Type
Dimension [mm]
L
W
t
d
10
1.6±0.15
0.8±0.15
0.8±0.15
0.3±0.2
FEATURES
APPLICATION
DIMENSION
DESCRIPTION
RECOMMENDED LAND PATTERN
CIS10P Series (1608 / EIA 0603)
Smallest beads used in high current.
CIS series is used for high current.
Part No.
Thickness
(mm)
Impedance
(Ω)±25%@100MHz
DC Resistance
(Ω) Max.
Rated Current
(mA) Max.
CIS10P260AC
0.6±0.15
26
0.007
6000
CIS10P300AC
0.6±0.15
30
0.01
6000
CIS10P700AC
0.6±0.15
70
0.02
4000
CIS10P101AC
0.6±0.15
100
0.03
3000
CIS10P121AC
0.6±0.15
120
0.03
3000
CIS10P181AC
0.6±0.15
180
0.04
2500
CIS10P221NC
0.8±0.15
220
0.05
2500
CIS10P301NC
0.8±0.15
300
0.07
2000
CIS10P331NC
0.8±0.15
330
0.07
1700
CIS10P391NC
0.8±0.15
390
0.10
1200
CIS10P471NC
0.8±0.15
470
0.13
1500
CIS10P601NC
0.8±0.15
600
0.15
1300
CIS10J300NC
0.8±0.15
30
0.01
6000
Noise Suppression in power line
0.7mm
0.55~0.65mm
0.55~0.65mm
0.7mm
CHARACTERISTIC DATA
CI S 10 P 260 A C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) Ultra high current
(3) Dimension (4) Material Code
(5) Nominal impedance (260: 26Ω, 300:30Ω, 121:120Ω)
(6) Thickness option (N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging (C:paper tape, E:embossed tape)
PACKAGING
Packaging Type
Quantity (pcs/reel)
Card Board Taping
4000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW
SOLDERING
FLOW
SOLDERING
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question regarding the
data sheets, please contact our sales personnel or application engineers.