Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8230TU
SiGe:C LOW NOISE AMPLIFIER FOR GPS
Document No. PU10612EJ01V0DS (1st edition)
Date Published April 2006 NS CP(N)
DESCRIPTION
The
PC8230TU is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise
amplifier for GPS. This device exhibits low noise figure and high power gain characteristics, so this IC can improve the
sensitivity of GPS receiver. In addition, the
PC8230TU which is included output matching circuit contributes to
reduce external components and system size.
The package is 8-pin lead-less minimold suitable for surface mount.
This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process.
FEATURES
Low noise : NF = 0.85 dB TYP. @ fin = 1 575 MHz
High gain : GP = 18.5 dB TYP. @ fin = 1 575 MHz
Low current consumption : ICC = 6.0 mA TYP. @ VCC = 3.0 V
Built-in power-saving function
High-density surface mounting : 8-pin lead-less minimold package (2.0 2.0 0.5 mm)
Included output matching circuit
Included very robust bandgap regulator (Small VCC and TA dependence)
Included protection circuits for ESD
APPLICATION
Low noise amplifier for GPS
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PC8230TU-E2
PC8230TU-E2-A
8-pin lead-less minimold
(Pb-Free)
8230
8 mm wide embossed taping
Pin 5, 6, 7, 8 indicates pull-out direction of tape
Qty 5 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
PC8230TU-A
Data Sheet PU10612EJ01V0DS
2
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
VCC
2
N.C.
3
GND
4
INPUT
5
Power Save
6
GND
7
OUTPUT
8
VCC
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C
4.0
V
Power-Saving Voltage
VPS
TA = +25C
4.0
V
Power Dissipation
PD
TA = +85°C Note
295
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
+10
dBm
Note Mounted on double-side copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
2.7
3.0
3.3
V
Operating Ambient Temperature
TA
40
+25
+85
C
Power Save Turn-on Voltage
VPSon
2.2
VCC
V
Power Save Turn-off Voltage
VPSoff
0
0.8
V
Data Sheet PU10612EJ01V0DS
3
ELECTRICAL CHARACTERISTICS
(TA = +25C, VCC = VPS = 3.0 V, fin = 1 575 MHz, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
No Signal (VPS = 3.0 V)
4.5
6.0
8.0
mA
At Power-Saving Mode (VPS = 0 V)
1
A
Power Gain
GP
Pin = 35 dBm
16
18.5
21
dB
Noise Figure
NF
0.85
1.15
dB
Input 3rd Order Distortion Intercept
Point
IIP3
fin1 = 1 574 MHz, fin2 = 1 575 MHz
5
dBm
Input Return Loss
RLin
8
11
dB
Output Return Loss
RLout
7
10
dB
Isolation
ISL
39
dB
Gain 1 dB Compression Input Power
Pin (1 dB)
17
dBm
TEST CIRCUIT
Data Sheet PU10612EJ01V0DS
4
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10612EJ01V0DS
5
Remark The graphs indicate nominal characteristics.
Data Sheet PU10612EJ01V0DS
6
S-PARAMETERS (TA = +25C, VCC = VPS = 3.0 V, monitored at connector on board)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10612EJ01V0DS
7
PACKAGE DIMENSIONS
8-PIN LEAD-LESS MINIMOLD (UNIT: mm)
Remark ( ) : Reference value
8 Data Sheet PU10612EJ01V0DS
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).