1
FEATURES
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
DIGITAL AUDIO PROCESSOR WITH ANALOG INTERFACE
Audio Digital Signal Processor
2
Audio Input/Output Programmable Functionality 3 Synchronous Serial Audio Inputs 135-MHz Operation(6 Channels)
48-Bit Data Path With 76-Bit Accumulator 2 Synchronous Serial Audio Outputs
Two Memory Loads and One Memory Store(4 Channels)
Per Cycle Input and Output Data Formats: 16-, 20-, or
Usable 768 Data RAM Words (48-Bit),24-Bit Data Left, Right ,and I
2
S
Usable 1K Coefficient RAM (28-Bit) SPDIF Transmitter
Usable 2.5K Program RAM 64 Fs Bit Clock Rate
360 ms at 48 kHz, 17408 Words 24-Bit Delay 512 Fs XTAL Input for Master Mode Clock Memory for Video SyncRates
System Control Processor 256 Fs MCLKIN for Slave Mode Clock Rates
Embedded 8051 WARP Microprocessor 10 Multiplexed Stereo Analog Inputs
Programmable Using Standard 8051 CSelectable into 1 Stereo ADC and 3 Stereo
CompilersLine Outputs
16K Words of Program RAM (8-Bit) High Quality DNR: 93 dB (Typical) ADC
2048 Words of Data RAM (8-Bit)Channel Performance (2 Channels)
256 Words of Internal RAM (8-Bit) 3 Single-Ended Analog Stereo Line Driver
Programmable FunctionalityOutputs With 1 of 11 Selectable Input, 10 k
General Features 100-pF Drive Capability (Typical Output
Easy-to-Use Control InterfaceLevel: 1 Vrms)
I
2
C Serial Control Master and Slave 3 Stereo Audio DACs
Interface High-Quality DNR: 97 dB (Typical) DAC
Control Interface Operational WithoutChannel Performance (6 Channels)
External MCLK Input Stereo Headphone Amplifier 24 mW Power
Single 3.3-V Power SupplyOutput into 16 , 100 pF
Integrated Regulators 100-Pin TQFP (PZP) Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
DVSS1
VREG_EN
STEST
TEST
TEST
GPIO4
GPIO3
MCLKOUT
LRCLKOUT
SCLKOUT
SDOUT1
SDOUT2/SPDIFOUT
DVDD2
VR_DIG1
DVSS2
SPDIF_IN
TEST
TEST
TEST
TEST
SDIN3
SDIN2
SDIN1
LRCLKIN
SCLKIN
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
MCLKIN
DVSS3
DVDD3
I2C_SDA2
I2C_SCL2
I2C_SDA1
I2C_SCL1
CS
GPIO1
GPIO2
MUTE
RESET
DVSS4
DVDD4
DVSS5
VR_DIG2
AVSS_ESD
LINEIN1L
LINEIN1R
AVDD_LI
LINEIN2L
LINEIN2R
AVSS_LI
LINEIN3L
LINEIN3R
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
V1P5_REF
BG_REF
BIAS_REF
AVSS_ADC/REF
AVDD_ADC
LINEIN10R
LINEIN10L
AVSS_LI
LINEIN9R
LINEIN9L
AVDD_LI
LINEIN8R
LINEIN8L
AVSS_LI
LINEIN7R
LINEIN7L
AVDD_LI
LINEIN6R
LINEIN6L
AVSS_LI
LINEIN5R
LINEIN5L
AVDD_LI
LINEIN4R
LINEIN4L
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
DVDD1
AVDD_OSC
VR_ANA
XTAL_OUT
XTAL_IN
AVSS_ESD
AVDD_HP
HPOUTR
AVSS_HP
HPOUTL
AVDD_HP
AVDD_DAC
AVSS_DAC
DACOUT2R
DACOUT2L
DACOUT1R
DACOUT1L
LINEIN1R
LINEIN1L
AVSS_LO
LINEOUT2R
LINEOUT2L
LINEOUT3R
LINEOUT3L
AVDD_REF
TAS3218
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The TAS3218 is available in a 100-pin TQFP (PZP) package.
PZP PACKAGE
(TOP VIEW)
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
TAS3218IPZP 40 ° C to 85 ° C TAS3218IPZPTAS3218IPZPRTQFP PZP Tape and reel
TAS3218PZP 20 ° C to 70 ° C TAS3218PZPTAS3218PZPR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
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TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
TERMINAL FUNCTIONS
TERMINAL
I/O TERMINATION
(1)
DESCRIPTIONNO. NAME
1 DVSS1 P Digital ground2 VREG_EN DI Voltage regulator enable3 STEST DI Pulldown Test pin to reconfigure pins4, 5,17, 18, TEST Pulldown19, 20
6 GPIO4 DIO Pulldown General purpose input/output 47 GPIO3 DIO Pulldown General purpose input/output 38 MCLKOUT DO Master clock output9 LRCLKOUT DO Left/right (frame) clock output10 SCLKOUT DO Serial audio data clock output11 SDOUT1 DO Serial digital audio data output 1SDOUT2/12 DO Serial digital audio data out 2 or S/PDIF outSPDIF_OUT
13 DVDD2 P 3.3-V digital powerPin out of internal regulator. A 4.7-F low ESR capacitor should be14 VR_DIG1 P connected between this pin and digital ground. This terminal must not beused to power external devices.15 DVSS2 P Digital ground16 SPDIF_IN DI S/PDIF input21 SDIN3 DI Serial digital audio data input 322 SDIN2 DI Serial digital audio data input 223 SDIN1 DI Serial digital audio data input 124 LRCLKIN DI Left/right (frame) clock input25 SCLKIN DI Serial audio data clock input26 MCLKIN DI Master clock input27 DVSS3 P Digital ground28 DVDD3 P 3.3-V digital power master29 I2C_SDA2 DIO I
2
C serial data master30 I2C_SCL2 DIO I
2
C serial clock slave31 I2C_SDA1 DIO I
2
C serial data slave32 I2C_SCL1 DIO I
2
C serial clock33 CS DI Chip select34 GPIO1 DIO General purpose input/output 135 GPIO2 DIO General purpose input/output 236 MUTE DI Pullup Mute device37 RESET DI Pullup Reset38 DVSS4 P Digital ground39 DVDD4 P 3.3-V digital power40 DVSS5 P 3.3-V digital powerPin out of internal regulator. A 4.7-F low ESR capacitor should be41 VR_DIG2 P connected between this pin and digital ground. This terminal must not beused to power external devices.42 AVSS_ESD P Analog ESD ground43 LINEIN1L AI Left-channel analog input 1
(1) All pullups are 20-A weak pullups, and all pulldowns are 20-A weak pulldowns (166 k) . The pullups and pulldowns are included toensure proper input logic levels if the terminals are left unconnected (pullups at logic 1 input; pull-downs at logic 0 input). Devices thatdrive inputs with pullups must be able to sink 20 A while maintaining a logic 0 drive level. Devices that drive inputs with pull-downs mustbe able to source 20 A while maintaining a logic 1 drive level.
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TAS3218
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TERMINAL FUNCTIONS (continued)
TERMINAL
I/O TERMINATION
(1)
DESCRIPTIONNO. NAME
44 LINEIN1R AI Right-channel analog input 145, 53,
AVDD_LI P 3.3-V analog power59, 65
46 LINEIN2L AI Left-channel analog input 247 LINEIN2R AI Right-channel analog input 248, 56,
AVSS_LI P Analog ground62, 68
49 LINEIN3L AI Left-channel analog input 350 LINEIN3R AI Right-channel analog input 351 LINEIN4L AI Left-channel analog input 452 LINEIN4R AI Right-channel analog input 454 LINEIN5L AI Left-channel analog input 555 LINEIN5R AI Right-channel analog input 557 LINEIN6L AI Left-channel analog input 658 LINEIN6R AI Right-channel analog input 660 LINEIN7L AI Left-channel analog input 761 LINEIN7R AI Right-channel analog input 763 LINEIN8L AI Left-channel analog input 864 LINEIN8R AI Right-channel analog input 866 LINEIN9L AI Left-channel analog input 967 LINEIN9R AI Right-channel analog input 969 LINEIN10L AI Left-channel analog input 1070 LINEIN10R AI Right-channel analog input 1071 AVDD_ADC P 3.3-V analog power72 AVSS_ADC/REF P Analog ground73 BIAS_REF AO Pin should be tied to analog ground with 22-k 1%74 BG_REF AO Band gap output. Must be tied to ground with 1-F low ESR capacitor.75 V1P5_REF AO Common mode output. Must be tied to ground with 1-F low ESR capacitor.76 AVDD_REF P 3.3-V analog power77 LINEOUT3L AO Analog line output #3 left channel78 LINEOUT3R AO Analog line output #3 right channel79 LINEOUT2L AO Analog line output #2 left channel80 LINEOUT2R AO Analog line output #2 right channel81 AVSS_LO P Analog ground82 LINEOUT1L AO Left-channel analog output 183 LINEOUT1R AO Right-channel analog output 184 DACOUT1L AO Left-channel digital-to-analog converter output 185 DACOUT1R AO Right-channel digital-to-analog converter output 186 DACOUT2L AO Left-channel digital-to-analog converter output 287 DACOUT2R AO Right-channel digital-to-analog converter output 288 AVSS_DAC P Analog ground89 AVDD_DAC P 3.3-V analog power90 AVDD_HP P 3.3-V analog power91 HPOUTL AO Left-channel headphone output92 AVSS_HP P Analog ground93 HPOUTR AO Right-channel headphone output94 AVDD_HP P 3.3-V analog power
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DESCRIPTION
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O TERMINATION
(1)
DESCRIPTIONNO. NAME
95 AVSS_ESD P Analog ground96 XTAL_IN DI External crystal input97 XTAL_OUT DO External crystal outputPin out of internal regulator. A 4.7-F low ESR capacitor should be98 VR_ANA P connected between this pin and digital ground. This terminal must not beused to power external devices.99 AVDD_OSC P 3.3-V analog power100 DVDD1 P 3.3-V digital power
TAS3218 is an audio system-on-a-chip (SOC) designed for digital television audio systems and mini/microcomponent applications. TAS3218 has a programmable audio DSP that preserves high-quality audio by using a48-bit data path, 28-bit filter coefficients, and a single cycle 28 x 48-bit multiplier. The programmability featureallows users to customize features in the DSP RAM.
The TAS3218 is composed of seven functional blocks.Clock and serial data interfaceAnalog input and outputM8051 WARP controller, serial control interface, and device controlAudio DSP digital audio processingPower supplyInternal references
Figure 1 shows the functional structure of the TAS3218.
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SAP
IN
Audio
processing
Control
I2C8051
A -MUX
10:1
2CH
ADC
10 chstereo
Analog
Inputs
DAC
Mod
6CH
DAC
SPDIF
HPAMP
SDIN 1
SDIN 2
SDIN 3
HPOUTL / R
SAP
OUT
SDOUT 1
SCL 1
SDA 1
SCL 2
SDA 2
GPIO 1-4
CS
SPDIFOUT /
SDOUT 2
3:1
MUX SPDIFIN
MUTEZ
2
2
2
MCLKIN
SCLKIN
LRCLKIN
MCLKOUT
SCLKOUT
LRCLKOUT
SCLKI
LRCLKI
0.8 uF
2.8 VRMS
10 K ohm
220
33K
47 uF
2
DACOUT 1 L/ R
DACOUT 2L/ R2
2
10 chstereo
10 chstereo
AnaloglineInput
1V
RMS
16 Ohm
Clock
Control
OSC512Fs
AVSS
TBD
TBD
R
bia s
512 Fs
10 pf
10 pfAVSS
Rbias
2LINEOUT 1L/R
2
A-MUX
10:1 LINEOUT 3L/R
2LINEOUT 2L/R
ApplytoallLineand
DACoutputs
2.2 uF
10K ohm
0.9 V RMS( MAX )
1V RMS( MAX )
Lineoutputs
DACoutputs
A-MUX
10:1
A-MUX
11:1
TAS3218
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Figure 1. Block Diagram
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SAP
IN
Audio
processing
Control
I2C8051
A -MUX
10:1
2CH
ADC
10 chstereo
Analog
Inputs
DAC
Mod
6CH
DAC
SPDIF
HPAMP
SDIN 1
SDIN 2
SDIN 3
HPOUTL / R
SAP
OUT
SDOUT 1
SCL1
SDA1
SCL 2
SDA2
GPIO 1-4
CS
SPDIFOUT /
SDOUT 2
3:1
MUX SPDIFIN
MUTEZ
2
2
DACOUT 1L/ R
2
DACOUT 2L/ R
2
2
MCLKIN
SCLKIN
LRCLKIN
MCLKOUT
SCLKOUT
LRCLKOUT
2
A- MUX
11:1
SCLKI
LRCLKI
LINEOUT 1L/R
2
10 chstereo
Clock
Control
OSC512Fs
AVSS
TBD
TBD
R
bias
512 Fs
10pf
10pfAVSS
Rbi as
External
ASRC
MCLKO
SCLKO
LRCLKO
SDO 1
SDO 2
SDO 3
SDIN1A
SDIN2B
SDIN3B
SDIN4B
SCLKA
LRCLKA
MCLKA
SCLKB
LRCLKB
MCLKB
MUX
MCLKI
SCLKI
LRCLKI
MUX SDI1
SDI2
SDI3
MCLKOUT
SCLKOUT
LRCLKOUT
Clocks
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
Figure 2. Interface to External ASRC
The TAS3218 can be configured as either the clock master or clock slave depending on the settings in the clockconfiguration register. By default, the TAS3218 is configured as the clock master. Figure 3 shows the blockdiagram of the TAS3218 clocks
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SAP OUT
(Transmitter )
LRCLKOUT
(Recreation /
Normalization )
DPLL
(11x)
DSP_CLK
(135MHz)
DIVBY
4MICRO_CLK
(33MHz)
MCLKOUT
256Fs
2816Fs
64Fs
Fs
SCLKOUT
64Fs
SCLKIN
LRCLKOUT
Fs
LRCLKIN
MCLKIN
128Fs
MCLKIN DIVBY
2
256Fs
CMS (ClockMaster /SlaveSelection )
DIVBY
2
DIVBY
4
DIVBY
8
DIVBY
512
0
1
0
1
0
1
0
1
CMS
CMS
SAP IN
(Receiver )
SDIN 1
DatatoDSP Ch 1[23 :0 ]
ON (OutputNormalization
Enable)
SDOUT 1
DatafromDSP Ch 1 [23:0]
SDIN 2
SDIN 3
DatatoDSP Ch 2[23 :0 ]
DatatoDSP Ch 3[23 :0 ]
DatatoDSP Ch 4[23 :0 ]
DatatoDSP Ch 5[23 :0 ]
DatatoDSP Ch 6[23 :0 ]
DatafromDSP Ch 2 [23 :0]
DatafromDSP Ch 3 [23 :0]
DatafromDSP Ch 4 [23 :0]
sdout2
SPDIF_CLK
IM[1:0]
(SAP InputMode )
OM[1 :0](SAP OutputMode )
SPDIF
Transmitter
ParallelDatafromDSP SPDIF _L[23:0]
ParallelDatafromDSP SPDIF _R[23:0]
SPDIF _CONTROL_ REG_IN[]
spdif_tx_out
01
00
1*
SPDIF _IN
I2CModule
DIVby 10
DIVby
(M+1)
DIVby 2^N
I2CSamplingClock
(N = 0)
SCLSDA
I2CMasterSCL
Clock
(M = 8)
IM[1:0]
DigitalSignalProcessor
(DSP)
8051uC & Control
N[2:0]
M[2:0]
CMS
IW[1:0]
(SAP InputWordSize )
OW[1 :0](SAP OutputWordSize )
OUTMUX [1:0]
(AudioOutputSelect - ControlBits [1:0]
fromSPDIFControlRegister : 0x16)
SPDIF_OUT/
SDOUT2
0
1
SPDIF_MUTE
0
(MuteControlRegister : 0x09)
SAPOUT_MUTE [1:0]
OSC
512Fs
Digital Audio Interface
TAS3218
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Figure 3. Clocking System
The TAS3218 has three digital inputs that accept discrete I
2
S, discrete left-justified, and discrete right-justifiedPCM data.
The TAS3218 has two digital outputs that provide discrete I
2
S, discrete left-justified, and discrete right-justifiedPCM data.The second digital output can also be configured to provide S/PDIF encoded PCM data.
The TAS3218 has a SPDIF input which is capable of routing an S/PDIF encoded signal through the device. Thisinput is not processed by the digital audio processor (DAP) The clocking system for the device is illustrated inFigure 4 .
