GE Data Sheet
September 11, 2013 ©2013 General Electric Company. All rights reserved.
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
Features
Compliant to RoHS EU Directive 2002/95/EC (Z
versions)
Compatible in a Pb-free or SnPb reflow environment
(Z versions)
Wide Input voltage range (2.4Vdc-5.5Vdc)
Output voltage programmable from 0.6Vdc to 3.63
Vdc via external resistor
Tunable LoopTM to optimize dynamic output voltage
response
Flexible output voltage sequencing EZ-SEQUENCE –
APTH versions
Remote sense
Fixed switching frequency
Output overcurrent protection (non-latching)
Overtemperature protection
Remote On/Off
Ability to sink and source current
Cost efficient open frame design
Small size: 20.3 mm x 11.4 mm x 8.5 mm
(0.8 in x 0.45 in x 0.334 in)
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-03
Certified, and VDE‡ 0805:2001-12 (EN60950-1)
Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Industrial equipment
Description
The Micro TLynxTM series of power modules are non-isolated dc-dc converters that can deliver up to 12A of output current.
These modules operate over a wide range of input voltage (VIN = 2.4Vdc-5.5Vdc) and provide a precisely regulated output
voltage from 0.6Vdc to 3.63Vdc, programmable via an external resistor. Features include remote On/Off, adjustable
output voltage, over current and overtemperature protection, and output voltage sequencing (APTH versions). A new
feature, the Tunable LoopTM, allows the user to optimize the dynamic response of the converter to match the load with
reduced amount of output capacitance leading to savings on cost and PWB area.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
TRIM
VOUT
SENSE
GND
CTUNE
RTUNE
RTrim
VIN
Co
Cin
Vin+ Vout+
ON/OFF
Q1
SEQ
MODULE
EZ-SEQUENCE
TM
RoHS Compliant
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All VIN -0.3 6 Vdc
Continuous
Sequencing Voltage APTH VSEQ -0.3 ViN, Max Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 2.4 ⎯ 5.5 Vdc
Maximum Input Current All IIN,max 11A Adc
(VIN=2.4V to 5.5V, IO=IO, max )
Input No Load Current VO,set = 0.6 Vdc IIN,No load 36 mA
(VIN = 5.0Vdc, IO = 0, module enabled) VO,set = 3.3Vdc IIN,No load 81 mA
Input Stand-by Current All IIN,stand-by 3 mA
(VIN = 5.0Vdc, module disabled)
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN =0 to
5.5V, IO= IOmax ; See Test Configurations)
All 49 mAp-p
Input Ripple Rejection (120Hz) All -30 dB
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point All VO, set -1.5 +1.5 % VO, set
Output Voltage All VO, set -3.0 ⎯ +3.0 % VO, set
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Adjustment Range All VO 0.6 3.63 Vdc
Selected by an external resistor
Output Regulation (for VO ≥ 2.5Vdc)
Line (VIN=VIN, min to VIN, max) All
⎯ 0.4 % VO, set
Load (IO=IO, min to IO, max) All
⎯ 10 mV
Output Regulation (for VO < 2.5Vdc)
Line (VIN=VIN, min to VIN, max) All
⎯ 10 mV
Load (IO=IO, min to IO, max) All
⎯ 5 mV
Temperature (Tref=TA, min to TA, max) All
⎯ 0.4 % VO, set
Remote Sense Range All 0.5 V
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max Co = 0.1μF // 10 μF
ceramic capacitors)
Peak-to-Peak (5Hz to 20MHz bandwidth) All ⎯ 25 35 mVpk-pk
RMS (5Hz to 20MHz bandwidth) All ⎯ 10 15 mVrms
External Capacitance1
Without the Tunable LoopTM
ESR ≥ 1 mΩ All CO, max 0 ⎯ 200 μF
With the Tunable LoopTM
ESR ≥ 0.15 mΩ All CO, max 0 ⎯ 1000 μF
ESR ≥ 10 mΩ All CO, max 0 ⎯ 5000 μF
Output Current All Io 0 12 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 200 % Io,max
Output Short-Circuit Current All IO, s/c 30 % Io,max
(VO≤250mV) ( Hiccup Mode )
Efficiency VO,set = 0.6Vdc η 75.0 %
VIN= 3.3Vdc, TA=25°C VO, set = 1.2Vdc η 85.5 %
IO=IO, max , VO= VO,set V
O,set = 1.8Vdc η 89.9 %
V
O,set = 2.5Vdc η 92.7 %
Vin=5Vdc VO,set = 3.3Vdc η 94.6 %
Switching Frequency All fsw ⎯ 600 ⎯ kHz
1 External capacitors may require using the new Tunable LoopTM feature to ensure that the module is stable as well as getting the best
transient response. See the Tunable LoopTM section for details.
