0-Delay — VCO Frequency / (PLL2_P * PLL2_N)

Single PLL, External VCO VCO VCO Frequency / (CLKoutX_Y_DIV * PLL2_N)

Single PLL, Internal VCO, 0-Delay VCO Divider VCO Frequency / (VCO_DIV * CLKoutX_Y_DIV * PLL2_N)

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Table 117. PLL2 Phase Detector Frequency — Feedback Path (N) during VCO Frequency Calibration

MODE VCO_MUX PLL2 PDF (N_CAL) =

VCO VCO Frequency / (PLL2_P * PLL2_N_CAL)

All Internal VCO

Modes VCO Divider VCO Frequency / (VCO_DIV * PLL2_P * PLL2_N_CAL)

9.1.5.1 Example PLL2 N Divider Programming

To program PLL2 to lock an LMK04808 using Dual PLL mode to a VCO frequency of 3000 MHz using a 40 MHz

VCXO reference, first determine the total PLL2 N divide value. This is VCO Frequency / PLL2 phase detector

frequency. This example assumes the PLL2 reference frequency doubler is enabled and a PLL2 R divide value

of 2 (see Note 1 in Table 115) which results in PLL2 phase detector frequency the same as PLL2 reference

frequency (40 MHz). 3000 MHz / 40 MHz = 75, so the total PLL2 N divide value is 75.

The dividers in the PLL2 N feedback path for Dual PLL mode include PLL2_P and PLL2_N. PLL2_P can be

programmed from 2 to 8 including both even and odd values. PLL2_N can be programmed from 1 to 263,143

including both even and odd values. Since the total PLL2 N divide value of 75 contains the factors 3, 5, and 5, it

would be allowable to program PLL2_P to 3 or 5. It is simplest to use the smallest divide, so PLL2_P = 3, and

PLL2_N = 25 which results in a Total PLL2 N = 75.

For this example and in most cases, PLL2_N_CAL will have the same value as PLL2_N. However when using

Single PLL mode with 0-delay, the values will differ. When using an external VCO, PLL2_N_CAL value is

unused.

To lock a PLL the divided reference and divided feedback from VCO or VCXO must result in the same phase

detector frequency. The following tables illustrate how the divides are structured for the reference path (R) and

feedback path (N) depending on the MODE of the device.

Table 118. PLL1 Phase Detector Frequency — Reference Path (R)

MODE (R) PLL1 PDF =

All CLKinX Frequency / CLKinX_PreR_DIV / PLL1_R

Table 119. PLL1 Phase Detector Frequency — Feedback Path (N)

MODE VCO_MUX OSCout0 PLL1 PDF (N) =

— Bypass VCXO Frequency / PLL1_N

Internal VCO Dual PLL — Divided VCXO Frequency / OSCin_DIV / PLL1_N

Bypass — VCO Frequency / CLKoutX_Y_DIV / PLL1_N (1)

Internal VCO /w 0-delay Divided — VCO Frequency / VCO_DIV / CLKoutX_Y_DIV / PLL1_N (1)

(1) The actual CLKoutX_Y_DIV used is selected by FEEDBACK_MUX.

Table 120. PLL2 Phase Detector Frequency — Reference Path (R)

EN_PLL2_REF_2X PLL2 PDF (R) =

Disabled OSCin Frequency / PLL2_R(1)

Enabled OSCin Frequency * 2 / PLL2_R(1)

(1) For applications in which the OSCin frequency and PLL2 phase detector frequency are equal, the best PLL2 in-band noise can be

achieved when the doubler is enabled (EN_PLL2_REF_2X = 1) and the PLL2 R divide value is 2. Do not use doubler disabled

(EN_PLL2_REF_2X = 0) and PLL2 R divide value of 1.

Table 121. PLL2 Phase Detector Frequency — Feedback Path (N)

MODE VCO_MUX PLL2 PDF (N) =

Dual PLL

Dual PLL /w 0-delay VCO VCO Frequency / PLL2_P / PLL2_N

Single PLL

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2e6 × PLLX_WND_SIZE × fPDX

PLLX_DLD_CNT

ppm =

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Table 121. PLL2 Phase Detector Frequency — Feedback Path (N) (continued)

MODE VCO_MUX PLL2 PDF (N) =

Dual PLL

Dual PLL /w 0-delay VCO Divider VCO Frequency / VCO_DIV / PLL2_P / PLL2_N

Single PLL

Dual PLL External VCO — VCO Frequency / VCO_DIV / PLL2_P / PLL2_N

Dual PLL External VCO /w 0-delay VCO VCO Frequency / CLKoutX_Y_DIV / PLL2_N

Single PLL /w 0-delay VCO Divider VCO Frequency / VCO_DIV / CLKoutX_Y_DIV / PLL2_N

Table 122. PLL2 Phase Detector Frequency — Feedback Path (N) during VCO Frequency Calibration

MODE VCO_MUX PLL2 PDF (N_CAL) =

VCO VCO Frequency / PLL2_P / PLL2_N_CAL

All Internal VCO Modes VCO Divider VCO Frequency / VCO_DIV / PLL2_P / PLL2_N_CAL

9.1.5.1.1 Example PLL2 N Divider Programming

To program PLL2 to lock an LMK04808 using Dual PLL mode to a VCO frequency of 3000 MHz using a 40-MHz

VCXO reference, first determine the total PLL2 N divide value. This is VCO Frequency / PLL2 phase detector

frequency. This example assumes a PLL2 R divide value of 1 which results in PLL2 phase detector frequency

the same as PLL2 reference frequency (40 MHz). 3000 MHz / 40 MHz = 75, so the total PLL2 N divide value is

75.

The dividers in the PLL2 N feedback path for Dual PLL mode include PLL2_P and PLL2_N. PLL2_P can be

programmed from 2 to 8, including both even and odd values. PLL2_N can be programmed from 1 to 263,143,

including both even and odd values. Since the total PLL2 N divide value of 75 contains the factors 3, 5, and 5, it

would be allowable to program PLL2_P to 3 or 5. It is simplest to use the smallest divide, so PLL2_P = 3, and

PLL2_N = 25 which results in a Total PLL2 N = 75.

For this example and in most cases, PLL2_N_CAL will have the same value as PLL2_N. However when using

Single PLL mode with 0-delay, the values will differ. When using an external VCO, PLL2_N_CAL value is

unused.

9.1.6 Digital Lock Detect Frequency Accuracy

The digital lock detect circuit is used to determine PLL1 locked, PLL2 locked, and holdover exit events. A window

size and lock count register are programmed to set a ppm frequency accuracy of reference to feedback signals

of the PLL for each event to occur. When a PLL digital lock event occurs the PLL's digital lock detect is asserted

true. When the holdover exit event occurs, the device will exit holdover mode.

Table 123. Digital Lock Detect Frequency Accuracy Table

EVENT PLL WINDOW SIZE LOCK COUNT

PLL1 Locked PLL1 PLL1_WND_SIZE PLL1_DLD_CNT

PLL2 Locked PLL2 PLL2_WND_SIZE PLL2_DLD_CNT

Holdover exit PLL1 PLL1_WND_SIZE HOLDOVER_DLD_CNT

For a digital lock detect event to occur there must be a “lock count” number of phase detector cycles of PLLX

during which the time/phase error of the PLLX_R reference and PLLX_N feedback signal edges are within the

user programmable "window size." Since there must be at least "lock count" phase detector events before a lock

event occurs, a minimum digital lock event time can be calculated as "lock count" / fPDX where X = 1 for PLL1 or

2 for PLL2.

By using Equation 5, values for a "lock count" and "window size" can be chosen to set the frequency accuracy

required by the system in ppm before the digital lock detect event occurs:

(5)

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16 ¸

§¸

§»

0 digital delay = CLKoutX_Y_DIV u CLKoutX_Y_DIV

+ 0.5 - 11.5

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The effect of the "lock count" value is that it shortens the effective lock window size by dividing the "window size"

by "lock count".

If at any time the PLLX_R reference and PLLX_N feedback signals are outside the time window set by "window

size", then the “lock count” value is reset to 0.

9.1.6.1 Minimum Digital Lock Detect Time Calculation Example

Given a PLL2 phase detector frequency of 40 MHz and PLL2_DLD_CNT value of 10,000, the minimum digital

lock detect time of PLL2 will be 10,000 / 40 MHz = 250 μs.

9.1.7 Calculating Dynamic Digital Delay Values for any Divide

This section explains how to calculate the dynamic digital delay for any divide value.

Dynamic digital delay allows the time offset between two or more clock outputs to be adjusted with no or minimal

interruption of clock outputs. Since the clock outputs are operating at a known frequency, the time offset can also

be expressed as a phase shift. When dynamically adjusting the digital delay of clock outputs with different

frequencies the phase shift should be expressed in terms of the higher frequency clock. The step size of the

smallest time adjustment possible is equal to half the period of the Clock Distribution Path, which is the VCO

frequency (Equation 3) or the VCO frequency divided by the VCO divider (Equation 4) if not bypassed. The

smallest degree phase adjustment with respect to a clock frequency will be 360 * the smallest time adjustment *

the clock frequency. The total number of phase offsets that the LMK0480x family is able to achieve using

dynamic digital delay is equal 1 / (higher clock frequency * the smallest phase adjustment).