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Product Folder Link(s): TAS3218
I C Sub Address x 00
2
S Slave Addr Sub Addr
Ack Ack Ack AckAck Ack
IM
Res ResRes Res OM
Res Res Res
ON OW Res
IW Res
CMS
31 25 24 23 21 18 16 15 13 11 975310
I C Sub Address x 01
2
S Slave Addr Sub Addr
Ack Ack N
AckRes ResAck Ack Res Ack
M
Res
31 23 15 76 2 0
CLOCK MASTER SELECTCMS
0Clock slave mode
1 Master mode
SAP OUTPUT NORMALIZATIONON
0Normalization disable
1 Normalization enable
OUTPUT SAP WORD SIZE
16-bit
20-bit
24-bit
OW[1]
0
0
1
1
OW[0]
0
1
0
1 Reserved
INPUT SAP WORD SIZE
16-bit
20-bit
24-bit
IW[1]
0
0
1
1
IW[0]
0
1
0
1 Reserved
INPUT SAP MODE
Left-justified
Right-justified
I S
2
IM[1]
0
0
1
1
IM[0]
0
1
0
1 Reserved
OUTPUT SAP MODE
Left-justified
Right-justified
I S
2
OM[1]
0
0
1
1
OM[0]
0
1
0
1 Reserved
Clock Master Operation
Clock Slave Operation
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
Figure 4. Clocking System I
2
C Mapping
When configured as the device clock master, an external crystal is used as a reference to an internal oscillator.In this mode of operation, all internal clocks are generated by the oscillator.LRCLKOUT is fixed at 48 kHz (Fs)SCLKOUT is fixed at 64 FsMCLKOUT is fixed 256 Fs
When configured as the device clock Slave, the DAP, MCU, and I
2
C interface are derived from the externalcrystal, however the digital audio clocks are supplied externally.
Internal analog clocks for the analog to digital converter (ADC) and digital to analog converter (DAC) are derivedfrom the MCLKIN input. As a result, analog performance will depend on the quality of MCLKIN.
Degradation in analog performance is to be expected depending on the quality of MCLKIN.
The TAS3218 device does not include any internal clock error or click/pop detection/management. The muting ofthe outputs at updating of sample rate dependent coefficients must be initiated by the host system controller.
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Digital Audio Data Formats
LRCLK (note reversed phase)
SCLK
2-Channel I S (Philips Format) Stereo Input
2
Left Channel Right Channel
LSBMSB MSB LSB
32 clks 32 clks
24-Bit Mode
20-Bit Mode
16-Bit Mode
23 22 21 20 19 18 17 16 15 14 13 10 9 8 765432 1 012 11 23 22 21 20 19 18 17 16 15 14 13 10 9 8 765432 1 012 11
19 18 17 16 15 14 13 10 9 8 765432 1 012 11
15 14 13 10 9 8 765432 1 012 11
19 18 17 16 15 14 13 10 9 8 765432 1 012 11
15 14 13 10 9 8 765432 1 012 11
TAS3218
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MCLKOUT, SCLKOUT, and LRCLKOUT are passed through from the clock inputs MCLKIN, SCLKIN, andLCLKIN.
MCLKIN 256 Fs is supplied externallySCLKIN 64 Fs is supplied externallyLRCLKIN Fs is supplied externally
NOTE:
In slave mode all incoming serial audio data must be synchronous to an incomingLRCLKIN of 32, 44.1 or 48 kHz. The TAS3218 does not support the use of anexternal (i.e., 24 MHz) clock input through into XTALI
Serial data is input on pins SDIN1-3 on the TAS3218, allowing up to 6 channels of digital audio input. TheTAS3218 supports 16-, 20-, or 24-bit data in left, right, or I
2
S serial data format. By default, all TAS3218 serialdigital inputs are configured in the 24-bit I
2
S format. The serial data input format is configurable via theSAP/Clock Settings Register.
Serial data is output on pins SDOUT1-2, allowing up to 4 channels of digital audio output. By default, the SDOUTdata format is 24-bit, I
2
S format at the same data rate as the input. The SDOUT1-2 output uses the SCLKOUTand LRCLKOUT signals to provide synchronization. SDOUT2 is multiplexed with an SPDIF output.
NOTE:
To avoid audio artifacts, I
2
C commands to reconfigure the serial audio port (SAP)should not be issued as standalone commands, rather should be accompanied bymute and unmute commands.
The TAS3218 uses the SCLK as a reference for both input and output samples. The negative edge of SCLK isused to output a new data bit, where as the positive edge of SCLK is used to sample incoming serial data.
Discrete I
2
S Timing
I
2
S timing uses an LRCLK to define when the data being transmitted is for the left channel and when it is for theright channel. The LRCLK is LOW for the left channel and HIGH for the right channel. A bit clock running at 64Fs is used to clock in the data. There is a delay of one bit clock from the time the LRCLK signal changes state tothe first bit of data on the data lines. The data is written MSB first and is valid on the rising edge of bit clock. TheTAS3218 will mask unused trailing data bit positions.
A. All data are presented in 2's complement form with MSB first.
Figure 5. SAP I
2
S Format 64 Fs Format
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LRCLK
SCLK
2-Channel Left-Justified Stereo Input
Left Channel Right Channel
LSBMSB MSB LSB
32 clks 32 clks
24-Bit Mode
20-Bit Mode
16-Bit Mode
23 22 21 20 19 18 17 16 15 14 13 10 9 8 765432 1 012 11
19 18 17 16 15 14 13 10 9 8 765432 1 012 11
15 14 13 10 9 8 765432 1 012 11
23 22 21 20 19 18 17 16 15 14 13 10 9 8 765432 1 012 11
19 18 17 16 15 14 13 10 9 8 765432 1 012 11
15 14 13 10 9 8 765432 1 012 11
LRCLK
SCLK
2-Channel Right-Justified (Sony Format) Stereo Input
Left Channel Right Channel
LSBMSB MSB LSB
32 clks 32 clks
24-Bit Mode
20-Bit Mode
16-Bit Mode
23 22 21 20 19 18 17 16 15 14 13 10 9 8 765432 1 012 11
19 18 17 16 15 14 13 10 9 8 765432 1 012 11
15 14 13 10 9 8 765432 1 012 11
23 22 21 20 19 18 17 16 15 14 13 10 9 8 765432 1 012 11
19 18 17 16 15 14 13 10 9 8 765432 1 012 11
15 14 13 10 9 8 765432 1 012 11
SAP Input and Output Normalization
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
Discrete Left-Justified
Left-justified (LJ) timing uses an L/RCLK to define when the data being transmitted is for the left channel andwhen it is for the right channel. The LRCLK is HIGH for the left channel and LOW for the right channel. A bitclock running at 64 Fs is used to clock in the data. The first bit of data appears on the data lines at the sametime the LRCLK toggles. The data is written MSB first and is valid on the rising edge of bit clock. The TAS3218will mask unused trailing data bit positions.
A. All data are presented in 2's complement form with MSB first.
Figure 6. SAP Left-Justified 64 Fs Format
Discrete Right-Justified
Right Justified (RJ) timing uses an L/RCLK to define when the data being transmitted is for the left channel andwhen it is for the right channel. The L/RCLK is HIGH for the left channel and LOW for the right channel. A bitclock running at 64 Fs is used to clock in the data. The first bit of data appears on the data 8-bit clock periods(for 24-bit data) after L/RCLK toggles. In RJ mode the LSB of data is always clocked by the last bit clock beforeL/RCLK transitions. The data is written MSB first and is valid on the rising edge of bit clock. The TAS3218 willmask unused leading data bit positions.
A. All data are presented in 2's complement form with MSB first.
Figure 7. SAP Right-Justified 64 Fs Format
The TAS3218 supports SAP input and SAP output normalization. This supports simultaneous output toleft-justified and I
2
S devices.
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External
Data Source TAS3208 DAC
I S, Left, or
Right Justified
2I S, Left, or
Right Justified
2
MCLKIN
SCLKIN
LRCLKIN
SDIN
MCLKOUT
SCLKOUT
LRCLKOUT
SDOUT
TAS3218
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NOTE:
The normalization function is only available in Slave mode.
Figure 8. SAP Output Normal Configuration (No Normalization)
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External
DataSource TAS3218
DAC1
(LeftJustified)
DAC2
(I S)
2
I S
2LRCLK
MSB
I SLRCLK
2
I SSDIN
2
SCLK
MSB
LeftChannel RightChannel
MSB
Left-JustifiedLRCLK
Left-JustifiedSDOUT MSB
LeftChannel RightChannel
I S
2
LeftJustified
SDOUT
LeftJustified
SDIN
LeftJustified
LRCLK
TAS3218
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Figure 9. SAP Output Configuration (I
2
S to Left Normalization ON)
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Figure 10. SAP Output Configuration (I
2
S to Left Normalization OFF)
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External
Data
Source
TAS3208
DAC1
(I2S)
DAC2
(LeftJusitified)
LeftJustified
I2S
LRCLK
I2S
SDOUT
I2S
SDIN
LeftJustified
LRCLK
MSB
LeftJustified
LRCLK
SCLK
LeftJustified
SDIN MSB
LeftChannel RightChannel
MSB
I2SLRCLK
I2SSDOUT MSB
LeftChannel RightChannel
MSB
LeftChannel
TAS3218
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Figure 11. SAP Output Configuration (Left to I
2
S Normalization ON)
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MSB
I2 SLRCLK
SCLK
I2 SSDIN MSB
LeftChannel RightChannel
MSB
LeftJustifiedLRCLK
LeftJustifiedSDOUT MSB
LeftChannel RightChannel
SPDIF Encoder
SPDIF Control
Register
DAP
Serial Audio
Port
(Receiver)
SDOUT2
SDOUT2/
SPDIF
Serial Audio Port
Transmitter
Control Signals
SPDIF Encoder
Channel Mute
Control
Output
Selector
Analog
Interface
SCLKIN
LRCLKIN
SDIN
SPDIF_IN
ANALOGIN
“0”
TAS3218
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Figure 12. SAP Output Configuration (Left to I
2
S Normalization OFF)
The SPDIF encoder is a digital audio transmitter designed for use in consumer audio applications. Transmit datarates up to 48 kHz are supported. The SPDIF encoder complies with the IEC-60958 interface standard.
The SPDIF encoder creates a multiplexed bit stream, containing audio, status, and user data. The multiplexeddata format is shown in Figure 14 . The data is then bi-phase mark-encoded and output.
The hardware architecture of the S/PDIF Encoder can is shown in Figure 13 .
Figure 13. SPDIF Encoder Hardware Architecture
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Start of Channel Status Block
Audio DataPreamble
Bits: 03 4 7 8 27 28 29 30 31
Aux Data LSB MSB VUC P
Channel A Channel A Channel A Channel BChannel BChannel B Z Y YXX
Validity Data
User Data
Parity Bit
Frame 191 Frame 0 Frame 1
One Sub-Frame
Channel Status Data
TAS3218
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Figure 14. SPDIF Frame Format
SPDIF Encoder Operation
The SPDIF encoder performs the multiplexing of audio, channel status, user, and validity flag. It also performsbi-phase mark encoding of the multiplexed data stream. Audio data for both left and right channels from the DAPare latched at the rising edge of the internal LRCLK, which marks the beginning of next sample cycle. The SPDIFencoder then multiplexes these samples with internally generated preambles, channel status, user data, validityflag, and parity. The channel status and validity flag are generated based on the settings in the SPDIF controlregisters while the user data is fixed to all zero. The bi-phase mark encoded signal is then output starting at thenext rising edge of the internal LRCLK. The generated SPDIF stream is fixed to consumer mode linear audioPCM format.
While the RESET input is low, the transmitter output, SPDIF_OUT, is forced to logic low level. Upon settingRESET high, the SPDIF encoder will remain inactive until the module reset is removed by writing 0 to the RSTbit of the control register. Then this module will wait for synchronization with the internal frame clock and startsencoding audio data. It is recommended to set all other SPDIF control register bits before releasing the modulereset.
Transmitter Control Register
Table 1 shows the M8051 SFR register map for the S/PDIF module control.
Table 1. M8051 SFR Register Map
ADDR 7 6 5 4 3 2 1 0
xx00 RST CP EMPxx01 CATEGORY Lxx10 SR VL VR SRCNUMxx11 CLKAC WORDLEN
The relationship of the M8051 SFR register map with I
2
C registers is described in Table 2 .
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Table 2. Relationship of M8051 SFR Register Map With I
2
C Registers
RST: Module reset0: Normal operation1: Reset SPDIF-TX module (default)CP: Copy permit0: Copy prohibit (default)1: Copy permitEMP: Pre-emphasis0: No pre-emphasis (default)1: 50/15 s 2-channel pre-emphasisCATEGORY: Category code 7-bit device category code. Default: 0101010(digital sound processor)L: Generation status0: Generation 1 or higher (default)1: OriginalSR: Sampling rate00: 44.1 kHz01: 48 kHz (default)10: Reserved11: 32 kHzVL: Validity for left channel0: Left channel data is valid (default)1: Left channel data is invalidVR: Validity for right channel0: Right channel data is valid (default)1: Right channel data is invalidSRCNUM: Source channel number0000: Not specified0001: 10010: 2 (default)0011: 3...1000: 8CLKAC: Clock accuracy00: Level II, 1000 ppm01: Level III, variable pitch shifted10: Level I, 50 ppm (default)11: ReservedWORDLEN: Sample bit size0000: 24 bits (default)0001: 23 bits0010: 22 bits...
20 bits0100:
...1000: 16 bitsOthers: Reserved
I
2
C Register Map for SPDIF
Figure 15 shows system accessible I
2
C register mapping for controlling the SPDIF module. The mute control(MTE) uses the same control bits for controlling SDOUT2 mute at subaddress 0x09 and the module reset (RST)is mapped to subaddress 0x10 together with other power down control bits. Other control bits are mapped tosubaddress 0x16.
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“0”
00000000000000
0 x 09
S Slave Addr Sub Addr
Ack Ack DIT
AMUXes SDOUT2 SDOUT1 DACs
31 18 17 12 11 10 9 87210
0 x 16
ESFR
31 2829 24
30 27 23 22 21 20 1619 15 9 8 72 1 0
0 . . . 0
0 x 10
S Slave Addr Sub Addr
Ack Ack DITRST PWRDN CTL
31 8760
Decode
MUTE
RSTZ
Decode
00
*1
10
X Mute Ctl
Force Mute Off
Force Mute On
1
0
Powerdown, disable
Powerup, enable
SPDIF-TX
SPDIF_IN
SDOUT2
TX-SAP
CP
S Slave Addr Sub Addr
Ack Ack OUTMUXEMP CLKAC WORDLEN SR VL VR SRCNUM CATEGORY L000000
CATEGORY L
SR SRCNUMVL VR
CLKAC WORDLEN
RST CP EMP
Specification Coverage
TAS3218
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Figure 15. I
2
C Register to EFSR and Hardware Connection Map
The TAS3218 is covered by the following specificaiotns:IEC60956-1: Second Edition, 2004-03IEC60956-3: Second Edition, 2003-01IEC958-2: First Edition, 1994-07
Specifcation coverage details can be found in Table 3 .
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Analog Audio Interface
Stereo Analog to Digital Converter
TAS3218
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Table 3. Specification Coverage for TAS3218
(1)
SPECIFICATION SECTION SUPPORTED REMARKS
Interface Format (4) Yes Auto frame formattingIEC60958-1
Channel Status (5) Yes First 2 bits fixed to 00. (consumer, linear PCM)Mode 1 (software info delivery usingIEC958-2 No Bits 28191 are fixed to all zero.b32191 of channel stat) (4.2.2.14.2.2.3)Channel Status General (5.1) Yes First channel status bit fixed to 0.b01: Fixed (00)b2: Register settableChannel Status Application (5.2.1)
YesByte0 (control)
b35: Register settableb67: Fixed (00)Category code is register settable, with default valueChannel Status Application (5.2.2)
Yes, with restriction 0101010L (Digital Sound Processor), but user data isByte1 (category)
fixed to all zero.b1619: Register settableChannel Status Application (5.2.2)
YesByte2 (source and channel number)
b2023: H/W auto set (1 for left, 2 for right channel)b2427: Register settable (32,44.1,48 kHz only)Channel Status Application (5.2.2)
Yes, with restrictionByte3 (sampling freq and clock accuracy)
b2829: Register settableIEC60958-3
H/W auto set according to register settingChannel Status Application (5.2.2)
b3235 : 24-bit original output sample is truncatedByte4 (word length, original sampling Yes, partially
to the specified word length.rate, Byte0, b1, 6, 7 = 0)
b3639 : Fixed to all zero (not indicated)Specifying categories other than 0101010L (DigitalCategory Code Groups (5.3.2) Yes, with restriction Sound Processor), especially those require non-zerouser data is not recommended.User Data (6) All zero
Clock accuracy indication is register settable.Timing accuracy (7.2.1) Yes Expected to set level I (50 ppm) for master mode(XTAL source) or level II (1000 ppm) for slave mode.Standard output buffer. Needs external SPDIF driverLine driver characteristics (7.3.2) No
(ex.: optical driver)
(1) Other sections of the specification not mentioned here are either considered irrelevant or covered elsewhere. IEC60958-4 is specific forprofessional applications and thus, irrelevant.