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 4
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (IO=IO, max, TA=25°C) Telecordia Issue 2, Method 1 Case 3 28,160,677 Hours
Weight ⎯ 3.59 (0.127) ⎯ g (oz.)
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to GND)
Device is with suffix “4” – Positive Logic (See Ordering
Information)
Logic High (Module ON)
Input High Current All IIH ⎯ ⎯ 10 µA
Input High Voltage All VIH VIN – 0.8 ⎯ VIN,max V
Logic Low (Module OFF)
Input Low Current All IIL ⎯ ⎯ 0.3 mA
Input Low Voltage All VIL -0.2 ⎯ 0.3 V
Device Code with no suffix – Negative Logic (See Ordering
Information)
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Logic High (Module OFF)
Input High Current All IIH — — 2 mA
Input High Voltage All VIH V
IN – 1.6 — VIN, max Vdc
Logic Low (Module ON)
Input low Current All IIL — — 1 mA
Input Low Voltage All VIL -0.2 — VIN – 1.6 Vdc
Turn-On Delay and Rise Times
(VIN=VIN, nom, IO=IO, max , VO to within ±1% of steady state)
Case 1: On/Off input is enabled and then input power is
applied (delay from instant at which VIN = VIN, min until
Vo = 10% of Vo, set)
All Tdelay — 2 — msec
Case 2: Input power is applied for at least one second
and then the On/Off input is enabled (delay from instant
at which Von/Off is enabled until Vo = 10% of Vo, set)
All Tdelay — 2 — msec
Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set) All Trise — 5 — msec
Output voltage overshoot (TA = 25oC 3.0 % VO, set
VIN= VIN, min to VIN, max,IO = IO, min to IO, max)
With or without maximum external capacitance
Over Temperature Protection All Tref 130 °C
(See Thermal Considerations section)
Sequencing Delay time
Delay from VIN, min to application of voltage on SEQ pin APTH TsEQ-delay 10 msec
Tracking Accuracy (Power-Up: 2V/ms) APTHl VSEQ –Vo 100 mV
(Power-Down: 2V/ms) APTH VSEQ –Vo 100 mV
(VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo)
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 5
Feature Specifications (continued)
Parameter Device Symbol Min Typ Max Units
Input Undervoltage Lockout
Turn-on Threshold All 2.2 Vdc
Turn-off Threshold All 1.75 Vdc
Hysteresis All
0.08 0.2 Vdc
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 6
Characteristic Curves
The following figures provide typical characteristics for the Micro TLynxTM at 0.6Vo and at 25oC.
EFFICIENCY, η (%)
70
75
80
85
90
024681012
Vin=5.5V
Vin=2.4V
Vin=3.3V
OUTPUT CURRENT, Io (A)
8
9
10
11
12
13
25 35 45 55 65 75 8
5
NC
0.5m/s
(100LFM)
1m/s
(200LFM)
2m/s
(400LFM)
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 1. Converter Efficiency versus Output Current. Figure 2. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (5Adiv) VO (V) (200mV/div)
TIME, t (1μs/div) TIME, t (20μs /div)
Figure 3. Typical output ripple and noise (VIN = 5V, Io = Io,max). Figure 4. Transient Response to Dynamic Load Change from
0% to 50% to 0% with VIN=5V.
ON/OFF VOLTAGE OUTPUT VOLTAGE
VON/OFF (V) (2V/div) VO (V) (200mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (2V/div) VO (V) (200mV/div)
TIME, t (1ms/div) TIME, t (1ms/div)
Figure 5. Typical Start-up Using On/Off Voltage (Io = Io,max). Figure 6. Typical Start-up Using Input Voltage (VIN = 5V, Io =
Io,max).
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 7
Characteristic Curves (continued)
The following figures provide typical characteristics for the Micro TLynxTM at 1.2Vo and at 25oC.
