IRGP4050
PDP Switch
E
C
G
n-channel
VCES = 250V
VCE(on) typ. = 1.64V
@VGE = 15V, IC = 30A
1www.irf.com
07/05/04
PD-95882
Features
Description
§ Key parameters optimized for PDP sustain &
Energy recovery applications
§ 104A continuous collector current
rating reduces component count
§ High pulse current rating makes it ideal for
capacitive load circuits
§ Low temperature co-efficient of VCE (ON) ensures
reduced power dissipation at operating junction
temperatures
§ Reverse voltage avalanche rating improves the
robustness in sustain driver application
§ Short fall & rise times for fast switching
This IGBT is specifically designed for sustain & energy recovery application
in plasma display panels. This IGBT features low VCE (ON) and fast switching
times to improve circuit efficiency and reliability. Low temperature co-efficient
of VCE (ON) makes this IGBT an ideal device for PDP sustain driver application. TO-247AC
*Package limited to 60A.
Absolute Maximum Ratings
Parameter Max. Units
VCES Collector-to-Emitter Voltage 250 V
IC @ TC = 25°C Continuous Collector Current 104* A
IC @ TC = 100°C Continuous Collector Current 56
ICM Pulse Collector Current
c
208
ILM Clamped Inductive Load current
d
290
VGE Gate-to-Emitter Voltage ±20 V
EARV Reverse Voltage Avalanche Energy
e
1240 mJ
PD @ TC = 25°C Maximum Power Dissipation 330 W
PD @ TC = 100°C Maximum Power Dissipation 130
TJOperating Junction and -55 to +150
TSTG Storage Temperature Range °C
Solder Temperature Range, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Thermal / Mechanical Characteristics
Parameter Min. T
y
p. Max. Units
RθJC Junction-to-Case- IGBT ––– ––– 0.38 °C/W
RθCS Case-to-Sink, flat, greased surface ––– 0.24 –––
RθJA Junction-to-Ambient, typical socket mount ––– ––– 40
Wt Weight ––– 6 (0.21) –– g (oz.)
IRGP4050
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Notes:
Repetitive rating; VGE = 20V, pulse width limited by max. junction temperature. ( See fig. 13b )
VCC = 80%(VCES), VGE = 20V, L = 10µH, RG = 5.0, (See fig. 13a).
Repetitive rating; pulse width limited by maximum junction temperature.
Pulse width 2.5ms; duty factor 0.1%.
Pulse width 5.0µs, single shot.
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)CES Collector-to-Emitter Breakdown Volta
g
e 250 V VGE = 0V, IC = 250
µ
A
V(BR)ECS Emitter-to-Collector Breakdown Voltage
f
18 V VGE = 0V, IC = 1.0A
V(BR)CES/TJTemperature Coeff. of Breakdown Voltage —8.2—mV/°C
VGE = 0V, IC = 1mA
—1.641.90 IC = 30A
VCE(on) Collector-to-Emitter Saturation Voltage 2.04 V IC = 56A VGE = 15V
—2.60 IC = 104A, TJ = 150°C See Fi
g
. 2, 5
VGE(th) Gate Threshold Voltage 3.0 6.0 VCE = VGE, IC = 250
µ
A
VGE(th)
/
TJThreshold Voltage temp. coefficient -11 mVC VCE = VGE, IC = 0.25mA
gfe Forward Transconductance
g
34 51 S VCE = 100V, IC = 56A
ICES Zero Gate Voltage Collector Current 250 VGE = 0V, VCE = 250V
——2.0µA
VGE = 0V, VCE = 10V
5000 VGE = 0V, VCE = 250V, TJ = 150°C
IGES Gate-to-Emitter Leakage Current ±100 nA VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
QgTotal Gate Charge (turn-on) 230 350 IC = 56A
Qge Gate-to-Emitter Charge (turn-on) 37 56 nC VCC = 200V See Fig. 8
Qgc Gate-to-Collector Charge (turn-on) 78 120 VGE = 15V
td(on) Turn-On delay time 37 TJ = 25°C
trRise time 35 ns IC = 30A, VCC = 180V
td(off) Turn-Off delay time 120 180 VGE = 15V, RG = 5.0
tfFall time 59 89 Energy losses include "tail"
Eon Turn-On Switching Loss 45 See Fig. 9, 10, 14
Eoff Turn-Off Switching Loss 125 µJ
ETS Total Switching Loss 170
td(on) Turn-On delay time 35 TJ = 15C
trRise time 35 ns IC = 30A, VCC = 180V
td(off) Turn-Off delay time 130 VGE = 15V, RG = 5.0
tfFall time 120 Energy losses include "tail"
ETS Total Switching Loss 280 µJ See Fig. 11, 14
LEInternal Emitter Inductance 13 nH Measured 5mm from package
Cies Input Capacitance 4650 VGE = 0V
Coes Output Capacitance 480 pF VCC = 30V, See Fig. 7