The TAS3218 is has 10 analog stereo inputs that are multiplexed to one analog to digital converter (ADC).Additionally, the TAS3218 has one line output that can source any of the 10 analog stereo inputs.
The TAS3218 has three stereo digital to analog converters (DAC). The outputs of of DAC3 are designed to beused as a 24 mW headphone amplifier or line driver. The other two DAC outputs are configured as stereo linedrivers.
Both the ADC and DAC blocks can be placed in power down when not used.
Figure 16 shows a block diagram of the Analog interface.
The TAS3218 has a analog 10:1 input multiplexer and a 11:1 output multiplexer. These can accept analog stereoinputs up to 1 Vrms. The outputs of the multiplexers are the stereo ADC and the line output.
The ADC supports a sampling rate of 48 kHz as a Clock Master Mode. In Clock Slave Mode, 32, 44.1, and 48kHz sampling frequencies are supported, based upon the master clock frequency.
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Stereo Digital to Analog Converters
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The TAS3218 has three stereo digital to analog converters (DACs). Each DAC can operate a maximum of 48kHz. The DACs provide a 48 kHz sampling frequency in master mode. In slave mode 32, 44.1, and 48 kHz aresupported, based upon the master clock frequency. Two of the DACs are configured for providing line outputs.One of the stereo DACs has the capability to drive either a line out or to be used as a headphone (HP) amplifier.
The stereo headphone amplifier is designed to drive up to 24 mW per channel into a headphone speaker load of16 . The headphone output is a single ended configuration using series 16- resistors and AC-couplingcapacitors.
The TAS3218 includes three multiplexed stereo line driver outputs. The input to each of these line drives can beselected to use one of the ten stereo analog input channels. Additionally, line driver output 1 can output thecontents of the stereo DAC. Each line driver is capable of driving up to a 10 k load.
NOTE:
To avoid audio aritifacts when using the line driver outputs, I
2
C commands toreconfigure the lineout multiplexers should not be issued alone, rather should beaccompanied by a mute/unmute sequence to all analog audio channels of theTAS3218.
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LINEOUT 2/3 L/R
(Stereo)
–1
Amp
MUX 10:1
LINEOUT 1 L/R
(Stereo)
–1
Amp DAC 1
–1
+
D2S Line Amp
MUX1
MUX 11:1
VREF
VREF and IBIAS
ADCAmp
Line Amp
–1
–1
MUX 10:1
LINE IN 10 ch
(Stereo)
1 V (single-ended)
RMS
DAC 3
DAC 2
–1
–1
+
+
D2S Line Amp
D2S HP Amp
DACOUT 1 L/R
(Stereo)
DACOUT 2 L/R
(Stereo)
HPOUT L/R
(Stereo)
Register Map for MUTE Control 0x09
DACOUT1
Pin Name
DAC 1
MUTE Block
LINEOUT1 13 12
BIT
Pin Name
MUX1
MUTE Block
LINEOUT2 15 13
BIT
Pin Name
MUX2
MUTE Block
LINEOUT3 17 14
BIT
Pin Name
MUX3
MUTE Block
DACOUT2
BIT
Pin Name
DAC 2
MUTE Block
54
HPOUT
BITPin Name
DAC 3
MUTE Block
2
3
76
BIT
0
*1
1
HW Mute control
DESCRIPTION
Force MUTE ON
Force MUTE OFF
0 0
MUX ADC
MUX1
TAS3218
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Figure 16. Analog Input/Output
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Embedded M8051 WARP Microcontroller
M8051 Addressing Modes
M8051 Boot-Up Sequence
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The embedded M8051 WARP microcontroller provides the overall control for the TAS3218 device. This controlincludes device initialization, memory loading, I
2
C transactions, control pin operations, and participation in mostprocessing tasks requiring multi-frame processing cycles.
The microcontroller has its own data RAM for storing intermediate values and queuing I
2
C commands, a fixedboot program ROM and a programmable program RAM. The microprocessors boot program cannot be altered.The microcontroller has specialized hardware for a master and slave interface operation, Volume Updates, and aprogrammable interval timer interrupt.
The 256 bytes of Internal Data Memory address space is accessible using indirect addressing instructions(including stack operations). However, only the lower 128 bytes are accessible using direct addressing. Theupper 128 bytes of direct address Data Memory space are used to access ESFRs.
Register Banks
There are four directly addressable register banks, only one of which may be selected at one time. The registerbanks occupy Internal Data Memory addresses from 00 hex to 1F hex.
Bit Addressing
The 16 bytes of Internal Data Memory that occupy addresses from 20 hex to 2F hex are bit-addressable. SFRsthat have addresses of the form 1XXXX000 binary are also bit-addressable.
Scratchpad
Internal data memory occupying direct addresses from 30 hex to 7F hex can be used as scratch pad registers orfor the stack.
External Data Memory
External Data RAM occupies a 64K address space. This space contains the External Special Function DataRegisters ESFRs. The ESFRs permit access and control of the hardware features and internal interfaces of theTAS3218 Digital Signal Processor.
Figure 17 shows the boot-up sequence. M8051 MCU ROM code follows this sequence after device resetrelease. After Micro completes boot up application code (RAM code), the microcontroller switches the programcounter from ROM to RAM code by pc_source(esfr - 0xFD).
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Reset
State
DAP -> Idle
uP -> Initialization
I2C BUS -> HIGH
uP Flushs
Internal RAM
uP -> Cmd to
Flush Delay
Memory
uP Flushs
External RAM
uP Flushs
DAP Coef/Data
RAM
uP Sets default
H/W configuration
Enable DAP
Processing start
RAM Flushed
RESET = False RESET = True
RAM Flushed
Delay Memory Flush command issued
Variables initialized
RAM Flushed
RAM Flushed
Default Values
Loaded
Enable I2C
Master mode
Setup
I2C Master I /F
Initialize
DPLL PLL Locked and Stable
Successful Load
Zero length data
header has been read
3 Reads tried
OR
SCL, SDA = LOW for 1ms detected
Start-up Oscillator
Any State
uP initialize
its variables
uP Flushs DAP
Instruction RAM
uP Flushs
uP Instruction
RAM
RAM Flushed
EEPROM
Load Process
Disable I2C
Master mode
Switch ROM to RAM
IDLE uP
Start App uP Code
Check GPIO 1
Loaddefault
DAP Program
andcoefficient
GPIO1 = Low
GPIO1
output Low
Loaded
Setup
I2C Slave I/F
GPIO1 = High
Main IDLE loop Test Processing
Routine
Test command
received
I2C Slave
download process
Slave download
command received
Successful Load
Zero length data header
has been received
TAS3218
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Figure 17. Boot-Up Sequence
Detailed information about the boot-up sequence is described in Table 4 .
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Control Pins
RESET
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Table 4. Process Description
PROCESS STATE ESFR DESCRIPTION
DSP idleuP initialization
I
2
C bus highuP Flush Internal RAM Clear micro internal RAM (256 byte)uP Flush External RAM Clear micro external RAM (2048 byte)uP command to Flush Delay
clr_dly_ram (0xc0 bit(3)) 1Memory
uP initialize variables Initialize variablesmute0_t 0mute1_t 0 Default mutez controlmute2_t 0reset_dac_mod 0xffreset_adc_sinc 0x03uP set default H/W configuration clock_control1 0x0aclock_delay_control2 0x05clock_delay_sel 0x80i2s_word_byte 0x22
IW/OW: 24 biti2c_mode_byte 0x22
IM/OM: I
2
Ssap_en 1uP Flush uP Instruction RAM mem_sel 0x02 Clear uP Instruction RAM (16384Byte)uP Flush DSP Instruction RAM mem_sel 0x01 Clear DSP Instruction RAM (3328W)Clear DSP lower coefficient RAM (1024 W) and datauP flush DSP lower coef/data RAM mem_sel 0x00
(48 bit) RAM (768 W)Enable I
2
C master I/F Setup I
2
C master I/F mode (enable interrupt 10)EEPROM loadDisable I
2
C master mode and
i2c_ms_ctl 0 Switch control MUX to slave I
2
C portenable slave I/FSwitch ROM to RAM pc_source 1
If (gpio_in_3_0 == 1) {Host_dsp = 1; /* keep DSP turned off */Load default DSP
host_dsp 0 } else {Program and coefficient
Host_dsp = 0; /* turn on DSP */}GPIO1 output low Enable GPIO output mode, and output low.
RESET is an asynchronous control signal that restores all TAS3218 components to the default configuration.When a reset occurs, the Digital Audio Processor (DAP) is put into an idle state and the M8051 MCU startsinitialization. A reset can be initiated by inputting logic 0 on the reset pin . A reset will also be issued at power upsequencing by the internal 1.8V regulator power sub-system.
NOTE:
There is a 1.3-s de-glitch filter on the RESET pin.
During a power up sequencing process, RESET should be held low until the DVDD and AVDD power inputshave reached a voltage of 3.0 V.
As long as the RESET pin is held a logic 0 the device is in the reset state. During this reset state, all I
2
C andSerial Data bus operations are ignored. The I
2
C interface SCL and SDA lines goes HIGH and remain in that stateuntil device initialization has completed.
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I
2
C Chip Select
GPIO Pins
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Power-Up Sequence
The rising edge of the RESET pin begins the initialization of housekeeping functions by clearing memory andsetting the default register values. After housekeeping initialization is complete, the TAS3218 enables the masterI
2
C interface. The TAS3218 then uses the master I
2
C interface to determine if an external memory device ispresent.
External Memory Device Present
Using the master I
2
C interface, the TAS3218 will automatically test to see if an external memory device is ataddress 1010xxx. The value xxx can be chip selects, other information, or dont care depending on the EEPROMselected.
If an external memory device is present and it contains the correct header information along with one or moreblocks of program/memory data, the TAS3218 will automatically download the M8051 MCU program RAM,coefficient and/or data RAM from the external EEPROM. This download is considered complete when an end ofprogram header is read by the TAS3218.
The memory block structure of the external memory device is available in Master I2C Load RAM Block Formats .
At this point, the TAS3218 will disable the master I
2
C interface, enable the slave I
2
C interface, and start normaloperation. After a successful download, the M8051 MCU program counter will be reset and the downloadedM8051 MCU and DSP application firmware will control execution.
External Memory Device Not Present
If no external EEPROM is present or if an error occurred during the external memory device read, the TAS3218will disable the master I
2
C interface, enable the slave I
2
C interface. The default slave configuration will then beloaded from the ROM into the M8051 MCU and DSP. In this default configuration, the TAS3218 will stream audiofrom input to output if the GPIO1 pin pulled LOW.
NOTE:
The master and slave interfaces do not operate simultaneously, thus when oneinterface is enabled, the other is disabled.
The CS pin on the TAS3218 allows up to two TAS3218 devices to be addressed by the I
2
C bus via an externalhost controller without the need for external logic. Table 5 and Table 6 list the I
2
C address for each I
2
C interface.
Table 5.I
2
C Slave Addressing
SLAVE ADDRESS CS
0x68/69 00x6A/6B 1
Table 6.I
2
C Master Addressing
SLAVE ADDRESS CS
0xA0/A1 00xA2/A3 1
The TAS3218 has two level-sensitive GPIO pins, GPIO1 and GPIO2, that are firmware programmable. Uponpower up or following a RESET, the GPIO1 pin becomes an input, and has a special function as described inGPIO1 Pin Function .
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GPIO1 Pin FunctionAfter RESET or powerup initialization, if no EEPROM is present, a memory error occurs, or SDA and SCL arepulled LOW for 1 ms, then TAS3218 will disable the master I
2
C interface and enable the slave I
2
C interfaceinitialization, to load the slave default configuration. When GPIO1 has been pulled HIGH through a 1020-k resistor the TAS3218 will then initialize in thedefault configuration with the serial data outputs not active. Once the TAS3218 has completed its defaultinitialization procedure, with the status register updated and the I
2
C slave interface enabled, then theGPIO1 pin will become an output and will be driven LOW. Following the High to Low transition of theGPIO1 pin, the system controller can access the TAS3218 through the I
2
C interface and read the statusregister to determine the load status.If a memory read error occurs the TAS3218 will report the error in the status register. When GPIO1 has been pulled LOW through a 1020-k resistor to permit a simple functional device test, theGPIO1 pin can be pulled low using external logic and a 1020-k resistor. In this case, once the TAS3218has completed its default test initialization procedure, with the status register updated and the I
2
C slaveinterface enabled, then the TAS3218 will stream audio from the input SDIN1 to outputs SDOUT1 andSDOUT2.
At this point the GPIO1 pin will become an output and will be driven LOW. If the external logic is no longerdriving the GPIO1 pin low after the load has completed (100 ms following a RESET if no EEPROM ispresent), then the state of the GPIO1 pin can be observed. At this point the system controller can accessthe TAS3218 through the I
2
C interface and read the status register to determine the load status.
NOTE:
If the GPIO1 pin state is not observed, the only indication that the device hascompleted its initialization procedure is that the TAS3218 will stream audio and theI
2
C slave interface has been enabled.
NOTE:
Some I
2
C masters will hang when they receive a NAC during an I
2
C transaction.
Once the TAS3218 has been programmed either through a successful boot load or via slave I
2
C download,the operation of GPIO1 can be programmed to be an input or an output.
General Purpose I/O Ports (GPIOs)
In I
2
C slave mode, the GPIO ports can be used as true general-purpose ports. Each port can be individuallyprogrammed, via the I
2
C bus, to be either an input or an output port. The default assignment for all GPIO ports,in I
2
C slave mode, is an input port.
When a given GPIO port is programmed as an output port, by setting the appropriate bit in the bit field GPIODIRof subaddress 0x0C to logic 1, the logic level output is set by the logic level programmed into the appropriate bitin bit field GPIO IN OUT. The I
2
C bus then controls the logic output level for those GPIO ports assigned asoutput ports. When a given GPIO port is programmed as an input port by setting the appropriate bit in bit fieldGPIODIR to logic 0, the logic input level into the GPIO port is written to the appropriate bit in bit field GPIO INOUT. The I
2
C bus can then be used to read bit field GPIO IN OUT to determine the logic levels at the input GPIOports. Whether a given bit in the bit field GPIO IN OUT is a bit to be read via the I
2
C bus or a bit to be written tovia the I
2
C bus is strictly determined by the corresponding bit setting in bit field GPIODIR.
In the I
2
C slave mode, the GPIO input ports are read every GPIOMICROCOUNT Micro Clocks, as was the casein the I
2
C master mode. However, parameter GPIO_samp_int does not have a role in the I
2
C slave mode. If aGPIO port is assigned as an output port, a logic 0 bit value is supplied by the TAS3218 for this GPIO port inresponse to a read transaction at subaddress 0x0C.
If the GPIO ports are left in their power turn on default state, they are input ports with a weak pull-up on the inputto VDSS.
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I C Sub Address x 0C
2
S Slave Addr Sub Addr
Ack Ack WDE
See Note A
Res
Reset
Reset
“0” (default state) enables
watchdog timer
GPIO IN/OUT GPIO DIR
31 30 27
1 1
0
25
Ack Ack Ack
GPIOMICROCOUNT
MS BYTE
GPIOMICROCOUNT
LS BYTE Ack
GPIO_samp_int
0
24 23 15 70
Watchdog Timer MICRO_CLK
MICRO_CLK
Data_IN_OUT
Data Path
Switch
Sampling
Logic
Decode 2^16
Decode 2^16
8051 uC Firmware
8051 uControl
Down Counter
LD
Q
D
GPIO1
ENB
Q
D
GPIO1
ENB
TAS3218
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Watchdog Timer
There is a hardware watchdog timer in the TAS3218 that can be programmed in the customer application codeto monitor the microprocessor activity. If the watchdog timer expires it will generate a reset to the 8051microprocessor. GPIOMICROCOUNT, in subaddress 0x0C, is used in order to trigger GPIO input/output and themonitoring to the DSP diagnostic count. Because of this, the value selected for GPIOMICROCOUNT must bechosen to provide a good tradeoff of between micro overheard and adequate execution frequency of theseprocesses. The default value for this counter is 0x5820 which corresponds to a period of 1.25 ms.