EFFICIENCY, η (%)
70
75
80
85
90
95
0 2 4 6 8 10 12
Vin=5.5V
Vin=2.4V
Vin=3.3V
OUTPUT CURRENT, Io (A)
8
9
10
11
12
13
25 35 45 55 65 75 85
NC
0.5m/s
(100LFM)
1m/s
(200LFM)
2m/s
(400LFM)
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 7. Converter Efficiency versus Output Current. Figure 8. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT
CURRENT
,
OUTPUT
VOLTAGE
IO (A) (5Adiv) VO (V) (200mV/div)
TIME, t (1μs/div) TIME, t (20μs /div)
Figure 9. Typical output ripple and noise (VIN = 5V, Io = Io,max). Figure 10. Transient Response to Dynamic Load Change
from 0% to 50% to 0% with VIN=5V.
ON/OFF VOLTAGE OUTPUT VOLTAGE
VON/OFF (V) (2V/div) VO (V) (500mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (2V/div) VO (V) (500mV/div)
TIME, t (1ms/div) TIME, t (1ms/div)
Figure 11. Typical Start-up Using On/Off Voltage (Io = Io,max). Figure 12. Typical Start-up Using Input Voltage (VIN = 5V, Io
= Io,max).
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 8
Characteristic Curves (continued)
The following figures provide typical characteristics for the Micro TLynxTM at 1.8Vo and at 25oC.
EFFICIENCY, η (%)
70
75
80
85
90
95
100
024681012
Vin=5.5V
Vin=2.4V Vin=3.3V
OUTPUT CURRENT, Io (A)
8
9
10
11
12
13
25 35 45 55 65 75 8
5
NC
0.5m/s
(100LFM)
1m/s
(200LFM)
2m/s
(400LFM)
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 13. Converter Efficiency versus Output Current. Figure 14. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT
CURRENT
,
OUTPUT
VOLTAGE
IO (A) (2Adiv) VO (V) (200mV/div)
TIME, t (1μs/div) TIME, t (20μs /div)
Figure 15. Typical output ripple and noise (VIN = 5V, Io = Io,max). Figure 16. Transient Response to Dynamic Load Change
from 0% to 50% to 0% with VIN=5V.
ON/OFF VOLTAGE OUTPUT VOLTAGE
VON/OFF (V) (2V/div) VO (V) (500mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (2V/div) VO (V) (1V/div)
TIME, t (1ms/div) TIME, t (1ms/div)
Figure 17. Typical Start-up Using On/Off Voltage (Io = Io,max). Figure 18. Typical Start-up Using Input Voltage (VIN = 5V, Io
= Io,max).
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 9
Characteristic Curves (continued)
The following figures provide typical characteristics for the Micro TLynxTM at 2.5Vo and at 25oC.
EFFICIENCY, η (%)
80
85
90
95
100
024681012
Vin=5.5V Vin=3V
Vin=3.3V
OUTPUT CURRENT, Io (A)
8
9
10
11
12
13
25 35 45 55 65 75 8
5
NC
0.5m/s
(100LFM)
1m/s
(200LFM)
2m/s
(400LFM)
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 19. Converter Efficiency versus Output Current. Figure 20. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
VO (V) (0mV/div)
OUTPUT
CURRENT
,
OUTPUT
VOLTAGE
IO (A) (5Adiv) VO (V) (200mV/div)
TIME, t (1μs/div) TIME, t (20μs /div)
Figure 21. Typical output ripple and noise (VIN = 5V, Io = Io,max). Figure 22. Transient Response to Dynamic Load Change
from 0% to 50% to 0% with VIN=5V.
ON/OFF VOLTAGE OUTPUT VOLTAGE
VON/OFF (V) (5V/div) VO (V) (1V/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (2V/div) VO (V) (1V/div)
TIME, t (1ms/div) TIME, t (1ms/div)
Figure 23. Typical Start-up Using On/Off Voltage (Io = Io,max). Figure 24. Typical Start-up Using Input Voltage (VIN = 5V, Io
= Io,max).
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 10
Characteristic Curves (continued)
The following figures provide typical characteristics for the Micro TLynxTM at 3.3Vo and at 25oC.
EFFICIENCY, η (%)
80
85
90
95
100
024681012
Vin=5.5V Vin=5V
Vin=4.5V
OUTPUT CURRENT, Io (A)
8
9
10
11
12
13
25 35 45 55 65 75 85
NC
0.5m/s
(100LFM)
1m/s
(200LFM)
2m/s
(400LFM)
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 25. Converter Efficiency versus Output Current. Figure 26. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT
CURRENT
,
OUTPUT
VOLTAGE
IO (A) (5Adiv) VO (V) (200mV/div)
TIME, t (1μs/div) TIME, t (20μs /div)
Figure 27. Typical output ripple and noise (VIN = 5V, Io = Io,max). Figure 28. Transient Response to Dynamic Load Change
from 0% 50% to 0% with VIN=5V.