Equation 6 calculates the digital delay value that must be programmed for a synchronizing clock to achieve a 0

time/phase offset from the qualifying clock. Once this digital delay value is known, it is possible to calculate the

digital delay value for any phase offset. The qualifying clock for dynamic digital delay is selected by the

FEEDBACK_MUX. When dynamic digital delay is engaged with same clock output used for the qualifying clock

and the new synchronized clock, it is termed relative dynamic digital delay since causing another SYNC event

with the same digital delay value will offset the clock by the same phase once again. The important part of

relative dynamic digital delay is that the CLKoutX_Y_HS must be programmed correctly when the SYNC event

occurs (Table 6). This can result in needing to program the device twice. Once to set the new CLKoutX_Y_DDLY

with CLKoutX_Y_HS as required for the SYNC event, and again to set the CLKoutX_Y_HS to its desired value.

Digital delay values are programmed using the CLKoutX_Y_DDLY and CLKoutX_Y_HS registers as shown in

Equation 7. For example, to achieve a digital delay of 13.5, program CLKoutX_Y_DDLY = 14 and

CLKoutX_Y_HS = 1.

(6)

Equation 6 uses the ceiling operator. To find the ceiling of a fractional number round up. An integer remains the

same value.

Digital delay = CLKoutX_Y_DDLY - (0.5 * CLKoutX_Y_HS) (7)

Note: since the digital delay value for 0 time/phase offset is a function of the qualifying clock's divide value, the

resulting digital delay value can be used for any clock output operating at any frequency to achieve a 0

time/phase offset from the qualifying clock. Therefore the calculated time shift table will also be the same as in

Table 124.

9.1.7.1 Example

Consider a system with:

• A VCO frequency of 2000 MHz.

• The VCO divider is bypassed, therefore the clock distribution path frequency is 2000 MHz.

• CLKout0_1_DIV = 10 resulting in a 200 MHz frequency on CLKout0.

• CLKout2_3_DIV = 20 resulting in a 100 MHz frequency on CLKout2.

For this system the minimum time adjustment is 0.25 ns, which is 0.5 / (2000 MHz). Since the higher frequency

is 200 MHz, phase adjustments will be calculated with respect to the 200 MHz frequency. The 0.25 ns minimum

time adjustment results in a minimum phase adjustment of 18 degrees, which is 360 degrees / 200 MHz * 0.25

ns.

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To calculate the digital delay value to achieve a 0 time/phase shift of CLKout2 when CLKout0 is the qualifying

clock. Solve Equation 6 using the divide value of 10. To solve the equation 16/10 = 1.6, the ceiling of 1.6 is 2.

Then to finish solving the equation solve (2 + 0.5) * 10 - 11.5 = 13.5. A digital delay value of 13.5 is programmed

by setting CLKout2_3_DDLY = 14 and CLKout2_3_HS = 1.

To calculate the digital delay value to achieve a 0 time/phase shift of CLKout0 when CLKout2 is the qualifying

clock, solve Equation 6 using the divide value of CLKout2, which is 20. This results in a digital delay of 18.5

which is programmed as CLKout0_1_DDLY = 19 and CLKout0_1_HS = 1.

Once the 0 time/phase shift digital delay programming value is known a table can be constructed with the digital

delay value to be programmed for any time/phase offset by decrementing or incrementing the digital delay value

by 0.5 for the minimum time/phase adjustment.

A complete filled out table for use of CLKout0 as the qualifying clock is shown in Table 124. It was created by

entering a digital delay of 13.5 for 0 degree phase shift, then decrementing the digital delay down to the minimum

value of 4.5. Since this did not result in all the possible phase shifts, the digital delay was then incremented from

13.5 to 14.0 to complete all possible phase shifts.

Table 124. Example Digital Delay Calculation

CALCULATED TIME SHIFT RELATIVE TIME SHIFT PHASE SHIFT

DIGITAL DELAY (ns) to 200 MHz (ns) of 200 MHz (Degrees)

4.5 -4.5 0.5 36

5 -4.25 0.75 54

5.5 -4.0 1.0 72

6 -3.75 1.25 90

6.5 -3.5 1.5 108

7 -3.25 1.75 126

7.5 -3.0 2.0 144

8 -2.75 2.25 162

8.5 -2.5 2.5 180

9 -2.25 2.75 198

9.5 -2.0 3.0 216

10 -1.75 3.25 234

10.5 -1.5 3.5 252

11 -1.25 3.75 270

11.5 -1.0 4.0 288

12 -0.75 4.25 306

12.5 -0.5 4.5 324

13 -0.25 4.75 342

13.5 0 0 0

14 0.25 0.25 18

14.5 0.5 0.5 36

Observe that the digital delay value of 4.5 and 14.5 will achieve the same relative time shift/phase delay.

However programming a digital delay of 14.5 will result in a clock off time for the synchronizing clock to achieve

the same phase time shift/phase delay.

Digital delay value is programmed as CLKoutX_Y_DDLY - (0.5 * CLKoutX_Y_HS). So to achieve a digital delay

of 13.5, program CLKoutX_Y_DDLY = 14 and CLKoutX_Y_HS = 1. To achieve a digital delay of 14, program

CLKoutX_Y_DDLY = 14 and CLKoutX_Y_HS = 0.

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CL = 6 + 6 + 4= 14 pF

CSTRAY

CL = CTUNE + CIN +

CPout1

LMK0480x

OSCin

OSCin*

PLL1 Loop Filter

XTAL

CC1 = 2.2 nF

CC2 = 2.2 nF

R1 = 4.7k

R3 = 10k

1 nF

R2 = 4.7k

SMV1249-074LF

Copt

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9.1.8 Optional Crystal Oscillator Implementation (OSCin/OSCin*)

The LMK0480x family features supporting circuitry for a discretely implemented oscillator driving the OSCin port

pins. Figure 35 illustrates a reference design circuit for a crystal oscillator:

Figure 35. Reference Design Circuit for Crystal Oscillator Option

This circuit topology represents a parallel resonant mode oscillator design. When selecting a crystal for parallel

resonance, the total load capacitance, CL, must be specified. The load capacitance is the sum of the tuning

capacitance (CTUNE), the capacitance seen looking into the OSCin port (CIN), and stray capacitance due to PCB

parasitics (CSTRAY), and is given by Equation 8.

(8)

CTUNE is provided by the varactor diode shown in Figure 35, Skyworks model SMV1249-074LF. A dual diode

package with common cathode provides the variable capacitance for tuning. The single diode capacitance

ranges from approximately 31 pF at 0.3 V to 3.4 pF at 3 V. The capacitance range of the dual package (anode to

anode) is approximately 15.5 pF at 3 V to 1.7 pF at 0.3 V. The desired value of VTUNE applied to the diode should

be VCC/2, or 1.65 V for VCC = 3.3 V. The typical performance curve from the data sheet for the SMV1249-074LF

indicates that the capacitance at this voltage is approximately 6 pF (12 pF / 2).

The nominal input capacitance (CIN) of the LMK0480x family OSCin pins is 6 pF. The stray capacitance (CSTRAY)

of the PCB should be minimized by arranging the oscillator circuit layout to achieve trace lengths as short as

possible and as narrow as possible trace width (50 Ωcharacteristic impedance is not required).

As an example, assume that CSTRAY is 4 pF. The total load capacitance is nominally:

(9)

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(C0 + CL1)-1

(C0 + CL2)=2

1À

FFCL1

FCL1 - FCL2 =2À

'FC0

C1¸

§CL2

C1¸

§CL1

2(C0 + CL1)+ 1 C0

C1¸

§CL

1+ 1

FL = FS À = FS À

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Consequently the load capacitance specification for the crystal in this case should be nominally 14 pF.

The 2.2-nF capacitors shown in the circuit are coupling capacitors that block the DC tuning voltage applied by

the 4.7-kΩand 10-kΩresistors. The value of these coupling capacitors should be large, relative to the value of

CTUNE (CC1 = CC2 >> CTUNE), so that CTUNE becomes the dominant capacitance.

For a specific value of CL, the corresponding resonant frequency (FL) of the parallel resonant mode circuit is:

where

• FS= Series resonant frequency

• C1= Motional capacitance of the crystal

• CL= Load capacitance

• C0= Shunt capacitance of the crystal, specified on the crystal datasheet (10)

The normalized tuning range of the circuit is closely approximated by:

(11)

CL1, CL2 = The endpoints of the circuit’s load capacitance range, assuming a variable capacitance element is one

component of the load. FCL1, FCL2 = parallel resonant frequencies at the extremes of the circuit’s load

capacitance range.

A common range for the pullability ratio, C0/C1, is 250 to 280. The ratio of the load capacitance to the shunt

capacitance is ~(n * 1000), n < 10. Hence, picking a crystal with a smaller pullability ratio supports a wider tuning

range because this allows the scale factors related to the load capacitance to dominate.