Figure 18 shows the GPIO register, the GPOI interface, and a typical user application code implementation of thewatchdog timer reset.
A. Determines how many consecutive Logic 0 samples (where each sample is spaced by GPIOMICROCOUNTMicro_clks) are required to read a Logic 0 on a GPIO input port
Figure 18. GPIO Ports
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I
2
C Control Interface
General I
2
C Transactions
Start
(by master)
Acknowledge
(by TAS3208)
(See Note A)
Start Condition
I2C_SDA while I2C_SCL = 1
MSB MSB–1
MSB
MSB
LSB
LSB
Ack
Ack
Ack
R/W
CS1
CS0
S S
0 0
1 1 1
MSB–2 LSB
Stop Condition
I2C_SDA while I2C_SCL = 1
Acknowledge
(by receiver)
Acknowledge
(by receiver)
Read or Write
(by master)
Stop
(by master)
I2C_SDA
I2C_SCL
Data Byte
(by transmitter)
Slave Address
(By master)
Data Byte
(by transmitter)
TAS3218
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The M8051 microprocessor receives and distributes I
2
C data to the I
2
C bus controllers, and participates in mostI
2
C processing tasks requiring multi-frame processing cycles. The master and slave interfaces do not operatesimultaneously.
The I
2
C communication protocol for the I
2
C slave mode is shown in Figure 19 .
A. Bits CS1 and CS0 in the TAS3218 slave address are compared to the logic levels on pins CS0 and CS1 for addressverification. This provides the ability to address up to four TAS3218 chips on the same I
2
C bus.
Figure 19. I
2
C Slave Mode Communication Protocol
The I
2
C bus employs two signals; SDA (data) and SCL (clock), to communicate between integrated circuits in asystem. Data is transferred on the bus serially one bit at a time. The address and data be transferred in byte(8-bit) format with the most-significant bit (MSB) transferred first. In addition, each byte transferred on the bus isacknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the masterdevice driving a start condition on the bus and ends with the master device driving a stop condition on the bus.The bus uses transitions on the data terminal (SDA) while the clock is HIGH to indicate a start and stopconditions. A HIGH-to-LOW transition on SDA indicates a start, and a LOW-to-HIGH transition indicates a stop.Normal data bit transitions must occur within the low time of the clock period. The master generate the 7-bit slaveaddress and the read/write (R/W) bit to open communication with another device and then wait for anacknowledge condition. The slave holds SDA LOW during acknowledge clock period to indicate anacknowledgement. When this occurs, the master transmits the next byte of the sequence. Each device isaddressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same signalsvia a bi-directional bus using a wired-AND connection. An external pull-up resistor must be used for the SDA andSCL signals to set the HIGH level for the bus.
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the lastword transfers, the master generates a stop condition to release the bus.
A read transaction requires that the master device first issue a write transaction to give the TAS3218 the subaddress to be used in the read transaction that follows. This sub address assignment write transaction is thenfollowed by the read transaction. For write transactions, the sub address is supplied in the first byte of datawritten, and this byte is followed by the data to be written. For write transactions, the sub address must alwaysbe included in the data written. There cannot be a separate write transaction to supply the sub address, as wasrequired for read transactions. If a subaddress assignment only write transaction is followed by a second writetransaction supplying the data, erroneous behavior results. The first byte in the second write transaction isinterpreted by the TAS3218 as another sub address replacing the one previously written.
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Start
Condition
Stop
Condition
Acknowledge Acknowledge
I C Device Address and
2Read/ Write Bit Sub Address First Data Byte Other Data Bytes Last Data Byte
Acknowledge Acknowledge Acknowledge
R/W Ack A7 Ack Ack Ack Ack
D7 D0 D0 D0D7 D7A0A1A6A5A6 SS SS SS SS SS
A1 A0
Stop
Condition
Acknowledge Acknowledge
I C Device Address
and
2
Read/Write Bit
I C Device Address
and
2
Read/Write Bit
Sub Address First Data Byte Other Data Bytes Last Data Byte
Acknowledge Acknowledge Acknowledge
Not
Acknowledge
A7 SS A0 A0 D0 Ack
R/W Ack D7 D7 D7D0 Ack Ack
D0
SS
A6
AckA6 SS A0 SS SS SS
R/W Ack
Start
Condition
Repeat Start
Condition
TAS3218
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Multiple Byte Write
A multiple byte data write transfer is identical to a single byte data write transfer except that multiple data bytesare transmitted by the master device to slave as shown in Figure 20 . After receiving each data byte, theTAS3218 will respond with an acknowledge bit.
Figure 20. Multiple Byte Write Transfer
Multiple Byte Read
A multiple byte data read transfer is identical to a single byte data read transfer except that multiple data bytesare transmitted by the TAS3218 to the master device as shown in Figure 21 . Except for the last data byte, themaster device will respond with an acknowledge bit after receiving each data byte.
Figure 21. Multiple Byte Read Transfer
Random I
2
C Transactions
Supplying a subaddress for each subaddress transaction is referred to as random I
2
C addressing. For randomI
2
C read commands, the TAS3218 responds with data, a byte at a time, starting at the sub address assigned, aslong as the master device continues to respond with acknowledges. If a given sub address does not use all 32bits, the unused bits are read as logic 0. I
2
C write commands, however, are treated in accordance with the dataassignment for that address space. If a write command is received for a biquad sub address, for example, theTAS3218 expects to see five 32-bit words. If fewer than five data words have been received when a stopcommand (or another start command) is received, the data received is discarded.
Sequential I
2
C Transactions
The TAS3218 supports sequential I
2
C addressing. For write transactions, if a sub address is issued followed bydata for that sub address and the fifteen sub addresses that follow, a sequential I
2
C write transaction has takenplace, and the data for all 16 sub addresses is successfully received by the TAS3218. For I
2
C sequential writetransactions, the sub address then serves as the start address and the amount of data subsequently transmitted,before a stop or start is transmitted, determines how many sub addresses are written to. As was true for randomaddressing, sequential addressing requires that a complete set of data be transmitted. If only a partial set of datais written to the last sub address, the data for the last sub address is discarded. However, all other data written isaccepted; just the incomplete data is discarded.
Sequential read transactions do not have restrictions on outputting only complete sub address data sets.
If the master does not issue enough data received acknowledges to receive all the data for a given sub address,the master device simply does not receive all the data.
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I
2
C Master Mode Operation
Stop
Condition
Acknowledge Acknowledge
I C Device Address
and
2
Read/Write Bit
I C Device Address
and
2
Read/Write Bit
Sub Address First Data Byte Other Data Bytes Last Data Byte
Acknowledge Acknowledge Acknowledge
Not
Acknowledge
A7 SS A0 A0 D0 Ack
R/W Ack D7 D7 D7D0 Ack Ack
D0
SS
A6
AckA6 SS A0 SS SS SS
R/W Ack
Start
Condition
Repeat Start
Condition
TAS3218
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If the master device issues more data received acknowledges than required to receive the data for a given subaddress, the master device simply receives complete or partial sets of data, depending on how many datareceived acknowledges are issued from the sub address(es) that follow. I
2
C read transactions, both sequentialand random, can impose wait states.
For the standard I
2
C mode (SCL = 100 kHz), worst-case wait state times for an 8-MHz microprocessor clock ison the order of 2 s. Nominal wait state times for the same 8-MHz microprocessor clock is on the order of 1 s. Forthe fast I
2
C mode (SCL = 400 kHz) and the same 8-MHz microprocessor clock, worst-case wait state times canextend up to 10.5 s in duration. Nominal wait state times for this same case lie in a range from 2 s to 4.6 s.Increasing the microprocessor clock frequency lowers the wait state times and for the standard I
2
C mode, ahigher microprocessor clock can totally eliminate the presence of wait states.
For example, increasing the microprocessor clock to 16 MHz results in no wait states. For the fast I
2
C mode,higher microprocessor clocks shortens the wait state times encountered, but does not totally eliminate theirpresence.
I
2
C master mode operation is enabled following a reset or power on reset.
The TAS3218 uses the master mode to download from EEPROM the memory contents for the following.Micro program memoryMicro extended memoryDSP program memoryDSP coefficient memoryDSP data memory
The TAS3218, when operating as an I
2
C master, can execute a complete download of any internal memory orany section of any internal memory without requiring any wait states.
When the TAS3218 operates as an I
2
C master, it generates a repeated start without an intervening stopcommand while downloading program and memory DATA from an external EEPROM. When a repeated start issent to the EEPROM in read mode, the EEPROM enters a sequential read mode to quickly transfer large blocksof data.
Figure 22. Multiple Byte Read Transfer
The TAS3218 will query the bus for an I
2
C EEPROM at an address 1010xxx. The value xxx can be chip selects,other information, or dont cares depending on the EEPROM selected.
The first act of the TAS3218 as master will be to transmit a start condition along with the device address of theI
2
C EEPROM with the read/write bit cleared (0) to indicate a write. The EEPROM acknowledges the addressbyte, and the TAS3218 send a sub address byte, which the EEPROM will acknowledge. Most EEPROMs have atleast 2-byte addresses and will acknowledge as many as are appropriate. At this point, the EEPROM sends alast acknowledge and becomes a slave transmitter. The TAS3218 acknowledges each byte repeatedly tocontinue reading each data byte that is stored in memory.
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I2C EEPROM Memory Map
Block Header 1
Block Header 2
Block Header N
Data Block N
Data Block 1
Data Block 2
TAS3218
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The memory load information starts with reading the header and data information that starts at sub-address 0 ofthe EEPROM. This information must be stored in a sequential memory addresses with no intervening gaps. TheData block is contiguous blocks of data that immediately follow the headers locations. The TAS3218 memorydata can be stored and loaded in (almost) any order. Additionally this addressing scheme permits portions of theTAS3218 internal memories to be loaded.
Figure 23. EEPROM Address Map
The TAS3218 will sequentially read EEPROM memory and load its internal memory unless it does not find avalid memory header block, is not able to read the next memory location because the end of memory wasreached, detects a check sum error, or reads a end of program header block. When it encounters a valid headeror read error, the TAS3218 will attempt to read the header or memory location three times before it determinesthat it has an error. If the TAS3218 encounters a Check Sum error it will attempt to re-read the entire block ofmemory two more times before it determines that it has an error.
NOTE:
Once the micro program memory has been loaded, it can not be reloaded until theTAS3218 has been RESET.
If an error is encountered TAS3218 terminates its memory load operation, loads the default configuration for boththe M8051 MCU and DSP from the embedded ROM, and disables further master I
2
C bus operations.
If an end of program data block is read, the TAS3218 has completed the initial program load.
The I
2
C master mode utilizes the starting and ending I
2
C check sums to verify a proper EEPROM download. Thefirst 16-bit data word received from the EEPROM is the I
2
C check sum at sub address 0x00, is stored andcompared against the 16-bit data word received for last subaddress, the ending I
2
C check sum and the checksum that is computed during the download. These three values must be equal. If the read and computed valuesdo not match, the TAS3218 sets the memory read error bits in the Status register and repeats the download fromthe EEPROM two more times. If the comparison check again fails the third time, the TAS3218 sets the microprogram to the default value.
NOTE:
When acting as an I
2
C master, the data rate transfer is fixed at 375 kHz.
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I
2
C Slave Mode Operation
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The I
2
C slave mode is the mode that is used to change configuration parameters during operation and performprogram and coefficient downloads from a master device. The latter can be used to replace the I
2
C master modeEEPROM download.
The TAS3218 uses the slave mode to load the memory contents for the:Micro program memoryMicro extended memoryDSP program memoryDSP coefficient memoryDSP data memoryUpdate coefficient and other control valuesRead status flags
The TAS3218 support both random and sequential I
2
C transactions. The TAS3218 I
2
C slave address is011010X, where the first 6 bits are the TAS3218 device address and the final 1 bit is set by the TAS3218 internalmicroprocessor at power-up. The internal microprocessor derives the last bit from an external pin (pin CS) whichis pulled up or down to create two unique addresses for control of multiple-TAS3218 part applications. Thepulldown resistance of CS creates a default 00 address when no connection is made to the pin.
The TAS3218 I
2
C block does respond to the broadcast address (00h).
NOTE:
When acting as an I
2
C slave, data rate transfer is determined by the master device onthe bus. However, the setting of I
2
C parameter N at sub-address 0x01 does play arole in setting the maximum possible data transfer rate. In the I
2
C slave mode, bitrates other than (and including) the I
2
C-specific 100 Kbps and 400 Kbps bit rates canbe obtained, but N must always be set so that the over-sample clock into the I
2
Cmaster and slave controllers is at least a factor of 20 higher in frequency than SCL.
N = 0 is a special case. When N = 0, a mode is enabled that detects I
2
C frames and enables the TAS3218 I
2
Cinterface to reset and continue operation after receiving an invalid I
2
C frame.
Table 7.I
2
C Slave Addresses
SLAVE ADDRESS CS
0x68/69 00x6A/6B 1
Table 8.I
2
C Master Addresses
SLAVE ADDRESS CS
0xA0/A1 00xA2/A3 1
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Digital Signal Processor (DSP) Arithmetic Unit
Overview
TAS3218
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The arithmetic processor is a fixed-point computational engine consisting of an arithmetic unit and data andcoefficient memory blocks. The primary features are:Two pipe parallel processing architecture 48-bit datapath with 76-bit accumulator Hardware single cycle multiplier (28 48) Three 48-bit general purpose data registers One 28 bit coefficient register 48-bit adder 28-bit adder Shift right, shift left Bi-modal clip Log2/Alog2
Magnitude truncationRead/read/write single-cycle memory accessData input is 48-bit 2s complement multiplexed in from SAP immediately following FSYNC pulseData output is four 32-bit 2s complement bussesSeparate control for writing to delay memorySeparate coefficient memory (28-bit) and data memory (48-bit)Linear Feedback Shift Register (LFSR) in the instruction register doubles as a random number generator innormal operating modeCoefficient RAM, Data RAM, LFSR seed, Program counter, and memory pointers are all mapped into thesame memory space for convenient addressing by the microMemory interface block contains four pointers, two for data memory and two for coefficient memory
Data Format
Figure 24 shows the data word structure of the arithmetic unit. Eight bits of overhead or guard bits are providedat the upper end of the 48-bit word, and 16 bits of computational precision or noise bits are provided at the lowerend of the 48-bit word. The incoming digital audio words are all positioned with the most significant bit abuttingthe 8-bit overhead/guard boundary. The sign bit in bit 39 indicates that all incoming audio samples are treated assigned data samples.
The arithmetic engine is a 48-bit (25.23 format) processor consisting of a general-purpose 76-bit arithmetic logicunit and function-specific arithmetic blocks. Multiply operations (excluding the function-specific arithmetic blocks)always involve 48-bit words and 28-bit coefficients (usually I
2
C programmable coefficients). If a group of productsare to be added together, the 76-bit product of each multiplication is applied to a 76-bit adder, where a DSP-likemultiply-accumulate (MAC) operation takes place. Biquad filter computations use the MAC operation to maintainprecision in the intermediate computational stages.
To maximize the linear range of the 76-bit ALU, saturation logic is not used. In MAC computations, intermediateoverflows are permitted, and it is assumed that subsequent terms in the computation flow will correct theoverflow condition.
The memory banks include a dual port data RAM for storing intermediate results, a coefficient RAM, and a fixedprogram ROM. Only the coefficient RAM, assessable via the I
2
C bus, is available to the user.