ON/OFF VOLTAGE OUTPUT VOLTAGE
VON/OFF (V) (2V/div) VO (V) (1V/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (2V/div) VO (V) (1V/div)
TIME, t (1ms/div) TIME, t (1ms/div)
Figure 29. Typical Start-up Using On/Off Voltage (Io = Io,max). Figure 30. Typical Start-up Using Input Voltage (VIN = 5V, Io =
Io,max).
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 11
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
1μH
BATTERY
CS 1000μF
Electrolytic
E.S.R.<0.1Ω
@ 20°C 100kHz
2x100μF
Tantalum
VIN(+)
COM
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 1μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
CIN
Figure 31. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Vo+
COM
0.1u F
RESISTIVE
LOAD
SCOPE U SING
BNC SOCKET
COPPER STRIP
GROUND PLANE
10uF
Figure 32. Output Ripple and Noise Test Setup.
VO
COM
VIN(+)
COM
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 33. Output Voltage and Efficiency Test Setup.
η =
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Filtering
The Micro TLynxTM module should be connected to a low ac-
impedance source. A highly inductive source can affect the
stability of the module. An input capacitance must be placed
directly adjacent to the input pin of the module, to minimize input
ripple voltage and ensure module stability.
To minimize input voltage ripple, low-ESR ceramic capacitors are
recommended at the input of the module. Figure 34 shows the
input ripple voltage for various output voltages at 3A of load
current with 1x47 µF or 2x47 µF ceramic capacitors and an input
of 5V. Figure 35 shows data for the 3.3Vin case, with 1x47µF or
2x37µF of ceramic capacitors at the input.
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
140
0.51 1.522.5 33.5
1x47uF
2x47uF
Output Voltage (Vdc)
Figure 34. Input ripple voltage for various output voltages
with 1x47 µF or 2x47 µF ceramic capacitors at the input (12A
load). Input voltage is 5V.
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
0.5 1 1.5 2 2.5 3
1x47uF
2x47uF
Output Voltage (Vdc)
Figure 35. Input ripple voltage in mV, p-p for various output
voltages with 1x47 µF or 2x47 µF ceramic capacitors at the
input (12A load). Input voltage is 3.3V.
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 12
Output Filtering
The Micro TLynxTM modules are designed for low output ripple
voltage and will meet the maximum output ripple specification
with 0.1 µF ceramic and 10 µF ceramic capacitors at the output
of the module. However, additional output filtering may be
required by the system designer for a number of reasons. First,
there may be a need to further reduce the output ripple and
noise of the module. Second, the dynamic response
characteristics may need to be customized to a particular load
step change.
To reduce the output ripple and improve the dynamic response
to a step load change, additional capacitance at the output can
be used. Low ESR ceramic and polymer capacitors are
recommended to improve the dynamic response of the module.
Figure 36 provides output ripple information for different
external capacitance values at various Vo and for load currents
of 12A while maintaining an input voltage of 5V. Fig 37 shows
the performance with a 3.3V input. For stable operation of the
module, limit the capacitance to less than the maximum output
capacitance as specified in the electrical specification table.
Optimal performance of the module can be achieved by using
the Tunable LoopTM feature described later in this data sheet.
0
5
10
15
0.5 1 1.5 2 2.5 3 3.5
Output Voltage(Volts)
Ripple(mVp-p)
1x10uF External Cap
1x47uF External Cap
2x47uF External Cap
4x47uF External Cap
Figure 36. Output ripple voltage for various output voltages
with external 1x10 µF, 1x47 µF, 2x47 µF or 4x47 µF ceramic
capacitors at the output (12A load). Input voltage is 5V.
0
5
10
15
0.5 1 1.5 2 2.5 3
Output Voltage(Volts)
Ripple(mVp-p)
1x10uF External Cap
1x47uF External Cap
2x47uF External Cap
4x47uF External Cap
Figure 37. Output ripple voltage for various output voltages
with external 1x10 µF, 1x47 µF, 2x47 µF or 4x47 µF ceramic
capacitors at the output (12A load). Input voltage is 3.3V.
Safety Considerations
For safety agency approval the power module must be installed
in compliance with the spacing and separation requirements of
the end-use safety agency standards, i.e., UL 60950-1, CSA C22.2
No. 60950-1-03, and VDE 0850:2001-12 (EN60950-1) Licensed.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the input must
meet SELV requirements. The power module has extra-low
voltage (ELV) outputs when all inputs are ELV.