Examples of the phase noise and jitter performance of the LMK04808 with a crystal oscillator are shown in

Table 125. This table illustrates the clock output phase noise when a 20.48-MHz crystal is paired with PLL1.

Performance of other LMK0480x devices will be similar.

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Table 125. Example RMS Jitter and Clock Output Phase Noise for LMK04808

with a 20.48 MHz Crystal Driving OSCin (T = 25 °C, VCC = 3.3 V) (1)

PLL2 PDF = 20.48 MHz PLL2 PDF = 40.96 MHz

(EN_PLL2_REF2X = 0,

INTEGRATION (EN_PLL2_REF2X = 1, XTAL_LVL = 3)

CLOCK OUTPUT TYPE XTAL_LVL = 3)

BANDWIDTH fCLK = 245.76 MHz fCLK = 122.88 MHz fCLK = 245.76 MHz

RMS JITTER (fs rms)

LVCMOS 374 412 382

100 Hz – 20 MHz LVDS 419 421 372

LVPECL 1.6 Vpp 460 448 440

LVCMOS 226 195 190

10 kHz – 20 MHz LVDS 231 205 194

LVPECL 1.6 Vpp 226 191 188

PHASE NOISE (dBc/Hz)

PLL2 PDF = 20.48 MHz PLL2 PDF = 40.96 MHz

(EN_PLL2_REF2X = 0, (EN_PLL2_REF2X = 1, XTAL_LVL = 3)

Offset Clock Output Type XTAL_LVL = 3)

fCLK = 245.76 MHz fCLK = 122.88 MHz fCLK = 245.76 MHz

LVCMOS -87 -93 -87

100 Hz LVDS -86 -91 -86

LVPECL 1.6 Vpp -86 -92 -85

LVCMOS -115 -121 -115

1 kHz LVDS -115 -123 -116

LVPECL 1.6 Vpp -114 -122 -116

LVCMOS -117 -128 -122

10 kHz LVDS -117 -128 -122

LVPECL 1.6 Vpp -117 -128 -122

LVCMOS -130 -135 -129

100 kHz LVDS -130 -135 -129

LVPECL 1.6 Vpp -129 -135 -129

LVCMOS -150 -154 -148

1 MHz LVDS -149 -153 -148

LVPECL 1.6 Vpp -150 -154 -148

LVCMOS -159 -162 -159

40 MHz LVDS -157 -159 -157

LVPECL 1.6 Vpp -159 -161 -159

(1) Performance data and crystal specifications contained in this section are based on Vectron model VXB1-1150-20M480, 20.48 MHz.

PLL1 has a narrow loop bandwidth, PLL2 loop parameters are: C1 = 150 pF, C2 = 120 nF, R2 = 470 Ω, Charge Pump current = 3.2 mA,

Phase detector frequency = 20.48 MHz or 40.96 MHz, VCO frequency = 2949.12 MHz. Loop filter was optimized for 40.96 MHz phase

detector performance.

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0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2

-180

-140

-100

-60

-20

100

140

180

PPM

VTUNE(V)

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Example crystal specifications are presented in Table 126.

Table 126. Example Crystal Specifications

PARAMETER VALUE

Nominal Frequency (MHz) 20.48

Frequency Stability, T = 25 °C ± 10 ppm

Operating temperature range -40 °C to +85 °C

Frequency Stability, -40 °C to +85 °C ± 15 ppm

Load Capacitance 14 pF

Shunt Capacitance (C0) 5 pF Maximum

Motional Capacitance (C1) 20 fF ± 30%

Equivalent Series Resistance 25 ΩMaximum

Drive level 2 mWatts Maximum

C0/C1ratio 225 typical, 250 Maximum

See Figure 36 for a representative tuning curve.

Figure 36. Example Tuning Curve, 20.48 MHz Crystal

The tuning curve achieved in the user's application may differ from the curve shown above due to differences in

PCB layout and component selection.

This data is measured on the bench with the crystal integrated with the LMK0480x family. Using a voltmeter to

monitor the VTUNE node for the crystal, the PLL1 reference clock input frequency is swept in frequency and the

resulting tuning voltage generated by PLL1 is measured at each frequency. At each value of the reference clock

frequency, the lock state of PLL1 should be monitored to ensure that the tuning voltage applied to the crystal is

valid.

The curve shows over the tuning voltage range of 0.3 VDC to 3.0 VDC, the frequency range is -140 to +91 ppm;

or equivalently, a tuning range of -2850 Hz to +1850 Hz. The measured tuning voltage at the nominal crystal

frequency (20.48 MHz) is 1.7 V. Using the diode data sheet tuning characteristics, this voltage results in a tuning

capacitance of approximately 6.5 pF.

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= 0.00164, MHz

(2.03 - 0.814) À 106

12.288 À 81.4 - (-81.4)

( )

'V À 106

FNOM À ('ppm2 - 'ppm1)

KVCO =

= 0.00164 MHz

2.03 - 0.814

0.001 - (-0.001)

KVCO = 'F

'V,MHz

=¸

§'F2 - 'F1

VTUNE2 - VTUNE1

LMK04803

LMK04805

LMK04806

LMK04808

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The tuning curve data can be used to calculate the gain of the oscillator (KVCO). The data used in the calculations

is taken from the most linear portion of the curve, a region centered on the crossover point at the nominal

frequency (20.48 MHz). For a well designed circuit, this is the most likely operating range. In this case, the tuning

range used for the calculations is ± 1000 Hz (± 0.001 MHz), or ± 81.4 ppm. The simplest method is to calculate

the ratio:

(12)

ΔF2 and ΔF1 are in units of MHz. Using data from the curve this becomes:

(13)

A second method uses the tuning data in units of ppm:

(14)

FNOM is the nominal frequency of the crystal and is in units of MHz. Using the data, this becomes:

(15)

In order to ensure startup of the oscillator circuit, the equivalent series resistance (ESR) of the selected crystal

should conform to the specifications listed in the table of Electrical Characteristics.

It is also important to select a crystal with adequate power dissipation capability, or drive level. If the drive level

supplied by the oscillator exceeds the maximum specified by the crystal manufacturer, the crystal will undergo

excessive aging and possibly become damaged. Drive level is directly proportional to resonant frequency,

capacitive load seen by the crystal, voltage and equivalent series resistance (ESR).

For more complete coverage of crystal oscillator design, see:

http://www.ti.com/lsds/ti/analog/clocksandtimers/tools.page or Application Note AN-1939, Crystal Based Oscillator

Design with the LMK04000 Family (SNAA065).

9.1.9 Application Curves

See Figure 36 for a representative tuning curve.

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CLKinX

CLKinX*

Phase

Detector

PLL1

External VCXO

or Tunable

Crystal

Phase

Detector

PLL2 Internal

VCO

External

Loop Filter

OSCin

CPout1

OSCoutX

OSCoutX*

LMK0480x

CPout2

Divider

Digital Delay

Analog Delay

CLKoutY

CLKoutY*

CLKoutX

CLKoutX*

Partially

Integrated

Loop Filter

12 outputs

External

Loop Filter

PLL1 PLL2

6 blocks

2 outputs

2 inputs

Input

Buffer

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9.2 Typical Applications

Normal use case of the LMK0480x device is as a dual loop jitter cleaner. This section will discuss a design

example to illustrate the various functional aspects of the LMK0480x device.

Figure 37. Simplified Functional Block Diagram for Dual Loop Mode

9.2.1 Design Requirements

Given a remote radio head (RRU) type application which needs to clock some ADCs, DACs, FPGA, SERDES,

and an LO. The input clock will be a recovered clock which needs jitter cleaning. The FPGA clock should have a

clock output on power up. A summary of clock input and output requirements are as follows:

Clock Input:

• 30.72 MHz recovered clock.

Clock Outputs:

• 2x 245.76 MHz clock for ADC, LVPECL

• 4x 983.04 MHz clock for DAC, LVPECL

• 1x 122.88 MHz clock for FPGA, LVPECL. POR clock

• 1x 122.88 MHz clock for SERDES, LVPECL

• 2x 122.88 MHz clock for LO, LVCMOS

It is also desirable to have the holdover feature engage if the recovered clock reference is ever lost. The

following information reviews the steps to produce this design.

9.2.2 Detailed Design Procedure

Design of all aspects of the LMK0480x are quite involved and software has been written to assist in part

selection, part programming, loop filter design, and simulation. This design procedure will give a quick outline of

the process.

Note that this information is current as of the date of the release of this datasheet. Design tools receive

continuous improvements to add features and improve model accuracy. Refer to software instructions or training

for latest features.

1. Device Selection

– the key to device selection is required VCO frequency given required output frequencies. The device

must be able to produce the VCO frequency that can be divided down to required output frequencies.

– The software design tools will take inot account VCO frequency range for specific devices based on the

application's required output frequencies. Using an external VCO provides increased flexibility regarding

valid designs.

– To understand the process better, refer to Frequency Planning with the LMK0480x Family for more detail

on calculating valid VCO frequency when using integer dividers using the least common multiple (LCM) of

the output frequencies.

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Typical Applications (continued)

2. Device Configuration

– There are many possible permutations of dividers and other registers to get same input and output

frequencies from a device. However there are some optimizations and trade-offs to be considered.

