© Semiconductor Components Industries, LLC, 2010
September, 2010 − Rev. 1
1Publication Order Number:
7SB3257/D
7SB3257
Mux / Demux Bus Switch
The 7SB3257 Mux / Demux Bus Switch is an advanced high−speed
line switch in ultra−small footprint.
Features
•High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V
•3 W Switch Connection Between 2 Ports
•Power Down Protection Provided on Inputs
•Ultra−Small Packages
•These are Pb−Free Devices
Figure 1. Logic Diagram
Figure 2. TSOP−6/SC−88
(Top View)
B0
S
B1
B0
GND VCC
A
1
2
3
6
4
B1
B0
GND
S
A
VCC
1
2
3
6
5
4
Figure 3. ULLGA6/UDFN6
(Top View)
A
B1
5
S
Function Table
Input S Function
LA = B0
HA = B1
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
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1
1
1
ULLGA6
1.0 x 1.0
CASE 613AD
ULLGA6
1.2 x 1.0
CASE 613AE
ULLGA6
1.45 x 1.0
CASE 613AF
K
M
6
1
6
AG MG
G
(Note: Microdot may be in either location)
AK, AG, K, D, L = Specific Device Code
M = Date Code
G= Pb−Free Package
TSOP−6
DT SUFFIX
CASE 318G
SOT−363/SC70−6/SC−88
DF SUFFIX
CASE 419B
6
AK MG
G
G
M
G
M
G
1
6
UDFN6
1.2 x 1.0
CASE 517AA
L
M
G
1
D
D
1
1
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2
Table 1. MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage −0.5 to +7.0 V
VIN Control Pin Input Voltage −0.5 to +7.0 V
VI/O Switch Input / Output Voltage −0.5 to +7.0 V
IIK Control Pin DC Input Diode Current VIN < GND −50 mA
IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA
IOOn−State Switch Current ±128 mA
Continuous Current Through VCC or GND ±150 mA
ICC DC Supply Current per Supply Pin ±150 mA
IGND DC Ground Current per Ground Pin ±150 mA
TSTG Storage Temperature Range −65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias 150 °C
qJA Thermal Resistance SC−88 / TSOP−6 (Note 1)
ULLGA6/UDFN6
333
496
°C/W
PDPower Dissipation in Still Air at 85°CSC−88 / TSOP−6 (Note 1)
ULLGA6/UDFN6
200
252
mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
VESD ESD Withstand Voltage Human Body Mode (Note 2)
Machine Mode (Note 3)
Charged Device Mode (Note 4)
>2000
>200
N/A
V
ILATCHUP Latchup Performance Above VCC and Below GND at 85°C (Note 5) ±100 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/ JESD22−A114−A
3. Tested to EIA/ JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA / JESD78.
Table 2. RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 4.0 5.5 V
VIControl Pin Input Voltage 0 5.5 V
VI/O Switch Input / Output Voltage 0 5.5 V
TAOperating Free−Air Temperature −55 +125 °C
Dt / DVInput Transition Rise or Fall Rate Control Input
Switch I/O
0
0
5
DC
nS/V
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Table 3. DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Conditions VCC (V)
TA = 255C TA = −555C to +1255C
Unit
Min Typ Max Min Max
VIK Clamp Diode Voltage IIN = −18 mA 4.5 −1.2 −1.2 V
VIH High−Level Input Voltage
(Control)
4.0 to 5.5 2.0 2.0 V
VIL Low−Level Input Voltage
(Control)
4.0 to 5.5 0.8 0.8 V
IIN Input Leakage Current 0 ≤ VIN ≤ 5.5 V 5.5 ±0.1 ±1.0 mA
IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0±0.1 ±1.0 mA
ICC Quiescent Supply Current IO = 0, VIN =
VCC or 0 V
5.5 ±0.1 ±1.0 mA
DICC Increase in Supply Current
(Control Pin)
One input at 3.4
V; Other inputs
at VCC or GND
5.5 2.5 mA
RON Switch ON Resistance VI/O = 0,
II/O = 64 mA
II/O = 30 mA
4.5
3
3
7
7
7
7
W
VI/O = 2.4,
II/O = 15 mA
4.5
6 15 15
VI/O = 2.4,
II/O = 15 mA
4.0
10 20 20
Table 4. AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Test Condition
TA = 255C
TA = −555C
to +1255C
Unit
Min Typ Max Min Max
tPD Propagation Delay,
A to B or B to A
4.0 to 5.5 See Figure 4 0.25 0.25 ns
tEN Output Enable Time 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 ns
4.0 0.8 3.0 4.6 0.8 4.6
tDIS Output Disable Time 4.5 to 5.5 0.8 3.1 4.8 0.8 4.8 ns
4.0 0.8 2.9 4.4 0.8 4.4
CIN Control Input Capacitance 5.0 VIN = 3 V or 0 2.0 pF
CIO(ON) Switch On Capacitance 5.0 Switch ON 10 pF