Feature Descriptions
Remote On/Off
The Micro TLynxTM modules feature an On/Off pin for remote
On/Off operation. Two On/Off logic options are available. In the
Positive Logic On/Off option, (device code suffix “4” – see
Ordering Information), the module turns ON during a logic High
on the On/Off pin and turns OFF during a logic Low. With the
Negative Logic On/Off option, (no device code suffix, see
Ordering Information), the module turns OFF during logic High
and ON during logic Low. The On/Off signal is always referenced
to ground. For either On/Off logic option, leaving the On/Off pin
disconnected will turn the module ON when input voltage is
present.
For positive logic modules, the circuit configuration for using the
On/Off pin is shown in Figure 38. For positive logic modules, the
circuit configuration for using the On/Off pin is shown in Figure
38. When the external transistor Q1 is in the OFF state, Q2 is ON,
the internal PWM Enable signal is pulled low and the module is
ON. When transistor Q1 is turned ON, the On/Off pin is pulled
low, Q2 is turned off and the internal PWM Enable signal is pulled
high through the 23.7K pull-up resistor and the module is OFF.
23.7K
Q1
GND
PWM Enable
ON/OFF
VIN+
ON/OFF
_
+
I
V
MODULE
ON/OFF
Q2
20K
470
20K
Figure 38. Circuit configuration for using positive On/Off
logic.
For negative logic On/Off modules, the circuit configuration is
shown in Fig. 39. The On/Off pin should be pulled high with an
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 13
external pull-up resistor (suggested value for the 2.4V to 5.5Vin
range is 3Kohms). When transistor Q1 is in the OFF state, the
On/Off pin is pulled high and the module is OFF. The On/Off
threshold for logic High on the On/Off pin depends on the input
voltage and its minimum value is VIN – 1.6V. To turn the module
ON, Q1 is turned ON pulling the On/Off pin low.
Figure 39. Circuit configuration for using negative On/Off
logic.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the
unit is equipped with internal current-limiting circuitry and can
endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back into
its specified range.
Overtemperature Protection
To provide protection in a fault condition, the unit is equipped
with a thermal shutdown circuit. The unit will shutdown if the
overtemperature threshold of 130oC is exceeded at the thermal
reference point Tref . The thermal shutdown is not intended as a
guarantee that the unit will survive temperatures beyond its
rating. Once the unit goes into thermal shutdown it will then
wait to cool before attempting to restart.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will begin to
operate at an input voltage above the undervoltage lockout
turn-on threshold.
Output Voltage Programming
The output voltage of the Micro TLynxTM module can be
programmed to any voltage from 0.6dc to 3.63Vdc by
connecting a resistor between the Trim+ and GND pins of the
module. Certain restrictions apply on the output voltage set
point depending on the input voltage. These are shown in the
Output Voltage vs. Input Voltage Set Point Area plot in Fig. 40.
The Upper Limit curve shows that the entire output voltage
range is available with the maximum input voltage of 5.5V. The
Lower Limit curve shows that for output voltages of 1.8V and
higher, the input voltage needs to be larger than the minimum of
2.4V.
0
1
2
3
4
5
6
0.511.522.533.54
Output Voltage (V)
Input Voltage (v)
Upper Limit
Lower Limit
Figure 40. Output Voltage vs. Input Voltage Set Point Area plot
showing limits where the output voltage can be set for
different input voltages.
Without an external resistor between Trim+ and GND pins, the
output of the module will be 0.6Vdc. To calculate the value of the
trim resistor, Rtrim for a desired output voltage, use the following
equation:
()
Ω
−
=k
Vo
Rtrim
6.0
2.1
Rtrim is the external resistor in kΩ, and Vo is the desired output
voltage.
Table 1 provides Rtrim values required for some common output
voltages.
Table 1
VO, set (V) Rtrim (KΩ)
0.6 Open
1.0 3.0
1.2 2.0
1.5 1.333
1.8 1.0
2.5 0.632
3.3 0.444
By using a ±0.5% tolerance trim resistor with a TC of ±25ppm, a
set point tolerance of ±1.5% can be achieved as specified in the
electrical specification. The POL Programming Tool available at
www.lineagepower.com under the Design Tools section, helps
determine the required trim resistor needed for a specific output
voltage.
60.4K
Q1
GND
PWM Enable
ON/OFF
VIN+
ON/OFF
+
V
I
MODULE
Rpullup
ON/OFF
R2
20K
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 14
VO+
TRIM
GND
Rtrim
LOAD
VIN
+
ON/OFF
SENSE
Figure 41. Circuit configuration for programming output
voltage using an external resistor.