– If more than one divider is in series, for instance VCO divider to CLKout divider, or VCO divider to PLL

prescaler to PLL N. It is possible although not assured that some crosstalk/mixing could be created

when using some divides.

– The design software normally attempts to maximize phase detector frequency, use smallest dividers, and

maximizes PLL charge pump current.

– When an external VCXO or crystal is used for jitter cleaning, the design software will choose the

maximum frequency value, depending on design software options, this max frequency may be limited to

standard value VCXOs/Crystals. Note, depending on application, different frequency VCXOs may be

chosen to generate some of the required output frequencies.

– Refer to PLL Programming for divider equations need to ensure PLL is locked. The design software is

able to configure the device for most cases, but at this time for advanced features like 0-delay, the

user must take care to ensure proper PLL programming.

– These guidelines may be followed when configuring PLL related dividers or other related registers:

– For lowest possible in-band PLL flat noise, maximize phase detector frequency to minimize N divide

value.

– For lowest possible in-band PLL flat noise, maximize charge pump current. The highest value charge

pump currents often have similar performance due to diminishing returns.

– To reduce loop filter component sizes, increase N value and/or reduce charge pump current.

– Large capacitors help reduce phase detector spurs at phase detector frequency caused by external

VCOs/VCXOs with low input impedance.

– As rule of thumb, keeping the phase detector frequency approximately between 10 * PLL loop

bandwidth and 100 * PLL loop bandwidth. A phase detector frequency less than 5 * PLL bandwidth

may be unstable and a phase detector frequency > 100 * loop bandwidth may experience increased

lock time due to cycle slipping.

3. PLL Loop Filter Design

– It is recommended to use Clock Design Tool or Clock Architect to design your loop filter.

– Best loop filter design and simulation can be achieved when:

– Custom reference and VCXO phase noise profiles are loaded into the software.

– VCO gain of the external VCXO or possible external VCO device are entered.

– The Clock Design Tool will return solutions with high reference/phase detector frequencies by default. In

the Clock Design Tool the user may increase the reference divider to reduce the frequency if desired.

Due to the narrow loop bandwidth used on PLL1, it is common to lower the phase detector frequency on

PLL1 to reduce component size.

– While designing loop filter, adjusting the charge pump current or N value can help with loop filter

component selection. Lower charge pump currents and larger N values result in smaller component

values but may increase impacts of leakage and reduce PLL phase noise performance.

– More detailed understanding of loop filter design can found in Dean Banerjee's PLL Performance,

Simulation, and Design (www.ti.com/tool/pll_book).

4. Clock Output Assignment

– At this time the design software does not take into account frequency assignment to specific outputs

except to ensure that the output frequencies can be achieved. It is best to consider proximity of each

clock output to each other and other PLL circuitry when choosing final clock output locations. Here are

some guidelines to help achieve best performance when assigning outputs to specific CLKout/OSCout

pins.

– Group common frequencies together.

– PLL charge pump circuitry can cause crosstalk at charge pump frequency. Place outputs sharing

charge pump frequency or lower priority outputs not sensitive to charge pump frequency spurs

together.

– Muxes can create a path for noise coupling. Consider all frequencies which may have some bleed

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Typical Applications (continued)

through from non-selected mux inputs.

– For example, LMK0480x CLKout6/7 and CLKout8/9 share a mux with OSCin.

– Some clock targets require low close-in phase noise. If possible, use a VCXO based PLL1 output for

such a clock target. An example is a clock to a PLL reference.

– Some clock targets require excellent noise floor performance. Outputs driven by the internal VCO have

the best noise floor performance. An example is an ADC or DAC.

5. Other device specific configuration. For LMK0480x, consider the following:

– PLL lock time based on programming:

– In addition to the time it takes the device to lock to frequency, there is a digital filter to avoid false lock

time detects which can also be used to ensure a specific PPM frequency accuracy. This also impacts

the time it takes for the digital lock detect (DLD) pin to be asserted. Refer to Digital Lock Detect

Frequency Accuracy for more information.

– Holdover configuration:

– Specific PPM frequency accuracy required to exit holdover can be programmed. Refer to Digital Lock

Detect Frequency Accuracy for more information.

– Digital delay: phase alignment of the output clocks.

– Analog delay: another method to shift phases of clocks with finer resolution with the penalty of increase

noise floor. Clock Design Tool can simulate analog delay impact on phase noise floor.

– Dynamic digital delay: ability to shift phase alignment of clocks with minimum disruption during operation.

6. Device Programming

– The software tool CodeLoader for EVM programming can be used to setup the device in the desired

configuration, then export a hex register map suitable for use in application.

Some additional information on each part of the design procedure for the RRU example is below.

9.2.2.1 Device Selection

Use the WEBENCH Clock Architect Tool or Clock Design Tool. Enter the required frequencies and formats into

the tool. To use this device, find a solution using the LMK04808B.

9.2.2.1.1 Clock Architect

When viewing resulting solutions, it is possible to narrow the parts used in the solution by setting a filter.

Under advanced tab, filtering of specific parts can be done using regular expressions in the Part Filter box.

"LMK04808B" will filter for only the LMK04808B devices (without quotes).

9.2.2.1.2 Clock Design Tool

In wizard-mode, select Dual Loop PLL to find the LMK04808B device. If a high frequency and clean reference is

available, Although dual loop mode is selected as a customer requirement, it is not required to use dual loop;

PLL1 can be powered down and input is then provided via the OSCin port. When simulating single loop

solutions, set PLL1 loop filter block to "0 Hz LBW" and use VCXO as the reference block.

9.2.2.1.3 Calculation Using LCM

In this example, the LCM(245.76 MHz, 983.04 MHz, 122.88 MHz) = 983.04 MHz. A valid VCO frequency for

LMK0480x is 2949.12 MHz = 3 * 983.04 MHz. Therefore the LMK0480B may be used to produce these output

frequencies.

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Typical Applications (continued)

9.2.2.2 Device Configuration

The tools automatically configure the simulation to meet the input and output frequency requirements given and

make assumptions about other parameters to give some default simulations. The assumptions made are to

maximize input frequencies, phase detector frequencies, and charge pump currents while minimizing VCO

frequency and divider values.

For this example, when using the clock design tool, the reference would have been manually entered as 30.72

MHz according to input frequency requirements, but the tool allows VCXO1 frequency either to be set manually,

auto-selected according to standard frequencies, or auto-selected for best frequency. With the best frequency

option, the highest possible VCXO frequency which gives the highest possible PLL2 PDF frequency is

recommended first. In this case: 421 + 53/175 MHz VCXO resulting in a 140 + 76/175 MHz phase detector

frequency. This is a high phase detector frequency, but the VCXO is likely going to be a custom order. The

select configuration page just before simulation shows before some different configurations possible with different

VCO divider values. For example, a more common 491.52 MHz frequency provides a 122.88 MHz PDF. This is a

more logical configuration.

From the simulation page of clock design tool, it can be seen that the VCXO frequency of 491.52 MHz is too high

for feedback into the PLL1_N divider. Reducing the VCXO frequency to 245.76 MHz resolves the PLL1_N divider

max input frequency problem. The PLL2 R divider must be updated to 2 so that the VCO of PLL2 is still at

2949.12 MHz.

At this point the design meets all input and output frequency requirements and it is possible to design a loop filter

for system and simulate performance on CLKouts. However, consider also the following:

• At this time the clock design tool doesn't assign outputs strategically for jitter, such as PLL1 vs PLL2. If PLL1

output frequency is high enough, it may have improved jitter performance depending on the noise floor and

application required integration range.

• The clock design tool does not consider power on reset clocks in the clock requirements or assignments.

• The clock design tool simplifies the LMK0480x architecture not showing the mux complexity around

OSCout0/1 and not showing OSCout1. Simulation of OSCout0 is equivalent to OSCout1.

The next section addresses how the user may alter the design when considering these items.

9.2.2.2.1 PLL LO Reference

PLL1 outputs have the best phase noise performance for LO references. As such OSCout0 can be used to

provide the 122.88 MHz LO reference clock. To achieve this with the 245.76 MHz VCXO the OSCout_DIV can

be set to 2 to provide 122.88 MHz at OSCout0. However in the next section it is determined that for the POR

clock, a 122.88 MHz VCXO will be chosen which results not needing to change this parameter.

9.2.2.2.2 POR Clock

If OSCout1 is to be used for LVPECL POR 122.88 MHz clock, the POR value of the OSCout_DIV is 1, so a

122.88 MHz VCXO frequency must be chosen. This may be desired anyway since the phase detector frequency

is limited to 122.88 MHz and lower frequency VCXOs tend to cost less. With this change the OSCin frequency

and phase detector frequency are the same, so the doubler must be enabled and the PLL2 R divider

programmed = 2 to follow the rule stated in PLL2 Frequency Doubler. Since the clock design tool does not show

the doubler, PLL2_R will still reflect the value 1 one for the simulation purposes.

If LVDS was required for POR clock, a voltage divider could be used to convert from LVPECL to LVDS.