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Overhead/Guard Bits
S
S
S
S
S
S
0
19
20
7
8
15
16
31
32
47
39
40
23
24
21
22
Precision/Noise Bits
16-bit
audio 18-bit
audio 20-bit
audio 24-bit
audio
32-bit
audio
10110111 (–73) –73
+ 11001101 (–51) + –51
10000100 (–124) –124
+ 11010011 (–45) + –45
01010111 (57) –169
+ 00111011 (59) + 59
10010010 (–110) –110
8-Bit ALU Operation
(without saturation)
Rollover
TAS3218
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Figure 24. Arithmetic Unit Data Word Structure
Figure 25. DSP ALU Operation with Intermediate Overflow
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Coefficient
Representation
8-Bit Headroom
and 16-Bit Noise
Input 24-Bit Data
Multiplier
Output
D23 D22 ------------ D1 D0
27–23 22 --------------- 0
D23 D22 ------------ D1 D0
0 ... 0
47–40 39 ------------------16 15–0
0 ... 0
Scaling Headroom Data (24-Bits)
5812 831
75–71 70–63 62–39 38–31 30–0
DAP Data Path Data Representation
12
Fractional Noise
48-Bit Clipping
POS48 = 0x7F_F FFF_FFFF _FF
NEG48 = 0x80_0 000_0000 _00
32-Bit Clipping
POS40 = 0xXX_ 7FFF_FFFF _XX
NEG40 = 0 8000_0000 _XXxXX_
28-Bit Clipping
POS20 = 0xXXXXX_ 7FFF_FFF
NEG20 = 0xXXXXX_ 8000_000
TAS3218
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Figure 26. DSP Data Path Data Representation
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Micro
Mem
IF
CLIP
To Output SAP
32
48
76
76 48 48 76
48 48 48
4848
76
28 48 28
2 48
28
48
48
76 48 48
28
28
48
28
48
48
LOG, ALOG,
NEG, ABS, or
THRU
Barrel Shift
NEG, ABS, or
THRU
Multiply
Legend
Register
ADD
48
28
Operand A Operand B
76
“ZERO”
VOL
48
28
28-bit data
48
48-bit data
76 76-bit data
32
32-bit data
28
DATA RAM
1024 24
X
DATA RAM
768 48
X
28
24
24
48 28 48
48
24
24-bit data
Output Register File (DO8–DO8)
Delay RAM
VOL (5 LSBs)
BL MD MC
ACC BR LR MR
COEF RAM
1.2 K 24
X
DI (3 LSBs)
LFS
DLYO
DLYI
TAS3218
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Figure 27. DSP Data Path Architecture
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DO0 DO1 DO2 DO3 DO4 DO5 DO6 DO7 DO8
Audio_out1 Audio_out2 Audio_out3 Audio_out4
SPDIF(L) SPDIF(R)
DAC
(TDM)
Audio_out5 Audio_out6 Audio_out7 Audio_out8
Ext_mem
(2nd Gen)
SDOUT1(L) SDOUT1(R) SDOUT2(L) SDOUT2(R)
Inside core
Outside core
Micro Data
48 -bit
Datapath
28 x 48-bit Multiplier
76-bit Accumulator
Coef RAM
(1K x 28 )
Data RAM
(768 x 48 )
Program RAM
(3.25 K x 55 )
DSP
Controller
Memory
Interface
Delay
Memory
(17408 x 24 )
8-bit MCU
(8051 )
Internal
Data RAM
(256 x 8)
External
Data RAM
(2K x 8)
Program RAM
(16 K x 8)
DSP
Delay
Control
MICRO
Delay Memory
TAS3218
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Figure 28. DSP Output Register Configuration
A. Memory size K = 1024
Figure 29. DSP, MCU, and Memory Interfaces
The Delay Memory Interface (DMIF) is the interface block between the DSP core and the delay memory. TheDMIF blocks primary purpose is to keep track of twenty four sets of delay memory pointers that are initially set upby the micro controller through an I
2
C command(s). Eight of the pointers are used to write/retrieve 48-bit data(full-precision intermediate) and the other sixteen for 24-bit data (post quantized). Thus to support 48-bit wordreverb delay, two RAM locations must be used.
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DSP Instruction Word
55-BIT INSTRUCTION
Ext ALU First Stage ALU Second Stage Data Memory Load Coefficient Memory Load Memory Store
0
54
P1OP
53–49
P2OP
48–42
MOP1 AD1
41–37 36–27
MOP2 AD2
23–1426–24
MOP3 AD3
9–013–10
TAS3218
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The key features of the felay memory are17408 24 delay memory locationsTwenty four separately addressable pointersProgrammable start/stop address on each pointerPointers capable of accessing 24-bit or 48-bit wordsSingle port access (one pointer access per access cycle)Access cycle < 4 DSP clocksSelf clearing INIT pin used to clear all memory to zeroFully synchronous
DP1DP15: sixteen 24-bit pointersRP1RP8: eight 48-bit (full precision) pointers
Since all of the pointers are contiguous, it is only necessary to write the address END point. For example, if DP1is to be a three-sample delay, the register DP1 should be set to 0x003. If RP1 is to be a 3 sample delay, theregister RP1 should be set to the value of DP15 + 6. All of the DP1-16 and RP1-8registers must be set to aminimum of a one sample delay (one or two words).
DP1 Start address is defined as 000x0
DP2 Start address is equal to DP1 end address + 1 ...
RP1 Start address is equal to DP16 end address + 1 ...
RP8 Start address is equal to RP7 end address + 2
Since the start/stop address for each pointer is programmable anywhere in the delay RAMs address space, thedelay for any one channel can be anywhere in the delay RAM. There is, however, no address space collisionavoidance logic to separate the pointers. The user (or micro) must take care to avoid overlapping the addressspacing of each pointer.
Pointer register address endpoint registers DP1-DP16 and RP 1-RP8 are typically written only during theinitialization (fast load) mode of the device. Writing to these registers while the TAS3218 DSP core is accessingthe pointers may cause the pointers to cross the address space of another pointer.
To write to the delay RAM, the TAS3218 DSP core controller must present the data to be written on thePT_DATA bus (LS bit always in bit zero of the bus), select the pointer to be accessed by driving the PT_SELpins, and assert the PT_WZ pin for a minimum of four clocks. The pointer will not increment until a write hasbeen performed and the PT_WZ pin has been de-asserted.
To perform a read, the PT_OUT bus may be read four clocks after PT_SEL is driven.
TAS3218 has a 55-bit instruction word. Each instruction has five independent operations, which can load twooperands from data memory and coefficient memory, store the result into data or coefficient memory and performtwo parallel arithmetic operations.
Figure 30. Instruction Word
The TAS3218 instruction set is a superset of the TAS3218 instruction set, extending the DSP processingcapabilities for improved efficiency of FIR operations as well as extending the addressable memory space. TheExt instruction bit (bit 54) has been added to extend the internal memory address space by 1 bit, increasing thememory space from 1K to 2K words.
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54-BIT INSTRUCTION
TAS3208 instruction word
Contains two dummy bits in every instruction word of the EEPROM.
All TAS3208 tool compilers always ZERO to these dummy bits in the compile EEPROM image.
DUM
ALU First Stage ALU Second Stage Data Memory Load Coefficient Memory Load Memory Store
2
P1OP
5
P2OP
4
MOP1 AD1
5 10
MOP2 AD2
103
MOP3 AD3
104
54–55 53–49 48–42 41–37 36–27 23–1426–24 9–013–10
54-BIT INSTRUCTION
New “Ext”-ended field
Extension bit designates offset of 1K to these
address references for LD/ST operations
Ext ALU First Stage ALU Second Stage Data Memory Load Coefficient Memory Load Memory Store
0P1OP P2OP MOP1 AD1 MOP2 AD2 MOP3 AD3
54 53–49 48–42 41–37 36–27 23–1426–24 9–013–10
DSP Instruction Set
TAS3218
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The superset instruction word maintains backward compatibility with the 54-bit instruction word of the TAS3218device, since the 54 bit instruction word required dummy storage of 2 bits in the EEPROM.
Figure 31. Instruction Word
As shown in Figure 32 the extension bit designates an offset of 1K to all three addresses in the instruction word.However, it should be noted that both data and coefficient memory addresses above the 1K boundary arereserved for housekeeping processing tasks. Any attempt to write to these addresses may corrupt the audiooutput.
Figure 32. Instruction Word Extension Field
Please see the TAS3xxx Programmers Guide for detailed information regarding programming of this device.
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ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE DISSIPATION RATINGS
(1) (2)
RECOMMENDED OPERATING CONDITIONS
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
MIN MAX UNIT
DVDD Supply voltage range 0.5 3.8 VAVDD Supply voltage range 0.5 3.8 V3.3-V TTL 0.5 VDDS + 0.5V
I
Input voltage range 3.3-V Analog 0.5 AVDDS + 0.5 V1.8-V LVCMOS 0.5 AVDD
(2)
+ 0.53.3-V TTL 0.5 VDDS + 0.53.3-V Analog 0.5 AVDDS + 0.5V
O
Output voltage range V0.5 DVDD
(3)
+ 0.51.8-V LVCMOS
0.5 AVDD
(4)
+ 0.5I
IK
Input clamp current (V
I
< 0 or V
I
> DVDD) 20 mAI
OK
Output clamp current (V
O
< 0 or V
O
> DVDD) 20 mAT
stg
Storage temperature range 65 150 CLead temperature 1.6 mm (1/16 inch) from case for 10 seconds 260 C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) AVDD is an internal 1.8-V supply derived from a regulator in the TAS3218 chip. Pin XTALI is the only TAS3218 input that is referencedto this 1.8-V logic supply. The absolute maximum rating listed is for reference; only a crystal should be connected to XTALI.(3) DVDD is an internal 1.8-V supply derived from regulators in the TAS3218 chip. DVDD is routed to DVDD_BYPASS_CAP to provideaccess to external filter capacitors, but should not be used to source power to external devices.(4) Pin XTALO is the only TAS3218 output that is derived from the internal 1.8-V logic supply AVDD. The absolute maximum rating listed isfor reference; only a crystal should be connected to XTALO. AVDD is also routed to AVDD_BYPASS_CAP to provide access to externalfilter capacitors, but should not be used to source power to external devices.
PACKAGE T
A
25C POWER RATING DERATING FACTOR ABOVE T
A
= 25C T
A
= 70C POWER RATING
TQFP PZP 2.78 W 28.7C/W 1.22 W
(1) High-K Board, 105C junction(2) Refer to PowerPADThermally Enhanced Package Application Report (literature number SLMA002 ).
PARAMETER MEASUREMENT MIN NOM MAX UNIT
DVDD Digital supply voltage 3 3.3 3.6 VAVDD Analog supply voltage 3.3-V Analog 3 3.3 3.6 V3.3-V TTL 2V
IH
High-level input voltage V1.8-V LVCMOS (XTL_IN) 1.26 1.953.3-V TTL 0.8V
IL
Low-level input voltage V1.8-V LVCMOS (XTL_IN) 0.54Operating ambient air temperature rangeT
A
20 25 70 C(guarantying parametric)T
J
Operating junction temperature range 20 105 C
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AUDIO SPECIFICATIONS CHANNEL, INPUT TO OUTPUT
AUDIO SPECIFICATIONS DIGITAL FILTERS
TAS3218
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T
A
=25C, AVDD = 3.3 V, DVDD = 3.3 V, Fs (audio) = 48 kHz, Clock source from XTALI, AES17 filter, second order 30 kHzlow pass filter (unless otherwise noted)
PARAMETER CONDITIONS MIN TYP MAX UNIT
A-in ADC DSP DAC Lineout A: WTD 87 92Overall dynamic
dBrange
A-in MUX Lineout A-WTD 95 98
T
A
=25C, AVDD = 3.3 V, DVDD = 3.3 V, Fs (audio) = 48 kHz, Clock source from XTALI, AES17 filter, second order 30 kHzlow pass filter (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
ADC Decimation Filter, Fs = 48 kHz
Filter gain from 0 to 0.39 Fs 0.1 dBFilter gain at 0.4125 Fs 0.25 dBFilter gain at 0.45 Fs 3 dBFilter gain at 0.5 Fs 17.5 dBFilter gain from 0.55 Fs to 64 Fs 75 dBFilter group delay 17/Fs s
DAC Interpolation Filter, Fs = 48 kHz
Pass band 20 0.45 Fs HzPass band ripple 0.06 dBTransition band 0.45 Fs 0.5501 Fs HzStop band 0.5501 Fs 7.455 Fs kHzStop band attenuation 65 dBFilter group delay 21/Fs s
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ELECTRICAL SPECIFICATIONS ANALOG SECTIONS
(1)
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
T
A
=25C, AVDD = 3.3 V, DVDD = 3.3 V, Fs (audio) = 48 kHz, Clock source from XTALI, AES17 filter, second order 30-kHzlow-pass filter (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Stereo MUX Input/ADC Channel 1-kHz sine wave inputFull scale input voltage (0 dB) 1 1.15 VrmsInput common mode voltage over recommended operating conditions 1.43 1.5 1.57 VDNR 60-dB full-scale input applied at Line inputs, A-weighted 90 93 dBATHD + N 1-kHz, 4-dB full-scale input 75 80 dBPSRR 1 kHz, 100 mVpp on AVDD 51 57 dBChannel separation 1 kHz 80 90 dBInput resistance 14.6 18.33 22 kInput capacitance 10 pF
DAC Channel/DAC Output 1-kHz sine wave input, load = 10 k, 10 pFFull scale output voltage (0 dB) 0.81 0.9 VrmsGain error 10 10 %Output common mode over recommended operating conditions 1.43 1.5 1.57 VDNR 60-dB full-scale input applied at Line inputs, A-weighted 95 97 dBATHD + N 1-dBFS input, 0 dB gain 80 90 dBPSRR 1 kHz, 100 mVpp on AVDD, V
GND
powered down 50 56 dBLoad capacitance pFLoad resistance 10 kChannel separation 81 84 dB1-kHz sine wave input, Load = 16 , external series resistanceDAC Channel/ Headphone Output = 16 ,coupling capacitance = 47 FFull scale output voltage (0 dB) 0.72 0.9 VrmsDNR 60-dB full-scale input applied at Line inputs, A-weighted 80 90 dBATHD + N 0-dBFS input, 0-dB gain 50 60 dBPSRR 1 kHz, 100 mVpp on AVDD , V
GND
powered down 48 54 dBMaximum output power
(2)
24 mWLoad capacitance 100 pFLoad resistance 16Channel separation 70 80 dB
(1) When the TAS3218 is operated in slave mode, the internal analog clocks for ADC and DAC are derived from external MCLKIN input. Inthis case, the analog performance will depend on MCLKIN quality (i.e., jitter, phase noise, etc.).(2) 16- series resistor required in L and R headphone outputs for short-circuit protection.
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TAS3218
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ELECTRICAL SPECIFICATIONS ANALOG SECTIONS (continued)T
A
=25C, AVDD = 3.3 V, DVDD = 3.3 V, Fs (audio) = 48 kHz, Clock source from XTALI, AES17 filter, second order 30-kHzlow-pass filter (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DAC Channel/Headphone Output 1-kHz sine wave input, load = 10 k, 10 pFFull scale output voltage (0 dB) 0.81 0.9 VrmsDNR 60-dB full-scale input applied at Line inputs, A-weighted 80 90 dBATHD + N 0-dBFS input, 0 dB gain 70 82 dBPSRR 1 kHz, 100 mVpp on AVDD, V
GND
powered down 48 54 dBChannel separation 70 80 dB
Analog Mux in Bypass Mode 1-kHz sine wave input, load = 10 k, 10 pFMux switching noise LINEIN inputs floating 20 20 mVFull scale input voltage (0 dB) 1 1.15 VrmsInput common mode voltage 1.43 1.5 1.57 VLoad capacitance 20 pFLoad resistance 10 kBetween Lch and Rch 80 dBChannel separation
Between each line input 80 dBFull scale output voltage (0 dB) 0.9 1 1.1 Vrms
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ELECTRICAL CHARACTERISTICS
MASTER CLOCK SIGNALS
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
3.3-V TTL I
OH
= 4 mA 2.4V
OH
High-level output voltage, V1.8-V LVCMOS (XTL_OUT) I
OH
= 0.55 mA 1.443.3-V TTL I
OL
= 4 mA 0.5V
OL
Low-level output voltage V1.8-V LVCMOS (XTL_OUT) I
OL
= 0.75 mA 0.396High-impedance outputI
OZ
3.3-V TTL 20 Acurrent,
1.8-V LVCMOS (XTL_IN) 1I
IL
Low-level input current
(1)
V
I
= V
IL
A3.3-V TTL 11.8-V LVCMOS (XTL_IN) 1I
IH
High-level input current
(2)
V
I
= V
IH
A3.3-V TTL 1DSP clock = 135 MHz,LRCLKIN/LRCLKOUT = 48I
DVDD
Digital supply current 200 mAKHz,
XTALI = 24.288 MHzDSP clock = 135 MHz,LRCLKIN/LRCLKOUT = 48I
AVDD
Analog supply current 28 mAKHz,
XTALI = 24.288 MHzI
DVDD
Digital supply current RESET = LOW 0.1 mAI
AVDD
Analog supply current RESET = LOW 5 mA
(1) Value given is for those input pins that connect to an internal pullup resistor as well as an input buffer. For inputs that have a pulldownresistor or no resistor, I
IL
is 1 A.(2) Value given is for those input pins that connect to an internal pulldown resistor as well as an input buffer. For inputs that have a pullupresistor or no resistor, I
IH
is 1 A.