Remote Sense
The Micro TLynxTM modules have a Remote Sense feature to
minimize the effects of distribution losses by regulating the
voltage at the SENSE pin. The voltage between the SENSE pin
and VOUT pin must not exceed 0.5V. Note that the output
voltage of the module cannot exceed the specified maximum
value. This includes the voltage drop between the SENSE and
Vout pins. When the Remote Sense feature is not being used,
connect the SENSE pin to the VOUT pin.
Voltage Margining
Output voltage margining can be implemented in the Micro
TLynxTM modules by connecting a resistor, Rmargin-up, from the
Trim pin to the ground pin for margining-up the output voltage
and by connecting a resistor, Rmargin-down, from the Trim pin to
output pin for margining-down. Figure 42 shows the circuit
configuration for output voltage margining. The POL
Programming Tool, available at www.lineagepower.com under
the Design Tools section, also calculates the values of Rmargin-up
and Rmargin-down for a specific output voltage and % margin
Please consult your local Lineage Power technical representative
for additional details.
Figure 42. Circuit Configuration for margining Output voltage
Monotonic Start-up and Shutdown
The Micro TLynxTM modules have monotonic start-up and
shutdown behavior for any combination of rated input voltage,
output current and operating temperature range.
Startup into Pre-biased Output
The 5.5V Pico TLynxTM 12A modules can start into a prebiased
output as long as the prebias voltage is 0.5V less than the set
output voltage. Note that prebias operation is not supported
when output voltage sequencing is used.
Output Voltage Sequencing
The APTH012A0X modules include a sequencing feature, EZ-
SEQUENCE that enables users to implement various types of
output voltage sequencing in their applications. This is
accomplished via an additional sequencing pin. When not using
the sequencing feature, either tie the SEQ pin to VIN or leave it
unconnected.
When an analog voltage is applied to the SEQ pin, the output
voltage tracks this voltage until the output reaches the set-point
voltage. The final value of the SEQ voltage must be set higher
than the set-point voltage of the module. The output voltage
follows the voltage on the SEQ pin on a one-to-one volt basis. By
connecting multiple modules together, multiple modules can
track their output voltages to the voltage applied on the SEQ pin.
Vo
MODULE
GND
Trim
Q1
Rtrim
Rmargin-up
Q2
Rmargin-down
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 15
For proper voltage sequencing, first, input voltage is applied to
the module. The On/Off pin of the module is left unconnected
(or tied to GND for negative logic modules or tied to VIN for
positive logic modules) so that the module is ON by default.
After applying input voltage to the module, a minimum 10msec
delay is required before applying voltage on the SEQ pin. This
delay gives the module enough time to complete its internal
power-up soft-start cycle. During the delay time, the SEQ pin
should be held close to ground (nominally 50mV ± 20 mV). This
is required to keep the internal op-amp out of saturation thus
preventing output overshoot during the start of the sequencing
ramp. By selecting resistor R1 (see fig. 43) according to the
following equation
05.0
24950
1
−
=
IN
V
Rohms,
the voltage at the sequencing pin will be 50mV when the
sequencing signal is at zero.
R1
GND
VIN+
SEQ
+
-
OUT
10K
499K
MODULE
Figure 43. Circuit showing connection of the sequencing
signal to the SEQ pin.
After the 10msec delay, an analog voltage is applied to the SEQ
pin and the output voltage of the module will track this voltage
on a one-to-one volt bases until the output reaches the set-
point voltage. To initiate simultaneous shutdown of the
modules, the SEQ pin voltage is lowered in a controlled
manner. The output voltage of the modules tracks the voltages
below their set-point voltages on a one-to-one basis. A valid
input voltage must be maintained until the tracking and output
voltages reach ground potential.
When using the EZ-SEQUENCETM feature to control start-up of
the module, pre-bias immunity during start-up is disabled. The
pre-bias immunity feature of the module relies on the module
being in the diode-mode during start-up. When using the EZ-
SEQUENCETM feature, modules goes through an internal set-up
time of 10msec, and will be in synchronous rectification mode
when the voltage at the SEQ pin is applied. This will result in
the module sinking current if a pre-bias voltage is present at
the output of the module. When pre-bias immunity during
start-up is required, the EZ-SEQUENCETM feature must be
disabled. For additional guidelines on using the EZ-
SEQUENCETM feature please refer to Application Note AN04-
008 “Application Guidelines for Non-Isolated Converters:
Guidelines for Sequencing of Multiple Modules”, or contact the
Lineage Power technical representative for additional
information.