Note: it is possible to set the PLL2 R = 0.5 to simulate the doubler in-case lower frequency VCXOs would like to

be simulated. For example a 61.44 MHz VCXO could be used while retaining a 122.88 MHz phase detector

frequency. However, it would reduce the LO reference frequency and POR clock frequency to 61.44 MHz.

At this time the main design updates have been made to support the POR clock and loop filter design may begin.

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Typical Applications (continued)

9.2.2.3 PLL Loop Filter Design

The PLL structure for the LMK0480x is illustrated in Loop Filter.

At this time the user may choose to make adjustments to the simulation tools for more accurate simulations to

their application. For example:

• Clock Design Tool allows loading a custom phase noise plot for any block. Typically, a custom phase noise

plot is entered for CLKin to match the reference phase noise to the device; a phase noise plot for the VCXO

can additionally be provided to match the performance of VCXO used. For improved accuracy in simulation

and optimum loop filter design, be sure to load these custom noise profiles for use in application. After

loading a phase noise plot, user should recalculate the recommended loop filter design.

• The Clock Design Tool will return solutions with high reference/phase detector frequencies by default. In the

Clock Design Tool the user may increase the reference divider to reduce the frequency if desired. Due to the

narrow loop bandwidth used on PLL1, it is common to reduce the phase detector frequency on PLL1 by

increasing PLL1 R.

For this example, for PLL1 to perform jitter cleaning and to minimize jitter from PLL2 used for frequency

multiplication:

• PLL1: A narrow loop bandwidth PLL1 filter was design by updating the loop bandwidth to 50 Hz and phase

margin to 50 degrees.

• PLL2:

– VCXO noise profile is measured, then loaded into VCXO block in clock design tool.

– The recommended loop filter is redesigned. Updates to the PLL1 loop filter and VCXO phase noise may

change the loop filter recommendation.

The next two sections will discuss PLL1 and PLL2 loop filter design specific to this example using default phase

noise profiles.

NOTE

Clock Design Tool provides some recommend loop filters upon first load of the simulation.

Anytime PLL related inputs change like an input phase noise, charge pump current,

divider values, and so forth. it is best to re-design the PLL1 loop filter to the recommended

design or your desired parameters. After PLL1, then update the PLL2 loop filter in the

same way to keep the loop filters designed and optimized for the application. Since PLL1

loop filter design may impact PLL2 loop filter design, be sure to update the designs in

order.

9.2.2.3.1 PLL1 Loop Filter Design

For this example, in the clock design tool simulator click on the PLL1 loop filter design button, then update the

loop bandwidth for 0.05 kHz and the phase margin for 50 degrees and press calculate. With the 30.72 MHz

phase detector frequency and 1.6 mA charge pump; the designed loop filter's largest capacitor, C2, is 27 µF.

Supposing a goal of < 10 µF; setting PLL1 R = 4 and pressing the calculate again shows that C2 is 6.8 µF.

Suppose that a reduction to < 1 µF is desired, continuing to increase the PLL1 R to 8 resulting in a phase

detector frequency of 3.84 MHz and reducing the charge pump current from 1.6 mA to 0.4 mA and calculating

again shows that C2 is 820 nF. As N was increased and charge pump decreased, this final design has R2 = 12

kΩ. The first design with low N value and high charge pump current result in R2 = 390 Ω. The impact of the

thermal resistance is calculated in the tool. Viewing the simulation of the loop filter with the 12-kΩresistor shows

that the thermal noise in the loop is not impacting performance.

It may be desired to design a 3rd order loop filter for additional attenuation input noise and spurs

With the PLL1 loop filter design complete, PLL2's loop filter is ready to be designed.

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Typical Applications (continued)

9.2.2.3.2 PLL2 Loop Filter Design

In the clock design tool simulator, click on the PLL2 loop filter design button, then press recommend design. For

PLL2's loop filter maximum phase detector frequency and maximum charge pump current are typically used.

Typically the jitter integration bandwidth includes the loop filter bandwidth for PLL2. The recommended loop filter

by the tools are designed to minimize jitter. The integrated loop filter components are minimized with this

recommendation as to allow maximum flexibility in achieve wide loop bandwidths for low PLL noise. With the

recommended loop filter calculated, this loop filter is ready to be simulated.

If using integrated components is desired, open the bode plot for the PLL2 Loop Filter, then make adjustments to

the integrated components. The effective loop bandwidth and phase margin with these updates is calculated.

The integrated loop filter components are good to use when attempting to eliminate some spurs since they

provide filtering after the bond wires. The recommended procedure is to increase C3/C4 capacitance, then

R3/R4 resistance. Large R3/R4 resistance can result in degraded VCO phase noise performance.

9.2.2.4 Clock Output Assignment

At this time the Clock Design Tool and Clock Architect only assign outputs to specific clock outputs numerically;

not necessarily by optimum configuration. The user may wish to make some educated re-assignment of outputs.

During device configuration, some output assignment was discussed since it impacted the part's configuration

relating to loop filter design, such as:

• In this example, OSCout1 can be used to provide the power on reset (POR) start-up clock to the FPGA at

122.88 MHz since the VCXO frequency is the required output frequency.

• Since PLL1 outputs have best in-band noise, OSCout0 is used to provide LVCMOS output to the PLL

reference for the LO. LVCMOS (Norm/Inv) is used instead of LVCMOS (Norm/Norm) to reduce crosstalk. It is

also possible to use CLKout6/7 or CLKout8/9 for a PLL reference being driven from the VCXO. The noise

floor will be higher, but close-in noise is typically of more concern since noise above the loop bandwidth of the

LO will be dominated by the VCO of the LO. See Figure 38.

Since CLKout6/7 and CLKout8/9 have a mux allowing them to be driven by the VCXO and due there is a chance

for some 122.88 MHz crosstalk from the VCXO. The 122.88 MHz SERDES clock will be placed on CLKout6

since it will not be sensitive to crosstalk as it is operating at the same frequency.

The two 245.76 MHz clocks and four 983.04 MHz clocks for the converters need to be discussed. There is some

flexibility in assignment. For example CLKout0/1 could operate at 245.76 MHz for the ADCs and then CLKout2/3

and CLKout4/5 could operate at 983.04 MHz for the DAC. It is also possible to consider CLKout2/3 for the ADC

and position CLKout0/1 and CLKout10/11 for the DAC. The ADCs clock was placed as far as possible from other

clock which could result in sub-harmonic spurs since the ADC clock is often the most sensitive.

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Typical Applications (continued)

9.2.2.5 Other Device Specific Configuration

9.2.2.5.1 Digital Lock Detect

Digital lock time for PLL1 will ultimately depend upon the programming of the PLL1_DLD_CNT register as

discussed in Digital Lock Detect Frequency Accuracy. Since the PLL1 phase detector frequency in this example

is 3.84 MHz, the lock time will = 1 / (PLL1_DLD_CNT * 3.84 MHz)

Digital lock time for PLL1 if PLL1_DLD_CNT = 10000 is just over 2.6 ms. When using holdover, it is very

important to program the PLL1_DLD_CNT to a value large enough to prevent false digital lock detect signals.

If PLL1_DLD_CNT is too small, when the device exits holdover and is re-locking, the DLD will go high while the

phase of the reference and feedback are within the specified window size because the programmed

PLL1_DLD_CNT will be satisfied. However, if the loop has not yet settled to without the window size, when the

phases of the reference and feedback once again exceed the window size, the DLD will return low. Provided that

DISABLE_DLD1_DET = 0, the device once again enter holdover. Assuming that the reference clock is valid

because holdover was just exited, the exit criteria will again be met, holdover will exit, and PLL1 will start locking.

Unfortunately, the same sequence of events will repeat resulting in oscillation out-of and back-into holdover.

Setting the PLL1_DLD_CNT to an appropriately large value prevents chattering of the PLL1 DLD signal and

stable holdover operation can be achieved.

Refer to Digital Lock Detect Frequency Accuracy for more detail on calculating exit times and how the

PLL1_DLD_CNT and PLL1_WND_SIZE work together.

9.2.2.5.2 Holdover

For this example, when the recovered clock is lost, the goal is to set the VCXO to Vcc/2 until the recovered clock

returns. Holdover Mode contains detailed information on how to program holdover.

To achieve the above goal, fixed holdover will be used. Program:

• HOLDOVER_MODE = 2 (Holdover enabled)

• EN_TRACK = 0 (Tracking disabled)

• EN_MAN_DAC = 1 (Use manual DAC for holdover voltage value)

• MAN_DAC = 512 (Approximately Vcc/2)

• DISABLE_DLD1_DET = 0 (Use PLL1 DLD = Low to start holdover)

9.2.2.6 Device Programming

The CodeLoader software is used to program the LMK0480x evaluation board using the LMK04808B profile. It

also allows the exporting of a register map which can be used to program the device to the user’s desired

configuration.

Once a configuration of dividers has been achieved using the Clock Design Tool to meet the requested

input/output frequencies with the desired performance, the CodeLoader software is manually updated with this

information to meet the required application. At this time no automatic import exists.