Cres Reverse Transfer Capacitance 92 f = 1.0MHz
IRGP4050
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Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics
0.1 110 100
VCE
, Collecto-to-Emitter Voltage (V)
0.1
1
10
100
1000
IC, Collector-to-Emitter Current (A)
VGE
= 15V
20µs PULSE WIDTH
TJ = 25°C
TJ = 150°C
0246810121416
VGE, Gate-to-Emitter Voltage (V)
0.01
0.1
1
10
100
1000
IC, Collector-to-Emitter Current (A)
TJ = 150°C
TJ = 25°C
VCC = 50V
20µs PULSE WIDTH
0.1 110 100
f , Frequency ( kHz )
0
20
40
60
80
100
120
140
Load Current ( A )
For both:
Duty cycle : 50%
Tj = 125°C
Tsink = 90°C
Gate drive as specified
Power Dissipation = 73W
Triangular wave:
Clamp voltage:
80% of rated
60% of rated
voltage
Ideal di odes
Square wave:
IRGP4050
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Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
Fig. 4 - Maximum Collector Current vs. Case
Temperature
-60 -40 -20 020 40 60 80 100 120 140 160
TJ , Junction Temperature (°C)
1.0
2.0
3.0
4.0
VCE , Collector-to Emitter Voltage (V)
IC = 112A
VGE = 15V
80µs PULSE WIDTH
IC = 56A
IC = 28A
1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t1 , Rectangular Pulse Duration (sec)
0.0001
0.001
0.01
0.1
1
Thermal Response ( Z thJC )
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE ) Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
Ri (°C/W) τi (sec)
0.0906 0.000350
0.0906 0.002209
0.2003 0.028536
τJ
τJ
τ1
τ1
τ2
τ2τ3
τ3
R1
R1R2
R2R3
R3
τ
τC
Ci i/Ri
Ci= τi/Ri
25 50 75 100 125 150
TC , Case Temperature (°C)
0
20
40
60
80
100
120
Maximum DC Collector Current (A)
LIMITED BY PACKAGE
IRGP4050
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Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
Fig. 10 - Typical Switching Losses vs.
Junction Temperature
050 100 150 200
VCE, Collector-toEmitter-Voltage(V)
10
100
1000
10000
100000
Capacitance (pF)
Cies
Coes
Cres
VGS = 0V, f = 1 MHZ
Cies = C ge + Cgd, C ce SHORTED
Cres = Cgc
Coes = Cce + Cgc
0 50 100 150 200
Q G, Total Gate Charge (nC)
0
2
4
6
8
10
12
14
16
VGE, Gate-to-Emitter Voltage (V)
VCES
= 200V
IC = 56A
0 5 10 15 20 25 30
RG, Gate Resistance ()
800
1000
1200
1400
1600
1800
2000
2200
2400
Total Swiching Losses (µJ)
VCE = 200V
VGE = 15V
TJ = 25°C
IC = 56A
-55 -5 45 95 145
TJ, Juntion Temperature (°C)
0
1000
2000
3000
4000
5000
6000
7000
Total Swiching Losses (µJ)
RG = 5.0Ω
VGE
= 15V IC = 112A
IC = 56A
IC = 28A
IRGP4050
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Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
Fig. 12 - Turn-Off SOA
20 40 60 80 100 120
IC, Collecto-to-Emitter (A)
0
1000
2000
3000
4000
5000
6000
Total Swiching Losses (µJ)
RG = 5.0Ω
TJ = 150°C
VCE
= 200V
VGE
= 15V
110 100 1000
VDS, Drain-to-Source Voltage (V)
1
10
100
1000
IC, Collector-to-Emitter Current (A)
VGE = 20V
TJ = 125°
SAFE OPERATING AREA
IRGP4050
www.irf.com 7
480V
4 X IC@25°C
D.U.T.
50V
L
V *
C
cd
* Driver same type as D.U.T.; Vc = 80% of Vce(max)
* Note: Due to the 50V power supply, pulse width and inductor
will increase to obtain rated Id.
1000V
Fig. 13a - Clamped Inductive
Load Test Circuit
Fig. 13b - Pulsed Collector
Current Test Circuit
480µF
960V
0 - 480V
RL =
t=5µs
d(on)
t
t
f
t
r
90%
t
d(off)
10%
90%
10%
5%
V
C
I
C
E
on
E
off
ts on off
E = (E +E )
c
d
e
Fig. 14b - Switching Loss
Waveforms
50V
Driver*
1000V
D.U.T.
I
C
C
V
c
de
L
Fig. 14a - Switching Loss
Test Circuit
* Driver same type
as D.U.T., VC = 480V
IRGP4050
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Data and specifications subject to change without notice.
This product has been designed and qualified for the Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.06/04
TO-247AC Part Marking Information
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Note: "P" in assembly line
position indicates "Lead-Free"
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/