over recommended operating conditions, see Figure 33
PARAMETER MIN TYP MAX UNIT
24.576f
XTALI
XTALI frequency (1/ t
cyc1
)
(1)
MHz(512 Fs)t
cyc1
XTALI cycle time
(2)
1/(512 Fs) nsf
MCLKIN
MCLKIN frequency (1/ t
cyc2
) 256 Fs MHztw
MCLKIN
MCLKIN pulse duration
(3)
0.4 t
cyc2
0.6 t
cyc2
nsf
MCLKOUT
MCLKOUT frequency(1/ t
cyc3
) 256 Fs MHztr
MCLKOUT
MCLKOUT rise time C
L
= 30 pF 10 nstf
MCLKOUT
MCLKOUT fall time C
L
= 30 pF 10 nstw
MCLKOUT
MCLKOUT pulse duration
(4)
0.4 t
cyc3
0.6 t
cyc3
nsXTALI master clockMCLKOUT jitter 80 pssourceDelay time,td
MIMO
MCLKIN rising edge to MCLKOUT rising MCLKOUT = MCLKIN 17 nsedge
(5)
(1) Frequency tolerance is 100 ppm (or better) at 25C.(2) t
cyc1
= 1/ fX
TALI(3) t
cyc2
= 1/ f
MCLKIN(4) t
cyc3
= 1/ f
MCLKOUT(5) When MCLKOUT is derived from MCLKIN, MCLKOUT jitter = MCLKIN jitter. MCLKOUT has the same duty cycle as MCLKIN whenMCLKOUT = MCLKIN.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 45
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RESET TIMING WITH RESPECT TO DVDD POWER GOOD
RESET TIMING
SERIAL AUDIO PORT SLAVE MODE SIGNALS
SERIAL AUDIO PORT MASTER MODE SIGNALS
TAS3218
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See Figure 34
PARAMETER MIN TYP MAX UNIT
t
pgw(L)
Minimum pulse duration, RESET low following DVDD = 3.3 V 100 ms
control signal parameters over recommended operating conditions (unless otherwise noted), see Figure 35
PARAMETER MIN TYP MAX UNIT
tr
DMSTATE
Time to outputs inactive 100 stw
RESET
Pulse duration, RESET active 200 nstr
EMSTATE
Time to enable I
2
C < 50 ms
over recommended operating conditions (unless otherwise noted), see Figure 36
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f
LRCLK
Frequency, LRCLKIN (FS) 32 48 kHztw
SCLKIN
Pulse duration, SCLKIN high
(1)
0.4 t
cyc
0.6 t
cyc
nsf
SCLKIN
Frequency, SCLKIN 64 Fs MHzt
cyc
Cycle time, SCLKIN
(1)
1/64 Fs nsPropagation delay, SCLKIN falling edge tot
pd1
16 nsSDOUTt
su1
Setup time, LRCLK to SCLKIN rising edge 10 nst
h1
Hold time, LRCLK from SCLKIN rising edge 5 nst
su2
Setup time, SDIN to SCLKIN rising edge 10 nst
h2
Hold time, SDIN from SCLKIN rising edge 5 nsPropagation delay, SCLKIN falling edge tot
pd2
SCLKOUT = SCLKIN 15 nsSCLKOUT falling edge
(1) t
cyc
= 1/ f
SCLKIN
over recommended operating conditions (unless otherwise noted), see Figure 37
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f
LRCLK
Frequency LRCLKOUT 48 kHztr
LRCLK
Rise time, LRCLKOUT C
L
= 30 pF 12 nstf
LRCLK
Fall time, LRCLKOUT C
L
= 30 pF 12 nsf
SCLKOUT
Frequency, SCLKOUT
(1)
64 Fs MHztr
SCLKOUT
Rise time, SCLKOUT C
L
= 30 pF 12 nstf
SCLKOUT
Fall time, SCLKOUT C
L
= 30 pF 12 nsPropagation delay, SCLKOUT falling edge tot
pd1
5 nsLRCLKOUT edgePropagation delay, SCLKOUT falling edge tot
pd2
5 nsSDOUT12t
su
Setup time, SDIN to SCLKOUT rising edge 25 nst
h
Hold time, SDIN from SCLKOUT rising edge 30 ns
(1) Typical duty cycle is 50/50.
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SPDIF INTERFACE SIGNALS TIMING CHARACTERISTICS
I
2
C INTERFACE AND I/O CHARACTERISTICS OF THE SDA AND SCL BUS LINES FOR
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Fs Encoded data sampling rate 32 48 kHzR
spdif
SPDIF signal bitrate 128 Fs MHzUI Unit interval 1/R
spdif
nsT
LO
/T
HI
Low/high periods 1 UI 3 UI nsV
OH
High-level output voltage 3.3-V TTL, I
OH
= 4 mA 2.4 VV
OL
Low-level output voltage 3.3-V TTL, I
OL
= 4 mA 0.5 V
STANDARD- AND FAST-MODE I
2
C BUS DEVICESSee Figure 38
PARAMETER STANDARD MODE FAST MODE UNIT
MIN MAX MIN MAX
f
SCL
SCL clock frequency 0 100 0 400
(1)
kHzHold time (repeated) START condition. After this period,t
HD;STA
4 0.6 sthe first clock pulse is generated.t
LOW
LOW period of the SCL clock 4.7 1.3 stHI
GH
HIGH period of the SCL clock 4 0.6 st
su;STA
Set-up time for a repeated START condition 4.7 0.6 st
su;DAT
Data set-up time 250 100
(2)
nst
r
Rise time of both SDA and SCL signals 1000 20 + 0.1 C
b
(3)
300 nst
f
Fall time of both SDA and SCL signals 300 20 + 0.1 C
b
(3)
300 nst
su;STO
Set-up time for STOP condition 4 0.6 st
BUF
Bus free time between a STOP and START condition 4.7 1.3 sC
b
Capacitive load for each bus line 400 400 pFNoise margin at the LOW level for each connected deviceV
nL
0.1 V
DD
0.1 V
DD
V(including hysteresis)
Noise margin at the HIGH level for each connected deviceV
nH
0.2 V
DD
0.2 V
DD
V(including hysteresis)V
hys
Hysteresis of Schmitt trigger inputs 0.05 V
DD
VPulse width of spikes which must be suppressed by thet
SP
0 50 nsinput filterInput current each I/O pin with an input voltage betweenI
i
10 10 10
(4)
10
(4)
A0.1 V
DD
and 0.9 V
DD
maxC
i
Capacitance for each I/O pin 10 10 pFOutput fall time from V
IH
min to V
IL
max with a bust
of
250
(5)
7 + 0.1 C
b
(3)
250
(5)
nscapacitance from 10 pF to 400 pF
(1) In Master mode the maximum I
2
C clock rate is 375 kHz.(2) A Fast-mode I
2
C bus device can be used in a Standard-mode I
2
C bus system, but the requirement t
SU;DAT
250 ns must then be met.This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch theLOW period of the SCL signal, it must output the next data bit to the SDA line.(3) C
b
= total capacitance of one bus line in pF.(4) I/O pins of Fast-mode devices must not obstruct the SDA and SCL lines if V
DD
is switched off.(5) The maximum t
f
for the SDA and SCL bus lines (300 ns) is longer than the specified maximum tof for the output stages (250 ns). Thisallows series protection resistors (Rs) to be connected between the SDA/SCL pins and the SDA/SCL bus lines without exceeding themaximum specified tf.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 47
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PARAMETER MEASUREMENT INFORMATION
Waveforms
XTALI
MCLKI
MCLKOUT
tcyc1
tcyc2
tcyc3
twMCLKI
twMCLKO tfMCLKO trMCLKO
tdMI–MO
RESET
DVD
3.3 V
tpgw(L)
RESET twRESET
trEMSTATE
trDMSTATE = ~100 sµ
Outputs
Inactive
Start of
Boot Sequence
TAS3218
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Figure 33. Master Clock Signals Timing Waveforms
Figure 34. Reset Timing During Power-On
Figure 35. Reset Timing
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SCLKIN
SCLKOUT
LRCLKIN
(input)
SDOUT1
SDOUT2
SDIN1
SDIN2
tsu2
tsu1
tfLRCLK,trLRCLK
tpd1
tpd2
th2
th1
tcyc
twSCLKIN
SCLKOUT
LRCLKOUT
SDOUT1
SDOUT2
SDIN1
SDIN2
SDIN3
tsu
tpd1, SC
tfLRCLK,trLRCLK
trSCLKOUT
tfSCLKOUT
tpd2
th
TAS3218
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PARAMETER MEASUREMENT INFORMATION (continued)
Figure 36. Serial Audio Port Slave Mode Timing Waveforms
Figure 37. Serial Audio Port Master Mode Timing Waveforms
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S
SCL
tHD;DAT
tSU;DAT
tLOW
tHD;STA
tHD;STA
tSP tBUF
tf
tf
tr
tr
tHIGH
tSU;STA tSU;STO
SDA
S
Sr P
Master I
2
C Load RAM Block Formats
Master I
2
C Memory Block Header
TAS3218
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PARAMETER MEASUREMENT INFORMATION (continued)
Figure 38. I
2
C SCL and SDA Timing Waveforms
This section describes the format of the data that is stored in an external memory device and downloaded to theTAS3218 via the master I
2
C bus.
Table 9. 1 Memory Block Header
STARTING
DATA BLOCK FORMAT SIZE NOTESBYTE
Checksum most significant byte (MSB)0 2 byte Checksum of byte 2 through N + 12Checksum least significant bye (LSB)Header ID byte 1 = 0x002 2 byte Must be 0x001FHeader ID byte 2 = 0x1F
0x00: micro program RAM ortermination header0x01: micro external data RAM4 Memory to be loaded 1 byte 0x02: DSP program RAM0x03 : DSP coefficient RAM0x04: DSP data RAM0x050x0F: reserved5 0x00 1 byte UnusedStart memory address MSB
If this is a termination header, this6 2 byte
value is 0000Start memory address LSBTotal number of byte transferred MSB Header size (12) + data byte + last8 2 byte checksum byte. If this is a terminationTotal number of byte transferred LSB
header, this value is 000010 0x00 1 byte Unused11 0x00 1 byte Unused
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Master I
2
C Download Memory Block Structure
TAS3218
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Table 10. 1 M8051 MCU Program RAM and External Data RAM Block Structure
STARTING
DATA BLOCK FORMAT SIZE VALUE NOTESBYTE
Checksum MSB
Checksum of byte 20 2 byte
through N + 12Checksum LSBHeader ID byte 1 0x002 2 byte Must be 0x001FHeader ID byte 2 0x1F
0x00 or Micro program RAM or4 Memory to be loaded 1 byte
0x01 micro external data RAM5 0x00 1 byte 0x00 UnusedStart memory address MSB
If this is a termination6 2 byte
header, this value is 0000Start memory address LSBTotal number of byte transferred MSB
Header (12) + data (N) +8 2 byte
checksum (4)Total number of byte transferred LSB10 0x00 1 byte 0x00 Unused11 0x00 1 byte 0x00 UnusedData byte 1 (LSB)Data byte 212 4 byte 14 microprocessor byteData byte 3Data byte 4 (MSB)Data byte 5 (LSB)Data byte 616 4 byte 58 microprocessor byteData byte 7Data byte 8 (MSB)
0x00
0x00
Repeated checksum byteN + 12 4 byte
2 through N +11Checksum MSBChecksum LSB
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Table 11. DSP Program RAM Block Structure
STARTING
DATA BLOCK FORMAT SIZE VALUE NOTESBYTE
Checksum MSB0 2 byte Checksum of byte 2 through N + 12Checksum LSBHeader ID byte 1 0x002 2 byte Must be 0x001FHeader ID byte 2 0x1F
Micro program RAM or micro external4 Memory to be loaded 1 byte 0x02
data RAM5 0x00 1 byte 0x00 UnusedStart memory addressMSB
If this is a termination header, this6 2 byte
value is 0000Start memory addressLSB
Total number of bytetransferred MSB8 2 byte Header (12) + data (N) + checksum (4)Total number of bytetransferred LSB10 0x00 1 byte 0x00 Unused11 0x00 1 byte 0x00 UnusedProgram byte 1 (LSB) Program word 1 D7D0Program byte 2 D15D8Program byte 3 D23D1612 Program byte 4 7 byte D31D24Program byte 5 D39D32Program byte 6 D47D40Program byte 7 (MSB) D55D48Program byte 8 (LSB)Program byte 9Program byte 1019 Program byte 11 7 byte Program word 2Program byte 12Program byte 13Program byte 14 (MSB)
0x00
0x00
0x00
Repeated checksum byte 2N + 12 0x00 7 byte
through N +110x00
Checksum MSBChecksum LSB
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Table 12. DSP Coefficient RAM Block Structure
STARTING
DATA BLOCK FORMAT SIZE VALUE NOTESBYTE
Checksum MSB0 2 byte Checksum of byte 2 through N + 12Checksum LSBHeader ID byte 1 0x002 2 byte Must be 0x001FHeader ID byte 2 0x1F
Micro program RAM or micro external4 Memory to be loaded 1 byte 0x03
data RAM5 0x00 1 byte 0x00 UnusedStart memory addressMSB
If this is a termination header, this6 2 byte
value is 0000Start memory addressLSB
Total number of bytetransferred MSB8 2 byte Header (12) + data (N) + checksum (4)Total number of bytetransferred LSB10 0x00 1 byte 0x00 Unused11 0x00 1 byte 0x00 UnusedData byte 1 (LSB) Coefficient word 1 D7D0Data byte 2 D15D812 4 byteData byte 3 D23D16Data byte 4 (MSB) D31D24Data byte 5 (LSB)Data byte 616 4 byte Coefficient word 2Data byte 7Data byte 8 (MSB)
0x00
0x00
Repeated checksum byte 2 through NN + 12 4 byte
+11Checksum MSBChecksum LSB
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Slave I
2
C Load RAM Block Formats
TAS3218
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Table 13. DSP Data RAM Block Structure
STARTING
DATA BLOCK FORMAT SIZE VALUE NOTESBYTE
Checksum MSB0 2 byte Checksum of byte 2 through N + 12Checksum LSBHeader ID byte 1 0x002 2 byte Must be 0x001FHeader ID byte 2 0x1F
Micro program RAM or micro external4 Memory to be loaded 1 byte 0x04
data RAM5 0x00 1 byte 0x00 UnusedStart memory addressMSB
If this is a termination header, this6 2 byte
value is 0000Start memory addressLSB
Total number of bytetransferred MSB8 2 byte Header (12) + data (N) + checksum (4)Total number of bytetransferred LSB10 0x00 1 byte 0x00 Unused11 0x00 1 byte 0x00 UnusedData byte 1 (LSB) Data word 1 D7D0Data byte 2 D15D8Data byte 3 D23D1612 6 byteData byte 4 (MSB) D31D24Data byte 5 D39D32Data byte 6 (MSB) D47D40Data byte 7 (LSB)Data byte 8Data byte 918 6 byte Data word 2Data byte 10Data byte 11Data byte 12 (MSB)
0x00
0x00
Repeated checksum byte 2 through NN + 12 6 byte
+11Checksum MSBChecksum LSB
The slave I
2
C bus permits the system controller to load the TAS3218 memories as an alternative to using themaster download from an external memory device via the I
2
C master bus. The transfer is performed by writing totwo I
2
C registers (0x04 and 0x05). The first register holds the header information, and the second register holdseight bytes of data. Figure 39 shows the I
2
C slave download flow.
I
2
C slave download register format are described in Table 14 to Table 18 . The I
2
C slave download process isterminated when a termination header with zero length byte count field is received.
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Enable I C Slave Mode
2
Status I = error
IDLE
Check num_byte
Halt DSP
host_dsp = 1
Mem_select
NG
OK
YES
YES
YES
0 (= termination
header)
> 0
receive mem_load_ctrl (0x04)
receive
mem_load_data
(0x05)
receive
mem_load_ctrl
(0x04)
Invalid
Valid
Num_byte OK?
Initialize Header
Information
Clear Invalid Memory
Select Status
pc_source = 1
PCON = 0x01
RAM Switch
Num_byte?
Status Error?
NO
NO
NO
Load Received Data
to Specified Memory
Calculate Checksum
Check Checksum
Clear Error Status
Load Data
End Checksum?
Checksum Error?