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 16
Tunable LoopTM
The 5V Pico TLynxTM 12A modules have a new feature that
optimizes transient response of the module called Tunable
LoopTM.
External capacitors are usually added to the output of the
module for two reasons: to reduce output ripple and noise (see
Figures 36 and 37) and to reduce output voltage deviations
from the steady-state value in the presence of dynamic load
current changes. Adding external capacitance however affects
the voltage control loop of the module, typically causing the
loop to slow down with sluggish response. Larger values of
external capacitance could also cause the module to become
unstable.
The Tunable LoopTM allows the user to externally adjust the
voltage control loop to match the filter network connected to
the output of the module. The Tunable LoopTM is implemented
by connecting a series R-C between the SENSE and TRIM pins
of the module, as shown in Fig. 44. This R-C allows the user to
externally adjust the voltage loop feedback compensation of
the module.
Figure. 44. Circuit diagram showing connection of RTUME and
CTUNE to tune the control loop of the module.
Recommended values of RTUNE and CTUNE for different output
capacitor combinations are given in Tables 2, 3, 4 and 5. Tables
2 and 4 show the recommended values of RTUNE and CTUNE for
different values of ceramic output capacitors up to 940F that
might be needed for an application to meet output ripple and
noise requirements for 5Vin and 3.3Vin respectively. Selecting
RTUNE and CTUNE according to Table 2 will ensure stable
operation of the module.
In applications with tight output voltage limits in the presence
of dynamic current loading, additional output capacitance will
be required. Tables 3 and 5 list recommended values of RTUNE
and CTUNE in order to meet 2% output voltage deviation limits
for some common output voltages in the presence of a 1.5A to
3A step change (50% of full load), with an input voltage of 5Vin
and 3.3Vin respectively
Please contact your Lineage Power technical representative to
obtain more details of this feature as well as for guidelines on
how to select the right value of external R-C to tune the module
for best transient performance and stable operation for other
output capacitance values or input voltages other than 5 or 3.3V.
Table 2. General recommended values of of RTUNE and CTUNE for
Vin=5V and various external ceramic capacitor combinations.
Cext 1x47μF2x47μF4x47μF 10x47μF 20x47μF
RTUNE 47 47 47 33 22
CTUNE 1500pF 3900pF 10nF 33nF 56nF
Table 3. Recommended values of RTUNE and CTUNE to obtain
transient deviation of 2% of Vout for a 6A step load with
Vin=5V.
Table 4. General recommended values of of RTUNE and CTUNE for
Vin=3.3V and various external ceramic capacitor
combinations.
Cext 1x47μF2x47μF4x47μF 10x47μF 20x47μF
RTUNE 47 47 33 33 22
CTUNE 3300pF 6800pF 15nF 47nF 68nF
Table 5. Recommended values of RTUNE and CTUNE to obtain
transient deviation of 2% of Vout for a 6A step load with
Vin=3.3V.
Vout 3.3V 2.5V 1.8V 1.2V 0.6V
Cext
330μF
Polymer
Cap
1x47μF
+ 330μF
Polymer
Cap
4x47μF
+ 330μF
Polymer
Cap
4x47μF
+ 2x330μF
Polymer Ca
p
6x330μF
Polymer Ca
p
RTUNE 56 33 33 33 33
CTUNE 15nF 18nF 27nF 47nF 220nF
ΔV 66mV 49mV 35mV 24mV 12mV
Vout 2.5V 1.8V 1.2V 0.6V
Cext 2 x 330μF
Polymer Ca
p
2 x 330μF
Polymer Cap
3 x 330μF
Polymer Cap
7 x 330μF
Polymer Cap
RTUNE 33 33 33 33
CTUNE 82nF 100nF 180nF 390nF
ΔV 45mV 32mV 24mV 12mV
MODULE
VOUT
SENSE
TRIM
GND
RTUNE
CTUNE
RTrim
C O
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 17
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 45. The preferred
airflow direction for the module is shown in Figure 46.
A
i
r
flow
x
Power Module
W
ind Tunnel
PWBs
12.7_
(0.50)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
Figure 45. Thermal Test Setup.
The thermal reference points, Tref used in the specifications are
shown in Figure 46. For reliable operation the temperatures at
these points should not exceed 125oC. The output power of the
module should not exceed the rated power of the module
(Vo,set x Io,max).