CIO(OFF) Switch Off Capacitance 5.0 Switch OFF 3.5 pF
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4
AC Loading and Waveforms
Figure 4. Load Circuit and Voltage Waveforms
500 W
CL = 50 pF
(see Note A)
7 V
From Output
Under Test
500 WS1 Open
GND
LOAD CIRCUIT
TEST S1
tPD
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
GND
Input 1.5 V 1.5 V
1.5 V 1.5 V
tPLH
tPHL
Output
3 V
VOH
0 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPZL
3 V
1.5 V
1.5 V
0 V
Output
Control
tPLZ
tPZH tPHZ
1.5 V
1.5 V
3.5 V
0 V
VOL
VOH
VOL + 0.3 V
VOH − 0.3 V
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 W, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The output is measured with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
DEVICE ORDERING INFORMATION
Device Package Shipping†
7SB3257DTT1G TSOP−6
(Pb−Free)
3000 / Tape & Reel
7SB3257DFT2G SC−88
(Pb−Free)
3000 / Tape & Reel
7SB3257AMX1TCG ULLGA6 − 0.5 mm Pitch
(Pb−Free)
3000 / Tape & Reel
7SB3257BMX1TCG ULLGA6 − 0.4 mm Pitch
(Pb−Free)
3000 / Tape & Reel
7SB3257CMX1TCG ULLGA6 − 0.35 mm Pitch
(Pb−Free)
3000 / Tape & Reel
7SB3257MUTCG UDFN6 − 0.4 mm Pitch
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
7SB3257
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5
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
E0.2 (0.008) MM
123
D
e
A1
A
A3
C
L
654
−E−
b6 PL
DIM MIN NOM MAX
MILLIMETERS
A0.80 0.95 1.10
A1 0.00 0.05 0.10
A3
b0.10 0.21 0.30
C0.10 0.14 0.25
D1.80 2.00 2.20
0.031 0.037 0.043
0.000 0.002 0.004
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.20 REF 0.008 REF
HE
HE
E1.15 1.25 1.35
e0.65 BSC
L0.10 0.20 0.30
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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6
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE U
ÉÉÉ
ÉÉÉ
23
456
D
1
e
b
E1
A1
A
0.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
c
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX
MILLIMETERS
0.90 1.00 1.10
A1 0.01 0.06 0.10
b0.25 0.38 0.50
c0.10 0.18 0.26
D2.90 3.00 3.10
E2.50 2.75 3.00
e0.85 0.95 1.05
L0.20 0.40 0.60
0.25 BSC
L2
−
0°10°
1.30 1.50 1.70
E1
E
RECOMMENDED
NOTE 5
L
C
M
H
L2
SEATING
PLANE
GAUGE
PLANE
DETAIL Z
DETAIL Z
0.60
6X
3.20 0.95
6X
0.95
PITCH
DIMENSIONS: MILLIMETERS
M
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7
PACKAGE DIMENSIONS
UDFN6 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
13
46
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b0.15 0.25
D1.20 BSC
E1.00 BSC
e0.40 BSC
L0.30 0.40
L1 0.00 0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42 6X
1.07
0.40
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
Bottom View
(Optional)
ÉÉÉ
ÉÉÉ
ÉÉÉ
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2 0.40 0.50
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8
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD−01
ISSUE A NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.12 0.22
D1.00 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.22
5X
0.48 6X
1.18
0.53 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.35
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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9
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉ
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.20 BSC
E1.00 BSC
e0.40 BSC
L0.25 0.35
L1 0.35 0.45
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.26
5X
0.49 6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
1
MOUNTING FOOTPRINT
PKG
OUTLINE
7SB3257
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10
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉÉ
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.45 BSC
E1.00 BSC
e0.50 BSC
L0.25 0.35
L1 0.30 0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
5X
0.49 6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
7SB3257/D
PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
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