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Figure 39. I
2
C Slave Download Flow
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Table 14. M8051 Microcontroller Program RAMand External Data RAM Block Structure
(1)
CALC TOTALREG BYTE DATA BLOCK FORMAT CHECK NUM NOTESUM BYTE
1 Checksum MSB2 Checksum LSBMemory to be loaded 0x00 or3
0x014 0x00Control
register
5 Start memory address MSB0x04
6 Start memory address LSBTotal number of byte transferred7
MSB
Total number of byte transferred8
LSB
1 Datum 1 D7D02 Datum 2 D7D03 Datum 3 D7D0Data
4 Datum 4D7D0Register
5 Datum 5 D7D00x05
6 Datum 6 D7D07 Datum 7 D7D08 Datum 8 D7D0
1 Datum 9 D7D02 Datum 10 D7D03 Datum 11D7D0Data
4 Datum 12 D7D0Register
5 Datum 13 D7D00x05
6 Datum 14 D7D07 Datum 15 D7D08 Datum 16 D7D0
1 Datum N-3 D7D0
If the last data register datum2 Datum N-2 D7D0
is less than 6 byte, zero data3 Datum N-1 D7D0
should be filled.Data
4 Datum N D7D0Register
5 0x000x05
Should be zero6 0x007 Checksum MSB
End checksum is alwayslocated here8 Checksum LSB
(1) Shades cells indicate the values included in the checksum/total number of bytes calculation.
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Table 15. DSP Program RAM Block Structure
(1)
CALC TOTALREG BYTE DATA BLOCK FORMAT CHECK NUM NOTESUM BYTE
1 Checksum MSB2 Checksum LSB3 Memory to be loaded 0x024 0x00Control
5 Start memory address MSBregister
0x04
6 Start memory address LSBTotal number of byte transferred7
MSB
Total number of byte transferred8
LSB
1 0x002 D55D48
3 D47D40Data
4 D39D32Register Program word 15 D31D240x05
6 D23D16
7 D15D8
8 D7D0
1 0x002 D55D48
3 D47D40Data
4 D39D32Register Program word 25 D31D240x05
6 D23D16
7 D15D8
8 D7D0
1 0x002 0x003 0x00
Should be zeroData
4 0x00Register
5 0x000x05
6 0x007 Checksum MSB
End checksum is alwayslocated here8 Checksum LSB
(1) Shades cells indicate the values included in the checksum/total number of bytes calculation.
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Table 16. DSP Coefficient RAM Block Structure
(1)
CALC TOTALREG BYTE DATA BLOCK FORMAT CHECK NUM NOTESUM BYTE
1 Checksum MSB2 Checksum LSB3 Memory to be loaded 0x034 0x00Control
5 Start memory address MSBregister
0x04
6 Start memory address LSBTotal number of byte transferred7
MSB
Total number of byte transferred8
LSB
1 D31D24
2 D23D16
Coefficient word 13 D15D8Data
4 D7D0Register
5 D31D240x05
6 D23D16
Coefficient word 27 D15D8
8 D7D0
1 D31D24
2 D23D16
Coefficient word 33 D15D8Data
4 D7D0Register
5 D31D240x05
6 D23D16
Coefficient word 47 D15D8
8 D7D0
1 D31D24
2 D23D16
Coefficient word N or zero3 D15D8Data
4 D7D0Register
5 0x000x05
Should be zero6 0x007 Checksum MSB
End checksum is alwayslocated here8 Checksum LSB
(1) Shades cells indicate the values included in the checksum/total number of bytes calculation.
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Table 17. DSP Data Block Structure
(1)
CALC TOTALREG BYTE DATA BLOCK FORMAT CHECK NUM NOTESUM BYTE
1 Checksum MSB2 Checksum LSB3 Memory to be loaded 0x044 0x00Control
5 Start memory address MSBregister
0x04
6 Start memory address LSBTotal number of byte transferred7
MSB
Total number of byte transferred8
LSB
1 0x002 0x00
Coefficient word 13 D47D40Data
4 D39D32Register
5 D31D240x05
6 D23D16
Coefficient word 27 D15D8
8 D7D0
1 0x002 0x00
Coefficient word 33 D47D40Data
4 D39D32Register
5 D31D240x05
6 D23D16
Coefficient word 47 D15D8
8 D7D0
1 0x002 0x003 0x00
Should be zeroData
4 0x00Register
5 0x000x05
6 0x007 Checksum MSB
End checksum is alwayslocated here8 Checksum LSB
(1) Shades cells indicate the values included in the checksum/total number of bytes calculation.
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2
C Register Map
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Table 18. Termination Header Block Structure
(1)
CALC TOTALREG BYTE DATA BLOCK FORMAT CHECK NUM NOTESUM BYTE
1 Checksum MSB 002 Checksum LSB 003 Memory to be loaded 004 0x00 00Control
5 Start memory address MSB 00register
0x04
6 Start memory address LSB 00Total number of byte transferred7 00MSB
Total number of byte transferred8 00LSB
(1) Shades cells indicate the values included in the checksum/total number of bytes calculation.
The I
2
C register map for ROM advanced code is described in Table 19 .
Table 19. I
2
C Register Map
(1)
SUB
REGISTER BYTES CONTENTS DEFAULT VALUEADDRESS
0x00 SAP/Clock Setting 4 See SAP/Clock Setting
0x01 4 u(31:24), u(23:16), u(15:8), u(7)M(6:3)N(2:0) 0x00, 0x00, 0x00, 0x00I
2
C M and N
0x00, 0x00, 0x00, 0x000x02 Status Register 8 See Status Register
0x00, 0x00, 0x00, 0x00
0x03 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
See Load Memory Control and Data 0x00, 0x00, 0x00, 0x000x04 8I
2
C RAM Load Control
Register 0x00, 0x00, 0x00, 0x00
See Load Memory Control and Data 0x00, 0x00, 0x00, 0x000x05 8I
2
C RAM Load Data
Register 0x00, 0x00, 0x00, 0x00
0x06 PEEK/POKE Control 4 See PEEK and POKE 0x00, 0x00, 0x00, 0x00
0x00, 0x00, 0x00, 0x000x07 PEEK/POKE Data 8 See PEEK and POKE
0x00, 0x00, 0x00, 0x00
0x08 Silicon Version 4 ver(31:24), ver(23:16), ver(15:8), ver(7:0) 0x00, 0x00, 0x00, 0x02
0x09 Mute Control 4 See Mute Control 0x00, 0x00, 0x00, 0x00
0x0a Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x0b Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x0c GPIO Control 4 See GPIO Control 0x00, 0x00, 0x00, 0x00
0x0d Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x0e Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x0f Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x10 Powerdown Control 4 See Powerdown Control 0x00, 0x00, 0x00, 0x00
0x11 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x12 A-MUX Control 4 See A-MUX Control 0x00, 0x00, 0x00, 0x00
0x13 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x14 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x15 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
(1) Shades cells indicate common to basic and advanced modes. Unshaded cells indicate advanced mode only.
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Table 19. I
2
C Register Map (continued)SUB
REGISTER BYTES CONTENTS DEFAULT VALUEADDRESS
0x16 SPDIF Control 4 See SPDIF Control 0x00, 0x00, 0x00, 0x00
0x17 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x18 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x19 Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x1a Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x1b Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x00, 0x00, 0x00, 0x010x1c Reserved 8 u(31:24), u(23:16), u(15:8), u(7:0)
0x47, 0xae, 0x00, 0x00
0x1d DC Dither 4 See DC Dither 0x00, 0x00, 0x00, 0x01
0x1e DSP Program Start Address 4 See DSP Program Start Address 0x00, 0x00, 0x00, 0x00
0x1f Reserved 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x20 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x21 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x22 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x23 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x24 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x25 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x26 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x27 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x28 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x29 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x2a Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x2b Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x2c Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x2d Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x2e Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x2f Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x30 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x31 Unused 4 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x32 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x33 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x34 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x35 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x36 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x37 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x38 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x39 Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x3a Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x3b Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x3c Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0x3d Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0xfe Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
0xff Unused 16 u(31:24), u(23:16), u(15:8), u(7:0) 0x00, 0x00, 0x00, 0x00
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SAP/Clock Setting (0x00)
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The SAP/Clock Setting register is used to configure the device as a Clock Master/Slave as well as specify thedesired format of the digital audio ports. This register is four bytes in length.
Table 20. SAP/Clock Setting
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
0 0 0 0 0 0 0 UnusedCM/S Clock master/slave select
BIT 23 22 21 20 19 18 17 16
UnusedON SAP output normalization
BIT 15 14 13 12 11 10 9 8
0 UnusedOW1 OW0 Digital audio output word size0 0 UnusedIW1 IW0 Digital audio input word size
BIT 7 6 5 4 3 2 1 0
0 UnusedOM1 OM0 Digital audio output format0 0 UnusedIM1 IM0 Digital audio input format
Table 21. Clock Master/Slave Select
(1)
CLOCK MASTER/SLAVE SELECT CMS
Master 1Slave 0
(1) Default values are shown in italics.
Table 22. Digital Audio Port Normalization
(1)
DIGITAL AUDIO PORT NORMALIZATION ON
Enable 1Disable 0
(1) Default values are shown in italics.
Bits 98 (IW1 and IW0) define the data word size for the input SAP. Bits 1312 (OW1 and OW0) define the dataword size for the output SAP.
Table 23. Audio Data Word Size
(1)
DIGITAL AUDIO I/O WORD SIZE IW1/OW1 IW0/OW0
16 bit 0 020 bit 0 124 bit 1 01 1
(1) Default values are shown in italics.
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Status Register (0x02)
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Table 24. Audio Data Format
(1)
DIGITAL AUDIO I/O FORMAT IM1/OM1 IM0/OM0
Left-justified 0 0Right-justified 0 1I
2
S 1 01 1
(1) Default values are shown in italics.
Status register provide memory load information. When a memory load error for a particular memory occurs, thememory load error bit for that memory is set to 1. When a memory load is successful for a particular memory thememory load error bit for that memory is set to 0. Host needs to check this load status after memory load. Hostcan clear all load error status by writing 0 to bits D40D32 of this register.
Table 25. SAP/Clock Setting
BIT 63 62 61 60 59 58 57 56 DESCRIPTION
0 0 0 0 0 0 0 0 Reserved
BIT 55 54 53 52 51 50 49 48
0 0 0 0 0 0 0 Reserved
BIT 47 46 45 44 43 42 41
0 0 0 0 0 0 0 Unsused
BIT 40 39 38 37 36 35 34 33 32
x x x x x x x x 1 Micro program memory load errorx x x x x x x 1 x Micro external memory load errorx x x x x x 1 x x DAP program memory load errorx x x x x 1 x x x DAP coefficient memory load errorx x x x 1 x x x x DAP data memory load errorx x x 1 x x x x x DAP upper data memory load errorDAP upper coefficient memory loadx x 1 x x x x x x
errorx 1 x x x x x x x Invalid memory select1 x x x x x x x x End of load header error1 1 1 1 1 1 1 1 1 No EEPROM0 0 0 0 0 0 0 0 0 No error
BIT 31 30 29 28 27 26 25 24
0 0 0 0 0 0 0 Reserved
BIT 23 22 21 20 19 18 17 16
0 0 0 0 0 0 0 Reserved
BIT 15 14 13 12 11 10 9 8
0 Reserved
BIT 7 6 5 4 3 2 1 0
0 ReservedABSY Analog busy flag0 Reserved0 Reserved0 Reserved0 ReservedBUSE I
2
C bus error0 Reserved
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Load Memory Control and Data Register (0x04 and 0x05)
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Bits 4032 define the memory load error status on EEPROM download and slave download.
Table 26. Analog Busy
(1)
ANALOG BUSY FLAG ABSY
Analog is busy 1Analog not busy 0
(1) Default values are shown in italics.
Analog control sequence takes time (maximum around 500 ms for headphone power up). This busy flag indicatewhether analog control sequence is running or not.
Table 27. I
2
C Bus Error
(1)
I
2
C BUS ERROR BUSE
Bus error 1No bus error 0
(1) Default values are shown in italics.
If I
2
C bus error occurs, this flag will be set. Only host uC can clear this flag by writing 0 to this bit. I
2
C bus errorstatus is read from ESFR (0xC5, bit 6), and is cleared by ESFR (0xC7, bit 6).
The I
2
C Memory Load port permits the system controller to load the TAS3218 memories as an alternative tohaving the TAS3218 load its memory from an external EEPROM.
The transfer is performed by writing to two I
2
C registers. The first register is a eight byte register than holds thecheck sum, the memory to be written, the starting address, the number of data bytes to be transferred. Thesecond register holds eight bytes of data.
The memory load operation starts with the first register being set. Then the data is written into the secondregister using the format shown. After the last data byte is written into the second register, an additional twobytes are written which constrain the two byte checksum. At that point, the transfer is complete and status of theoperation is reported in the status register.
NOTE:
Once the micro program memory has been loaded, further updates to this memoryare inhibited until the device is RESET.
When the first I
2
C slave down load register is written by the system controller the TAS3218 will update the statusregister by setting a error bit to indicate an error for the memory type that is being loaded. This error bit is resetwhen the operation complete and a valid checksum has been received.
For example when the Micro program memory is being loaded, the TAS3218 will set a Micro program memoryerror indication in the status register at the start of the sequence. When the last byte of the micro programmemory and checksum is received, the TAS3218 will clear the micro program memory error indication. Thisenables the TAS3218 to preserve any error status indications that occur as a result of incomplete transfers ofdata/ checksum error during a series of data and program memory load operations.
The checksum is always contained in the last two bytes of the data block.
The I
2
C slave download is terminated when a termination header with a zero length byte count filed is received.
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PEEK and POKE (0x06 and 0x07)
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Table 28. Load Memory Control Register (0x04)
BYTE DATA BLOCK FORMAT SIZE NOTES
12 Checksum code 2 bytes Checksum of bytes 2 through N+8, If this isa termination header, this value is 00 00.3 Memory to be loaded 1 byte 0: Micro Program memory1: Micro External Data memory2: DSP Program memory3: DSP Coefficient memory4: DSP Data Memory515: Reserved4 Unused 1 byte Reserved67 Starting TAS3218 2 bytes If this is a termination header, this value isMemory address 00 0078 Number of data bytes to be transferred 2 bytes If this is a termination header, this value is00 00
Table 29. Load Memory Data Register (0x05)
BYTE 8-BIT DATA 24-BIT DATA 28-BIT DATA 48-BIT DATA 55-BIT DATA
1 Datum 1 D7D0 XXXX D27D242 Datum 2 D7D0 D23D16 D23D16 X D54D483 Datum 3 D7D0 D15D8 D15D8 D47D40 D47D404 Datum 4 D7D0 D7D0 D7D0 D39D32 D39D325 Datum 5 D7D0 XXXX D27D24 D31D24 D31D246 Datum 6 D7D0 D23D16 D23D16 D23D16 D23D167 Datum 7 D7D0 D15D8 D15D8 D15D8 D15D88 Datum 8 D7D0 D7D0 D7D0 D7D0 D7D0
Registers 0x06 (Table 30 ) and 0x07 (Table 31 ) allow the user to access the internal resources of TAS3218.Figure 40 shows the I
2
C transaction for PEEK and POKE register.
Table 30. Memory Select and Address (0x06)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
0 0 0 0 0 0 0 0 Unused
BIT 23 22 21 20 19 18 17 16
0 0 0 0 0 0 0 1 DSP coefficient memory load error0 0 0 0 0 0 1 0 DSP data memory load error0 0 0 0 0 0 1 1 DSP delay memory0 0 0 0 0 1 0 0 M8051 internal data memory0 0 0 0 0 1 0 1 M8051 external data memory0 0 0 0 0 1 1 0 Extended special function registers0 0 0 0 0 1 1 1 M8051 program memory0 0 0 0 1 0 0 0 DSP program memory
BIT 15 14 13 12 11 10 9 8
0 0 0 0 0 0 0 0 Memory address MSB
BIT 7 6 5 4 3 2 1 0
0 0 0 0 0 0 0 0 Memory address LSB
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SSlave address
+ W ACK Sub address
(0x07) ACK D63–D56 ACK D55–D48 ACK D47–D40 ACK D39–D32 ACK
Poke (Write)
D31–D24 ACK D23–D16 ACK D15–D8 ACK D7–D0 NAK P
Peek (Read)
SSlave address
+ W ACK D63–D56 ACK D55–D48 ACK D47–D40 ACK D39–D32 ACK
SSlave address
+ W ACK Sub address
(0x07) ACK
D31–D24 ACK D23–D16 ACK D15–D8 ACK D7–D0 NAK P
P
SSlave address
+ W ACK Sub address
(0x06) ACK 00000000 ACK memory section ACK address (MS Byte) ACK address (LS Byte) ACK P
Memory Select and Address
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Table 31. Data Register (0x07)
BIT 63 62 61 60 59 58 57 56 DESCRIPTION
D63 D62 D61 D60 D59 D58 D57 D56 Data to be read or written
BIT 55 54 53 52 51 50 49 48
D55 D54 D53 D52 D51 D50 D49 D48 Data to be read or written
BIT 47 46 45 44 43 42 41 40
D47 D46 D45 D44 D43 D42 D41 D40 Data to be read or written
BIT 39 38 37 36 35 34 33 32
D39 D38 D37 D36 D35 D34 D33 D32 Data to be read or written
BIT 31 30 29 28 27 26 25 24
D31 D30 D29 D28 D27 D26 D25 D24 Data to be read or written
BIT 23 22 21 20 19 18 17 16
D23 D22 D21 D20 D19 D18 D17 D16 Data to be read or written
BIT 15 14 13 12 11 10 9 8
D15 D14 D13 D12 D11 D10 D9 D8 Data to be read or written
BIT 7 6 5 4 3 2 1 0
D7 D6 D5 D4 D3 D2 D1 D0 Data to be read or written
Figure 40. I
2
C Transaction for PEEK and POKE
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Mute Control
GPIO Control (0x0c)
TAS3218
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....................................................................................................................................................................................................... SLES235 JULY 2008
Table 32. Mute Control
BI
31 30 29 28 27 26 25 24 DESCRIPTIONT
0 0 0 0 0 0 0 0 Unused
BI
23 22 21 20 19 18 17 16T
0 0 0 0 0 0 UnusedAMX3 AMX3 AMUX03 (LINEOUT3)
BI
15 14 13 12 11 10 9 8T
AMX2 AMX2 Analog MUX out (LINEOUT2)AMX1 AMX0 Analog MUX out (LINEOUT1)SD2 SD2 SDOUT2/SPDIFOUTSD1 SD1 SDOUT1
BI
76543210T
DAC1 DAC1 DAC1 (DACOUT1)DAC2 DAC2 DAC2 (DACOUT2)DAC3 DAC3 DAC3 (HPOUT)DIT DIT DIT (BiPhase)
Table 33. MUTE
(1)
MUTE MUTE[1] MUTE[0]
HW Mute Control 0 0Force mute off x 1Force mute on 1 0
(1) Default values are shown in italics.