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Frequency Offset (Hz)

Phase Noise (dBc/Hz)

-170

-165

-160

-155

-150

-145

-140

-135

-130

1k 10k 100k 1M 10M

D001

VCO CLKoutX

VCXO CLKout6/7/8/9

VCXO OSCout0/1

VCXO Direct

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Typical Applications (continued)

9.2.3 Application Curve

Figure 38. LVPECL Phase Noise, 122.88 MHz

Illustration of Different Performance Depending on Signal Path.

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CPout1

LEuWire

CLKuWire

DATAuWire

To Host

processor

LDObyp1

LDObyp2

10 PF0.1 PF

LMK0480x

OSCin

OSCin*

100Ö

0.1 PF

PLL1 Loop Filter

Rterm 0.1 PF

CLKin1

CLKin1*

TCXO

50Ö0.1 PF

0.1 PFCLKin0

CLKin0*

Recovered

Reference

Clock

0.1 PF

VCXO

CPout2

PLL2 External

Loop Filter

CLKout2*,3*,4*,5*

CLKout2, 3, 4, 5

0.1 PF

240Ö

4x LVPECL

output clocks

to ADC

0.1 PF

240Ö

3x LVDS clocks

to FPGAs and

microcontrollers

OSCout0*,1*

OSCout0, 1

0.1 PF

240Ö

LVPECL

OSCout clocks

to PLL

references

0.1 PF

240Ö

CLKout 6 and 8 active at startup

OSCout0 on at startup

CLKout0*,1*

CLKout0, 1

0.1 PF

240Ö

2x LVPECL

output clocks

to DAC

0.1 PF

240Ö

CLKout10*

CLKout10 LVDS Low

Frequency

System

Synchronization

Clock

CLKout6*,7*,8*

CLKout6, 7, 8

Up to 14 total differential clocks

2 clock outputs unused in above design

CLKout11*

CLKout11

CLKout9*

CLKout9

SYNC

Status_HOLDOVER

Status_LD

Status_CLKin1

Status_CLKin0

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9.3 System Examples

9.3.1 System Level Diagram

Figure 39 and Figure 40 show an LMK0480x family device with external circuitry for clocking and for power

supply to serve as a guideline for good practices when designing with the LMK0480x family. Refer to Pin

Connection Recommendations for more details on the pin connections and bypassing recommendations. Also

refer to the evaluation board in LMK0480x Evaluation Board Instructions (SNAU076). PCB design will also play a

role in device performance.

Figure 39. Example Application – System Schematic Except for Power

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LMK0480x

FB = Ferrite bead

Vcc13 CLKout0/1

Vcc12 CLKout10/11

Vcc11 CLKout8/9

Vcc10 CLKout6/7

Vcc9 PLL2 N Divider

Vcc7 OSCin/OSCout0/

PLL2 Circuitry

Vcc6 PLL1 CP

Vcc4 Digital

Vcc3 CLKout4/5

Vcc2 CLKout2/3

Vcc1 VCO LDO

Vcc8 PLL2 CP

Vcc5 CLKin/OSCout1

PLL Supply Plane

Clock Supply Plane

LDO

LP3878-ADJ

10 µF, 1 µF, 0.1 µF

10 µF, 1 µF, 0.1 µF 1 µF, 0.1 µF, 10 nF

0.1 µF

Do not directly copy schematic for

CLKout Vcc13/2/3/10/11/12. This

is for example frequency plan only.

Recommendation is to group

supplies by same frequency and

share a ferrite bead among outputs

of the same frequency.

Example

Frequency 1

Example

Frequency 2

Example

Frequency 3

LMK04803

LMK04805

LMK04806

LMK04808

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

System Examples (continued)

Figure 39 shows the primary reference clock input is at CLKin0/0*. A secondary reference clock is driving

CLKin1/1*. Both clocks are depicted as AC coupled drivers. The VCXO attached to the OSCin/OSCin* port is

configured as an AC coupled single-ended driver. Any of the input ports (CLKin0/0*, CLKin1/1*, or

OSCin/OSCin*) may be configured as either differential or single-ended. These options are discussed later in the

data sheet.

See Loop Filter for more information on PLL1 and PLL2 loop filters.

All the LVPECL clock outputs are AC coupled with 0.1 uF capacitors. The LVDS outputs are DC coupled.. Some

clock outputs are depicted as LVPECL with 240-Ωemitter resistors and some clock outputs as LVDS. The

appropriate output termination on each output should be implemented according to the output format to be

programmed by the user. Later sections of this data sheet illustrate alternative methods for AC coupling, DC

coupling and terminating the clock outputs.

PCB design will influence crosstalk performance. Tightly coupled clock traces will have less crosstalk than

loosely coupled clock traces. Also proximity to other clocks traces will influence crosstalk.

Figure 40. Example Application – Power System Schematic

Figure 40 shows an example decoupling and bypassing scheme for the LMK0480x, which could apply to

configurations shown in Figure 20 or Figure 39. Components drawn in dotted lines are optional (see Pin

Connection Recommendations). Two power planes are used in these example designs, one for the clock outputs

and one for PLL circuits. It is possible to reduce the number of decoupling components by tying together clock

output Vcc pins for CLKouts that share the same frequency or otherwise can tolerate potential crosstalk between

outputs with different frequencies. In the two examples, Vcc2 and Vcc3 can be tied together since CLKout2/3

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System Examples (continued)

and CLKout4/5 will operate at the same frequencies. Vcc10, Vcc11, and Vcc12 can be tied together since

potential crosstalk between the FPGA/SerDes clocks and low-frequency synchronization clocks will not impact

the performance of these digital interfaces, which typically have less stringent jitter requirements. PCB design will

influence impedance to the supply. Vias and traces will increase the impedance to the power supply. Ensure

good direct return current paths.

9.4 Do's and Don'ts

9.4.1 LVCMOS Complementary vs. Non-Complementary Operation

• It is recommended to use a complementary LVCMOS output format such as LVCMOS (Norm/Inv) to reduce

switching noise and crosstalk when using LVCMOS.

• If only a single LVCMOS output is required, the complementary LVCMOS output format can still be used by

leaving the unused LVCMOS output floating.

• A non-complimentary format such as LVCMOS (Norm/Norm) is not recommended as increased switching

noise is present.

9.4.2 LVPECL Outputs

When using an LVPECL output it is not recommended to place a capacitor to ground on the output as might be

done when using a capacitor input LC lowpass filter. The capacitor will appear as a short to the LVPECL output

drivers which are able to supply large amounts of switching current. The effect of the LVPECL sourcing large

switching currents can result in the following:

1. Large switching currents through the Vcc pin of the LVPECL power supply resulting in more Vcc noise and

possible Vcc spikes.

2. Large switching currents injected into the ground plane through the capacitor which could couple onto other

Vcc pins with bypass capacitors to ground resulting in more Vcc noise and possible Vcc spikes.

Product Folder Links: LMK04803 LMK04805 LMK04806 LMK04808

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

10 Power Supply Recommendations

10.1 Pin Connection Recommendations

10.1.1 Vcc Pins and Decoupling

All Vcc pins must always be connected.

Integrated capacitance on the LMK0480x makes external high frequency decoupling capacitors (≤1 nF)

unnecessary. The internal capacitance is more effective at filtering high frequency noise than off device bypass

capacitance because there is no bond wire inductance between the LMK0480x circuit and the bypass capacitor.

10.1.1.1 Vcc2, Vcc3, Vcc10, Vcc11, Vcc12, Vcc13 (CLKout Vccs)

Each of these pins has an internal 200 pF of capacitance.

Ferrite beads may be used to reduce crosstalk between different clock output frequencies on the same

LMK0480x device. Ferrite beads placed between the power supply and a clock Vcc pin will reduce noise

between the Vcc pin and the power supply. When several output clocks share the same frequency a single ferrite

bead can be used between the power supply and each same frequency CLKout Vcc pin.

When using ferrite beads on CLKout Vcc pins, consider the following guidelines to ensure the power supply will

source the needed switching current:

• In most cases a ferrite bead may be placed and the internal capacitance is sufficient.

• If a ferrite bead is used with a low frequency output (typically ≤30 MHz) and a high current switching clock

output format such as non-complementary LVCMOS or high swing LVPECL is used, then:

– The ferrite bead can be removed to the lower impedance to the main power supply and bypass capacitors,

– Localized capacitance can be placed between the ferrite bead and Vcc pin to support the switching

current.

–Note: the decoupling capacitors used between the ferrite bead and a CLKout Vcc pin can permit high

frequency switching noise to couple through the capacitors into the ground plane and onto other

CLKout Vcc pins with decoupling capacitors. This can degrade crosstalk performance.

– It is recommended to use a complementary LVCMOS output format such as LVCMOS (Norm/Inv) to

reduce switching noise and crosstalk when using LVCMOS. If only a single LVCMOS output is required,

the complementary LVCMOS output format can still be used by leaving the unused LVCMOS output

floating.

10.1.1.2 Vcc1 (VCO), Vcc4 (Digital), and Vcc9 (PLL2)

Each of these pins has internal bypass capacitance.

Ferrite beads should not be used between these pins and the power supply/large bypass capacitors because

these Vcc pins don’t produce much noise and a ferrite bead can cause phase noise disturbances and

resonances.