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
Figure 46. Preferred airflow direction and location of hot-
spot of the module (Tref).
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 18
Example Application Circuit
Requirements:
Vin: 3.3V
Vout: 1.8V
Iout: 9A max., worst case load transient is from 6A to 9A
ΔVout: 1.5% of Vout (27mV) for worst case load transient
Vin, ripple 1.5% of Vin (50mV, p-p)
CI1 2 x 47μF/6.3V ceramic capacitor (e.g. TDK C Series)
CI2 100μF/6.3V Bulk Electrolytic
CO1 6 x 47μF/6.3V ceramic capacitor (e.g. TDK C Series)
CO2 330μF/6.3V Polymer/poscap (e.g. Sanyo Poscap)
CTune 56nF ceramic capacitor (can be 1206, 0805 or 0603 size)
RTune 33 ohms SMT resistor (can be 1206, 0805 or 0603 size)
RTrim 1kΩ SMT resistor (can be 1206, 0805 or 0603 size, recommended tolerance of 0.1%)
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 19
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Side View
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 20
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
PIN FUNCTION
1 ON/OFF
2 VIN
3 SEQ
4 GND
5 TRIM
6 VOUT
7 VS+
8 GND
9 NC
10 NC
PIN 8 PIN 4
PIN 9
PIN 10
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 21
Packaging Details
The APTH012A0X modules are supplied in tape & reel as standard. Modules are shipped in quantities of 250 modules per reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions:
Outside Dimensions: 330.2 mm (13.00)
Inside Dimensions: 177.8 mm (7.00”)
Tape Width: 44.00 mm (1.732”)
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
September 11, 2013 ©2013 General Electric Company. All rights reserved. Page 22
Surface Mount Information
Pick and Place
The Micro TLynxTM modules use an open frame construction and
are designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a large
surface area for pick and place operations. The label meets all
the requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow temperatures
of up to 300oC. The label also carries product information such
as product code, serial number and the location of
manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be considered to
optimize this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the bottom
side of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
process. If assembly on the bottom side is planned, please
contact Lineage Power for special manufacturing process
instructions.
Only ruggedized (-D version) modules with additional epoxy will
work with a customer’s first side assembly. For other versions,
first side assembly should be avoided
Lead Free Soldering
The Micro TLynxTM modules are lead-free (Pb-free) and RoHS
compliant and fully compatible in a Pb-free soldering process.
Failure to observe the instructions below may result in the
failure of or cause damage to the modules and can adversely
affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air-
convection reflow profile based on the volume and
thickness of the package (table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). A 6 mil thick stencil is
recommended.
For questions regarding Land grid array(LGA) soldering, solder
volume; please contact Lineage Power for special
manufacturing process instructions.
The recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Fig. 47. Soldering outside of the recommended profile
requires testing to verify results and performance.
MSL Rating
The Micro TLynxTM modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB) with
desiccant are required for MSL ratings of 2 or greater.
These sealed packages should not be broken until time of
use. Once the original package is broken, the floor life of
the product at conditions of ≤ 30°C and 60% relative
humidity varies according to the MSL rating (see J-STD-
033A). The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90% relative
humidity.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 47. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.74423-206
India:
+91.80.28411633
www.ge.com/powerelectronics
September 11, 2013 ©2013 General Electric Company. All rights reserved. Version 1.17
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 6. Device Codes
Device Code Input
Voltage Range
Output
Voltage
Output
Current
On/Off
Logic
Connector
Type Comcodes
APTH012A0X3-SRZ 2.4 – 5.5Vdc 0.6 – 3.63Vdc 12A Negative SMT CC109130465
APTH012A0X43-SRZ 2.4 – 5.5Vdc 0.6 – 3.63Vdc 12A Positive SMT CC109130473
APXH012A0X3-SRZ 2.4 – 5.5Vdc 0.6 – 3.63Vdc 12A Negative SMT CC109130481
APXH012A0X43-SRZ 2.4 – 5.5Vdc 0.6 – 3.63Vdc 12A Positive SMT CC109130498
Table 7. Coding Scheme
TLynx
family
Sequencing
feature.
Input voltage
range
Output
current
Output voltage
On/Off logic Options ROHS Compliance
AP T H 012A0 X 4 -SR Z
T = with Seq.
X = w/o Seq.
H = 2.4 – 5.5V 12.0A X =
programmable
output
4 = positive
No entry =
negative
S = Surface Mount
R = Tape&Reel
Z = ROHS6