Table 34. GPIO Control (0x0c)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
WDE Watchdog timer0 0 0 UnusedIO2 GPIO2 input/output valueIO1 GPIO1 input/output valueDIR2 GPIO2 directionDIR1 GPIO1 direction
BIT 23 22 21 20 19 18 17 16
x x x x x x x x GPIOMICROCOUNT MSB
BIT 15 14 13 12 11 10 9 8
x x x x x x x x GPIOMICROCOUNT LSB
BIT 7 6 5 4 3 2 1 0
y y y y y y y y GPIO_Sampling_Interval
GPIOMICROCOUNT sets the number of micro clock cycles for Timer 0 interrupt. In Timer 0 interrupt serviceroutine, watchdog timer is reset if it is enabled. The default value for this counter is 0x5820 which correspond toa period 1.25 ms.
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Powerdown Control (0x10)
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Table 35.Watchdog Timer Enable
(1)
WATCHDOG TIMER WDE
Enable 0Disable 1
(1) Default values are shown in italics.
Table 36. GPIO Direction
(1)
GPIOx DIRECTION DIRx
Output 0Input 1
(1) Default values are shown in italics.
Table 37. Powerdown Control
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
0 0 0 0 0 0 0 0 Unused
BIT 23 22 21 20 19 18 17 16
0 0 0 0 0 0 0 0 Unused
BIT 15 14 13 12 11 10 9 8
0 0 0 0 0 0 0 0 Unused
BIT 7 6 5 4 3 2 1 0
DIT DIT resetDAC3 DAC3 (HPOUT)DAC2 DAC2 (DACOUT2)DAC1 DAC1 (DACOUT1)ADC AMUX + AAF + ADCAMX3 AMUX3 + Line Amp 3AMX2 AMUX2 + Line Amp 2AMX1 AMUX1 + LineAmp1
Table 38. Powerdown
(1)
POWERDOWN PD
Powerdown and disable 0Powerup and enable 1
(1) Default values are shown in italics.
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Table 39. A-MUX Control (0x12)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
x x x x 1 1 1 1 Reservedx x x x 1 1 1 0 Reservedx x x x 1 1 0 1 Reservedx x x x 1 1 0 0 Reservedx x x x 1 0 1 1 DACx x x x 1 0 1 0 Analog MUX line 10 selectx x x x 1 0 0 1 Analog MUX line 9 selectx x x x 1 0 0 0 Analog MUX line 8 selectx x x x 0 1 1 1 Analog MUX line 7 selectx x x x 0 1 1 0 Analog MUX line 6 selectx x x x 0 1 0 1 Analog MUX line 5 selectx x x x 0 1 0 0 Analog MUX line 4 selectx x x x 0 0 1 1 Analog MUX line 3 selectx x x x 0 0 1 0 Analog MUX line 2 selectx x x x 0 0 0 1 Analog MUX line 1 select0 0 0 0 0 0 0 0 MUTE
BIT 23 22 21 20 19 18 17 16
x x x x 1 1 1 1 Reservedx x x x 1 1 1 0 Reservedx x x x 1 1 0 1 Reservedx x x x 1 1 0 0 Reservedx x x x 1 0 1 1 Reservedx x x x 1 0 1 0 AMUX2 IN 10x x x x 1 0 0 1 AMUX2 IN 9x x x x 1 0 0 0 AMUX2 IN 8x x x x 0 1 1 1 AMUX2 IN 7x x x x 0 1 1 0 AMUX2 IN 6x x x x 0 1 0 1 AMUX2 IN 5x x x x 0 1 0 0 AMUX2 IN 4x x x x 0 0 1 1 AMUX2 IN 3x x x x 0 0 1 0 AMUX2 IN 2x x x x 0 0 0 1 AMUX2 IN 10 0 0 0 0 0 0 0 MUTE
BIT 15 14 13 12 11 10 9 8
x x x x 1 1 1 1 Reservedx x x x 1 1 1 0 Reservedx x x x 1 1 0 1 Reservedx x x x 1 1 0 0 Reservedx x x x 1 0 1 1 Reservedx x x x 1 0 1 0 AMUX3 IN 10x x x x 1 0 0 1 AMUX3 IN 9x x x x 1 0 0 0 AMUX3 IN 8x x x x 0 1 1 1 AMUX3 IN 7x x x x 0 1 1 0 AMUX3 IN 6x x x x 0 1 0 1 AMUX3 IN 5
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Table 39. A-MUX Control (0x12) (continued)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
x x x x 0 1 0 0 AMUX3 IN 4x x x x 0 0 1 1 AMUX3 IN 3x x x x 0 0 1 0 AMUX3 IN 2x x x x 0 0 0 1 AMUX3 IN 10 0 0 0 0 0 0 0 MUTE
BIT 7 6 5 4 3 2 1 0
x x x x 1 1 1 1 Reservedx x x x 1 1 1 0 Reservedx x x x 1 1 0 1 Reservedx x x x 1 1 0 0 Reservedx x x x 1 0 1 1 DACx x x x 1 0 1 0 Analog MUX line 10 selectx x x x 1 0 0 1 Analog MUX line 9 selectx x x x 1 0 0 0 Analog MUX line 8 selectx x x x 0 1 1 1 Analog MUX line 7 selectx x x x 0 1 1 0 Analog MUX line 6 selectx x x x 0 1 0 1 Analog MUX line 5 selectx x x x 0 1 0 0 Analog MUX line 4 selectx x x x 0 0 1 1 Analog MUX line 3 selectx x x x 0 0 1 0 Analog MUX line 2 selectx x x x 0 0 0 1 Analog MUX line 1 select0 0 0 0 0 0 0 0 MUTE
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SPDIF Control (0x16)
TAS3218
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Table 40. PDIF Control (0x16)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
CP Copyright flagEMP Pre-emphasis flagCLKAC CLKAC
Clock accuracyb28 b29
WL3 WL2 WL1 WL0 Sample word length
BIT 23 22 21 20 19 18 17 16
SR SR
Sampling rateb24 b25 0 0 0 0 0 0VL Left-channel validity flagVR Right-channel validity flagSRC# SRC# SRC# SRC#
Source channel numberb19 b18 b17 b16
BIT 15 14 13 12 11 10 9 8
Cat Cat Cat Cat Cat Cat Cat
Category codeb8 b9 b10 b11 b12 b13 b14 0
L Generation status
BIT 7 6 5 4 3 2 1 0
0 0 0 0 0 0 UnusedMUX1 MUX0 SPDIF MUX
Table 41. Copyright Flag
(1)
COPYRIGHT FLAG CP
Copy prohibited 0Copy permitted 1
(1) Default values are shown in italics.
Table 42. Pre-Emphasis Flag
(1)
PRE-EMPHASIS FLAG EMP
No pre-emphasis 050/15 s pre-emphasis 1
(1) Default values are shown in italics.
Table 43. Sample Word Length
SAMPLE WORD LENGTH WLx
24-bit sample word length 0
Table 44. Sampling Rate
SAMPLING RATE b24 b25
48 kHz 0 1
Table 45. Validity Flag
(1)
VALIDITY FLAG Vx
Valid 0Not valid 1
(1) Default values are shown in italics.
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DC Dither (0x1d)
DSP Program Start Address (0x1e)
TAS3218
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Table 46. Channel Source Number
CHANNEL SOURCE NUMBER b19 b18 b17 b16
Channel 2 0 0 1 0
Table 47. Category Code
CATEGORY CODE b8 b9 b10 b11 b12 b13 b14
Digital sound processor 0 1 0 1 0 1 0
Table 48. Generation Status
GENERATION STATUS Vx
Gen 1 or higher 0Original 1
Table 49. SDOUT/SPDIF MUX
(1)
SDOUT/SPDIF MUX MUX1 MUX2
SDOUT2 0 0SPDIF Tx 0 1SPDIF In 1
(1) Default values are shown in italics.
Table 50. DC Dither (0x1d)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
0 0 0 0 0 0 0 0 Unused
BIT 23 22 21 20 19 18 17 16
0 0 0 0 0 0 0 0 Unused
BIT 15 14 13 12 11 10 9 8
0 0 0 0 0 0 0 0 Unused
BIT 7 6 5 4 3 2 1 0
0 0 0 0 0 0 0 UnusedON DC dither enable
Table 51.DC Dither Enable
(1)
DC DITHER ENABLE ON
Disable 0Enable 1
(1) Default values are shown in italics.
The DSP instruction execution loops each Fs cycle. At the beginning of the Fs cycle, the DSP instruction pointeris set to the starting address specified in the 12 LSBs. The maximum address is the end address of DSPinstruction address 3327.
Table 52. DSP Program Start Address (0x1e)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
0 0 0 0 0 0 0 0 Unused
BIT 23 22 21 20 19 18 17 16
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Table 52. DSP Program Start Address (0x1e) (continued)
BIT 31 30 29 28 27 26 25 24 DESCRIPTION
0 0 0 0 0 0 0 0 Unused
BIT 15 14 13 12 11 10 9 8
0 0 0 0 x x x x Starting address MSB
BIT 7 6 5 4 3 2 1 0
x x x x x x x x Starting address LSB
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APPLICATION INFORMATION
AVDD
AVDD_HP
SDIN2
DAC1L
LineOut1R
LineOut1L
SDIN1
AVDD_REF
TAS3218PZP
U1
RESERVED
5
LINEIN6L 57
VR_ANA 98
DVSS1
1
RESERVED
6
MCLKOUT
8
LRCLKOUT
9
SCLKOUT
10
SDOUT1
11
SDOUT2/SPDIF_OUT
12
DVDD2
13
VR_DIG1
14
DVSS2
15
SPDIF_IN
16
RESERVED
17
RESERVED
18
RESERVED
20
SCLKIN
25
DVDD3
28
I2C_SDA2
29
I2C_SCL2
30
I2C_SCL1
32
CS
33
GPIO2
35
/MUTE
36
/RESET
37
DVDD4
39
DVSS5
40
VR_DIG2
41
AVSS_ESD
42
LINEIN3L
49
LINEIN3R
50
LINEIN4R 52
AVDD_LI 53
LINEIN5L 54
AVDD_LI 65
LINEIN9L 66
LINEIN9R 67
AVSS_LI 68
LINEIN10R 70
AVDD_ADC 71
AVSS_ADC/REF 72
BG_REF 74
AVDD_REF 76
LINEOUT3L 77
LINEOUT3R 78
LINEOUT2L 79
XTAL_IN 96
XTAL_OUT 97
AVSS_LI
48
AVDD_LI
45
LINEIN2R
47
LINEOUT1R 83
SDIN2
22
SDIN1
23
DVSS3
27 AVDD_OSC 99
RESERVED
3
RESERVED
4
LINEIN5R 55
AVSS_LI 56
LINEIN6R 58
AVDD_LI 59
LINEIN7L 60
LINEIN7R 61
LINEIN8L 63
LINEIN8R 64
SDIN3
21
I2C_SDA1
31
LINEIN1R
44
AVSS_LI 62
LINEIN10L 69
V1P5_REF 75
DACOUT1L 84
DVDD1 100
MCLKIN
26
DVSS4
38
LINEIN4L 51
AVSS_DAC 88
AVSS_LO 81
LINEOUT1L 82
DACOUT1R 85
DACOUT2L 86
DACOUT2R 87
AVDD_DAC 89
AVDD_HP 90
HPOUTL 91
AVSS_HP 92
HPOUTR 93
AVDD_HP 94
AVSS_ESD 95
/VREG_EN
2
LINEOUT2R 80
BIAS_REF 73
RESERVED
7
RESERVED
19
LRCLKIN
24
GPIO1
34
LINEIN1L
43
LINEIN2L
46
Power_PAD 101
33K
1 2
AVDD_ADC
L/RCLK_IN
AVDD_LI
SCLK_IN
4.7uF
21
AVDD_LI
AVDD_LI
GPIO1
DVDD1
4.7uF
1
2
0.1uF
21
33K
1 2
4.7uF
21
GPIO2 LineIn1R
24k1 2
DVDD
LineIn1L
DVDD1
47uF12
DVDD2
4.7uF
1
2
10uF
1
2
0.1uF
21
0.1uF
21
24.576MHz
12
0.1uF
21
47uF
12
1uF21
0.1uF
21
0.1uF
21
DVDD
4.7uF
1
2
DVDD2
0.1uF
21
22uF
1 2
4.7uF
1
2
DVDD
22uF
1 2
DVDD3
AVDD_DAC
AVDD
0.1uF
21
10K
1 2
DVDD
4.7uF
1
2
DVDD4
1.00M
1
2
LineOut2R
LineOut2L
22uF
1 2
22uF
1 2
33K
1 2
10K
1 2
4.7uF
21
Chip_Select 33K
1 2
LineIn2R
4.7uF
21
10K
1 2
4.7uF
1
2
LineIn2L
DVDD3
22uF
1 2
22uF
1 2
10K
1 2
10K
1 2
AVDD_HP
SPDIF
AVDD_HP
DVDD4
33K
1 2
4.7uF
21
33K
1 2
4.7uF
21
LineIn4R
LineIn4L
33K
1 2
4.7uF
21 LineIn3R
33K
1 2
4.7uF
21
1uF21
LineIn3L
10pF
2 1
AVDD_ADC
10pF
2 1
nMUTE
SDOUT2/SPDIFOUT
4.7uF
21
nRESET
33K
1 2
10K
1 2
4.7uF
21
LineIn5R
33K
1 2 LineIn5L
MCLK_IN
22uF
1 2
22uF
1 2
10K
1 2
10K
1 2
SDOUT1
4.7uF
1
2
4.7uF
21
33K
1 2
4.7uF
21
33K
1 2
LineIn6R
LineIn6L
4.7uF
21
33K
1 2
4.7uF
21
33K
1 2
LineIn7R
LineIn7L
HeadphoneR
HeadphoneL
SCLK_OUT
AVDD_REF
4.7uF
21
AVDD_LI
33K
1 2
4.7uF
21
LineIn8R
33K
1 2 LineIn8L
4.7uF
21
33K
1 2
AVDD_HP
4.7uF
21
33K
1 2
LineIn9R
LineIn9L
L/RCLK_OUT
AVDD_LI
4.7uF
21
33K
1 2
4.7uF
21
33K
1 2
LineIn10R
AVDD_LI
LineIn10L
MCLK_OUT
MASTER_SDA
AVDD_LI
MASTER_SCL
10K
1 2
SLAVE_SDA
SDIN3
10K
1 2
SLAVE_SCL
0.1uF
21
0.1uF
21
4.7uF
1
2
AVDD_HP
AVDD
AVDD_DAC
DAC1R
0.1uF
21
DAC2R
DAC2L
0.1uF
21
4.7uF
1
2
LineOut3R
LineOut3L
22uF
1 2
22uF
1 2
10K
1 2
10K
1 2
TAS3218
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TAS3218IPZP NRND HTQFP PZP 100 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
TAS3218IPZPR NRND HTQFP PZP 100 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR
TAS3218PZPR OBSOLETE HTQFP PZP 100 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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