The typical application diagram in Figure 40 shows all these Vccs connected to together to Vcc without a ferrite

bead.

10.1.1.3 Vcc6 (PLL1 Charge Pump) and Vcc8 (PLL2 Charge Pump)

Each of these pins has an internal bypass capacitor.

Use of a ferrite bead between the power supply/large bypass capacitors and PLL1 is optional. PLL1 charge

pump can be connected directly to Vcc along with Vcc1, Vcc4, and Vcc9. Depending on the application, a 0.1 uF

capacitor may be placed close to PLL1 charge pump Vcc pin.

A ferrite bead should be placed between the power supply/large bypass capacitors and Vcc8. Most applications

have high PLL2 phase detector frequencies and (> 50 MHz) such that the internal bypassing is sufficient and a

ferrite bead can be used to isolate this switching noise from other circuits. For lower phase detector frequencies

a ferrite bead is optional and depending on application a 0.1 uF capacitor may be added on Vcc8.

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Pin Connection Recommendations (continued)

10.1.1.4 Vcc5 (CLKin and OSCout1), Vcc7 (OSCin and OSCout0)

Each of these pins has an internal 100 pF of capacitance. No ferrite bead should be placed between the power

supply/large bypass capacitors and Vcc5 or Vcc7.

These pins are unique since they supply an output clock and other circuitry.

Vcc5 supplies CLKin and OSCout1.

Vcc7 supplies OSCin, OSCout0, and PLL2 circuitry.

Impacts of excessive noise on PLL2 circuitry may impact PLL2 DLD operation.

It is recommended to use a complementary LVCMOS output format such as LVCMOS (Norm/Inv) to reduce

switching noise and crosstalk when using LVCMOS. If only a single LVCMOS output is required, the

complementary LVCMOS output format can still be used by leaving the unused LVCMOS output floating.

10.1.2 LVPECL Outputs

When using an LVPECL output it is not recommended to place a capacitor to ground on the output as might be

done when using a capacitor input LC lowpass filter. The capacitor will appear as a short to the LVPECL output

drivers which are able to supply large amounts of switching current. The effect of the LVPECL sourcing large

switching currents can result in:

1. Large switching currents through the Vcc pin of the LVPECL power supply resulting in more Vcc noise and

possible Vcc spikes.

2. Large switching currents injected into the ground plane through the capacitor which could couple onto other

Vcc pins with bypass capacitors to ground resulting in more Vcc noise and possible Vcc spikes.

10.1.3 Unused Clock Outputs

Leave unused clock outputs floating and powered down.

10.1.4 Unused Clock Inputs

Unused clock inputs can be left floating.

10.1.5 LDO Bypass

The LDObyp1 and LDObyp2 pins should be connected to GND through external capacitors, as shown in

Figure 40.

10.2 Current Consumption and Power Dissipation Calculations

From Table 127 the current consumption can be calculated for any configuration.

For example, the current for the entire device with 1 LVDS (CLKout0) and 1 LVPECL 1.6 Vpp /w 240-Ωemitter

resistors (CLKout1) output active with a clock output divide = 1, and no other features enabled can be calculated

by adding up the following blocks: core current, clock buffer, one LVDS output buffer current, and one LVPECL

output buffer current. There will also be one LVPECL output drawing emitter current, which means some of the

power from the current draw of the device is dissipated in the external emitter resistors which doesn't add to the

power dissipation budget for the device but is important for LDO ICC calculations.

For total current consumption of the device, add up the significant functional blocks. In this example, 228.1 mA

equals the sum of the following:

• 140 mA (core current)

• 17.3 mA (base clock distribution)

• 25.5 mA (CLKout0 and 1 divider)

• 14.3 mA (LVDS buffer)

• 31 mA (LVPECL 1.6 Vpp buffer /w 240-Ωemitter resistors)

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

Current Consumption and Power Dissipation Calculations (continued)

Once total current consumption has been calculated, power dissipated by the device can be calculated. The

power dissipation of the device is equation to the total current entering the device multiplied by the voltage at the

device minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no emitter

resistors are connected to the LVPECL outputs, this power will be 0 watts. Continuing the above example which

has 228.1 mA total Icc and one output with 240-Ωemitter resistors. Total IC power = 717.7 mW = 3.3 V * 228.1

mA - 35 mW.

Table 127. Typical Current Consumption for Selected Functional Blocks

(TA= 25 °C, VCC = 3.3 V)

POWER

TYPICAL DISSIPATED

DISSIPATED

BLOCK CONDITION ICC EXTERNALL

in DEVICE

(mA) Y(1)(2)(3)

(mW) (mW)

CORE and FUNCTIONAL BLOCKS

MODE = 0: Dual Loop, Internal PLL1 and PLL2 locked 140 462 -

VCO

MODE = 2: Dual Loop, Internal PLL1 and PLL2 locked; Includes 155 512 -

VCO, 0-Delay EN_FEEDBACK_MUX = 1

MODE = 3: Dual Loop, External PLL1 and PLL2 locked 127 419 -

VCO

MODE = 6: Single Loop (PLL2), PLL2 locked 116 383 -

Core Internal VCO

MODE = 11: Single Loop (PLL2), PLL2 locked 103 340 -

External VCO

MODE = 15: Dual PLL, 0-DELAY, 144 475

External VCO PD_OSCin = 0 42 139 -

MODE = 16: Clock Distribution PD_OSCin = 1 34.5 114 -

EN_TRACK Tracking is enabled (EN_TRACK = 1) 2 6.6 -

Base Clock At least 1 CLKoutX_Y_PD = 0 17.3 57.1 -

Distribution Each CLKout group (CLKout0/1 and 10/11, CLKout2/3 and 4/5, CLKout

CLKout Group 2.8 9.2 -

6/7 and 8/9)

When a clock output is enabled, this contributes the divider/delay block 25.5 84.1 -

Clock Divider/

Digital Delay Divider / digital delay in extended mode 29.6 97.7 -

VCO Divider VCO Divider current 7.7 25.4 -

HOLDOVER mode When in holdover mode 2.2 7.2 -

Feedback mux must be enabled for 0-delay modes and digital delay

Feedback Mux 4.9 16.1 -

mode (SYNC_QUAL = 1)

SYNC Asserted While SYNC is asserted, this extra current is drawn 1.7 5.6 -

Required for SYNC functionality. May be turned off once SYNC is

EN_SYNC = 1 6 19.8 -

complete to save power.

SYNC_QUAL = 1 Delay enabled, delay > 7 (CLKout_MUX = 2, 3) 8.7 28.7 -

XTAL_LVL = 0 1.8 5.9 -

XTAL_LVL = 1 2.7 9 -

Crystal Mode Enabling the Crystal Oscillator XTAL_LVL = 2 3.6 12 -

XTAL_LVL = 3 4.5 15 -

OSCin Doubler EN_PLL2_REF_2X = 1 2.8 9.2 -

(1) Power is dissipated externally in LVPECL emitter resistors. The externally dissipated power is calculated as twice the DC voltage level

of one LVPECL clock output pin squared over the emitter resistance. That is to say power dissipated in emitter resistors = 2 * Vem2/

Rem.

(2) Assuming R θJA = 15 °C/W, the total power dissipated on chip must be less than (125 °C – 85 °C) / 16 °C/W = 2.5 W to ensure a

junction temperature is less than 125 °C.

(3) Worst case power dissipation can be estimated by multiplying typical power dissipation with a factor of 1.15.

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

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Current Consumption and Power Dissipation Calculations (continued)

Table 127. Typical Current Consumption for Selected Functional Blocks

(TA= 25 °C, VCC = 3.3 V) (continued)

POWER

TYPICAL DISSIPATED

DISSIPATED

BLOCK CONDITION ICC EXTERNALL

in DEVICE

(mA) Y(1)(2)(3)

(mW) (mW)

CLKoutX_Y_ANLG_DLY = 0 to 3 3.4 11.2 -

CLKoutX_Y_ANLG_DLY = 4 to 7 3.8 12.5 -

CLKoutX_Y_ANLG_DLY = 8 to 11 4.2 13.9 -

Analog Delay Value CLKoutX_Y_ANLG_DLY = 12 to 4.7 15.5 -

Analog Delay CLKoutX_Y_ANLG_DLY = 16 to 5.2 17.2 -

Only Single Output Of Clock Pair Has Analog Delay Selected. Example:

CLKout0_ADLY_SEL = 1 and CLKout1_ADLY_SEL = 0, or 2.8 9.2 -

CLKout0_ADLY_SEL = 0 and CLKout1_ADLY_SEL = 1.

CLOCK OUTPUT BUFFERS

LVDS 100-Ωdifferential termination 14.3 47.2 -

LVPECL 2.0 Vpp, AC coupled using 240-Ωemitter resistors 32 70.6 35

LVPECL 1.6 Vpp, AC coupled using 240-Ωemitter resistors 31 67.3 35

LVPECL LVPECL 1.6 Vpp, AC coupled using 120-Ωemitter resistors 46 91.8 60

LVPECL 1.2 Vpp, AC coupled using 240-Ωemitter resistors 30 59 40

LVPECL 0.7 Vpp, AC coupled using 240-Ωemitter resistors 29 55.7 40

LVCMOS Pair (CLKoutX_TYPE 3 MHz 24 79.2 -

= 6 to 9) 30 MHz 26.5 87.5 -

CL= 5 pF 150 MHz 36.5 120.5 -

LVCMOS LVCMOS Single (CLKoutX_TYPE 3 MHz 15 49.5 -

= 10 to 13) 30 MHz 16 52.8 -

CL= 5 pF 150 MHz 21.5 71 -

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0.2 mm

1.46 mm

7.2 mm

1.15 mm

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

11 Layout

11.1 Layout Guidelines

Power consumption of the LMK0480x family of devices can be high enough to require attention to thermal

management. For reliability and performance reasons the die temperature should be limited to a maximum of

125 °C. That is, as an estimate, TA(ambient temperature) plus device power consumption times RθJA should not

exceed 125 °C.

The package of the device has an exposed pad that provides the primary heat removal path as well as excellent

electrical grounding to a printed circuit board. To maximize the removal of heat from the package a thermal land

pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the

package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package.

A recommended land and via pattern is shown in Figure 41. More information on soldering WQFN packages can

be obtained from www.ti.com/packaging/. See also the packaging information in Mechanical, Packaging, and

Orderable Information.

To minimize junction temperature, it is recommended that a simple heat sink be built into the PCB (if the ground

plane layer is not exposed). This is done by including a copper area on the opposite side of the PCB from the

device. This copper area may be plated or solder coated to prevent corrosion, but should not have conformal

coating (if possible), which could provide thermal insulation. The vias shown in Figure 41 should connect these

top and bottom copper layers and to the ground layer. These vias act as “heat pipes” to carry the thermal energy

away from the device side of the board to where it can be more effectively dissipated. Avoid routing traces close

to exposed ground pad to ensure proper thermal flow on the PCB.

Figure 41. Recommended Land and Via Pattern

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CLKin and OSCin path ± if differential input (preferred) route trace

tightly coupled like clock outputs. If single ended, have at least 3 trace

width (of CLKin/OSCin trace) separation from other RF traces.

Example shown is hybrid for both differential and single ended ± not

tightly couple to compromise for both configurations. RF Terminations

should be placed as close to IC as possible. When using CLKin1 for

high frequency input for external VCO or distribution, a 3 dB pi pad is

suggested for termination.

)RU&/.RXW9FF¶VSODFHIHUULWHEHDGVRQWRSOD\HUFORVHWRSLQVWRFKRNH

high frequency noise from via.

Charge pump output ± shorter traces are better.

Place all resistors and caps closer to IC except for

a single capacitor next to VCXO. In a 2nd order

filter place C1 close to VCXO Vtune pin. In a 3rd

and 4th order filter place C3 or C4 respectively

close to VCXO.

Clock outputs ± differential signals, should be

routed tightly coupled to minimize PCB crosstalk.

Trace impedance and terminations should be

designed according to output type being used (i.e.

LVDS, LVPECL...)

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

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11.2 Layout Example

Figure 42. LMK0480x Layout Example

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SNAS489K –MARCH 2011–REVISED DECEMBER 2014

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

For additional support, see the following:

• Clock Design Tool: http://www.ti.com/tool/clockdesigntool

• Clock Architect: http://www.ti.com/lsds/ti/analog/webench/clock-architect.page

12.2 Documentation Support

12.2.1 Related Documentation

For additional information, see the following:

•Common Data Transmission Parameters and their Definitions, Application Note AN-912 (SNLA036)

•Crystal Based Oscillator Design with the LMK04000 Family, Application Note AN-1939 (SNAA065)

•Frequency Synthesis and Planning for PLL Architectures, Application Note AN-1865 (SNAA061)

12.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 128. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LMK04803 Click here Click here Click here Click here Click here

LMK04805 Click here Click here Click here Click here Click here

LMK04806 Click here Click here Click here Click here Click here

LMK04808 Click here Click here Click here Click here Click here

12.4 Trademarks

PLLatinum is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LMK04803 LMK04805 LMK04806 LMK04808

PACKAGE OPTION ADDENDUM

www.ti.com 8-Feb-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LMK04803BISQ/NOPB ACTIVE WQFN NKD 64 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04803BISQ

LMK04803BISQE/NOPB ACTIVE WQFN NKD 64 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04803BISQ

LMK04803BISQX/NOPB ACTIVE WQFN NKD 64 2000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04803BISQ

LMK04805BISQ/NOPB ACTIVE WQFN NKD 64 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04805BISQ

LMK04805BISQE/NOPB ACTIVE WQFN NKD 64 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04805BISQ

LMK04805BISQX/NOPB ACTIVE WQFN NKD 64 2000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04805BISQ

LMK04806BISQ/NOPB ACTIVE WQFN NKD 64 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04806BISQ

LMK04806BISQE/NOPB ACTIVE WQFN NKD 64 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04806BISQ

LMK04806BISQX/NOPB ACTIVE WQFN NKD 64 2000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04806BISQ

LMK04808BISQ/NOPB ACTIVE WQFN NKD 64 1000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04808BISQ

LMK04808BISQE/NOPB ACTIVE WQFN NKD 64 250 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04808BISQ

LMK04808BISQX/NOPB ACTIVE WQFN NKD 64 2000 Green (RoHS

& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 K04808BISQ

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

PACKAGE OPTION ADDENDUM

www.ti.com 8-Feb-2017

Addendum-Page 2

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LMK04803BISQ/NOPB WQFN NKD 64 1000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04803BISQE/NOPB WQFN NKD 64 250 178.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04803BISQX/NOPB WQFN NKD 64 2000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04805BISQ/NOPB WQFN NKD 64 1000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04805BISQE/NOPB WQFN NKD 64 250 178.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04805BISQX/NOPB WQFN NKD 64 2000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04806BISQ/NOPB WQFN NKD 64 1000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04806BISQE/NOPB WQFN NKD 64 250 178.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04806BISQX/NOPB WQFN NKD 64 2000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04808BISQ/NOPB WQFN NKD 64 1000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04808BISQE/NOPB WQFN NKD 64 250 178.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

LMK04808BISQX/NOPB WQFN NKD 64 2000 330.0 16.4 9.3 9.3 1.3 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 23-May-2018

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LMK04803BISQ/NOPB WQFN NKD 64 1000 367.0 367.0 38.0

LMK04803BISQE/NOPB WQFN NKD 64 250 210.0 185.0 35.0

LMK04803BISQX/NOPB WQFN NKD 64 2000 367.0 367.0 38.0

LMK04805BISQ/NOPB WQFN NKD 64 1000 367.0 367.0 38.0

LMK04805BISQE/NOPB WQFN NKD 64 250 210.0 185.0 35.0

LMK04805BISQX/NOPB WQFN NKD 64 2000 367.0 367.0 38.0

LMK04806BISQ/NOPB WQFN NKD 64 1000 367.0 367.0 38.0

LMK04806BISQE/NOPB WQFN NKD 64 250 210.0 185.0 35.0

LMK04806BISQX/NOPB WQFN NKD 64 2000 367.0 367.0 38.0

LMK04808BISQ/NOPB WQFN NKD 64 1000 367.0 367.0 38.0

LMK04808BISQE/NOPB WQFN NKD 64 250 210.0 185.0 35.0

LMK04808BISQX/NOPB WQFN NKD 64 2000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-May-2018

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

64X 0.3

0.2

7.2 0.1

60X 0.5

64X 0.5

0.3

0.8 MAX

7.5

9.1

8.9

B9.1

8.9

0.3

0.2

0.5

0.3

(0.1)

TYP

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WQFN - 0.8 mm max heightNKD0064A

WQFN

PIN 1 INDEX AREA

SEATING PLANE

16 33

17 32

64 49

(OPTIONAL)

PIN 1 ID

SEE TERMINAL

DETAIL

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

0.1 C A B

0.05 C

SCALE 1.600

DETAIL

OPTIONAL TERMINAL

TYPICAL

www.ti.com

EXAMPLE BOARD LAYOUT

( 7.2)

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

64X (0.6)

64X (0.25)

(8.8)

60X (0.5)

() VIA

TYP

0.2

(1.36)

TYP

8X (1.31)

(1.36) TYP 8X (1.31)

4214996/A 08/2013

WQFN - 0.8 mm max heightNKD0064A

WQFN

SYMM

SEE DETAILS

17 32

SYMM

LAND PATTERN EXAMPLE

SCALE:8X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note

in literature No. SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

www.ti.com

EXAMPLE STENCIL DESIGN

(8.8)

64X (0.6)

64X (0.25)

25X (1.16)

(8.8)

60X (0.5)

(1.36) TYP

(1.36)

TYP

4214996/A 08/2013

WQFN - 0.8 mm max heightNKD0064A

WQFN

NOTES: (continued)

5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SYMM

METAL

TYP

SOLDERPASTE EXAMPLE

BASED ON 0.125mm THICK STENCIL

EXPOSED PAD

65% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

17 32

SYMM

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